CN1318937C - Non-fan cooling device for CPU of passive baseplate type engineering controlled computer - Google Patents
Non-fan cooling device for CPU of passive baseplate type engineering controlled computer Download PDFInfo
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- CN1318937C CN1318937C CNB200510026459XA CN200510026459A CN1318937C CN 1318937 C CN1318937 C CN 1318937C CN B200510026459X A CNB200510026459X A CN B200510026459XA CN 200510026459 A CN200510026459 A CN 200510026459A CN 1318937 C CN1318937 C CN 1318937C
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- heat
- cpu
- radiating fin
- heat radiating
- fan
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Abstract
The present invention relates to a heat radiating device of a central processing unit (CPU) of an industrial control computer, more specifically to a heat radiating device without a fan of a central processing unit (CPU) of a passive soleplate type industrial control computer. The present invention is characterized in that the back end surface of a CPU base is connected with a heat insulating bin which is in a cavity structure; a circular hole is formed in the right end surface of the heat insulating bin, and a heat radiating patch plate of a CPU, a heat conducting pipe and a fixed seat of the heat conducting pipe are respectively installed from front to back in the heat insulating bin; one end of the heat conducting pipe, which extends from the circular hole in the right end surface of the heat insulating bin, is connected with a heat radiating mechanism composed of a front heat radiating wing piece, a fixed frame of heat radiating equipment, a back heat radiating wing piece and a semiconductor refrigeration piece. Compared with the prior art, the present invention has the advantages that the structure is novel; the heat radiating problem in a case is well solved; the service life of the heat radiating device is extended; the reliability of the heat radiating device is enhanced; the damage to other components because of the changing time and the changing process of a fan is reduced; the noise caused by a traditional CPU fan with large power is reduced; the fixed frame of heat radiating equipment is installed, and the installation is firm.
Description
[technical field]
The present invention relates to the heat abstractor of industrial control computer CPU, the heat radiator without fan of specifically a kind of CPU of passive baseplate type industrial computer.
[background technology]
Along with making rapid progress of development in science and technology, computing machine is also in development at full speed.Industry control circle is no exception, the present treatable incident of the computing machine of industry spot speed also more and more, that handle are also more and more faster, yet, in the quick computing of computing machine, exectorial while, the various devices of computing machine especially central processor CPU can produce higher temperature, particularly in industry spot, under hot environment, cpu temperature is higher.Generally be to adopt the cpu fan heat radiation to high performance CPU heat dissipating method at present, traditional cpu fan cooling system comprises: radiating fin, fan.Because the frequency of CPU makes its power consumption also big more more and more sooner, traditional cpu fan cooling system is in order to provide enough heat dissipation capacity radiating fin also just bigger, heavier, and the rotating speed and the volume of fan also increase.Though this method has solved the heat dissipation problem of hot environment, the problem that can not be ignored is: the one, and fan belongs to machinery product, and the life-span is limited, in case the cpu fan damage can cause stopping accident at once; The 2nd, the radiating fin between fan and the CPU along with the increase of CPU power consumption is also more and more heavier, in industrial computer dispatches from the factory shipping, damages the cpu fan mounting bracket through regular meeting because of the reason of carrying; The 3rd, the fan that runs up also brings higher machine noise, and all between 55 ~ 60 decibels, the dead of night in the air-conditioned room, operator on duty are difficult to the such sound of tolerance to the noise objective of general industry computing machine.
[summary of the invention]
The present invention is in order to overcome above-mentioned defective, the heat radiator without fan of a kind of CPU of passive baseplate type industrial computer is provided, utilization heat pipe, radiating fin, the heat conduction of semiconductor chilling plate, the physical characteristics of heat radiation have reduced failure rate, have improved unfailing performance.
For achieving the above object, design the heat radiator without fan of a kind of CPU of passive baseplate type industrial computer, comprise the CPU base, heat insulation storehouse, the CPU pasting board that dispels the heat, heat pipe, the heat pipe holder, cooling mechanism is formed, CPU base 1 rear end face connects heat insulation storehouse 2, heat insulation storehouse 2 is a cavity structure, 2 right sides, heat insulation storehouse have circular hole 3,2 inside, heat insulation storehouse are respectively equipped with CPU heat radiation pasting board 4 to forward direction, heat pipe 5 and heat pipe holder 6, the end that heat pipe 5 extends out in the 2 right side circular holes 3 of heat insulation storehouse connects by preceding radiating fin, the heat dissipation equipment fixed mount, back radiating fin, this cooling mechanism that semiconductor chilling plate is formed, the heat dissipation equipment fixed mount front end face of described this cooling mechanism has square groove, heat dissipation equipment fixed mount left side is provided with the baffle plate fixed strip, preceding radiating fin is fixed on the heat dissipation equipment fixed mount front end face, back radiating fin is fixed on the heat dissipation equipment fixed mount rear end face, by a heat pipe part that extends out in the circular hole 3 in the groove that preceding radiating fin and back have between the radiating fin, back radiating fin inside is provided with semiconductor chilling plate, and the input end of semiconductor chilling plate connects direct current current stabilization module; CPU base, heat pipe, preceding radiating fin, back radiating fin adopt good metal or the metal alloy compositions of thermal conductivity to make.
The present invention compares with prior art, novel structure, easy to use, utilization heat pipe, radiating fin, semiconductor chilling plate, the physical characteristics of heat conduction, heat radiation has better solved the heat dissipation problem in the cabinet to the CPU heat radiation of passive baseplate type industrial control computer, prolong heat abstractor serviceable life, increased the heat abstractor reliability, reduced because of fan and change in time and the replacing process, reduced the noise that traditional high-power cpu fan brings the damage of other parts; Be provided with the heat dissipation equipment fixed mount, install more firm.
[description of drawings]
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the right view of Fig. 1;
Fig. 3 is a stereographic map of the present invention;
Fig. 4 is equipment figure of the present invention;
Fig. 5 is an installation diagram of the present invention;
Referring to Fig. 1, Fig. 2, Fig. 4, Fig. 5,1 is the CPU base, and 2 is heat insulation storehouse, and 3 is circular hole, 4 are CPU heat radiation pasting board, and 5 is heat pipe, and 6 is the heat pipe holder, and 7 is the heat dissipation equipment fixed mount, 8 is preceding radiating fin, and 9 is the back radiating fin, and 10 is semiconductor chilling plate, 11 is CPU board, and 12 is left end, and 13 is the bottom, 14 is the baffle plate fixed strip, and 15 is computer bottom plate, and 16 is slot, 17 is cabinet, and 18 is guide channel, and 19 is the cabinet rear portion.
[embodiment]
The present invention will be further described below in conjunction with accompanying drawing:
Referring to Fig. 1, Fig. 2, Fig. 4, CPU base (1) adopts the good copper of thermal conductivity to become, CPU base (1) rear end face connects heat insulation storehouse (2), heat insulation storehouse (2) is a cavity structure, right side, heat insulation storehouse (2) has circular hole (3), heat insulation storehouse (2) is inner to be respectively equipped with CPU heat radiation pasting board (4) to forward direction, heat pipe (5) and heat pipe holder (6), heat pipe (5) is made of copper, and the end that heat pipe (5) extends out in heat insulation storehouse (2) the right side circular hole (3) connects by preceding radiating fin, the heat dissipation equipment fixed mount, back radiating fin, the cooling mechanism that semiconductor chilling plate is formed; Heat dissipation equipment fixed mount (7) front end face of cooling mechanism has square groove, heat dissipation equipment fixed mount (7) left side is provided with baffle plate fixed strip (14), preceding radiating fin (8) is fixed on heat dissipation equipment fixed mount (7) front end face, back radiating fin (9) is fixed on heat dissipation equipment fixed mount (7) rear end face, heat pipe (5) is positioned at the groove that has between preceding radiating fin (8) and the back radiating fin (9), back radiating fin (9) inside is provided with semiconductor chilling plate (10), the one side of semiconductor chilling plate (10) refrigeration is near heat pipe (5), and the one side that heats is near back radiating fin (9); Preceding radiating fin, back radiating fin are made of copper.
The effect in heat insulation storehouse (2) is to improve heat that the effect in heat pipe hot junction distributes CPU to conduct to far-end by heat pipe better and distribute, rather than is dispersed into around the CPU.
Referring to Fig. 5, during installation, earlier CPU board (11) is installed between CPU base (1) and heat insulation storehouse (2), then the bottom (13) of heat dissipation equipment fixed mount (7) is inserted on the slots (16) such as PCI, ISA on the computer bottom plate (15), PCI-X, the left end (12) of heat dissipation equipment fixed mount (7) is fixed in the guide channel (18) on the cabinet (17), the baffle plate fixed strip (14) of the right-hand member of heat dissipation equipment fixed mount (7) is fixed on the cabinet rear portion (19), and the input end of semiconductor chilling plate (10) connects direct current current stabilization module.This manufacturing technology is still more clearly concerning those skilled in the art.
Claims (2)
1. the heat radiator without fan of the CPU of a passive baseplate type industrial computer, comprise the CPU base, heat insulation storehouse, the CPU pasting board that dispels the heat, heat pipe, the heat pipe holder, cooling mechanism is formed, it is characterized in that CPU base (1) rear end face connects heat insulation storehouse (2), heat insulation storehouse (2) is a cavity structure, right side, heat insulation storehouse (2) has circular hole (3), heat insulation storehouse (2) is inner to be respectively equipped with CPU heat radiation pasting board (4) to forward direction, heat pipe (5) and heat pipe holder (6), the end that heat pipe (5) extends out in heat insulation storehouse (2) the right side circular hole (3) connects by preceding radiating fin, the heat dissipation equipment fixed mount, back radiating fin, this cooling mechanism that semiconductor chilling plate is formed, the heat dissipation equipment fixed mount front end face of described this cooling mechanism has square groove, heat dissipation equipment fixed mount left side is provided with the baffle plate fixed strip, preceding radiating fin is fixed on the heat dissipation equipment fixed mount front end face, back radiating fin is fixed on the heat dissipation equipment fixed mount rear end face, by a heat pipe part that extends out in the circular hole (3) in the groove that preceding radiating fin and back have between the radiating fin, back radiating fin inside is provided with semiconductor chilling plate, and the input end of semiconductor chilling plate connects direct current current stabilization module.
2. the heat radiator without fan of the CPU of passive baseplate type industrial computer as claimed in claim 1 is characterized in that CPU base, heat pipe, preceding radiating fin, back radiating fin adopt good metal or the metal alloy compositions of thermal conductivity to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510026459XA CN1318937C (en) | 2005-06-03 | 2005-06-03 | Non-fan cooling device for CPU of passive baseplate type engineering controlled computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510026459XA CN1318937C (en) | 2005-06-03 | 2005-06-03 | Non-fan cooling device for CPU of passive baseplate type engineering controlled computer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1694039A CN1694039A (en) | 2005-11-09 |
| CN1318937C true CN1318937C (en) | 2007-05-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200510026459XA Expired - Fee Related CN1318937C (en) | 2005-06-03 | 2005-06-03 | Non-fan cooling device for CPU of passive baseplate type engineering controlled computer |
Country Status (1)
| Country | Link |
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| CN (1) | CN1318937C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102043449B (en) * | 2009-10-16 | 2013-06-05 | 鸿富锦精密工业（深圳）有限公司 | Computer case and fan fixing bracket thereon |
| TWI675616B (en) * | 2016-01-13 | 2019-10-21 | 微星科技股份有限公司 | Heat dissipation system |
| CN106102415B (en) * | 2016-06-24 | 2019-06-25 | 联想(北京)有限公司 | Radiator, battery and electronic equipment |
| CN109152311A (en) * | 2018-10-23 | 2019-01-04 | 四川深北电路科技有限公司 | A kind of heat sinking circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5949648A (en) * | 1998-02-26 | 1999-09-07 | Compal Electronics Inc. | Heat radiating device capable of reducing electromagnetic interference |
| CN2632363Y (en) * | 2003-05-20 | 2004-08-11 | 奇鋐科技股份有限公司 | CPU radiatnig module |
| CN2664179Y (en) * | 2003-09-16 | 2004-12-15 | 珍通科技股份有限公司 | Radiator and heat conducting pipe structure |
-
2005
- 2005-06-03 CN CNB200510026459XA patent/CN1318937C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5949648A (en) * | 1998-02-26 | 1999-09-07 | Compal Electronics Inc. | Heat radiating device capable of reducing electromagnetic interference |
| CN2632363Y (en) * | 2003-05-20 | 2004-08-11 | 奇鋐科技股份有限公司 | CPU radiatnig module |
| CN2664179Y (en) * | 2003-09-16 | 2004-12-15 | 珍通科技股份有限公司 | Radiator and heat conducting pipe structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1694039A (en) | 2005-11-09 |
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| C06 | Publication | ||
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070530 Termination date: 20100603 |