CN218888943U - Reinforced heat dissipation structure of underwater electronic equipment - Google Patents
Reinforced heat dissipation structure of underwater electronic equipment Download PDFInfo
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- CN218888943U CN218888943U CN202223288251.3U CN202223288251U CN218888943U CN 218888943 U CN218888943 U CN 218888943U CN 202223288251 U CN202223288251 U CN 202223288251U CN 218888943 U CN218888943 U CN 218888943U
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- cabin body
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Abstract
The utility model relates to the technical field of heat dissipation of underwater electronic equipment, in particular to a reinforced heat dissipation structure of underwater electronic equipment; including electronic equipment, electronic equipment is withstand voltage watertight cabin body structure, and its internally mounted has the circuit board, the opening has been seted up to the side of the cabin body, can dismantle seal installation on the opening has the heat pipe radiator, the evaporating terminal of heat pipe radiator is located inside the cabin body, with the circuit board laminating mutually, the cooling end is located the cabin body is outside. The heat pipe radiator comprises a sealing plate, a heat pipe, a radiating fin, a sealing groove, a sealing ring and a screw; the sealing plate is welded and inserted with the heat pipes, the sealing groove is formed in the sealing plate, the sealing ring is embedded in the sealing groove, the cooling fins are sleeved on the outer walls of the cooling ends of the two heat pipes, and the sealing plate is detachably and fixedly mounted to the opening of the cabin body through the screws; the problem of high electronic heat consumption of underwater equipment is solved.
Description
Technical Field
The utility model relates to an electronic equipment heat dissipation technical field under water, in particular to radiating structure is reinforceed to electronic equipment under water.
Background
High temperature is a main reason for operation failure of underwater electronic equipment, at present, the electronic equipment mostly adopts a cold plate for heat conduction underwater, an oil-filled heat dissipation mode is adopted when the heat consumption of the electronic equipment is high, the heat conduction effect of the cold plate depends on the physical property of a heat conduction material and the contact area of an electronic device, and most of the equipment cannot meet the requirement that all circuit boards are attached to the wall surface, so that air thermal resistance is formed, and the heat dissipation problem is caused. Although the oil filling mode has obvious effect, the problems of difficult disassembly, difficult maintenance and cleaning and the like of the circuit board exist.
Therefore, the utility model relates to a heat pipe heat radiation structure, when strengthening the heat conduction, also convenient the dismantlement can effectively solve the underwater equipment heat dissipation problem.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a heat radiation structure is reinforceed to electronic equipment under water solves the higher problem of equipment electron heat loss under water.
The utility model discloses a following technical scheme realizes:
the utility model provides an electronic equipment strengthens heat radiation structure under water, includes electronic equipment, electronic equipment is withstand voltage watertight cabin body structure, and its internally mounted has the circuit board, the opening has been seted up to the side of the cabin body, detachable seal installs heat pipe radiator on the opening, heat pipe radiator's evaporating end is located the cabin body is inside, with the circuit board laminating mutually, and the cooling end is located the cabin body is outside.
Preferably, the heat pipe radiator comprises a sealing plate, a heat pipe, a radiating fin, a sealing groove, a sealing ring and a screw; the sealing plate is welded and inserted with the heat pipes, the sealing groove is formed in the sealing plate, the sealing ring is embedded in the sealing groove, the radiating fins are sleeved on the outer wall of the cooling end of each heat pipe, and the sealing plate is detachably, fixedly and fixedly mounted to the opening of the cabin through the screws.
Preferably, the number of the heat pipes is at least two, and the heat pipes are matched with the two circuit boards arranged in the cabin body.
Preferably, the structure of the heat radiating fin adopts a flat plate shape or a corrugated plate shape.
The utility model discloses following beneficial effect has:
the utility model discloses mainly solve to electron heat dissipation equipment under water, when the electron heat loss is higher, utilize heat pipe radiator to dispel the heat to the under-deck circuit board, high heat loss electronic equipment is under water when working under water promptly, the high heat loss chip of circuit board is hugged closely to the evaporating end of two heat pipes, heat pipe evaporating end temperature risees, condensate evaporates in the heat pipe, produced steam flows to other end cooling end, through the direct heat transfer of cooling end installation fin and the extravehicular liquid medium, reaches radiating purpose.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a structural diagram of the present invention.
Fig. 2 is a cross-sectional view of the present invention.
Fig. 3 is a structural diagram of the medium heat pipe radiator of the present invention.
In the figure: 1-electronic equipment, 2-circuit board, 3-heat pipe radiator, 31-sealing plate, 32-heat pipe, 33-radiating fin, 34-sealing groove, 35-sealing ring and 36-screw.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-3, the present embodiment provides a technical solution of a reinforced heat dissipation structure for an underwater electronic device, including an electronic device 1, the electronic device 1 is a pressure-resistant watertight cabin structure, a circuit board 2 is installed inside the cabin structure, an opening is formed on a side surface of the cabin structure to facilitate the detachment and installation of a heat pipe 32, the heat pipe 32 is detachably and hermetically installed on the opening, an evaporation end of the heat pipe 32 is located inside the cabin structure and is attached to the circuit board 2, and a cooling end is located outside the cabin structure.
The heat pipe 32 comprises a sealing plate 31, a heat pipe 32, a radiating fin 33, a sealing groove 34, a sealing ring 35 and a screw 36; the heat pipes 32 are welded and inserted on the sealing plate 31, the sealing groove 34 is formed in the sealing plate 31, the sealing ring 35 is embedded in the sealing groove 34, the heat pipes 32 are end-face sealed through the sealing ring 35, the radiating fins 33 are sleeved on the outer walls of the cooling ends of the two heat pipes 32, and the sealing plate 31 is detachably fastened and installed at the opening of the cabin body through screws 36.
The number of the heat pipes 32 is at least two, and the heat pipes are matched with the two circuit boards 2 arranged in the cabin body; if there are many points with high heat consumption, the number of heat pipes 32 can be increased.
The structure of the fin 33 takes the shape of a flat plate or a corrugated plate.
The utility model is suitable for an all high heat consumption electronic equipment 1 under water, high heat consumption electronic equipment 1 is at the during operation under water, 2 high heat consumption chips on circuit board are hugged closely to the evaporating terminal of two heat pipes 32, the temperature of the evaporating terminal of heat pipe 32 risees, condensate evaporates in the heat pipe 32, produced steam flows to other end cooling end, through fin 33 and external medium heat transfer, fin 33 piece type can be parallel with the incoming flow direction for plain film or corrugated sheet, the convection heat dissipation does not increase the flow resistance simultaneously, evaporate like this in succession, steam flows, the process of carrying the heat from the evaporating terminal that is the heating end to the cooling end has been accomplished with the backward flow of liquid to the condensation, thereby the temperature of 2 chips on circuit board has been reduced, such mode can the at utmost take out the cabin with the heat of the high heat consumption chip in the cabin outside, reach radiating purpose.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (4)
1. The utility model provides an electronic equipment strengthens heat radiation structure under water, includes electronic equipment (1), electronic equipment (1) is withstand voltage watertight cabin body structure, and its internally mounted has circuit board (2), its characterized in that, the opening has been seted up to the side of the cabin body, detachable seal installs heat pipe (32) on the opening, the evaporation end of heat pipe (32) is located cabin body inside, with circuit board (2) laminate mutually, and the cooling end is located cabin body outside.
2. The enhanced heat dissipation structure for underwater electronic equipment as recited in claim 1, wherein the heat pipe (32) includes a sealing plate (31), a heat pipe (32), a heat sink (33), a sealing groove (34), a sealing ring (35) and a screw (36); the sealing plate (31) is welded and spliced with the heat pipe (32), the sealing plate (31) is provided with the sealing groove (34), the sealing ring (35) and the sealing groove (34) are embedded into the sealing ring (35) and the sealing ring two are sleeved on the outer wall of the cooling end of the heat pipe (32), and the cooling fin (33) is sleeved on the outer wall of the cooling end of the heat pipe (32), and the sealing plate (31) is detachably fastened and installed on the opening of the cabin body through the screw (36).
3. The structure for enhancing the heat dissipation of underwater electronic equipment as recited in claim 2, wherein said heat pipes (32) are provided in at least two numbers, and are adapted to two said circuit boards (2) installed in said cabin.
4. An enhanced heat dissipation structure for underwater electronic equipment as claimed in claim 2, characterized in that the structure of the heat sink (33) is in the shape of a flat sheet or a corrugated sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223288251.3U CN218888943U (en) | 2022-12-08 | 2022-12-08 | Reinforced heat dissipation structure of underwater electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223288251.3U CN218888943U (en) | 2022-12-08 | 2022-12-08 | Reinforced heat dissipation structure of underwater electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218888943U true CN218888943U (en) | 2023-04-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223288251.3U Active CN218888943U (en) | 2022-12-08 | 2022-12-08 | Reinforced heat dissipation structure of underwater electronic equipment |
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| Country | Link |
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| CN (1) | CN218888943U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116321883A (en) * | 2023-05-17 | 2023-06-23 | 之江实验室 | High-water-tightness high-power device heat dissipation device applied to deep sea |
-
2022
- 2022-12-08 CN CN202223288251.3U patent/CN218888943U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116321883A (en) * | 2023-05-17 | 2023-06-23 | 之江实验室 | High-water-tightness high-power device heat dissipation device applied to deep sea |
| CN116321883B (en) * | 2023-05-17 | 2023-08-18 | 之江实验室 | High-water-tightness high-power device heat dissipation device applied to deep sea |
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