CN108391367A - A kind of optical module of good heat dispersion performance - Google Patents
A kind of optical module of good heat dispersion performance Download PDFInfo
- Publication number
- CN108391367A CN108391367A CN201810135585.6A CN201810135585A CN108391367A CN 108391367 A CN108391367 A CN 108391367A CN 201810135585 A CN201810135585 A CN 201810135585A CN 108391367 A CN108391367 A CN 108391367A
- Authority
- CN
- China
- Prior art keywords
- pcb
- heat
- optical device
- optical module
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a kind of optical modules of good heat dispersion performance, are related to the field of radiating of optical module.Optical module includes shell and the PCB in outer shell bottom wall, PCB is internally provided with several layers of copper, the front of PCB is provided with optical device, the positive and negative of PCB place corresponding with optical device, it is both provided with bright copper, it is provided at least two thermal vias between the positive bright copper of PCB and the bright copper of reverse side, each heat dissipation is both provided with heat-radiating rod by interior.Heat quickly can be transferred to PCB reverse side by the present invention by heat-radiating rod from the fronts PCB, and then be obviously improved the heat transference efficiency of PCB, consequently also greatly enhanced the heat dissipation performance of optical device, be ensure that the safe to use of optical device.
Description
Technical field
The present invention relates to the field of radiating of optical module, and in particular to a kind of optical module of good heat dispersion performance.
Background technology
Optical module includes shell, and the interior bottom of shell is provided with PCB (Printed Circuit Board, printed circuit board),
The mode of the upper pin feet+welding of PCB is packaged with optical device and other devices (such as chip etc.).The temperature specification of optical device is general
Sun adjuster part is needed to radiate in order to ensure the normal work of optical device for 85 DEG C of shell temperature.In hermetically sealed optical module shell
In, optical device is in calm condition, due to optical device metal top cover and not in contact with its pyrotoxin, and metal top cover cannot be born
Pressure, therefore the method that can not contact radiator by the metal top cover of optical device, sun adjuster part radiate；That is optical device
PCB can be fully relied on to radiate.
The heat dissipating method of existing optical device is：When optical device when the temperature is excessively high, transferred heat to by heat transfer
On the lower PCB of temperature, PCB conducts heat to the outer casing bottom of optical module again, finally takes away heat by extraneous air-flow.
The above method has the following defects：
(1) when optical device works, the heat that optical device work generates is conducted to the positive corresponding region of PCB, due to PCB
The heat transference efficiency of the characteristic of own material, heat from front conduction to the reverse side of PCB of PCB is relatively low, i.e., heat is difficult to from PCB
Front conduction to PCB reverse side so that the radiating efficiency of optical device is relatively low, it is difficult to ensure the safe to use of optical device.
(2) it when optical device does not work, other devices on PCB need to reprocess, needs to replace other devices from PCB (first
Damage device is dismantled, then more renews device), when dismantling and replacing device, it is required to be heated to high temperature (generally to device
260 DEG C~390 DEG C) so that the tin cream of bottom device melts, welding when dismounting and replacement to complete device.To it
After his device heating, the low temperature of high temperature PCB region, meeting where with the relatively low optical device of degree where other excessively high devices of temperature
PCB region forms very big temperature difference band, and heat can be transferred to low temperature PCB region rapidly by high temperature PCB region.After tested
Going out, temperature is 260 DEG C~390 DEG C other devices when reprocessing, after transferring heat to the PCB region where optical device, shell
The temperature of place corresponding with optical device has reached 150 DEG C or more (heat transfer causes to heat up), which has been more than seriously optical device
The probability of temperature specification (85 DEG C of shell temperature), at this time optical device damage is very big, and optical device is once damage, then entire optical module can not
It uses.
Invention content
In view of the deficiencies in the prior art, present invention solves the technical problem that being：How in optical module light device is improved
The heat dissipation performance of part.
To achieve the above objectives, the optical module of good heat dispersion performance provided by the invention, including shell and be located at shell bottom
PCB on wall, PCB are internally provided with several layers of copper, and the front of PCB is provided with optical device, and the positive and negative of PCB is corresponding with optical device
Place is both provided with bright copper, at least two thermal vias is provided between the positive bright copper of PCB and the bright copper of reverse side, and each heat dissipation is logical
It is both provided with heat-radiating rod in crossing.
Based on the above technical solution, FR4 copper-clad plates are both provided with around the bright copper of the PCB obverse and reverses.
Based on the above technical solution, it is provided with isolation board around the positive bright copper of the PCB.
Based on the above technical solution, the PCB is connect with the boss in outer shell bottom wall.
Based on the above technical solution, it is provided with heat-conducting layer between the PCB and boss.
Based on the above technical solution, the heat-conducting layer selects G800 chill bars.
Based on the above technical solution, the quantity of the thermal vias is 4.
Based on the above technical solution, the heat-radiating rod is copper rod.
Compared with the prior art, the advantages of the present invention are as follows：
When the temperature is excessively high, the heat that optical device generates can be from optical device bottom conductive to front for optical device in the present invention
The heat in radiating surface region, front radiating surface region is transferred to the hot face region of reverse side by the heat-radiating rod in multiple thermal vias,
The heat in the hot face region of reverse side is transferred to outer shell bottom wall by boss, finally takes away heat by extraneous air-flow.With the prior art
The middle lower PCB of heat transference efficiency is compared, and heat quickly can be transferred to PCB by the present invention by heat-radiating rod from the fronts PCB
Reverse side, and then it is obviously improved the heat transference efficiency of PCB, consequently also greatly enhance the heat dissipation performance of optical device.
Similarly, when other devices are reprocessed, heat that the higher PCB of heat transference efficiency can also generate other devices
It is rapidly transferred to the bottom wall heat dissipation of shell, and then significantly reduces the probability of optical device damage, ensure that the use peace of optical device
Entirely.
Description of the drawings
Fig. 1 is the structural schematic diagram of the optical module of the good heat dispersion performance in the embodiment of the present invention；
Fig. 2 is the longitudinal sectional drawing of Fig. 1；
In figure：1- outer shell bottom walls, 1a- boss, 2-PCB, the fronts 2a- radiating surface region, 2b- heat-radiating rods, 2c- layers of copper, 2d-
Reverse side heat dissipation region, other devices of 3-, 4- isolation boards, 5-FR4 copper-clad plates, 6- optical devices, 7- heat-conducting layers.
Specific implementation mode
Invention is further described in detail with reference to the accompanying drawings and embodiments.
Shown in referring to Fig. 1 and Fig. 2, the optical module of the good heat dispersion performance in the embodiment of the present invention, including shell and PCB2,
PCB2 is connect with the boss 1a in outer shell bottom wall 1.Shown in Figure 2, PCB2 is internally provided with several layers of copper 2c for conduction,
The front of PCB2 is provided with optical device 6, and the positive and negative place corresponding with optical device 6 of PCB2 is both provided with bright copper.Define PCB2 just
The bright copper in bright copper region and its week of the bright copper in bright copper region in face and surrounding region for front radiating surface region 2a, PCB2 reverse side
The region enclosed is reverse side heat dissipation region 2d, and at least two heat dissipation is provided between front radiating surface region 2a and reverse side heat dissipation region 2d
Through-hole【Hot via is 4 in the present embodiment), each heat dissipation is both provided with heat-radiating rod 2b by interior【Copper rod).
It follows that the optical device 6 in the present embodiment is when the temperature is excessively high, the heat that optical device 6 generates can be from optical device 6
Bottom conductive to front radiating surface region 2a, the heat of front radiating surface region 2a passes through the heat-radiating rod 2b in multiple thermal vias
It is transferred to the hot face region of reverse side, the heat in the hot face region of reverse side is transferred to outer shell bottom wall 1 by boss 1a, finally by extraneous gas
Stream takes away heat.Compared with the lower PCB2 of heat transference efficiency in the prior art, the present embodiment can be quick by heat-radiating rod 2b
Heat is transferred to PCB2 reverse side from the fronts PCB2, and then be obviously improved the heat transference efficiency of PCB2, consequently also greatly increase
The strong heat dissipation performance of optical device 6.
Similarly, when other devices 3 are reprocessed, what the higher PCB2 of heat transference efficiency can also generate other devices 3
Heat is rapidly transferred to the bottom wall heat dissipation of shell, and then significantly reduces the probability of the damage of optical device 6, ensure that optical device 6
It is safe to use.
It is shown in Figure 2, heat-conducting layer 8 is provided between PCB2 and boss 1a, heat-conducting layer 8 selects G800 chill bars, with
Further increase the heat dissipation performance of the heat conduction efficiency and optical device 6 of PCB2.
It is shown in Figure 1, around the front radiating surface region 2a of PCB2 and reverse side radiating surface region, it is both provided with FR4 and covers
The thermal coefficient of copper coin 5, FR4 is very low, while reducing the heat that other devices 3 are transmitted when reprocessing, reduces heat
Transmission speed is measured, when the temperature of other devices 3 increases, the influence of sun adjuster part 6 is very small, and then further reduced light device
The probability that part 6 damages.
It is shown in Figure 1, it is additionally provided with isolation board 4 around the positive FR4 copper-clad plates of PCB2 5, isolation board 4 can pass through
When cooling wind sun adjuster part 6 is cooled down, blocking cooling wind flows to other regions of PCB2, avoids other devices on PCB2
Part 3 reduces welding temperature because of cooling wind, ensure that the welding efficiency of other devices 3.
Further, the present invention is not limited to the above-described embodiments, for those skilled in the art,
Without departing from the principles of the invention, several improvements and modifications can also be made, these improvements and modifications are also considered as the present invention
Protection domain within.The content not being described in detail in this specification belongs to existing skill well known to professional and technical personnel in the field
Art.
Claims (8)
1. a kind of optical module of good heat dispersion performance, including shell and the inside the PCB (2) in outer shell bottom wall (1), PCB (2)
Several layers of copper (2c) are provided with, the front of PCB (2) is provided with optical device (6), and the positive and negative of PCB (2) is corresponding with optical device (6)
Place is both provided with bright copper, it is characterised in that：At least two heat dissipation is provided between the positive bright copper of PCB (2) and the bright copper of reverse side
Through-hole, each heat dissipation are both provided with heat-radiating rod (2b) by interior.
2. the optical module of good heat dispersion performance as described in claim 1, it is characterised in that：PCB (2) obverse and reverse
FR4 copper-clad plates (5) are both provided with around bright copper.
3. the optical module of good heat dispersion performance as described in claim 1, it is characterised in that：PCB (2) the positive bright copper week
It encloses and is provided with isolation board (4).
4. the optical module of good heat dispersion performance as described in claim 1, it is characterised in that：The PCB (2) and outer shell bottom wall
(1) boss (1a) connection on.
5. the optical module of good heat dispersion performance as claimed in claim 4, it is characterised in that：The PCB (2) and boss (1a) it
Between be provided with heat-conducting layer (7).
6. the optical module of good heat dispersion performance as claimed in claim 5, it is characterised in that：The heat-conducting layer (7) selects G800
Chill bar.
7. such as the optical module of good heat dispersion performance described in any one of claim 1 to 5, it is characterised in that：The thermal vias
Quantity be 4.
8. such as the optical module of good heat dispersion performance described in any one of claim 1 to 5, it is characterised in that：The heat-radiating rod
(2b) is copper rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810135585.6A CN108391367A (en) | 2018-02-09 | 2018-02-09 | A kind of optical module of good heat dispersion performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810135585.6A CN108391367A (en) | 2018-02-09 | 2018-02-09 | A kind of optical module of good heat dispersion performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108391367A true CN108391367A (en) | 2018-08-10 |
Family
ID=63075693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810135585.6A Pending CN108391367A (en) | 2018-02-09 | 2018-02-09 | A kind of optical module of good heat dispersion performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108391367A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587934A (en) * | 2018-12-11 | 2019-04-05 | 温岭市霍德电子科技有限公司 | A kind of circuit board |
| CN110876225A (en) * | 2018-08-30 | 2020-03-10 | 苏州旭创科技有限公司 | Circuit board, preparation method of circuit board and optical module with circuit board |
| WO2020125330A1 (en) * | 2018-12-18 | 2020-06-25 | 中兴通讯股份有限公司 | Optical module communication assembly |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6823582B1 (en) * | 2002-08-02 | 2004-11-30 | National Semiconductor Corporation | Apparatus and method for force mounting semiconductor packages to printed circuit boards |
| CN202535631U (en) * | 2011-12-28 | 2012-11-14 | 鋐鑫电光科技股份有限公司 | Aluminum oxide ceramic circuit board having metal posts and packaging structure of aluminum oxide ceramic circuit board |
| CN206879195U (en) * | 2017-05-16 | 2018-01-12 | 高德(苏州)电子有限公司 | A kind of heat radiating type heat conducting circuit board |
-
2018
- 2018-02-09 CN CN201810135585.6A patent/CN108391367A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6823582B1 (en) * | 2002-08-02 | 2004-11-30 | National Semiconductor Corporation | Apparatus and method for force mounting semiconductor packages to printed circuit boards |
| CN202535631U (en) * | 2011-12-28 | 2012-11-14 | 鋐鑫电光科技股份有限公司 | Aluminum oxide ceramic circuit board having metal posts and packaging structure of aluminum oxide ceramic circuit board |
| CN206879195U (en) * | 2017-05-16 | 2018-01-12 | 高德(苏州)电子有限公司 | A kind of heat radiating type heat conducting circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110876225A (en) * | 2018-08-30 | 2020-03-10 | 苏州旭创科技有限公司 | Circuit board, preparation method of circuit board and optical module with circuit board |
| CN109587934A (en) * | 2018-12-11 | 2019-04-05 | 温岭市霍德电子科技有限公司 | A kind of circuit board |
| WO2020125330A1 (en) * | 2018-12-18 | 2020-06-25 | 中兴通讯股份有限公司 | Optical module communication assembly |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180810 |