CN101098605A - Heat pipe radiator - Google Patents
Heat pipe radiator Download PDFInfo
- Publication number
- CN101098605A CN101098605A CNA2006100614193A CN200610061419A CN101098605A CN 101098605 A CN101098605 A CN 101098605A CN A2006100614193 A CNA2006100614193 A CN A2006100614193A CN 200610061419 A CN200610061419 A CN 200610061419A CN 101098605 A CN101098605 A CN 101098605A
- Authority
- CN
- China
- Prior art keywords
- heat
- radiating
- pipe
- substrate
- fin group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat pipe heat radiator comprises a baseboard, a first radiation fin group and at least one heat pipe arranged on the baseboard, wherein the heat pipe is connected with a first heat radiation fin group and a baseboard, at least one side of the first heat radiation fin group is provided with a second heat radiation fin group extended to one side of the baseboard and sheathed on the heat pipe. The inventive heat radiator distributes the second heat radiation fin group on at least one side of the baseboard, to optimize heat radiation and reduce weight.
Description
Technical field
The present invention relates to a kind of heat-pipe radiating apparatus, refer in particular to a kind of effectively heat-pipe radiating apparatus of cooling electronic components.
Background technology
Along with developing rapidly of electronic industry, the arithmetic speed of electronic components such as central processing unit significantly improves, and the heat of its generation also increases severely thereupon, the performance when the electronic component operation in serious threat.How the heat with electronic component distributes, to guarantee that its normal operation is vital.For effectively distribute the heat that central processing unit produces in running, industry installs auxiliary its heat radiation of a radiator usually additional on the central processing unit surface, thereby makes central processing unit self temperature maintenance in normal range of operation.
The traditional heat-dissipating device includes a radiator, and this radiator comprises a base and the radiating fin that is located on this base, and mostly this base is the entity metal.Yet along with the CPU volume is more and more littler, performance boost is more and more faster, its heat that sends is also more concentrated, because be confined to the heat transfer property of metal, the heat of base center often too concentrate can't effectively be passed to heat abstractor around, and heat transfer rate is slow, influences the integral heat sink effect, make the CPU fluctuation of service, can't significance arithmetic.
The most band heat-pipe radiators that adopt of golf calorific value CPU, the heat transferred that CPU produces is to the pedestal that joins with it, heat is delivered to rapidly on the radiating fin of far-end simultaneously, by radiating fin heat is dispersed into around the heat abstractor again, reach the purpose of cooling CPU by heat pipe.Heat pipe is promoted significantly because of heat transfer rate makes the heat abstractor performance soon, how further to improve the service efficiency of heat pipe in heat abstractor, is that industry is being made great efforts improved target always.
Summary of the invention
In view of this, be necessary to provide a kind of weight the light and good heat-pipe radiating apparatus of heat dispersion.
A kind of heat-pipe radiating apparatus, comprise a substrate, be located at the first radiating fin group and at least one heat pipe on the substrate, this heat pipe connects first radiating fin group and the substrate, at least one side of this first radiating fin group is provided with the second radiating fin group, this second radiating fin group extends to substrate one side, and is sheathed on the heat pipe.
Compared with prior art, the both sides of substrate are distributed with the extension of the second radiating fin group, make that the heat of heat pipe can just in time be distributed near endotherm section, shortened heat-transfer path, make heat dispersion better, and can save the part baseplate material, alleviated the weight of substrate.
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of heat-pipe radiating apparatus of the present invention.
Fig. 2 is the inversion three-dimensional assembly diagram of heat-pipe radiating apparatus of the present invention.
Fig. 3 is the part three-dimensional assembly diagram of heat-pipe radiating apparatus of the present invention.
Fig. 4 is the three-dimensional exploded view of heat-pipe radiating apparatus of the present invention.
Embodiment
See also Fig. 1 to Fig. 4, heat-pipe radiating apparatus of the present invention is in order to dispel the heat to heat-generating electronic elements, comprise a substrate 40, be located at the first radiating fin group 80 on the substrate 40 and be distributed in the first radiating fin group 80 and two second radiating fin groups 90 of substrate 40 both sides that this device also comprises the heat pipe 20 of some connection substrates 40 and first and second radiating fin group 80,90.
This substrate 40 comprises two fixed parts 44,46 that extend the relative both sides with this body of the body 48 that is used for heat conduction, and wherein fixed part 44 is identical with body 48 width, and fixed part 46 is wideer than body 48, thereby forms T type structure.Be equipped with the hole that is used for fixing on this two fixed part 44,46.One surface of the body 48 of this substrate 40 is used to be close to electronic component (figure does not show), another apparent surface offers some semicircle tanks 42 that combine with heat pipe 20, and be distributed with some radiating fins on should the surface and extend upward, form the first radiating fin group 80.
This first radiating fin group 80 is spaced by some first radiating fins and forms, and these fins are connected on the substrate 40 by soldering or heat-conducting glue.This first radiating fin group 80 comprises near first radiating part 84 of substrate 40 with away from second radiating part 82 of substrate 40.This first radiating part 84 extends beyond the body 48 of substrate 40 and the fixed part 44 of substrate 40 fits to increase the fin heat transfer area.Second radiating part 82 is wide than first radiating part 84, and the one side is concordant with first radiating part 84, and another relative side extends beyond substrate 40, makes fins group be " L " type thereby form a ladder drop.Offer under through hole 86, first radiating part 84 ora terminalis on this second radiating part 82 and offer tank 88.These tank 88 notches are beneficial to and heat pipe 20 interference fit greater than semicircle.This tank 88 is corresponding with the tank 42 of substrate 40, and the synthetic through hole when both connect of tank between the two.Heat pipe 20 runs through in this through hole of insertion and contacts with substrate 20, the first radiating fin group 80 respectively.
These second radiating fin group, 90 parallel both sides of being located at the first radiating fin group 80 and substrate 40, it is spaced by some second radiating fins and forms.This second radiating fin group 90 comprises near first radiating part 94 of substrate 40 with away from second radiating part 92 of substrate 40.This first radiating part 94 is wide with the body 48 of substrate 40, second radiating part 92 is wide than first radiating part 94, the one side is concordant with first radiating part 94, it is mutually concordant with a side of second radiating part 82 of the first radiating fin group 80 that another relative side extends beyond substrate 40, makes fins group be " L " type thereby form a ladder drop.This second radiating part 92 and first radiating part 94 offer the through hole 96 and 98 that combines with heat pipe 20 respectively.
This heat pipe 20 is " U " type, comprises first heat transfer segment 22 that is parallel to each other, second heat transfer segment 24 and the 3rd heat transfer segment 26 that first heat transfer segment 22 and second heat transfer segment 24 are joined together.Tank 42 solderings on the most of side face of first heat transfer segment 22 of this heat pipe 20 and tank 88 interference fit of the first radiating fin group 80, remainder side face and substrate 40 or be connected by heat-conducting glue.First heat transfer segment 22 of heat pipe 20 crosses out in substrate 40 both sides and is arranged in the through hole 46 of first radiating part 94 of the second radiating fin group 90 in the mode of interference fit, and second heat transfer segment 24 be arranged in first, second radiating fin group 80,90 second radiating part 82,92 through hole 86,96 and combine closely by interference fit and fin.
During electronic component work, the heat transferred of its generation is to substrate 40, the part heat is dispersed rapidly by the first radiating fin group 80, a part of heat transferred is to first heat transfer segment 22 of heat pipe 20 simultaneously, working media in the heat pipe 20 makes heat be delivered to sheathed each radiating fin group 80,90 thereon rapidly by the phase change circulation, thereby effectively heat is distributed.Because at first radiating part 94 that is arranged with the second radiating fin group 90 near near the heat pipe section the substrate 40, its heat-transfer path is shortened, heat is distributed timely, so its heat dispersion is better, and the second radiating fin group 90 is distributed in the both sides of substrate 40, do not need to be arranged on the substrate 40, thereby saved baseplate material, alleviated the weight of substrate.
Claims (10)
1. heat-pipe radiating apparatus, comprise a substrate, be located at the first radiating fin group and at least one heat pipe on the substrate, this heat pipe connects first radiating fin group and the substrate, it is characterized in that: at least one side of the described first radiating fin group is provided with the second radiating fin group, this second radiating fin group extends to substrate one side, and is sheathed on the heat pipe.
2. heat-pipe radiating apparatus as claimed in claim 1 is characterized in that: described heat-pipe radiating apparatus comprises two second radiating fin groups and is distributed in the relative both sides of the first radiating fin group and substrate.
3. heat-pipe radiating apparatus as claimed in claim 1 or 2 is characterized in that: described heat pipe comprises first heat transfer segment and second heat transfer segment, and wherein first heat transfer segment is connected on the substrate, extends laterally substrate and passes the described second radiating fin group.
4. heat-pipe radiating apparatus as claimed in claim 3 is characterized in that: the part of corresponding heat pipe first heat transfer segment of this second radiating fin group is provided with through hole, and the through hole edge is provided with the flanging that combines with heat pipe.
5. heat-pipe radiating apparatus as claimed in claim 3 is characterized in that: described heat pipe is the U type, and its second heat transfer segment is passed the position of described first, second radiating fin group away from substrate.
6. heat-pipe radiating apparatus as claimed in claim 3 is characterized in that: the containing hole that is provided with ccontaining described heat pipe between described first radiating fin group and the substrate.
7. heat-pipe radiating apparatus as claimed in claim 6 is characterized in that: described containing hole is to be combined by the tank on tank on the substrate top surface and the corresponding with it first radiating fin group bottom surface.
8. heat-pipe radiating apparatus as claimed in claim 7 is characterized in that: the tank on the described substrate top surface is less than semicircle, and the tank on the fins group is greater than semicircle, but so that heat pipe and tank interference fit.
9. heat-pipe radiating apparatus as claimed in claim 1, it is characterized in that: the described first radiating fin group and the second radiating fin group respectively comprise near first radiating part of substrate with away from second radiating part of substrate, wherein second radiating part is wide than first radiating part, the one side is concordant with first radiating part, another relative side extends beyond substrate, forms a ladder drop and makes fins group be " L " type.
10. heat-pipe radiating apparatus as claimed in claim 1 or 2 is characterized in that: described heat pipe and first, second radiating fin group are all combined closely by the mode of interference fit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100614193A CN100499981C (en) | 2006-06-30 | 2006-06-30 | Heat pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100614193A CN100499981C (en) | 2006-06-30 | 2006-06-30 | Heat pipe radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101098605A true CN101098605A (en) | 2008-01-02 |
| CN100499981C CN100499981C (en) | 2009-06-10 |
Family
ID=39012022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100614193A Expired - Fee Related CN100499981C (en) | 2006-06-30 | 2006-06-30 | Heat pipe radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100499981C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101287350B (en) * | 2007-04-10 | 2010-12-08 | 株式会社藤仓 | Heat sink |
| CN102436295A (en) * | 2010-09-29 | 2012-05-02 | 研祥智能科技股份有限公司 | Heat tube heat radiator |
| CN101875168B (en) * | 2009-04-29 | 2012-08-15 | 技嘉科技股份有限公司 | Radiating module and assembly method thereof |
| CN101522010B (en) * | 2008-02-29 | 2012-09-19 | 富准精密工业(深圳)有限公司 | Heat dissipating device and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI255689B (en) * | 2003-12-16 | 2006-05-21 | Asia Vital Components Co Ltd | Structure and manufacturing method of heat sink module |
| US7036566B1 (en) * | 2005-10-06 | 2006-05-02 | Tsung-Hsien Huang | Heat dissipating module |
-
2006
- 2006-06-30 CN CNB2006100614193A patent/CN100499981C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101287350B (en) * | 2007-04-10 | 2010-12-08 | 株式会社藤仓 | Heat sink |
| US7942194B2 (en) | 2007-04-10 | 2011-05-17 | Fujikura Ltd. | Heat sink |
| CN101522010B (en) * | 2008-02-29 | 2012-09-19 | 富准精密工业(深圳)有限公司 | Heat dissipating device and manufacturing method thereof |
| CN101875168B (en) * | 2009-04-29 | 2012-08-15 | 技嘉科技股份有限公司 | Radiating module and assembly method thereof |
| CN102436295A (en) * | 2010-09-29 | 2012-05-02 | 研祥智能科技股份有限公司 | Heat tube heat radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100499981C (en) | 2009-06-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201115256Y (en) | Heat radiation device | |
| CN100517665C (en) | Heat-pipe radiating apparatus | |
| US20030141041A1 (en) | Tube-style radiator structure for computer | |
| US20040050534A1 (en) | Heat sink with heat pipe in direct contact with component | |
| US20040052051A1 (en) | Heat sink with heat pipe and base fins | |
| TW201024982A (en) | Heat dissipation device | |
| US10281220B1 (en) | Heat sink with vapor chamber | |
| US20090314471A1 (en) | Heat pipe type heat sink and method of manufacturing the same | |
| JP2009198173A (en) | Heat sink with heat pipes and method for manufacturing the same | |
| CN208970501U (en) | Radiator | |
| CN202284783U (en) | Radiating device for heat pipe | |
| US20040050535A1 (en) | Heat sink with angled heat pipe | |
| CN102332437A (en) | Heat pipe radiating device and installation method thereof | |
| CN100499981C (en) | Heat pipe radiator | |
| CN2763975Y (en) | Heat-pipe radiator | |
| CN101078949B (en) | Radiator | |
| WO2020135311A1 (en) | Heat dissipation apparatus and method | |
| US20100038064A1 (en) | Reinforced Thermal Module Structure | |
| CN101115368A (en) | Heat radiating device | |
| CN102891119A (en) | Radiating device | |
| CN109462968A (en) | A kind of radiator of multi-surface heat-producing device | |
| US20070285897A1 (en) | Thermal module with heat pipe | |
| CN208300186U (en) | Air-cooled/water cooling two uses radiator | |
| CN201146661Y (en) | Heat radiation structure for module power supply | |
| CN211427292U (en) | Radiator structure of double-circuit server |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090610 Termination date: 20150630 |
|
| EXPY | Termination of patent right or utility model |