CN204145971U - Power electronics high-power water-cooling radiator - Google Patents
Power electronics high-power water-cooling radiator Download PDFInfo
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- CN204145971U CN204145971U CN201420493001.XU CN201420493001U CN204145971U CN 204145971 U CN204145971 U CN 204145971U CN 201420493001 U CN201420493001 U CN 201420493001U CN 204145971 U CN204145971 U CN 204145971U
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Abstract
The utility model belongs to electric and electronic technical field, and particularly a kind of power electronics high-power water-cooling radiator, comprises base plate of radiator and at least two radiating modules; Described radiating module comprises water inlet, delivery port, runner and cover plate; The back side of described base plate of radiator is provided with radiator installing hole, for position with power electronic equipment and fastening; The surface of described base plate of radiator is provided with power component installation position; Between different radiating modules, cooling fluid is separate; Described radiator integral adopts aluminium alloy or Cu alloy material.The power electronics high-power water-cooling radiator integral flow resistance that the utility model provides is low, thermal resistance is little, and uniform temperature is good, compact conformation, installs and uses simple and easy; Multiple radiating module can realize multiple different types of power component and use a radiator heat-dissipation simultaneously; Independent mutually between runner, can realize carrying out water distribution according to the watt level of each components and parts, radiating effect is remarkable.
Description
Technical field
The utility model belongs to electric and electronic technical field, particularly a kind of power electronics high-power water-cooling radiator.
Background technology
Power electronic technology is due to the advantage of himself, and be widely applied in multiple fields such as Power System Flexible direct current (interchange) transmission of electricity, high voltage direct current transmission and reactive power compensations, development potentiality is huge.In power electronic equipment, power component is in operation and can produces a large amount of heats, and therefore power electronic equipment heat dissipation problem becomes more and more outstanding, particularly in high-power field, tradition wind-cooling heat dissipating cannot meet its primary demand, is just progressively replaced by Water Cooling Technology.
Along with the development of power electronic technology, for meeting different application demands, the power component kind in single power electronic equipment and quantity also constantly increase.Water Cooling Technology radiating effect is superior, but current single radiator can only be often one, the heat radiation of a kind of components and parts, so, need the radiator quantity meeting of configuration a lot of in single power electronic equipment, its volume is caused greatly to increase, also become difficult point to whole power electronic equipment heat radiation water distribution simultaneously, the unreasonable meeting of water distribution causes the radiating effect of partial power's components and parts in device not reach requirement, increase risk etc. of leaking, have influence on device to use normally, the application of restriction power electronic technology.
Utility model content
The purpose of this utility model be to provide a kind of heat dispersion good, can simultaneously for multiple different types of power component carries out the water-filled radiator that dispels the heat.
For solving the problems of the technologies described above, the utility model provides following technical scheme:
Power electronics high-power water-cooling radiator, comprises base plate of radiator and at least two radiating modules; Described radiating module comprises water inlet, delivery port, runner and cover plate; The back side of described base plate of radiator is provided with radiator installing hole, for position with power electronic equipment and fastening; The surface of described base plate of radiator is provided with power component installation position; Between different radiating modules, cooling fluid is separate, and on the one hand flow resistance is low, and thermal resistance is little, the cooling liquid speed that also can control between disparate modules respectively according to the distribution situation of components and parts in addition; Described radiator integral adopts aluminium alloy or Cu alloy material.
Cooling fluid enters in radiator through water inlet, then carries out heat exchange through runner and the power component being arranged in spreader surface, takes away the heat that power component work produces, discharges finally by by delivery port.
Preferably, the base plate of radiator of its cover plate both sides is arranged high performance components installation position, be mainly used in the installation (as IGBT etc.) of high performance components, near the edge of base plate of radiator, be provided with small-power components and parts installation position, (as square resistance etc.) is installed in the small-power components and parts heat radiation being mainly used in caloric value in power electronic equipment little.
Described power component installation position is screwed hole or dowel hole; For laminating installing type power component (as thyristor or rectifier diode etc.), alignment pin also can be used to fix, now need offer dowel hole in spreader surface.
Preferably, the side of described base plate of radiator be also provided with radiator installing hole (be provided with water inlet, delivery port side relative), radiator can be made to be positioned by different installation position and power electronic equipment and fastening.
Preferably, the back of described base plate of radiator is fluted body structure, and radiator carrying and installation is simple and easy, laborsaving; When power component is more, this groove position may be used for mounting related components equally, realizes two-side radiation form, makes full use of radiator.
Preferably, between described cover plate and base plate of radiator, adopt embedded welding procedure, be welded in spreader surface by the technique such as soldering or soldering.
In the utility model, the quantity of radiating module is at least 2, can according to the quantity of power component and arrangement in actual use, do corresponding increase, flow channel length can lengthen in the horizontal, also longitudinally increasing independently runner, can meet different user demands.
The utility model has the advantage of:
1, radiator integral flow resistance is low, thermal resistance is little, and uniform temperature is good, compact conformation, installs and uses simple and easy;
2, multiple radiating module can realize multiple different types of power component and use a radiator heat-dissipation simultaneously, can meet the heat radiation of large power power electronic appliance simultaneously;
3, independent mutually between runner, can realize carrying out water distribution according to the watt level of each components and parts, radiating effect is remarkable;
4, independent many covering plate structures, embedded welding, effectively reduces the risk that radiator integral leaks.
5, cover plate can adopt the metal material of the high heat transfer efficiency such as aluminium alloy or copper alloy, greatly can improve the uniform temperature of radiator integral.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of power electronics high-power water-cooling radiator of the present utility model.
Fig. 2 is the end view of the embodiment of power electronics high-power water-cooling radiator of the present utility model.
Fig. 3 is the upward view of the embodiment of power electronics high-power water-cooling radiator of the present utility model.
In figure: 1. base plate of radiator; 2. radiating module; 3. water inlet; 4. delivery port; 5. runner; 6. cover plate; 7. power component installation position; 71. high performance components installation positions; 72 small-power components and parts installation positions; 8. radiator installing hole.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described further.
Power electronics high-power water-cooling radiator, comprises base plate of radiator 1 and two radiating modules 2; Each radiating module 2 comprises water inlet 3, delivery port 4, runner 5 and cover plate 6; The back side of base plate of radiator 1 is provided with eight radiator installing holes 8, for position with power electronic equipment and fastening; The surface of base plate of radiator 1 is provided with power component installation position 7; Cooling fluid enters in radiator through water inlet 3, then carries out heat exchange through runner 5 and the power component being arranged in spreader surface, takes away the heat that power component work produces, discharges finally by by delivery port 4; Between two radiating modules 2, cooling fluid is separate; Radiator integral adopts aluminium alloy or Cu alloy material.
The base plate of radiator 1 of its cover plate 6 both sides arranges high performance components installation position 71, be mainly used in the installation (as IGBT etc.) of high performance components, near the edge of base plate of radiator, be provided with small-power components and parts installation position 72, (as square resistance etc.) is installed in the small-power components and parts heat radiation being mainly used in caloric value in power electronic equipment little.
The back of base plate of radiator 1 is fluted body structure, and carrying and installation is simple and easy, laborsaving; When power component is more, this groove position may be used for mounting related components equally, realizes two-side radiation form, makes full use of radiator.
Embedded welding procedure is adopted between cover plate 6 and radiator body, by soldering or soldering in spreader surface, its material adopts 6063 aluminum alloy materials, ensures that the radiator heat-dissipation face contacted with power component possesses good uniform temperature, ensures its trouble free service.
Runner 5 inside is square structure; On the basis keeping radiator basic structure constant, runner 5 interior shape is not limited to square structure, and the structures such as offset strip fin formula, labyrinth type, spiral flow passage type, circle can be adopted to substitute.
More than display only describes principal character of the present utility model and inventive point.Those skilled in the art should understand, and the utility model is not restricted to the described embodiments.Under the prerequisite not departing from inventive point and protection range, the utility model also has various change, and these changes and improvements all will fall in the claimed scope of the utility model.
Claims (6)
1. power electronics high-power water-cooling radiator, comprises base plate of radiator (1) and at least two radiating modules (2); Described radiating module (2) comprises water inlet (3), delivery port (4), runner (5) and cover plate (6); The back side of described base plate of radiator (1) is provided with radiator installing hole (8), for position with power electronic equipment and fastening; The surface of described base plate of radiator is provided with power component installation position (7); Between different radiating modules (2), cooling fluid is separate.
2. power electronics high-power water-cooling radiator as claimed in claim 1, is characterized in that, the base plate of radiator (1) of described cover plate (6) both sides arranges high performance components installation position (71); Edge near base plate of radiator (1) is provided with small-power components and parts installation position (72).
3. power electronics high-power water-cooling radiator as claimed in claim 1, it is characterized in that, described power component installation position (7) is screw or dowel hole.
4. power electronics high-power water-cooling radiator as claimed in claim 1, it is characterized in that, the side of described base plate of radiator (1) is also provided with radiator installing hole (8).
5. power electronics high-power water-cooling radiator as claimed in claim 1, it is characterized in that, the back of described base plate of radiator (1) is fluted body structure.
6. power electronics high-power water-cooling radiator as claimed in claim 1, is characterized in that, adopt embedded welding procedure between described cover plate (6) and base plate of radiator (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420493001.XU CN204145971U (en) | 2014-08-27 | 2014-08-27 | Power electronics high-power water-cooling radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420493001.XU CN204145971U (en) | 2014-08-27 | 2014-08-27 | Power electronics high-power water-cooling radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204145971U true CN204145971U (en) | 2015-02-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420493001.XU Active CN204145971U (en) | 2014-08-27 | 2014-08-27 | Power electronics high-power water-cooling radiator |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104936423A (en) * | 2015-06-25 | 2015-09-23 | 常州博瑞电力自动化设备有限公司 | High-effect liquid cooling plate |
| CN108759533A (en) * | 2018-05-29 | 2018-11-06 | 电子科技大学 | A kind of microchannel cold plates, radiator and device based on 3D bulk prints |
-
2014
- 2014-08-27 CN CN201420493001.XU patent/CN204145971U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104936423A (en) * | 2015-06-25 | 2015-09-23 | 常州博瑞电力自动化设备有限公司 | High-effect liquid cooling plate |
| CN108759533A (en) * | 2018-05-29 | 2018-11-06 | 电子科技大学 | A kind of microchannel cold plates, radiator and device based on 3D bulk prints |
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