CN107396531A - A kind of pcb board of high efficiency and heat radiation, pcb board heat dissipating method - Google Patents
A kind of pcb board of high efficiency and heat radiation, pcb board heat dissipating method Download PDFInfo
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- CN107396531A CN107396531A CN201710570448.0A CN201710570448A CN107396531A CN 107396531 A CN107396531 A CN 107396531A CN 201710570448 A CN201710570448 A CN 201710570448A CN 107396531 A CN107396531 A CN 107396531A
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- pcb board
- cpu
- thermal vias
- installing space
- pads
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a kind of pcb board of high efficiency and heat radiation, pcb board heat dissipating method, to solve the problems, such as the existing pcb board long-time work influence stability of a system at high temperature.The pcb board includes the first surface and second surface being oppositely arranged, the first surface is provided with CPU installing spaces, the second surface is provided with imaging sensor installing space, CPU pads are provided among the CPU installing spaces, the CPU pads have lap in the projection of the second surface with described image sensor installing space, in addition to：First thermal vias, positioned at the lap；Second thermal vias, positioned at the CPU pads the second surface projection and described image sensor installing space not lap；3rd thermal vias, positioned at the non-pad portion of the CPU installing spaces.The present invention is solved because pcb board deals with the leakage problem brought improperly, and does not increase cost and process.
Description
Technical field
The present invention relates to technical field of PCB board, more particularly to a kind of pcb board of high efficiency and heat radiation, pcb board heat dissipating method.
Background technology
As electronic consumer products outward appearance is less and less and frivolous, the PCB main board area of the inside is less and less, chipset
Cheng Du is increased substantially, plus the plastic casing used under cost pressure, bring product attractive in appearance and it is high performance simultaneously, for a long time
Worked at a high temperature of relative, the stability of system is challenged, and the radiating of product turns into urgent problem to be solved.It is but improper
Radiating mode can bring minus effect on the contrary.
Video high density transport module needs solve heat dissipation problem as far as possible, and otherwise image has hot noise, reaches certain
The CPU and imaging sensor of temperature are likely to not work.But find some improperly to handle during solving to radiate
Although method can preferably radiate, also occurs the problem of picture quality is worse simultaneously.For example the radiating of CPU this sides is drawn
The more phenomenon of image noise may be occurred as soon as to imaging sensor side, imaging sensor can be caused not work what is more.
Existing product radiating mainly passes through：1. hot hole is broken up in product casing appropriate location；The method belongs to heat loss through convection,
Indoor type is only applicable to, without waterproof requirement；2. fin is installed on high power consumption device surface；The method belongs to heat loss through conduction,
Intelligence effectively reduces local temperature, and is easily limited by structure, while increases hardware cost.3. fan, this mode are installed
Belong to forced convertion radiating, increase product size, apply in general to indoor large frame or frame-type product.4. pass through pcb board
The area of the windowing of face welding resistance and increase welding resistance windowing adds the radiation approach and area of calorie spread, to reach PCB to whole plate
Overall Homogeneouslly-radiating；Such a method chip back can not put device, not be suitable for highdensity product.5. by generating heat most
The place of big chip layout is beaten macropore and radiated, but this product be not suitable for for photaesthesia, because punching printing opacity causes
Back side photosensitive products data are wrong.
Publication No. CN104994678A patent provides a kind of pcb board of high efficiency and heat radiation.A kind of PCB of high efficiency and heat radiation
Plate, including sheet material, the sheet material inside are provided with interior comb, and the interior comb is connected with outer comb, and the sheet material, which is arranged on, to be fixed
On plate, the fixed plate both ends are provided with end plate, and the fixed plate both ends are provided with end plate, contact position of the outer comb with fixed plate
Sealing ring is installed, the sheet material is provided with through hole.The pcb board of this high efficiency and heat radiation when in use, using comb by plate
The heat discharge of electronic component on material, ensure that the temperature of electronic component on sheet material is in normal working condition, meets to use
Demand.The invention breaks up hot hole in product surgery, belongs to heat loss through convection, without waterproof requirement.And the through hole of the invention is uncomfortable
Close on the product of photaesthesia, punching printing opacity can make it that back side photosensitive products data are wrong.
The content of the invention
The technical problem to be solved in the present invention purpose is to provide a kind of pcb board of high efficiency and heat radiation, pcb board heat dissipating method,
To solve the problems, such as the existing pcb board long-time work influence stability of a system at high temperature.
To achieve these goals, the technical solution adopted by the present invention is：
A kind of pcb board of high efficiency and heat radiation, including the first surface and second surface being oppositely arranged, the first surface are provided with
CPU installing spaces, the second surface are provided with imaging sensor installing space, and CPU welderings are provided among the CPU installing spaces
Disk, the CPU pads have lap with described image sensor installing space in the projection of the second surface, also wrapped
Include：
First thermal vias, positioned at the lap；
Second thermal vias, installed positioned at projection of the CPU pads in the second surface with described image sensor
Space not lap；
3rd thermal vias, positioned at the non-pad portion of the CPU installing spaces.
Further, the aperture of first thermal vias is less than the aperture of second thermal vias；Described second dissipates
The aperture of heat through-hole is less than the aperture of the 3rd thermal vias.
Further, the pore diameter range of first thermal vias is 0.254mm~0.3mm.
Further, the pore diameter range of second thermal vias is 0.4mm~0.5mm.
Further, the pore diameter range of the 3rd thermal vias is 0.5mm~1mm.
Further, in addition to：
Windowing, positioned at the top of the imaging sensor installing space of the second surface.
Further, first thermal vias has carried out consent processing.
A kind of pcb board heat dissipating method, including step：
In the projection of CPU pads and the lap of imaging sensor installing space, the first thermal vias is set；
Set the second radiating logical in the projection of the CPU pads and the not lap of described image sensor installing space
Hole；
In the non-pad portion of the CPU installing spaces, the 3rd thermal vias is set.
Further, in addition to step：
Opened a window in the top of described image sensor installing space.
Further, in addition to step：
Consent processing is carried out to first thermal vias.
It is of the invention compared with traditional technology, have the following advantages：
The present invention is solved because pcb board deals with the leakage problem brought improperly, and does not increase cost and process.
Brief description of the drawings
Fig. 1 is the schematic diagram that pcb board beats macropore in the prior art；
Fig. 2 is the schematic diagram that pcb board spiles in the prior art；
Fig. 3 is a kind of schematic diagram of the pcb board for high efficiency and heat radiation that embodiment one provides；
Fig. 4 is a kind of pcb board heat dissipating method flow chart that embodiment two provides；
Fig. 5 is a kind of pcb board heat dissipating method flow chart that embodiment three provides；
Fig. 6 is a kind of pcb board heat dissipating method flow chart that example IV provides.
Embodiment
It is the specific embodiment of the present invention and with reference to accompanying drawing below, technical scheme is further described,
But the present invention is not limited to these embodiments.
Embodiment one
PCB Chinese is printed circuit board, also known as printed substrate, is important electronic unit, is electronics member device
The supporter of part, it is the carrier of electronic component electrical connection.Because it is using electron printing making, therefore it is referred to as
" printing " circuit board.After electronic equipment uses printed board, due to the uniformity of similar printed board, so as to avoid artificial wiring
Mistake, and electronic component inserting or attachment, automatic tin soldering, automatic detection automatically can be realized, the quality of electronic equipment is ensure that,
Improve labor productivity, reduce cost, and be easy to repair.
General video high density transport module needs solve heat dissipation problem as far as possible, and otherwise image has noise, reaches one
The CPU and imaging sensor of constant temperature degree are likely to not work.But although some improper processing can in solving radiation processes
Preferably to radiate, but also occurs the worse situation of picture quality simultaneously.
In order to solve heat dissipation problem, pcb board can be punched.The larger parts that necessarily have of CPU are placed among pcb board.
Avoiding plank center as far as possible if CPU is smaller avoids the chip with back side image sensor from generating heat and influence each other mutually.
The heat that CPU comes out can directly affect the imaging sensor at the back side by sheet material and ground hole, if environment temperature exceedes image
During senor operating temperature, the image that camera comes out just has hot noise or directly collapse.
, it is necessary to be radiated as far as possible into air by PCB after shell heat dissipation design and patch fin.This is a lot
Two kinds of extreme cases occur in PCB design teacher.
As shown in figure 1, beating macropore on the CPU pads of pcb board, radiating effect is more preferable after tested for this scheme, but
Tin can be leaked when paster so that the attractive in appearance of pcb board is influenceed in terms of the CPU back sides, most of punching in addition is pacified in imaging sensor
Fill in space so that light enters imaging sensor installing space by macropore influences imaging sensor so that camera is final
The problem of appearing in the poor qualities such as the image color error of computer is big or image section is fuzzy.
Another situation is not punched or beaten less as shown in Fig. 2 corresponding to pcb board position in imaging sensor mounting space portion
Metering-orifice, so it is unfavorable for radiating, the CPU in the near future that works after tested can be stopped.
A kind of pcb board of high efficiency and heat radiation is present embodiments provided, as shown in figure 3, including the first surface 100 being oppositely arranged
With second surface 200, first surface 100 is provided with CPU installing spaces 110, and second surface 200 is provided with imaging sensor installing space
CPU pads 111, projection and image sensing of the CPU pads 111 in second surface 200 are provided among 210, CPU installing space 110
Device installing space 210 has lap, in addition to：
First thermal vias 112, positioned at lap；
Second thermal vias 113, positioned at projection of the CPU pads 111 in second surface 200 and imaging sensor installing space
210 not laps；
3rd thermal vias 114, positioned at the non-pad portion of CPU installing spaces 110.
Windowing 211, positioned at the top of the imaging sensor installing space of second surface 200.
In the present embodiment, the aperture of the first thermal vias 112 is less than the aperture of second thermal vias 113；Second dissipates
The aperture of heat through-hole 113 is less than the aperture of the 3rd thermal vias 114.
Wherein, the pore diameter range of the first thermal vias 112 is 0.254mm~0.3mm.
The pore diameter range of second thermal vias 113 is 0.4mm~0.5mm.
The pore diameter range of 3rd thermal vias 114 is 0.5mm~1mm.
The present invention relates to the surface treatment of the pcb board containing sensor devices.The punching via10 on pcb board, via12 hole,
And sieve aperture is handled, in order to avoid light leak influences photosensitive effect, so as to influence product function, need to consider plus dissipate if fruit product heating is serious
Backing or change program reduce job number, can not beat macropore near photosensitive period.
The heat dissipation problem of the pcb board of present invention design video high density transport module is to obtain preferably pickup quality.
The pcb board puncturing schemes that the present embodiment provides are best suitable for pcb board radiating.
Specifically, in sensor installing space 210 with the first thermal vias.The pore diameter range of first thermal vias 112 is
0.254mm~0.3mm.Preferably, via10 (0.254mm) is selected, via12 (0.3mm) hole and carries out consent processing, is kept away
Exempt from light leak.
Wherein, via is also known as via, and in assist side, a circuit jumps to another side from the one side of plate, connects two lines
Hole also make via (be different from pad, layer is not helped on side.)
CPU installing spaces 110 CPU pads 111 imaging sensor installing space 210 not lap beat it is slightly larger
Second thermal vias.The pore diameter range of second thermal vias 113 is 0.4mm~0.5mm.To avoid Lou tin influence attractive in appearance, preferably
, via16 (aperture 0.4mm) can be used, via20 (0.5mm) hole, is installed in addition in the imaging sensor of second surface 200
The top in space 210 is provided with windowing 211.
Wherein, the meaning of copper is leaked in windowing, and the design of windowing 211 is reticulated.Be advantageous to radiate.Close to image in Fig. 1
Small rectangle above sensor installing space 210 is windowing 211.Can shadow because it is contemplated that too rejecting heat to second surface 200
The work of imaging sensor is rung, therefore has only opened fraction window.Copper sheet do not open a window no more than imaging sensor installing space 210 and not
Can be beyond ground copper sheet.
Larger the 3rd can be beaten by not being related to the ground of CPU pads 111 below CPU installing spaces 110 or elsewhere
Thermal vias.The pore diameter range of 3rd thermal vias 114 is 0.5mm~1mm.Convenient radiating.
The present invention avoids light leak in the part aperture of imaging sensor installing space 210 and consent processing；Installed in CPU
The CPU pads 111 in space 110 and do not beat in the part of imaging sensor installing space 210 slightly larger hole avoid Lou tin influence it is beautiful
See, also suitably opened a window in second surface 200 in addition；Below CPU installing spaces 110 or portion that other are not related to CPU pads 111
Divide and play the convenient radiating in larger hole.The method punched compared to traditional pcb board, can reach Homogeneouslly-radiating effect and will not be because of
Light leak and influence product quality.The present invention is only handled on the pcb board of interiors of products, does not increase extra cost and process.
Embodiment two
A kind of pcb board heat dissipating method is present embodiments provided, as shown in figure 4, including step：
S11：In the projection of CPU pads and the lap of imaging sensor installing space, the first thermal vias is set；
S12；In the projection of CPU pads and the not lap of imaging sensor installing space, the second thermal vias is set；
S13：In the non-pad portion of CPU installing spaces, the 3rd thermal vias is set.
The heat dissipation problem of the pcb board of the present embodiment design video high density transport module is to obtain preferably pickup quality.
General video high density transport module needs solve heat dissipation problem as far as possible, and otherwise image has noise, reaches certain temperature
CPU and imaging sensor are likely to not work.But although some improper processing can be preferably in solving radiation processes
Radiating, but also occur the worse situation of picture quality simultaneously.
The pcb board that the present embodiment provides includes the first surface and second surface being oppositely arranged, and first surface is pacified provided with CPU
Space is filled, second surface is provided with imaging sensor installing space, and CPU installing spaces centre is provided with CPU pads, and CPU pads are the
The projection on two surfaces has lap with imaging sensor installing space.
Specifically, in sensor installing space with the first thermal vias.The pore diameter range of first thermal vias is 0.254mm
~0.3mm.Preferably, via10 (0.254mm) is selected, via12 (0.3mm) hole, avoids light leak.
Wherein, via is also known as via, and in assist side, a circuit jumps to another side from the one side of plate, connects two lines
Hole also make via (be different from pad, layer is not helped on side.)
In the CPU pads of CPU installing spaces, in imaging sensor installing space, lap does not play slightly larger second radiating
Through hole.The pore diameter range of second thermal vias 113 is 0.4mm~0.5mm.To avoid Lou tin influence attractive in appearance, it is preferred that Ke Yiyong
Via16 (aperture 0.4mm), via20 (0.5mm) hole.
Not being related to the ground of CPU pads below CPU installing spaces or elsewhere, can to play the 3rd larger radiating logical
Hole.The pore diameter range of 3rd thermal vias is 0.5mm~1mm.Convenient radiating.
With traditional pcb board heat dissipating method, one is that macropore is beaten on the CPU pads of pcb board, and this scheme dissipates after tested
Thermal effect is more preferable, but tin can be leaked when paster, and the attractive in appearance of pcb board is influenceed in terms of the CPU back sides, and most of punching in addition exists
In imaging sensor installing space, light enters imaging sensor installing space by macropore influences imaging sensor, camera
The problem of eventually appearing in the poor qualities such as the image color error of computer is big or image section is fuzzy.
Another situation corresponds to pcb board position in imaging sensor mounting space portion and does not punch or beat a small amount of hole, so
It is unfavorable for radiating, the CPU in the near future that works after tested can be stopped.
The method that the present embodiment provides avoids light leak leakage tin, does not affect the appearance, and enable to pcb board efficiently to dissipate
Heat.
Embodiment three
A kind of pcb board heat dissipating method is present embodiments provided, as shown in figure 5, including step：
S21：In the projection of CPU pads and the lap of imaging sensor installing space, the first thermal vias is set；
S22；In the projection of CPU pads and the not lap of imaging sensor installing space, the second thermal vias is set；
S23：Opened a window in the top of imaging sensor installing space；
S24：In the non-pad portion of CPU installing spaces, the 3rd thermal vias is set.
It is with the difference of embodiment two, in addition to step S23.
In the CPU pads of CPU installing spaces, in imaging sensor installing space, lap does not play slightly larger second radiating
Through hole.To avoid Lou tin influence attractive in appearance, it is preferred that via16 (aperture 0.4mm) can be used, via20 (0.5mm) hole, existed in addition
The top of the imaging sensor installing space of second surface is provided with windowing.
Wherein, the meaning of copper is leaked in windowing, and windowing design is reticulated.Be advantageous to radiate.Because it is contemplated that undue radiating
The work of imaging sensor can be influenceed to second surface, therefore has only opened fraction window.Copper sheet open a window no more than imaging sensor
Installing space and can not exceed ground copper sheet.
Windowing leakage copper, avoid Lou tin influence it is attractive in appearance, be advantageous to radiate.
Example IV
A kind of pcb board heat dissipating method is present embodiments provided, as shown in fig. 6, including step：
S31：In the projection of CPU pads and the lap of imaging sensor installing space, the first thermal vias is set；
S32：Consent processing is carried out to the first thermal vias；
S33；In the projection of CPU pads and the not lap of imaging sensor installing space, the second thermal vias is set；
S34：Opened a window in the top of imaging sensor installing space；
S35：In the non-pad portion of CPU installing spaces, the 3rd thermal vias is set.
It is with embodiment two, three differences, in addition to step S32.
Specifically, in sensor installing space with the first thermal vias.The pore diameter range of first thermal vias is 0.254mm
~0.3mm.Preferably, via10 (0.254mm) is selected, via12 (0.3mm) hole and carries out consent processing, avoids light leak.
Wherein, via is also known as via, and in assist side, a circuit jumps to another side from the one side of plate, connects two lines
Hole also make via (be different from pad, layer is not helped on side.)
Handled by consent, can preferably avoid light leak.
Specific embodiment described herein is only to spirit explanation for example of the invention.Technology belonging to the present invention is led
The technical staff in domain can be made various modifications or supplement to described specific embodiment or be replaced using similar mode
Generation, but without departing from the spiritual of the present invention or surmount scope defined in appended claims.
Claims (10)
- A kind of 1. pcb board of high efficiency and heat radiation, it is characterised in that including the first surface and second surface being oppositely arranged, described One surface is provided with CPU installing spaces, and the second surface is provided with imaging sensor installing space, among the CPU installing spaces It is provided with CPU pads, the CPU pads have with described image sensor installing space overlapping in the projection of the second surface Part, in addition to：First thermal vias, positioned at the lap；Second thermal vias, positioned at projection of the CPU pads in the second surface and described image sensor installing space Not lap；3rd thermal vias, positioned at the non-pad portion of the CPU installing spaces.
- A kind of 2. pcb board of high efficiency and heat radiation according to claim 1, it is characterised in that the hole of first thermal vias Footpath is less than the aperture of second thermal vias；The aperture of second thermal vias is less than the hole of the 3rd thermal vias Footpath.
- A kind of 3. pcb board of high efficiency and heat radiation according to claim 2, it is characterised in that the hole of first thermal vias Footpath scope is 0.254mm~0.3mm.
- A kind of 4. pcb board of high efficiency and heat radiation according to claim 2, it is characterised in that the hole of second thermal vias Footpath scope is 0.4mm~0.5mm.
- A kind of 5. pcb board of high efficiency and heat radiation according to claim 2, it is characterised in that the hole of the 3rd thermal vias Footpath scope is 0.5mm~1mm.
- 6. the pcb board of a kind of high efficiency and heat radiation according to claim 1, it is characterised in that also include：Windowing, positioned at the top of the imaging sensor installing space of the second surface.
- 7. the pcb board of a kind of high efficiency and heat radiation according to claim 1, it is characterised in that first thermal vias is carried out Consent processing.
- 8. a kind of pcb board heat dissipating method, it is characterised in that including step：In the projection of CPU pads and the lap of imaging sensor installing space, the first thermal vias is set；In the projection of the CPU pads and the not lap of described image sensor installing space, the second thermal vias is set；In the non-pad portion of the CPU installing spaces, the 3rd thermal vias is set.
- 9. a kind of pcb board heat dissipating method according to claim 8, it is characterised in that also including step：Opened a window in the top of described image sensor installing space.
- 10. a kind of pcb board heat dissipating method according to claim 8, it is characterised in that also including step：Consent processing is carried out to first thermal vias.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710570448.0A CN107396531B (en) | 2017-07-13 | 2017-07-13 | PCB with efficient heat dissipation function and PCB heat dissipation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710570448.0A CN107396531B (en) | 2017-07-13 | 2017-07-13 | PCB with efficient heat dissipation function and PCB heat dissipation method |
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| CN107396531A true CN107396531A (en) | 2017-11-24 |
| CN107396531B CN107396531B (en) | 2021-01-12 |
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| CN201710570448.0A Active CN107396531B (en) | 2017-07-13 | 2017-07-13 | PCB with efficient heat dissipation function and PCB heat dissipation method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108875232A (en) * | 2018-06-27 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of method, apparatus, equipment and readable storage medium storing program for executing checking solder mask window |
| CN113690649A (en) * | 2021-08-25 | 2021-11-23 | 锐捷网络股份有限公司 | Connector assembly |
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| JPH04320392A (en) * | 1991-04-19 | 1992-11-11 | Mitsubishi Electric Corp | Multilayer printed circuit board and its manufacture |
| CN102970829A (en) * | 2003-09-12 | 2013-03-13 | 独立行政法人产业技术综合研究所 | Substrate and method for manufacturing same |
| CN204442828U (en) * | 2015-03-26 | 2015-07-01 | 袁志贤 | A kind of PCB of high efficiency and heat radiation |
| CN204761831U (en) * | 2015-08-07 | 2015-11-11 | 冠捷显示科技（厦门）有限公司 | PCB board encapsulation heat radiation structure |
| WO2016093933A1 (en) * | 2014-12-10 | 2016-06-16 | Raytheon Company | Vertical radio frequency module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04320392A (en) * | 1991-04-19 | 1992-11-11 | Mitsubishi Electric Corp | Multilayer printed circuit board and its manufacture |
| CN102970829A (en) * | 2003-09-12 | 2013-03-13 | 独立行政法人产业技术综合研究所 | Substrate and method for manufacturing same |
| WO2016093933A1 (en) * | 2014-12-10 | 2016-06-16 | Raytheon Company | Vertical radio frequency module |
| CN204442828U (en) * | 2015-03-26 | 2015-07-01 | 袁志贤 | A kind of PCB of high efficiency and heat radiation |
| CN204761831U (en) * | 2015-08-07 | 2015-11-11 | 冠捷显示科技（厦门）有限公司 | PCB board encapsulation heat radiation structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108875232A (en) * | 2018-06-27 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of method, apparatus, equipment and readable storage medium storing program for executing checking solder mask window |
| CN108875232B (en) * | 2018-06-27 | 2022-03-22 | 郑州云海信息技术有限公司 | Method, device and equipment for checking welding-proof windowing and readable storage medium |
| CN113690649A (en) * | 2021-08-25 | 2021-11-23 | 锐捷网络股份有限公司 | Connector assembly |
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| CN107396531B (en) | 2021-01-12 |
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