GB9415495D0 - CPU cooling device - Google Patents
CPU cooling deviceInfo
- Publication number
- GB9415495D0 GB9415495D0 GB9415495A GB9415495A GB9415495D0 GB 9415495 D0 GB9415495 D0 GB 9415495D0 GB 9415495 A GB9415495 A GB 9415495A GB 9415495 A GB9415495 A GB 9415495A GB 9415495 D0 GB9415495 D0 GB 9415495D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- cooling device
- cpu cooling
- cpu
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20903794A | 1994-03-09 | 1994-03-09 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9415495D0 true GB9415495D0 (en) | 1994-09-21 |
GB2287837A GB2287837A (en) | 1995-09-27 |
GB2287837B GB2287837B (en) | 1997-10-08 |
Family
ID=22777064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9415495A Expired - Fee Related GB2287837B (en) | 1994-03-09 | 1994-08-01 | CPU cooling device |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2287837B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2348277B (en) * | 1996-02-01 | 2001-02-14 | Hewlett Packard Co | Fan assisted heat sink device |
US5785116A (en) * | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
JP3942248B2 (en) * | 1997-02-24 | 2007-07-11 | 富士通株式会社 | Heat sink and information processing apparatus equipped with the same |
FR2766302B1 (en) * | 1997-07-17 | 1999-09-24 | Valeo Climatisation | ELECTRIC MOTOR, ESPECIALLY A MOTOR VEHICLE, WITH COOLING RADIATOR WITH VARIABLE VANE CONFIGURATION |
JP2997231B2 (en) * | 1997-09-12 | 2000-01-11 | 富士通株式会社 | Method for manufacturing multi-semiconductor bare chip mounting module |
US6176299B1 (en) | 1999-02-22 | 2001-01-23 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
GB2415545B (en) * | 2005-04-29 | 2006-06-28 | Bestec Power Electronics Co Lt | Heat dissipating device |
CN101364576B (en) * | 2008-09-19 | 2011-07-20 | 秦彪 | Radiator for semi-conductor electronic device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4513812A (en) * | 1981-06-25 | 1985-04-30 | Papst-Motoren Gmbh & Co. Kg | Heat sink for electronic devices |
JP3069819B2 (en) * | 1992-05-28 | 2000-07-24 | 富士通株式会社 | Heat sink, heat sink fixture used for the heat sink, and portable electronic device using the heat sink |
US5309983B1 (en) * | 1992-06-23 | 1997-02-04 | Pcubid Computer Tech | Low profile integrated heat sink and fan assembly |
EP1056129A3 (en) * | 1992-08-06 | 2002-01-30 | Pfu Limited | Heat-generating element cooling device |
-
1994
- 1994-08-01 GB GB9415495A patent/GB2287837B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2287837A (en) | 1995-09-27 |
GB2287837B (en) | 1997-10-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2295488B (en) | Semiconductor device | |
GB2292010B (en) | Semiconductor device | |
DE69530385D1 (en) | COOLING DEVICE | |
GB2303597B (en) | Cooling device | |
EP0704897A3 (en) | Semiconductor device | |
TW505356U (en) | Semiconductor device | |
GB9515646D0 (en) | Cpu heat dissipating apparatus | |
EP0677710A3 (en) | Cooling device. | |
EP0720295A3 (en) | Semiconductor device | |
TW490082U (en) | Semiconductor device | |
GB9523207D0 (en) | Semiconductor device | |
GB2292637B (en) | Semiconductor device | |
GB2295272B (en) | Semiconductor device | |
GB2287837B (en) | CPU cooling device | |
GB2296373B (en) | Semiconductor device | |
TR199501397A2 (en) | Cooling device | |
EP0716445A3 (en) | Semiconductor device | |
GB2314920B (en) | Heat dissipation device | |
GB2295051B (en) | Semiconductor device | |
GB9402639D0 (en) | Semiconductor device | |
IL109947A0 (en) | Cooling device | |
TW454899U (en) | Fixed device added for CPU cooling sheet | |
GB9402814D0 (en) | Semiconductor device | |
GB9425852D0 (en) | Heat dissipation device | |
TW331430U (en) | Heat dissipating device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20000801 |