Utility model content
The utility model proposes a kind of new structure of controller of fan, by reducing the area of high heat-conduction circuit board, save cost of manufacture thereby realize.
In order to achieve the above object, the technical scheme that the utility model adopts is:
A kind of controller of fan, comprising:
Power is the Equations of The Second Kind power device lower than predetermined power higher than the first kind power device of predetermined power and power;
First circuit board, integrated described first kind power device on described first circuit board;
Second circuit board, integrated described Equations of The Second Kind power device on described second circuit board;
Wherein, described first circuit board and described second circuit board lamination arrange.
As further improvement of the utility model, described first circuit board is integrated with the side that a side of power device and described second circuit board be integrated with power device and is oppositely arranged.
As further improvement of the utility model, described first circuit board is integrated with the side that the opposing opposite side of power device one side and described second circuit board be integrated with power device and is oppositely arranged.
As further improvement of the utility model, described first circuit board is integrated with a side of power device and described second circuit board and is integrated with the opposing opposite side of power device one side and is oppositely arranged.
As further improvement of the utility model, described first circuit board is integrated with the opposing opposite side of power device one side and described second circuit board and is integrated with the opposing opposite side of power device one side and is oppositely arranged.
As further improvement of the utility model, between described first circuit board and described second circuit board, be electrically connected by connector.
As further improvement of the utility model, on described first circuit board, be printed with the circuit that 2oz copper is thick, described circuit live width is 5.95mm.
As further improvement of the utility model, on described second circuit board, be printed with the circuit that 1oz copper is thick, described line width is 11.9mm.
As further improvement of the utility model, described first kind power device comprises inductance and/or electric capacity and/or metal-oxide-semiconductor and and/or detection resistance.
As further improvement of the utility model, described Equations of The Second Kind power device comprises predrive chip and/or MCU chip and and/or sampling filter.
Compared with prior art, controller of fan of the present utility model is by integrated high power device paramount heat-conduction circuit board, low-power device is integrated into ordinary circuit board, thereby reduce the area of high heat-conduction circuit board, save the cost of manufacture of circuit board, high heat-conduction circuit board and ordinary circuit board lamination are arranged simultaneously, improved space availability ratio.
Embodiment
Below with reference to embodiment shown in the drawings, the utility model is described in detail.But these execution modes do not limit the utility model, the conversion in structure, method or function that those of ordinary skill in the art makes according to these execution modes is all included in protection range of the present utility model.
In the utility model, controller of fan includes some power devices, and it is integrated on circuit board, the work that cooperatively interacts between each power device, thus form controller of fan, play the effect of heat radiation.These some power devices comprise power higher than the first kind power device of predetermined power and power the Equations of The Second Kind power device lower than predetermined power, this Equations of The Second Kind power can be considered that produced heat is very little.Especially, in present embodiment, the circuit board that controller of fan uses includes first circuit board 1 and second circuit board 2.Wherein, first circuit board 1 is selected the circuit board of high heat conduction and is integrated with first kind power device, and 2 of second circuit boards are selected ordinary circuit board and are integrated with Equations of The Second Kind power device.In present embodiment, circuit board mainly needs to consider whether meet power demand, and anti-electromagnetic interference capability.Preferably, by first circuit board 1 and second circuit board 2 lamination settings, its lamination setting can reduce the volume of controller of fan module, prior can reducing production costs.
Shown in please refer to the drawing 1, in an execution mode of the present utility model, first circuit board 1 is integrated with the side that a side of power device and second circuit board 2 be integrated with power device and is oppositely arranged.Wherein, between first circuit board 1 and second circuit board 2, be electrically connected by connector 3.The laminated construction of this second circuit board 2 and second circuit board 2, had both saved cost, had improved space availability ratio simultaneously.Preferably; this execution mode is preferred forms of the present utility model; one side first circuit board 1 to power device and second circuit board 2 have the relative lamination setting of a side of power device; so not only improve space availability ratio; and power device is integrated on circuit board and has certain protective effect, avoid the damage causing outside because power device is exposed.In the present embodiment, first circuit board 1 is high-power plate, and first kind power device placed thereon comprises inductance and/or electric capacity and/or metal-oxide-semiconductor and and/or detects other high power devices such as resistance.On this first circuit board 1, be printed with the circuit that 2oz copper is thick, its circuit live width is 5.95mm.Second circuit board 2 is small-power plate, and Equations of The Second Kind power device placed thereon comprises predrive chip and/or MCU chip and and/or the low-power device such as sampling filter.On this second circuit board 2, be printed with the circuit that 1oz copper is thick, its line width is 11.9mm.Especially, on first circuit board 1, also can be provided with radiator, to assist first kind power device heat radiation on first circuit board 1.
As shown in Figure 2, in another execution mode of the present utility model, first circuit board 1 is integrated with the side that the opposing opposite side of power device one side and second circuit board 2 be integrated with power device and is oppositely arranged.Wherein, between first circuit board 1 and second circuit board 2, be electrically connected by connector 3.The laminated construction of this second circuit board 2 and second circuit board 2, had both saved cost, had improved space availability ratio simultaneously.In the present embodiment, first circuit board 1 is high-power plate, and first kind power device placed thereon comprises inductance and/or electric capacity and/or metal-oxide-semiconductor and and/or detects other high power devices such as resistance.On this first circuit board 1, be printed with the circuit that 2oz copper is thick, its circuit live width is 5.95mm.Second circuit board 2 is small-power plate, and Equations of The Second Kind power device placed thereon comprises predrive chip and/or MCU chip and and/or sampling filter etc.On this second circuit board 2, be printed with the circuit that 1oz copper is thick, its line width is 11.9mm.Especially, on first circuit board 1, also can be provided with radiator, to assist first kind power device heat radiation on first circuit board 1.
As shown in Figure 3, in another execution mode of the present utility model, first circuit board 1 is integrated with the opposite side that a side of power device and second circuit board 2 be integrated with the opposing side of power device and is oppositely arranged.Wherein, between first circuit board 1 and second circuit board 2, be electrically connected by connector 3.The laminated construction of this second circuit board 2 and second circuit board 2, had both saved cost, had improved space availability ratio simultaneously.In the present embodiment, first circuit board 1 is high-power plate, and first kind power device placed thereon comprises inductance and/or electric capacity and/or metal-oxide-semiconductor and and/or detects other high power devices such as resistance.On this first circuit board 1, be printed with the circuit that 2oz copper is thick, its circuit live width is 5.95mm.Second circuit board 2 is small-power plate, and Equations of The Second Kind power device placed thereon comprises predrive chip and/or MCU chip and and/or sampling filter.On this second circuit board 2, be printed with the circuit that 1oz copper is thick, its line width is 11.9mm.Especially, on first circuit board 1, also can be provided with radiator, to assist first kind power device heat radiation on first circuit board 1.
As shown in Figure 4, in another execution mode of the present utility model, first circuit board 1 is integrated with the opposite side that the opposite side of the opposing side of power device and second circuit board 2 be integrated with the opposing side of power device and is oppositely arranged.Wherein, between first circuit board 1 and second circuit board 2, be electrically connected by connector 3.The laminated construction of this second circuit board 2 and second circuit board 2, had both saved cost, had improved space availability ratio simultaneously.In addition, between first circuit board 1 and second circuit board 2 laminations, other structures of all right accommodating controller of fan, play the effect of protection.In the present embodiment, first circuit board 1 is high-power plate, and first kind power device placed thereon comprises inductance and/or electric capacity and/or metal-oxide-semiconductor and and/or detects other high power devices such as resistance.On this first circuit board 1, be printed with the circuit that 2oz copper is thick, its circuit live width is 5.95mm.Second circuit board 2 is small-power plate, and Equations of The Second Kind power device placed thereon comprises predrive chip and/or MCU chip and and/or sampling filter.On this second circuit board 2, be printed with the circuit that 1oz copper is thick, its line width is 11.9mm.Especially, on first circuit board 1, also can be provided with radiator, to assist first kind power device heat radiation on first circuit board 1.
In the utility model, controller of fan, by integrated high power device paramount heat-conduction circuit board, is integrated into ordinary circuit board by low-power device, thereby has reduced the area of high heat-conduction circuit board, has saved the cost of manufacture of circuit board.High heat-conduction circuit board and ordinary circuit board lamination are arranged simultaneously, improved space availability ratio.
Be to be understood that, although this specification is described according to execution mode, but be not that each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should make specification as a whole, technical scheme in each execution mode also can, through appropriately combined, form other execution modes that it will be appreciated by those skilled in the art that.
Listed a series of detailed description is above only illustrating for feasibility execution mode of the present utility model; they are not in order to limit protection range of the present utility model, all do not depart from the equivalent execution mode that the utility model skill spirit does or change and all should be included in protection range of the present utility model within.