KR20190094041A - Heat spreader and electronic device comprising the same - Google Patents

Abstract

The present invention is to provide a heat spreader and an electronic device comprising the same. The heat spreader comprises: a first board consisting of a thermal conductive board; a second board facing the first board and consisting of the thermal conductive board; and a connection board interposed between the first board and the second board, connected to at least a part of the first board and the second board and consisting of the thermal conductive board. At least one of a portion where the connection board is connected in the first board, a portion of the connection board and a portion where the connection board is connected in the second board comprises a cavity with an empty space.

Description

Heat spreader and electronic device including the same {HEAT SPREADER AND ELECTRONIC DEVICE COMPRISING THE SAME}

The present invention relates to a heat spreader and an electronic device including the same to effectively dissipate heat generated from an internal heat source such as an electric or electronic product to the outside.

Recently, the demand for electronic devices such as mobile devices, smart phones, smart devices is increasing rapidly. If the heat inside the electronic devices does not radiate to the outside, the life of components inside the electronic devices may be shortened, the electronic devices may explode, or the fire may occur. There may be a malfunction problem. In addition, the recent trend of technology development and product launch of smart phones have become more difficult to dissipate heat inside electronic devices by strengthening the packing due to consumer's demand for waterproof and dustproof. There is a need for a technology that can effectively diverge to the outside.

In particular, the AP chip part that controls the electronic device generates a lot of heat sources, and researches are being conducted to more effectively radiate and dissipate heat generated from the AP chip part to the outside of the electronic device. It is a situation that a simple heat sink used. However, in the recent trend of electronic devices becoming smaller and slimmer, simple heat sinks take up a relatively large amount of space and are difficult to dissipate heat effectively.In the case of heat pipes having a large number of bends due to the characteristics of the product into which the heat medium is injected, It is difficult to use because the heat medium is not smoothly moved, and there is a problem in that it does not exhibit an effective heat dissipation performance. In addition, there is a problem that the heat dissipation effect by the simple heat sink is not enough due to the limitation of the surface area.

Therefore, it is necessary to study a heat dissipation device that occupies a small area, and is easy to install while minimizing the heat dissipation effect in a miniaturized and slimmer electronic device.

Republic of Korea Patent Publication No. 10-2013-0043720 Republic of Korea Patent Publication No. 10-1533782

Accordingly, an object of the present invention is to provide a heat spreader capable of dissipating heat to the outside more effectively while occupying a small area inside the electronic device.

In addition, the present invention can be applied in various forms such as curved areas, and provides a heat spreader that can be freely applied in a miniaturized slimmer electronic device.

Another object of the present invention is to provide a heat spreader which is less likely to be damaged by external impact or squeeze or loses heat dissipation.

In addition, the present invention provides a heat spreader capable of dissipating heat of a heat source through an even area.

In addition, the present invention provides an electronic device including the heat spreader.

The objects of the present invention are not limited to the above-mentioned technical problem, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

The heat spreader according to an embodiment of the present invention for solving the above problems is a first plate member composed of a thermally conductive plate, a second plate member facing the first plate member, and composed of a thermally conductive plate member, and the first plate member And a connecting plate interposed between the second plate and the first plate and at least a portion of the second plate, the connecting plate comprising a thermally conductive plate, wherein the connecting plate is connected to the first plate. At least one or more of a portion, a portion of the connecting plate member, and a portion of the second plate member to which the connecting plate member is connected include a cavity formed as an empty space.

In addition, the first plate member comprises a first cavity formed in at least a portion of the connecting plate member is connected, the first cavity is characterized in that formed inside the portion overlapping the outer edge of the connecting plate member.

In addition, the connecting plate member may include a second cavity formed as an empty space inside.

In addition, the second plate member may include a third cavity formed in at least a portion of the portion connecting the connecting plate material, the third cavity may be formed inside the portion overlapping with the outer edge of the connecting plate material have.

The connecting plate member may include a second cavity formed as an empty space therein, and the second plate member may include a third cavity formed in at least part of a portion to which the connecting plate member is connected. The third cavity may be characterized in that it overlaps with the first plate.

In addition, at least a portion of the portion of the first plate to which the connecting plate is connected, at least a portion of the connecting plate or at least a portion of the portion of the connecting plate is connected to the second plate in the horizontal direction further comprises a slit opening in the horizontal direction Can be.

In addition, when the first plate and the second plate member extends in a first direction and a second direction perpendicular to the first direction of the horizontal direction, and extends relatively longer in the first direction, the trimmed portion is It may be characterized in that formed in the second direction.

In addition, the trim may be formed in a plurality of positions facing each other.

The electronic device according to an embodiment of the present invention for solving the above problems is a heat source electrically connected to a circuit board, a shielding unit formed to surround the heat source with the circuit board, the shielding unit And a heat spreader disposed on the heat spreader and a heat sink disposed on the heat spreader, the heat spreader being a heat spreader of the present invention.

In addition, the first plate member of the heat spreader may be disposed on the shielding unit, and the connection plate member and the heat source may be arranged to overlap each other in the vertical direction.

The cavity and the heat source of the heat spreader may be disposed to overlap each other in the vertical direction.

The apparatus may further include a heat dissipation adhesive or a heat conductive heat dissipation tape interposed between the shielding unit and the first plate member of the heat spreader.

The heat spreader may further include a heat dissipation adhesive or a heat conductive heat dissipation tape interposed between the second plate member of the heat spreader and the heat dissipation plate.

Specific details of other embodiments are included in the detailed description and the drawings.

According to embodiments of the present invention has at least the following effects.

The heat spreader according to the present invention can more effectively dissipate heat inside the electronic device to the outside while occupying a small area in the miniaturized and slimmed electronic device.

In addition, even if there is bending inside the electronic device, it can be applied freely, and even if the heat spreader is partially damaged or changed in shape by external impact or stamping, the heat dissipation function can be prevented from being lost.

In addition, heat emitted from the heat source can be discharged to the outside through an even area of the heat spreader.

In addition, the electronic device according to the present invention includes the heat spreader as described above, thereby more effectively and evenly dissipates the heat inside the electronic device to the outside.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a schematic perspective view of a heat spreader according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along the line AA ′ of the heat spreader of FIG. 1.
3 is a plan view of the heat spreader of FIG. 1.
4 is a schematic perspective view of a heat spreader according to another embodiment of the present invention.
FIG. 5 is a cross-sectional view taken along line BB ′ of the heat spreader of FIG. 4.
6 is a schematic perspective view of a heat spreader according to another embodiment of the present invention.
FIG. 7 is a cross-sectional view taken along the line CC ′ of FIG. 6.
8 is a schematic perspective view of a heat spreader according to another embodiment of the present invention.
FIG. 9 is a cross-sectional view of the heat spreader of FIG. 8 taken along line D-D '. FIG.
10 is a plan view of the heat spreader of FIG. 8.
11 is a schematic perspective view of a heat spreader according to another embodiment of the present invention.
12 is a plan view of the heat spreader of FIG. 11.
13 is a schematic perspective view of a heat spreader according to another embodiment of the present invention.
14 is a plan view of the heat spreader of FIG. 13.
15 is a schematic perspective view of a heat spreader according to another embodiment of the present invention.
16 is a plan view of the heat spreader of FIG. 15.
17 is a cross-sectional view illustrating a portion of an electronic device to which the heat spreader of the present invention is applied, according to an embodiment.
18 is a cross-sectional view illustrating a part of an electronic device to which the heat spreader of the present invention is applied according to another embodiment.
19 is a cross-sectional view illustrating a part of an electronic device to which the heat spreader of the present invention is applied according to another embodiment.
20 is a photograph showing a smartphone to which the heat pipe and the heat spreader of the comparative example and the embodiment are applied.
21 is a photograph showing the operation of the smartphone of the comparative example and the embodiment.
22 is a photograph of a thermal imaging camera for photographing the activated smartphones of FIG. 21.
23 is a result of photographing a smartphone with a thermal imaging camera when the heat pipe of the comparative example is applied.
24 is a result of photographing a smartphone with a thermal imaging camera when the heat spreader of the embodiment is applied.
25 is a planar photograph of a heat spreader actually manufactured according to an embodiment of the present invention.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity.

The spatially relative terms "below", "beneath", "lower", "bottom", "bottom", "above", "upper", " "Top surface", "top", etc. may be used to easily describe the correlation of one device or components with another device or components.

Although the first, second, etc. are used to describe various components, these components are of course not limited by these terms. These terms are only used to distinguish one component from another. Therefore, of course, the first component mentioned below may be the second component within the technical spirit of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic perspective view of a heat spreader according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1, and FIG. 3 is a plan view of FIG. 1. Is shown.

Hereinafter, a heat spreader according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3.

1 to 3, the heat spreader 1 is opposed to the first plate 110, which is made of a thermally conductive plate, and the first plate 110, and the second plate 120, which is made of a heat conductive plate. And a connection interposed between the first plate member 110 and the second plate member 120 and connected to at least a portion of the first plate member 110 and the second plate member 120, and configured of a thermally conductive plate member. Plate 200 is included. In addition, a portion of the portion connecting the connecting plate 200 in the first plate 110, a portion of the connecting plate 200, and the connecting plate 200 is connected in the second plate 120 At least one or more of some of the portions includes a cavity P formed of empty space.

The first plate member 110 is composed of a thermally conductive plate, and may include, for example, a member having excellent thermal conductivity such as copper, silver aluminum, and the like, and is not particularly limited to any one as long as the member has excellent thermal conductivity. For example, among the thermally conductive members, the copper has a thermal conductivity of 400 W / (mK), and the aluminum has a high thermal conductivity of 237 W / (mK). In addition, the thermally conductive plate may be configured in the form of a thin plate, for example, may have a thickness of less than 0.3mm. In addition, when the thickness direction of the first plate member 110 is referred to as the vertical direction, and the direction in which the plate member is extended to the horizontal direction, it may be a relatively long form extending in the first direction of the horizontal direction.

The second plate member 120 is formed of a thermally conductive plate like the first plate member 110, and may include, for example, a member having excellent thermal conductivity such as copper, silver aluminum, or the like. In addition, it may be made of the same material as the first plate member 110, or may be applied differently by selecting among the thermally conductive members as appropriate. In addition, the first plate 110 is disposed to face each other. Here, the meaning of facing each other means a state in which surfaces of the first plate member 110 and the second plate member 120 face each other, and the thickness of the first plate member 110 and the second plate member 120 defined above. It means a state in which the wide faces face each other in the direction.

The connecting plate 200 may be formed of the same thermal conductive member as the first plate 110 and the second plate 120, and may include, for example, a member having excellent thermal conductivity such as copper, silver aluminum, or the like. have. As a non-limiting example, the first plate member 110, the second plate member 120, the connecting plate member 200 may be formed by processing the same thermal conductive member for convenience of manufacturing.

The first plate member 110, the second plate member 120 and the connecting plate member 200 are all thin and have a thin plate shape extending in a horizontal direction, and may be coupled to each other by surface welding or spot welding. Preferably, the surfaces of the portions overlapping each other may be combined with each other by a kind of surface welding or spot welding that applies pressure and heat as a whole.

Meanwhile, in the present specification and drawings, the first plate member 110, the connecting plate member 200, and the second plate member 120 are described, but in addition to the third plate member (not shown) or the fourth plate member (not shown). A plurality of thin plate-like thermal conductive plates formed of other thermally conductive members may be coupled to each other, and, as necessary, other second connecting plates (not shown), third connecting plates (not shown), etc. may be interposed therebetween. Interposed and connected to each other, the cavity (P) to be described below may also be formed in the space between them as needed. In other words, in the present invention, the structure in which the first plate member 110 and the second plate member 120 are coupled by the connecting plate member 200 is described. However, those skilled in the art may add the number as appropriate and change each other. Can be configured to form a heat spreader.

In addition, in the drawing of the present invention, the length extending in the horizontal direction is relatively short compared to the first plate member 110 or the second plate member 120, but the present invention is not limited thereto. Accordingly, the first plate 110 or the second plate 120 may have the same length, and may be coupled to each other at a specific portion. In this case, the cavity P to be described below is formed at the portion where these are combined. In addition, the portions other than the coupled or connected portions are spaced apart by a predetermined interval, thereby maximizing the heat dissipation effect.

On the other hand, a portion of the connection portion 200 is connected to the first plate member 110, a portion of the connection plate member 200, and the connecting plate member 200 is connected to the second plate member 120 At least one or more of some of the portions includes a cavity P formed of empty space.

The cavity P is formed in each of the components, and may be configured as an empty space. In other words, the empty space defining the cavity P may be a space partitioned by other components. For example, when the cavity P is formed in the first plate member 110, a predetermined space is empty inside the first plate member 110, and the empty space is different from the surrounding of the first plate member 110. It may be shaped to be partitioned by the parts. That is, the cavity P may be defined as a space in which some of them are removed from the first plate member 110, the connecting plate member 200, and the second plate member 120. However, the present invention is not limited thereto and, unlike FIG. 1, the empty space formed by the cavity P may not be completely partitioned by other parts around the empty space, and may be partially opened. In addition, unlike the drawings, the cavity may not be completely penetrated in the vertical direction, and only a part thereof may be formed.

As shown in FIGS. 1 and 2, the cavity P may be formed in all of the first plate member 110, the connecting plate member 200, and the second plate member 120. Specifically, the first plate member 110 includes a first cavity P formed in at least a portion of the portion where the connecting plate member 200 is connected, and the connecting plate member 200 is formed as an empty space therein. It includes a second cavity (P), the second plate member 120 may include a third cavity (P) formed in at least a portion of the connecting plate member 200 is connected. In the present specification, for convenience of description, the cavity located in each of the components will be defined as the first cavity to the third cavity as described above.

The first to third cavities P to P may be formed in portions overlapping each other, and these overlapping portions are located above the heat source portion where heat is dissipated most in the electronic device to be described below. The heat of the heat source can be moved upward by heat conduction. In addition, the heat of the heat source may be concentrated in one part by the cavity P, and may be spread evenly to the other part.

Specifically, if the portion that emits the most heat inside the electronic device is an AP chip that controls the electronic device, the AP chip portion becomes a hot spot due to a large amount of heat dissipation. Due to the nature, the heat transferred to the upper part is mostly concentrated at the top of the hot spot. However, if the cavity (P) is formed in the portion to be located at the top of the hot spot as in the present invention, the cavity (P) portion has an air layer, in the case of the air layer compared to the thermally conductive member described above, the thermal conductivity It is quite low, at 0.0.25 W / (mK), and the heat conduction is dispersed to other parts. Therefore, the heat of the hot spot portion can be concentrated in one place so that it is not transmitted upward, and evenly distributed around the cavity P.

On the other hand, the cavity (P) is formed in a portion of the connecting plate member 200, or is formed in a portion where the connecting plate member 200 and the horizontal cross-section overlaps. Referring to FIGS. 1 and 2, when all of the cavities P are formed in the first plate member 110, the connecting plate member 200, and the second plate member 120, these cavities may be connected to form one cavity. have. That is, it can fully penetrate in the vertical direction of the heat spreader.

4 is a schematic perspective view of a heat spreader according to another embodiment of the present invention, and FIG. 5 is a cross-sectional view taken along the line BB ′ of the heat spreader 2 of FIG. 4.

4 and 5, in the heat spreader 2, the second cavity formed as an empty space inside the connecting plate 201 and the second cavity formed in the second plate 121 are the first plate 111. Can be nested with That is, the cavity is not formed in the first plate member 110, and the cavity P may be formed only in the connection plate member 201 and the second plate member 121, and the cavity P may be formed of the first plate member 111. It can be included in the plane. This does not form a cavity in the first plate member 111 that is located closest to the heat source, thereby primarily increasing the heat transfer area to the portion where heat from the heat source is primarily transferred, and the cavity P above the first plate member 111. By heat transfer to the upper side can be distributed evenly.

FIG. 6 is a schematic perspective view of a heat spreader according to still another embodiment of the present invention, and FIG. 7 is a cross-sectional view of the heat spreader 3 of FIG. 6 taken along line CC ′.

6 and 7, the cavity P may be formed only on the second plate 122 in the heat spreader 3. This effectively receives the heat of the heat source from the first plate member 112 to a larger area, and effectively transfers heat from the connecting plate member 202 to the second plate member 122 on the upper side, while forming a cavity formed in the second plate member 122. By (P), it is possible to evenly disperse heat at the top.

FIG. 8 is a schematic perspective view of a heat spreader according to another embodiment of the present invention, and FIG. 9 is a cross-sectional view of the heat spreader 4 of FIG. 8 taken along line D-D '. 10 is a plan view of the heat spreader 4 of FIG. 8.

8 to 10, the cavity P is not visually recognized from the outside of the heat spreader 4, and the first plate material 113 is formed so that the second cavity P is present only in the connection plate material 203 located inside. Heat is distributed evenly in the process of transferring heat to the second plate member 123, and when the heat is radiated to the upper side of the second plate member 123 again, the contact area can be expanded to maximize the heat dissipation effect.

1 to 10, the cavity of the present invention can be appropriately adjusted by the person skilled in the art according to the use environment, the shape or structure of the device used, and the like appropriately.

11 is a schematic perspective view of a heat spreader according to still another embodiment of the present invention, and FIG. 12 is a plan view of the heat spreader 5 of FIG. 11.

Referring to FIGS. 11 and 12, the heat spreader 5 may further include a trimming portion R that is horizontally opened on at least a portion of the second plate member 124. In more detail with respect to the trimming portion R, the first plate member 114 and the second plate member 124 extend in a first direction and a second direction perpendicular to the first direction in a horizontal direction, When it is relatively extended in the first direction, the trimming portion R may be formed in the second direction. In FIG. 11, the second plate member 124 may be formed by opening in a shorter extending direction on a horizontal cross section.

The air present in the cavity P may be freely introduced into and out of the cavity P by the trim part R. FIG. This is to allow the air layer inside the cavity having a thermal insulation effect to continue the thermal insulation effect by exchanging with the outside air when the thermal insulation function is reduced by a lot of heat. To this end, the trimming portion R may be connected to the cavity P, that is, the cavity P may be extended.

FIG. 13 shows a schematic perspective view of a heat spreader according to another embodiment of the invention, and FIG. 14 shows a top view of the heat spreader 6 of FIG. 13.

13 and 14, in the heat spreader 6, a plurality of trimming portions R may be formed at positions facing each other. As a result, the air inside and outside the cavity P may be exchanged in both directions, thereby maximizing a thermal insulation effect, and through this, heat at a hot spot may be more continuously and evenly distributed and transferred upward.

FIG. 15 shows a schematic perspective view of a heat spreader according to another embodiment of the invention, and FIG. 16 shows a plan view of the heat spreader 7 of FIG. 15.

Referring to FIGS. 15 and 16, the recess R in the heat spreader 7 may be formed by opening in the horizontal direction in the connecting plate member 206. On the other hand, unlike FIG. 15, the connecting plate member 206 may be formed in the first direction when the length difference between the first direction and the second direction described above is not large.

On the other hand, in the above drawings it is shown that a plurality of trimming portion (R) in one direction or opposite to each other on the second plate or connecting plate, it can be arranged, as shown in Figure 11 to 16, the trimming portion (R) ) May be formed by horizontally opening at least a portion of the first plate member to which the connecting plate member is connected, at least a part of the connecting plate member or at least a portion of the second plate member to which the connecting plate member is connected. , They may be combined with each other.

On the other hand, although not separately shown, the heat spreader of the present invention further improves heat dissipation characteristics on one or both surfaces of the first plate material, on one or both surfaces of the second plate material, and / or on one or both surfaces of the connecting plate material. Heat radiation material may be applied to make.

The heat spreader of the present invention can be freely manufactured even when there is bending in the vertical direction or the horizontal direction by stacking and connecting a plurality of thin plate-shaped thermal conductive plates, and also loses its function due to external impact or dip. There is very little to do. In addition, the production is very easy by combining the thermally conductive plate material.

On the other hand, Figure 17 is a cross-sectional view showing a portion of the electronic device to which the heat spreader of the present invention is applied according to an embodiment of the present invention.

Referring to FIG. 17, an electronic device according to an exemplary embodiment of the present disclosure is described. An electronic device includes a heat source 320 electrically connected to a circuit board 310 and the heat source 320 interposed between the circuit board 310. And a shielding unit 330 formed to surround the heat dissipation unit, a heat spreader disposed on the shielding unit 330, and a heat spreader 400 disposed on the heat spreader and formed of a metal plate material. It is characterized in that the heat spreader of the present invention described.

The heat source 320 is a portion that radiates heat inside the electronic device, and may be, for example, an AP chip that controls the electronic device. In addition, the circuit board 310 may be an FPCB, a PCB, or the like electrically connected from a portion defined by the heat source 320. The shielding unit 330 may be for protecting the heat source 320 from external impact or blocking electromagnetic waves.

On the other hand, the heat sink 400 serves to discharge the heat transferred from the heat spreader located in the lower portion to the outside of the electronic device. The heat sink 400 is formed of a material having a high thermal conductivity in the form of a plate material, which is well known in the art, a detailed description thereof will be omitted.

Meanwhile, the first plate member 110 of the heat spreader may be disposed on the shielding unit, and the connection plate member 200 and the heat source 320 may be disposed to overlap each other in the vertical direction. In other words, by receiving the heat of the heat source from the first plate member 110 to be transferred to the upper portion, by placing the connecting plate 200 on the top of the most heat source 320, it is possible to effectively transfer heat.

In addition, the cavity (P) and the heat source of the heat spreader may be arranged to overlap each other in the vertical direction. As a result, the heat source 320, that is, the heat concentrated from the hot spot to the upper portion is transmitted while being evenly distributed to the periphery, so that the heat is evenly distributed and transmitted over the entire area to the upper heat sink 400.

The heat spreader may include a heat dissipation adhesive 450 interposed between the second plate member 120 of the heat spreader and the heat dissipation plate 400, and a heat dissipation tape having thermal conductivity. The heat dissipation adhesive 450 is disposed between the heat dissipation plate 400 and the second plate member 120 to be in direct contact with the heat dissipation plate 400 and the second plate member 120 to serve as a heat transfer therebetween. Thermal interface material). The heat dissipation adhesive 450 may be a heat dissipation adhesive having excellent thermal conductivity or a heat dissipation tape. For example, the heat dissipation adhesive 450 may have a thermal conductivity of 2 W / (mk) to 5 W / (mk).

By connecting the heat spreader and the heat sink using a heat radiation adhesive 450 or a heat radiation tape having a high thermal conductivity as described above, it is possible to implement the excellent heat dissipation function by allowing the heat of the lower portion to be transferred to the heat sink with high heat transfer efficiency. For example, in the case of using the heat radiation adhesive 450, the heat spreader and the heat sink by heat-bonding at a temperature of 80 ℃ to 120 ℃ after coating the heat radiation adhesive on the surface bonded to the heat spreader of the heat sink 400 ( It is possible to prevent the loss of heat transfer by minimizing the formation of voids or pores between 400).

The electronic device may include a heat dissipation adhesive 350 interposed between the shielding unit 330 and the first plate member 110 of the heat spreader, or a heat dissipation tape having thermal conductivity.

The heat dissipation adhesive 350 may be formed of a conductive material having high heat transfer efficiency, and may be stretched to increase the maximum contact area with the upper side of the shielding unit 330. That is, the roughness (Roughness) of the upper surface of the shielding unit 330 may be high, but the first plate member 110 and the shielding unit 330 by the heat dissipation adhesive 350 while adhering to each other of the shielding unit 330 The roughness can be compensated for to increase the heat transfer efficiency. The heat radiation adhesive 350 is well known in the art, and a detailed description thereof will be omitted.

18 and 19 are cross-sectional views of an electronic device according to another embodiment of the present invention. Referring to FIGS. 18 and 19, the cavity P is formed in the connecting plate 201 and the second plate 121. The second plate member 111 may not be formed or may be formed only on the connecting plate member 202 as shown in FIG. 19. That is, FIG. 18 may be a heat spreader 2 as shown in FIG. 4, and FIG. 19 may be a heat spreader 4 as shown in FIG. 8. On the other hand, since the effects of the arrangement of these cavities have already been described above, overlapping descriptions will be omitted.

17 to 19, the heat spreader of various embodiments described in the heat spreader may be applied to the electronic device.

Hereinafter, the present invention will be described in more detail with reference to specific examples and comparative examples. However, the following examples are intended to help the understanding of the specification and the following contents are not intended to limit the contents of the present invention.

Comparative example

As shown in the left side of FIG. 20, a heat pipe was prepared and installed in an AP chip portion corresponding to a heat source that emits the most heat in the smartphone.

Example

As shown in the right side of FIG. 20, a heat spreader according to an embodiment of the present invention is prepared and installed on an AP chip portion corresponding to a heat source that emits the most heat in a smartphone.

Measurement example

As shown in FIG. 21, the smartphones of the comparative example and the example were simultaneously operated and photographed from the top using a thermal imaging camera (model name FLIR T420) as shown in FIG. 22.

The photographing result of the comparative example is shown in FIG. 23, and the photographing result of the Example is shown in FIG.

As shown in FIG. 23, in the case of the comparative example, it can be confirmed that heat is concentrated at a portion corresponding to a heat source, that is, a hot spot. Therefore, it is possible to confirm that the heat dissipation area is small because a lot of heat is concentrated in one place in the portion where the AP chip corresponding to the heat source exists.

On the other hand, in FIG. 24, which is a result of the embodiment to which the heat spreader of the present invention is applied, it can be seen that a lot of heat in the portion where the AP chip is present is not concentrated in the hot spot portion, but is diffused to the peripheral portion in comparison with the comparative example.

Therefore, in the case of the electronic device to which the heat spreader of the present invention is applied, it can be confirmed that there is an excellent effect of dissipating heat to the outside while spreading the heat of the hot spot portion where the most heat is generated more evenly to the peripheral portion.

Meanwhile, FIG. 25 is a plan view of a heat spreader actually manufactured according to an embodiment of the present invention. Referring to this, the heat spreader may be formed according to the first plate, the second plate, and / or the connecting plate as necessary. The thickness, area, etc. can be appropriately modified, bent in the horizontal direction, and can be freely modified to suit the internal structure of the electronic device to which the shape is applied.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments but may be manufactured in various forms, and having ordinary skill in the art to which the present invention pertains. It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

1, 2, 3, 4, 5, 6, 7: Heat spreader
110, 111, 112, 113, 114, 115, 116: first plate
120, 121, 122, 123, 124, 125, 126: second plate
200, 201, 202, 203, 204, 205, 206: connecting plate
310: circuit board
320: heat source
330: shielding unit
350: heat resistant adhesive
400: heat sink
450: heat resistant adhesive
P: Cavity
R: trim
H: heat

Claims (13)

A first plate composed of a thermally conductive plate;
A second plate facing the first plate and composed of a thermally conductive plate; And
And a connection plate member interposed between the first plate member and the second plate member, connected to at least a portion of the first plate member and the second plate member, and formed of a thermally conductive plate member.
At least one of a portion of the first plate member to which the connecting plate member is connected, a part of the connecting plate member, and a portion of the second plate member to which the connecting plate member is connected include a cavity including a cavity formed as an empty space. Spreader. The method of claim 1,
The first plate member includes a first cavity formed in at least a portion of the portion connecting the connecting plate member,
And the first cavity is formed inside a portion overlapping with an outer edge of the connecting plate material. The method of claim 1,
The connecting plate member is a heat spreader including a second cavity formed into an empty space inside. The method of claim 1,
The second plate member includes a third cavity formed in at least a portion of the portion connecting the connecting plate member,
The third cavity is a heat spreader, characterized in that formed inside the portion overlapping with the outer edge of the connecting plate material. The method of claim 1,
The connecting plate member includes a second cavity formed into an empty space therein,
The second plate member includes a third cavity formed in at least a portion of the portion connecting the connecting plate member,
And said second cavity and said third cavity overlap with said first plate material. The method of claim 1,
At least a portion of the first plate member to which the connecting plate member is connected, at least a part of the connecting plate member or at least a part of the second plate member to which the connecting plate member is connected, further includes a heat spreader. . The method of claim 6,
When the first plate and the second plate member extends in the first direction of the horizontal direction and the second direction perpendicular to the first direction, and extends relatively longer in the first direction,
And the trimmed portion is formed in the second direction. The method of claim 6,
And a plurality of trim portions formed at positions facing each other. Circuit board;
A heat source electrically connected to the circuit board;
A shielding unit formed to surround the heat source with the circuit board;
A heat spreader disposed on the shielding unit; And
And a heat sink disposed on the heat spreader and configured of a metal plate material.
The heat spreader is an electronic device, characterized in that the heat spreader of any one of claims 1 to 8. The method of claim 9,
And the first plate member of the heat spreader is disposed on the shielding unit, and the connection plate member and the heat source are disposed to overlap each other in the vertical direction. The method of claim 10,
And the cavity and the heat source of the heat spreader are disposed to overlap each other in the vertical direction. The method of claim 9,
And a heat dissipating adhesive or a heat conductive heat dissipating tape interposed between the shielding unit and the first plate of the heat spreader and adhering the shielding unit. The method of claim 9,
And a heat dissipation adhesive or a heat conductive heat dissipation tape interposed between the second plate member of the heat spreader and the heat dissipation plate to adhere the heat spreader.

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