CN202196771U - Novel two-side cooler used for electromobile semiconductor - Google Patents
Novel two-side cooler used for electromobile semiconductor Download PDFInfo
- Publication number
- CN202196771U CN202196771U CN2011203063659U CN201120306365U CN202196771U CN 202196771 U CN202196771 U CN 202196771U CN 2011203063659 U CN2011203063659 U CN 2011203063659U CN 201120306365 U CN201120306365 U CN 201120306365U CN 202196771 U CN202196771 U CN 202196771U
- Authority
- CN
- China
- Prior art keywords
- semiconductor
- coldplate
- novel
- electromobile
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a novel two-sided cooler used for an electromobile semiconductor, which is connected with the semiconductor. Radiating plates are installed at two ends of the semiconductor and contacted with the semiconductor in facing mode, and a cooling plate is installed on the other face of each radiating plates. Further, an insulation plate is arranged between each radiating plate and each cooling plate, and the cooling plates are aluminum water circulation cooling plates. Due to the fact that the cooling plates are arranged at two ends of the semiconductor, radiating efficiency of the semiconductor is remarkably improved. Compared with the traditional single-side coolers, the two-side cooler is provided with thermal resistance reduced by about 50%, thereby facilitating working stability of an electrical system of an electromobile.
Description
Technical field
The utility model relates to a kind of peltier cooler, relate in particular to a kind of significantly improve semi-conductive radiating efficiency be used for the semi-conductive novel two-sided cooler of electric automobile.
Background technology
In the Circuits System of electric automobile; PCU (power control unit) main body is made up of control backplane circuit, power semiconductor, cascade type cooler and capacitor etc., and PCU has type of voltage step-up and inverter function, is the important component part of electric automobile Circuits System; But its heating is very fast; So, in order to guarantee the PCU operate as normal, how to dispel the heat to become a major issue.
Main heat generating components is a power semiconductor among the PCU; Along with the power of electric automobile constantly increases; Its semi-conductive caloric value also constantly increases, and the electric current that flows through on the semiconductor element of large power, electrically electrical automobile even reach more than the 300A can produce a large amount of heat energy; If can not high efficiency and heat radiation, cause the damage of Circuits System probably.
The heat dissipating method of conventional semiconductor element; Be to be close to the installation coldplate at a semi-conductive end face, coldplate is generally realized low temperature through the cold water circulation, and it is no problem that this structure is used in the small power electric electrical automobile; But in the large power, electrically electrical automobile with regard to something wrong; Its radiating effect is not good, often causes the Circuits System strike because conductor temperature is too high, after the cooling a period of time of stopping using, recovers normal again.This has more seriously had influence on the development of electric automobile industry.
Summary of the invention
The purpose of the utility model with regard to be to provide in order to address the above problem a kind of significantly improve semi-conductive radiating efficiency be used for the semi-conductive novel two-sided cooler of electric automobile.
The utility model is realized above-mentioned purpose through following technical scheme:
The utility model is connected with semiconductor, and said semi-conductive two ends all are equipped with heating panel, and said heating panel contacts with said semiconductor surface face, and the another side of said heating panel is equipped with coldplate.
Further, also be provided with insulation board between said heating panel and the said coldplate; Said coldplate is an aluminium boiler water circulation coldplate.
Though the utility model structure is simple, owing to dispelled the heat in the semiconductor two ends simultaneously, efficient almost reaches the twice of single face cooler, so effect is very significant.
The beneficial effect of the utility model is:
Owing to dispelled the heat in the semiconductor two ends simultaneously; And use heating panel and insulation board to assist heat conduction; Enlarged area of dissipation, so the efficient of the utility model almost reaches the twice of single face cooler, its radiating effect significantly improves; Help guaranteeing electric automobile Circuits System operate as normal, lay the first stone for electric automobile develops to the high-power direction.
Description of drawings
Accompanying drawing is the structural representation of the utility model.
Embodiment
Below in conjunction with accompanying drawing the utility model is described further:
Shown in accompanying drawing, the utility model is connected with semiconductor 3, and the two ends of semiconductor 3 all are equipped with heating panel 5, and 3 faces of heating panel 5 and semiconductor contact, and the another side of heating panel 5 is close to insulation board 4 is installed, and 2 faces of the another side of insulation board 4 and coldplate contact.
Shown in accompanying drawing, coldplate 2 is an aluminium boiler water circulation coldplate.
Shown in accompanying drawing, heating panel 5 is packaged together through potting resin 6 with semiconductor 3, and simultaneously packed also have current terminal 1 and control terminal 8, and semiconductor 3 and control terminal 87 link together through going between.
In conjunction with accompanying drawing, the utility model is processed to the cascade type structure.In the course of processing, earlier overlapping some coldplates 2 are accomplished the making of coldplate group, and overlapping then semiconductor 3 inserts the coldplate group with semiconductor 3 again.For the ease of inserting semiconductor 3, can increase the interval between the coldplate, but at interval can not be too big; If between coldplate 2 and the semiconductor 3 space is arranged, then can reduce the performance of semiconductor 3, so; After inserting semiconductor 3; Also on the coldplate 2 at two ends, pressurize, each semiconductor 3 is all fitted tightly with the coldplate 2 on both sides, guarantee that the performance of semiconductor 3 is constant.
Though the utility model structure is simple, owing to dispelled the heat simultaneously in semiconductor 3 two ends simultaneously, its radiating efficiency almost reaches the twice of single face cooler, so effect is very significant.
Claims (3)
1. one kind is used for the semi-conductive novel two-sided cooler of electric automobile; Be connected with semiconductor; It is characterized in that: said semi-conductive two ends all are equipped with heating panel, and said heating panel contacts with said semiconductor surface face, and the another side of said heating panel is equipped with coldplate.
2. the semi-conductive novel two-sided cooler of electric automobile that is used for according to claim 1 is characterized in that: also be provided with insulation board between said heating panel and the said coldplate.
3. the semi-conductive novel two-sided cooler of electric automobile that is used for according to claim 1 and 2, it is characterized in that: said coldplate is an aluminium boiler water circulation coldplate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203063659U CN202196771U (en) | 2011-08-22 | 2011-08-22 | Novel two-side cooler used for electromobile semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203063659U CN202196771U (en) | 2011-08-22 | 2011-08-22 | Novel two-side cooler used for electromobile semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202196771U true CN202196771U (en) | 2012-04-18 |
Family
ID=45951670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203063659U Expired - Fee Related CN202196771U (en) | 2011-08-22 | 2011-08-22 | Novel two-side cooler used for electromobile semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202196771U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104097382A (en) * | 2013-04-11 | 2014-10-15 | 三星显示有限公司 | Device for cooling bonding layer of display device and method for separating panel |
| CN104966706A (en) * | 2015-07-20 | 2015-10-07 | 南通明诺机械有限公司 | Integrated power control unit (PCU) |
| CN109906020A (en) * | 2019-01-07 | 2019-06-18 | 深圳市环宇鼎鑫科技有限公司 | A kind of power module of battery management system |
| CN111158411A (en) * | 2020-01-17 | 2020-05-15 | 深圳市曼恩斯特科技有限公司 | Constant temperature device |
-
2011
- 2011-08-22 CN CN2011203063659U patent/CN202196771U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104097382A (en) * | 2013-04-11 | 2014-10-15 | 三星显示有限公司 | Device for cooling bonding layer of display device and method for separating panel |
| CN104097382B (en) * | 2013-04-11 | 2018-10-19 | 三星显示有限公司 | The device of the cooling adhesive layer for showing equipment and the method for detaching panel |
| CN104966706A (en) * | 2015-07-20 | 2015-10-07 | 南通明诺机械有限公司 | Integrated power control unit (PCU) |
| CN109906020A (en) * | 2019-01-07 | 2019-06-18 | 深圳市环宇鼎鑫科技有限公司 | A kind of power module of battery management system |
| CN109906020B (en) * | 2019-01-07 | 2020-07-21 | 深圳市环宇鼎鑫科技有限公司 | Power module of battery management system |
| CN111158411A (en) * | 2020-01-17 | 2020-05-15 | 深圳市曼恩斯特科技有限公司 | Constant temperature device |
| CN111158411B (en) * | 2020-01-17 | 2021-05-18 | 深圳市曼恩斯特科技股份有限公司 | Constant temperature device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: DALI YANGBI ANYI ELECTROMBILE INDUSTRY CO., LTD. Free format text: FORMER OWNER: SICHUAN SOFTWARE TESTING TECHNOLOGY TESTING CENTER CO., LTD. Effective date: 20130306 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 610000 CHENGDU, SICHUAN PROVINCE TO: 672599 DALI BAI AUTONOMOUS PREFECTURE,YUNNAN PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130306 Address after: 672599 Hexi village, Yangbi Yi Autonomous County, Dali Bai Autonomous Prefecture, Yunnan, Cangshan Province Patentee after: Dali Yangbi Anyi Electrombile Industry Co., Ltd. Address before: 108, room 6, building 1480, hi tech incubator Park, north section of Tianfu Road, Chengdu hi tech Zone, Sichuan, 610000 Patentee before: Sichuan Software Measurement Technology Inspection Center Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120418 Termination date: 20140822 |
|
| EXPY | Termination of patent right or utility model |