CN208300186U - Air-cooled/water cooling two uses radiator - Google Patents
Air-cooled/water cooling two uses radiator Download PDFInfo
- Publication number
- CN208300186U CN208300186U CN201721886215.3U CN201721886215U CN208300186U CN 208300186 U CN208300186 U CN 208300186U CN 201721886215 U CN201721886215 U CN 201721886215U CN 208300186 U CN208300186 U CN 208300186U
- Authority
- CN
- China
- Prior art keywords
- band
- cooled
- fin
- air
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of air-cooled, radiators of water cooling two, including substrate, the substrate side outwardly protrudes the thermal conductive surface to be formed and be in close contact with heater element, the substrate another side has upwardly extended multiple band-like fins, the band-like fin arrangement is formed on substrate from upper parallel multiple waveform channels up, the band-like fin arrangement forms parallel multiple linear channels from left to right on substrate, is also removably installed the outline border for surrounding band-like fin on the substrate another side；The outline border upper and lower side can be respectively arranged with the air-cooled outline border of fan and the water cooled housing that all band-like fins are respectively arranged with waterpipe jointing in upper and lower side is surrounded in sealing.The utility model has the advantages that good heat dissipation effect, water-cooling or wind-cooling heat dissipating can be achieved.
Description
Technical field
The utility model relates to heat dissipation element, more particularly, to a kind of good heat dissipation effect, water-cooling or air-cooled can be achieved
Air-cooled/water cooling two of heat dissipation uses radiator.
Background technique
The prior art provides several single types of cooling for controller heat dissipation, there is Water Cooling Technology, air blast cooling skill
Art, natural cooling, heat pipe heat radiation and microchannel heat dissipation etc. are used according to actual use situation selection, and water cooling is dissipated for high-power
Heat, air blast cooling are suitable for open space, and natural cooling is used for small-power component, and heat pipe and microchannel are suitable for special feelings
Condition.For several single types of cooling, water-cooling effect is good, but occupied space, increases weight；The heat dissipation of air blast cooling technology
Effect is preferable, but needs to arrange fan, also occupied space；Natural cooling is suitable for small space, but heat dissipation effect is poor；Heat pipe dissipates
Thermal technology application range is limited, microchannel higher cost.The heavy vehicles such as present high-power electric automobile, fork truck are answered extensively
With electric control system power increases, but existing heat dissipation technology is no longer satisfied requirement, needs to pursue the higher heat dissipation of performance
Device；In addition, controller heat dissipation can only select a kind of type of cooling under normal circumstances, and cannot be big according to service condition, power
Minor adjustment changes radiating mode, and in the case of larger for Hyundai Motor changed power range, single radiating mode can not
Meet requirement.
Utility model content
To solve the above problems, the utility model aim be to provide a kind of good heat dissipation effect, water-cooling can be achieved or
Air-cooled/water cooling two of wind-cooling heat dissipating uses radiator.
The utility model realized by following technical measures, a kind of air-cooled/radiator of water cooling two, including substrate, institute
It states substrate side and outwardly protrudes the thermal conductive surface to be formed and be in close contact with heater element, the substrate another side has upwardly extended multiple
Band-like fin, the band-like fin arrangement is formed on substrate from upper parallel multiple waveform channels up, described band-like
Fin arrangement forms parallel multiple linear channels from left to right on substrate, also removably pacifies on the substrate another side
Equipped with the outline border for surrounding band-like fin；The outline border upper and lower side can be respectively arranged with the air-cooled outline border of fan and sealing is surrounded and owned
Band-like fin is respectively arranged with the water cooled housing of waterpipe jointing in upper and lower side.
The band-like fin is the thin bandlet shape in the thick top in bottom end as a preferred method,.
The band-like fin is the curved band-like fin that waveform matches as a preferred method,.
The band-like fin is made using calendering technology as a preferred method,.
The band-like fin and substrate are aluminium alloy or copper alloy as a preferred method,.
The thermal conductive surface is graphite heat radiation fin as a preferred method,.
The band-like fin is graphite flake as a preferred method,.
The linear channel that waveform channel and left and right settings setting up and down is utilized in the utility model forms turbulent-flow heat-exchanging
Technology, and it can be respectively used to air blast cooling heat dissipation and water-cooling, the Control of Electric Vehicles big suitable for high-power, changed power
System radiating.Waveform channel considers the mobile performance and flow-boundary-layer thickness variation of fluid, and fluid flow resistance is dropped
To minimum, reduction flow loss and local resistance loss.Using turbulent-flow heat-exchanging mechanism, by waveform channel decomposition at several small bands
Section, while linear channel water conservancy diversion is used, the turbulent flow effect of fluid is improved in the lesser situation of drag losses, is increased and is flowed solid convection current
The coefficient of heat transfer.This radiator can be according to applying working condition, operation watt level, in the feelings that controller box and radiator do not need to change
Under condition, change controller radiating mode (air blast cooling heat dissipation and water-cooling) and heat radiation power size, using flexible, before
Scape is wide, calculates by simulation, and compared to the conventional fins radiator of same volume, under the same terms, water-cooling ability is mentioned
Nearly 1.6 times are risen, air blast cooling heat-sinking capability promotes nearly 1.8 times, and heat dissipation performance is significantly improved, and air blast cooling heat dissipation and water cooling
Heat dissipation can be selected according to actual use situation switching, using flexible, it should wide.Wind-cooling heat dissipating, water-cooling, can be real in one
The switching at any time of existing two kinds of radiating modes need to only install spare platform small fan additional air-cooled outline border upper and lower ends when air-cooled,
Then install upper water cooled housing when water cooling additional and connect with water tank, change is convenient, without more heat exchange radiator, without change surrounding its
Its components, applicable controller power bracket is very wide, can be used for big power controller heat dissipation.
Detailed description of the invention
Fig. 1 is the main view that the utility model embodiment does not install outline border.
Fig. 2 is the side view that the utility model embodiment does not install outline border.
Fig. 3 is the main view that the utility model embodiment installs air-cooled outline border.
Fig. 4 is the cross-sectional view that the utility model embodiment installs water cooled housing.
Fig. 5 is the main view of the utility model embodiment water cooled housing.
Specific embodiment
Below with reference to embodiment and compares attached drawing the utility model is described in further detail.
A kind of air-cooled/radiator of water cooling two of the present embodiment, please refers to attached drawing 1 to Fig. 5, including substrate 1, the substrate
1 outwardly protrudes the thermal conductive surface 5 to be formed and be in close contact with heater element 12 on one side, and 1 another side of substrate has upwardly extended multiple
Band-like fin 2, the band-like fin 2, which arranges, to be formed on substrate 1 from upper parallel multiple waveform channels 4 up, described
Band-like fin 2 arranges the parallel multiple linear channels 3 formed on substrate 1 from left to right, may be used also on 1 another side of substrate
The outline border for surrounding band-like fin 2 is releasably installed；The outline border upper and lower side can be respectively arranged with the air-cooled outline border 6 of fan 7,8
The water cooled housing 9 of waterpipe jointing 10,11 is respectively arranged in upper and lower side with all band-like fins of sealing encirclement.
The linear channel 3 that waveform channel 4 and left and right settings setting up and down is utilized in this radiator forms turbulent-flow heat-exchanging
Technology, and it can be respectively used to air blast cooling heat dissipation and water-cooling, the Control of Electric Vehicles big suitable for high-power, changed power
System radiating.Waveform channel 4 considers the mobile performance and flow-boundary-layer thickness variation of fluid, and fluid flow resistance is dropped
To minimum, reduction flow loss and local resistance loss.Using turbulent-flow heat-exchanging mechanism, waveform channel 4 is resolved into several small
Band section, while linear 3 water conservancy diversion of channel is used, the turbulent flow effect of fluid is improved in the lesser situation of drag losses, and it is solid to increase stream
Convection transfer rate.This radiator can not be needed to change according to applying working condition, operation watt level in controller box and radiator
In the case where, change controller radiating mode (air blast cooling heat dissipation and water-cooling) and heat radiation power size, using flexible,
It has a extensive future, is calculated by simulation, compared to the conventional fins radiator of same volume, under the same terms, water-cooling
Nearly 1.6 times of capability improving, air blast cooling heat-sinking capability promotes nearly 1.8 times, and heat dissipation performance is significantly improved, and air blast cooling is radiated
It can be selected according to actual use situation switching with water-cooling, using flexible, it should wide.Wind-cooling heat dissipating, water-cooling are in one
Body, it can be achieved that two kinds of radiating modes switching at any time, need to only install 4 spare small fans additional air-cooled about 6 outline border when air-cooled
Both ends then install upper water cooled housing 9 when water cooling additional and connects with water tank, and change facilitates, without more heat exchange radiator, without
Other components around changing, applicable controller power bracket is very wide, can be used for big power controller heat dissipation.
In the embodiment of an air-cooled/radiator of water cooling two, Fig. 1 to Fig. 2 is please referred to, in front on the basis of technical solution
Specifically it is also possible that band-like fin 2 is the thin bandlet shape in the thick top in bottom end.Gap between band-like fin 2 is from bottom to top
Increase, meets hot-air expanded by heating principle, reduce cross-ventilation resistance to greatest extent, increase the same of air flow
When, destruction fluid boundary layer is additionally aided, so that hot-air can reach turbulent condition under lower flow velocity, is greatly provided
Convection transfer rate.
In the embodiment of an air-cooled/radiator of water cooling two, Fig. 1 to Fig. 2 is please referred to, in front on the basis of technical solution
Specifically it is also possible that band-like fin 2 is the curved band-like fin that waveform matches.
In the embodiment of an air-cooled/radiator of water cooling two, Fig. 1 to Fig. 2 is please referred to, in front on the basis of technical solution
Specifically it is also possible that band-like fin 2 is made using calendering technology.
In the embodiment of an air-cooled/radiator of water cooling two, Fig. 1 to Fig. 2 is please referred to, in front on the basis of technical solution
Specifically it is also possible that band-like fin 2 and substrate 1 are aluminium alloy or copper alloy.Radiator uses property aluminum alloy materials, has
Higher thermal coefficient and preferable hardness；Baseplate material --- the property aluminum alloy materials of function admirable are selected, and are set
Counting reasonable substrate shape reduces diffusion thermal resistance.The direction thermally-conductive interface that substrate shape is spread along hot-fluid gradually reduces, and meets
Hot-fluid gradually spreads the changing rule of reduction, and reasonable utilization material reduces the volume of radiator.For baseplate material and
2 material of curved surface wing heat sink can also select Cu alloy material as needed, but material processing performance must satisfy requirement, adopt
It can further increase the heat dissipation performance of radiator with Cu alloy material, but corresponding weight also increases more, this is for system
It is adversely affected in terms of loss of weight, should take the circumstances into consideration to select according to the actual situation.
In the embodiment of an air-cooled/radiator of water cooling two, Fig. 1 to Fig. 2 is please referred to, in front on the basis of technical solution
Specifically it is also possible that thermal conductive surface 5 is graphite heat radiation fin, interface Heat Conduction Material selects high performance graphite cooling fin, can be fast by heat
Speed is transferred uniformly into entire heat-absorbent surface, reduces diffusion thermal resistance and thermal contact resistance.
In the embodiment of an air-cooled/radiator of water cooling two, Fig. 1 to Fig. 2 is please referred to, in front on the basis of technical solution
Specifically it is also possible that air-cooled/water cooling two radiator is rectangular.It can be pushed further into the miniaturization, integrated of radiator, it is rectangular
Convenient for a certain number of small heat-dissipating devices that gather on radiating bottom plate, better heat dissipation effect will be reached.
In the embodiment of an air-cooled/radiator of water cooling two, Fig. 1 to Fig. 2 is please referred to, in front on the basis of technical solution
Specifically it is also possible that band-like fin 2 is graphite flake.Graphite heat radiation fin can be used.High performance graphite cooling fin is selected to reduce expansion
Heat dissipation resistance and interface contact heat resistance, the thermal coefficient due to the special lamellar molecular structure of graphite, in graphite heat radiation fin level
Up to 1500W/mK, interlayer thermal diffusion thermal coefficient be 20W/mK, thermal conduction resistance makes heat uniform rapidly in extremely low layer
Ground is distributed in base plate of radiator plane, greatly reduces diffusion thermal resistance；Graphite heat radiation fin, can be with due to higher thermal conductivity
Heat is rapidly transmitted and distributed, comprehensive heat dissipation effect is metallic copper, twice or more of aluminium；Ultra-thin graphite heat radiation fin
Device weight can also be mitigated, more excellent heat conduction and heat radiation performance can be provided, and there is excellent flexibility, can make it is larger compared with
Thin is laminar structured, can be well adapted for any surface, can be effectively reduced thermal contact resistance.
It is that/water cooling two air-cooled to the utility model is expounded with radiator above, is used to help understand that this is practical new
Type, but the embodiments of the present invention and be not restricted to the described embodiments, it is any without departing from institute under the utility model principle
The changes, modifications, substitutions, combinations, simplifications of work should be equivalent substitute mode, be included in the protection model of the utility model
That encloses is interior.
Claims (7)
1. a kind of air-cooled/radiator of water cooling two, it is characterised in that: including substrate, the substrate side outwardly protrude to be formed and
The thermal conductive surface that heater element is in close contact, the substrate another side have upwardly extended multiple band-like fins, the band-like fin row
It is listed in and is formed on substrate from upper parallel multiple waveform channels up, the band-like fin arrangement is formed on substrate from a left side
The parallel multiple linear channels turned right also are removably installed the outline border for surrounding band-like fin on the substrate another side；
The outline border upper and lower side can be respectively arranged with the air-cooled outline border of fan and sealing is surrounded all band-like fins and set respectively in upper and lower side
It is equipped with the water cooled housing of waterpipe jointing.
2. air-cooled/radiator of water cooling two according to claim 1, it is characterised in that: the band-like fin is that bottom end is thick
The thin bandlet shape in top.
3. air-cooled/radiator of water cooling two according to claim 1, it is characterised in that: the band-like fin is waveform
The curved band-like fin to match.
4. air-cooled/radiator of water cooling two according to claim 1, it is characterised in that: the band-like fin is using calendering
Technique is made.
5. air-cooled/radiator of water cooling two according to claim 1, it is characterised in that: the band-like fin and substrate are
Aluminium alloy or copper alloy.
6. air-cooled/radiator of water cooling two according to claim 1, it is characterised in that: the thermal conductive surface is graphite radiating
Piece.
7. air-cooled/radiator of water cooling two according to claim 1, it is characterised in that: the band-like fin is graphite flake.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721886215.3U CN208300186U (en) | 2017-12-28 | 2017-12-28 | Air-cooled/water cooling two uses radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721886215.3U CN208300186U (en) | 2017-12-28 | 2017-12-28 | Air-cooled/water cooling two uses radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208300186U true CN208300186U (en) | 2018-12-28 |
Family
ID=64697859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721886215.3U Expired - Fee Related CN208300186U (en) | 2017-12-28 | 2017-12-28 | Air-cooled/water cooling two uses radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208300186U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995837A (en) * | 2017-12-28 | 2018-05-04 | 深圳红河马智能数字动力技术有限公司 | Air-cooled, water cooling two uses radiator |
-
2017
- 2017-12-28 CN CN201721886215.3U patent/CN208300186U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995837A (en) * | 2017-12-28 | 2018-05-04 | 深圳红河马智能数字动力技术有限公司 | Air-cooled, water cooling two uses radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209823474U (en) | Wireless charging equipment | |
| TW201143590A (en) | Heat dissipation device | |
| CN208300186U (en) | Air-cooled/water cooling two uses radiator | |
| CN107995837A (en) | Air-cooled, water cooling two uses radiator | |
| CN207674759U (en) | A kind of semiconductor cooling device | |
| CN110475466B (en) | Air-cooled radiator and electrical equipment | |
| CN210014475U (en) | Radiator, air condensing units and air conditioner | |
| CN210014478U (en) | Radiator, air condensing units and air conditioner | |
| CN108489303A (en) | A kind of heat sink arrangement with thermal insulation layer | |
| CN204836913U (en) | Compound radiator and heat dissipation module | |
| CN113677159B (en) | Water-cooling and air-cooling compatible heat dissipation device | |
| WO2022083365A1 (en) | Device heat dissipation method and heat dissipation device | |
| CN211125625U (en) | Liquid cooling heat dissipation assembly, liquid cooling heat dissipation device and power electronic equipment | |
| CN210349818U (en) | Low flow resistance fin radiator | |
| CN210399248U (en) | Microchannel heat dissipation component, radiator, air conditioner outdoor unit and air conditioner | |
| CN114071955A (en) | Cooling device and electronic equipment comprising same | |
| CN210014479U (en) | Radiator, air condensing units and air conditioner | |
| CN204145971U (en) | Power electronics high-power water-cooling radiator | |
| CN209435686U (en) | Remote controler integral heat sink structure | |
| CN209299652U (en) | A kind of air-cooled radiator using aluminium extruded Formula V C quick conductive | |
| CN208300185U (en) | natural convection radiator | |
| CN105552049A (en) | Integrated liquid cooling heat sink device of power module and bottom plate used by power module | |
| CN109287100B (en) | Liquid metal heat abstractor and electronic equipment | |
| CN214791873U (en) | Radiator and air conditioner | |
| CN209248389U (en) | Circuit board and supercomputer server |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190121 Address after: 610066 No. 845 Haitang Road, Jinjiang District, Chengdu City, Sichuan Province Patentee after: Sichuan Fengguyuan New Energy Co., Ltd. Address before: 518000 Tongfu Industrial City, Tanglang, Xili Street, Nanshan District, Shenzhen City, Guangdong Province, 11 buildings, 1-2 buildings Patentee before: Red River, Shenzhen horse intelligent digital power technology Co., Ltd |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181228 Termination date: 20201228 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |