CN202663571U - Heat radiation structure of electromagnetic heating appliance - Google Patents
Heat radiation structure of electromagnetic heating appliance Download PDFInfo
- Publication number
- CN202663571U CN202663571U CN 201220245977 CN201220245977U CN202663571U CN 202663571 U CN202663571 U CN 202663571U CN 201220245977 CN201220245977 CN 201220245977 CN 201220245977 U CN201220245977 U CN 201220245977U CN 202663571 U CN202663571 U CN 202663571U
- Authority
- CN
- China
- Prior art keywords
- radiator
- electromagnetic heating
- heating device
- water
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 18
- 230000005855 radiation Effects 0.000 title abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 49
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims description 4
- 229910017629 Sb2Te3 Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000006104 solid solution Substances 0.000 claims description 3
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 241000238631 Hexapoda Species 0.000 abstract description 4
- 230000002265 prevention Effects 0.000 abstract 2
- 238000005057 refrigeration Methods 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Abstract
The utility model relates to a heat radiation structure of electromagnetic heating utensil, including circuit board and the radiator that is connected with power components and parts, its characterized in that install semiconductor refrigeration piece between radiator and the power components and parts, and still including passing the inside circulating water cooling system of radiator. The utility model adopts the semiconductor refrigeration combined with the water cooling mode to dissipate heat of the power components which mainly generate heat, does not need to install a fan, has good heat dissipation effect, can be totally closed, and has the effects of moisture protection, insect prevention and oil pollution prevention; meanwhile, the electromagnetic heating device does not have wind noise when working due to the omission of a cooling fan.
Description
Technical field
The utility model relates to the radiator structure of cooking appliance, especially a kind of radiator structure of electromagnetic heating device.
Background technology
The radiator structure of prior art electromagnetic heating device has air-cooled and the water-cooled dual mode, usually adopts air-cooled+heat spreader structures.The devices such as components and parts IGBT and bridge heap belong to high power device, can produce amount of heat during work.The employing wind-cooling heat dissipating just need to drive at the electromagnetic heating device casing, air outlet, and fan will be brought into the electromagnetic heating device inside such as dust, greasy dirt, causes fault, and reduces component reliability.Simultaneously, adopt the mode of wind-cooling heat dissipating can produce noise.
Water-cooling heat radiating device commonly used has the water tank type water-cooling radiating structure, and existing water-cooling pattern is directly device to be dispelled the heat, and sustainability is not strong, namely can not maintain a lower temperature.Adopt water-cooled to add semiconductor chilling plate, be equivalent to shift the heat radiation object.The cold and hot two ends temperature difference of cooling piece is about 60 ℃, and water-cooled is to the cooling piece hot-side heat dissipation, and cold junction just can maintain low temperature always, and the cooling piece thermal endurance is more eager to excel in whatever one does than IGBT, bridge heap constant power device, and these all are that water-cooled is inaccessible.
Summary of the invention
The purpose of this utility model is to overcome the problems referred to above, a kind of radiator structure of electromagnetic heating device is provided, adopt semiconductor refrigerating in conjunction with the heat sink conception of water-cooled, its heat conduction efficiency is much higher than traditional wind-cooling heat dissipating, use the semiconductor cold junction that components and parts are cooled off, and take away the heat in semiconductor hot junction with recirculated water, reach the purpose to the components and parts heat radiation.The present invention can realize totally-enclosed, fan-free, and protection against the tide, insect protected, dustproof, oil-stain-preventing and satisfy Modern Family to the demand of low environment noise.
The technical scheme that realizes the utility model purpose is, a kind of radiator structure of electromagnetic heating device, comprise the circuit board and the radiator that are connected with power component, it is characterized in that, between described radiator and power component, semiconductor chilling plate is installed, and also includes the circulating water cooling system that passes radiator inside.
Above-mentioned semiconductor chilling plate comprises hot junction and cold junction, and described cold junction contacts with the circuit board power component, and the hot junction contacts with radiator by Heat Conduction Material.
Above-mentioned circulating water cooling system comprises the recirculated water cooling passage that is made of water tank, water pump and the metal heat sink inside of circulation circuit the water pipe series connection.
Above-mentioned water pump be arranged in the water tank or water tank outside.
Above-mentioned semiconductor chilling plate is the ternary solid solution alloy take bismuth telluride as matrix, and wherein the P type is Bi2Te3-Sb2Te3, and N-type is Bi2Te3-Bi2Se3.
The beneficial effects of the utility model are, the utility model adopts semiconductor refrigerating to dispel the heat in conjunction with the power component of water-cooling pattern to main heat production, need not provided with fan, not only good heat dissipation effect, and can play totally-enclosed, have protection against the tide, insect protected, oil-stain-preventing, effect; Simultaneously, because having omitted radiator fan, there is not wind-dryness sound during electromagnetic heating device work.
Description of drawings
Fig. 1 is the structural representation that the utility model is used for electromagnetic oven;
Fig. 2 is structural representation between power component, semiconductor chilling plate and the radiator three.
Among the figure: water tank 1, water pump 2, circuit board 3, radiator 4, the recirculated water cooling passage 41 of radiator inside, semiconductor chilling plate 5, semiconductor chilling plate cold junction 51, semiconductor chilling plate hot junction 52, power component 6, water pipe 7, casing 8, electromagnetic oven guidance panel 9.
Embodiment
Below in conjunction with accompanying drawing embodiment of the present utility model is described further.
As shown in Figure 1 and Figure 2, the utility model is used for the heat radiation at the electromagnetic oven heating element, the power component 6 that this radiator structure can generate heat when comprising recirculated water cooling passage 41, semiconductor chilling plate 5, the work of water tank 1, water pump 2, circuit board 3, radiator 4, radiator inside, the delivery port of water tank 1 is connected with water pump 2, and the water inlet of access radiator inner loop water-cooling channel 41, the delivery port of the recirculated water cooling passage 41 of radiator inside is communicated with water tank 1 by water pipe 7.
As shown in Figure 2, power component 6 is close to by the cold junction 51 of Heat Conduction Material and semiconductor chilling plate 5, the hot junction 52 of semiconductor chilling plate 5 is close to by Heat Conduction Material and radiator 4, and circuit board 3 and semiconductor chilling plate 5, radiator 4 are by buckle or beat the screw mode and be fixed together.Radiator 4 is made by metallic aluminium or copper, in establish recirculated water cooling passage 41, by water pipe 7 radiator 4, water pump 2, water tank 1 are coupled together and consist of a circulation circuit, water pipe 7 is PVC water pipe or plastic flexible pipe, water tank 1 also can be made and casing 8 one.
Described semiconductor chilling plate 5 is the ternary solid solution alloys take bismuth telluride as matrix, and wherein the P type is Bi2Te3-Sb2Te3, and N-type is Bi2Te3-Bi2Se3.
When electromagnetic oven work of the present utility model is installed, circuit board 3, power component 6(IGBT, Qiao Dui) will produce very large power consumption and heat, the cold junction 51 of semiconductor chilling plate 5 can maintain lower temperature (20 degree are following), by thermaltransmission mode the heat of power component 6 is taken away, the heat in semiconductor chilling plate 5 hot junctions 52 is delivered on the radiator 4 simultaneously, water pump 2 draws water from water tank 1, by water pipe 7, flow through with the radiator 4 of recirculated water cooling passage 41, after the heat of radiator 4 taken away, get back to water tank 1, consist of waterway circulating.Water tank 1 also can directly dispel the heat by casing.Because solved the heat dissipation problem of topmost power component 6, the temperature of whole electromagnetic oven work system also will reduce greatly, thereby make the electromagnetic oven internal stability maintain lower temperature.The utility model need not provided with fan, good heat dissipation effect not only, and can play totally-enclosed, have protection against the tide, insect protected, oil-stain-preventing, effect; Simultaneously, because having omitted radiator fan, there is not wind-dryness sound during electromagnetic heating device work yet.
Claims (5)
1. the radiator structure of an electromagnetic heating device, comprise the circuit board and the radiator that are connected with power component, it is characterized in that, between described radiator and power component, semiconductor chilling plate is installed, and also include the circulating water cooling system that passes radiator inside.
2. the radiator structure of electromagnetic heating device according to claim 1 is characterized in that, described semiconductor chilling plate comprises hot junction and cold junction, and described cold junction contacts with the circuit board power component, and the hot junction contacts with radiator by Heat Conduction Material.
3. the radiator structure of electromagnetic heating device according to claim 1 and 2 is characterized in that, described circulating water cooling system comprises the recirculated water cooling passage that is made of water tank, water pump and the metal heat sink inside of circulation circuit the water pipe series connection.
4. the radiator structure of electromagnetic heating device according to claim 3 is characterized in that, described water pump be arranged in the water tank or water tank outside.
5. the radiator structure of electromagnetic heating device according to claim 1 is characterized in that, described semiconductor chilling plate is the ternary solid solution alloy take bismuth telluride as matrix, and wherein the P type is Bi2Te3-Sb2Te3, and N-type is Bi2Te3-Bi2Se3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220245977 CN202663571U (en) | 2012-05-29 | 2012-05-29 | Heat radiation structure of electromagnetic heating appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220245977 CN202663571U (en) | 2012-05-29 | 2012-05-29 | Heat radiation structure of electromagnetic heating appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202663571U true CN202663571U (en) | 2013-01-09 |
Family
ID=47458439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220245977 Expired - Lifetime CN202663571U (en) | 2012-05-29 | 2012-05-29 | Heat radiation structure of electromagnetic heating appliance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202663571U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106427754A (en) * | 2016-11-17 | 2017-02-22 | 天津捷盛东辉保鲜科技有限公司 | Solar simple cold-chain logistics freshness retaining equipment |
| CN108650861A (en) * | 2018-07-12 | 2018-10-12 | 江门市银河科技发展有限公司 | A kind of heat generating components high temperature water flow cooling device |
| CN110139414A (en) * | 2018-02-02 | 2019-08-16 | 佛山市顺德区美的电热电器制造有限公司 | Cooking apparatus |
-
2012
- 2012-05-29 CN CN 201220245977 patent/CN202663571U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106427754A (en) * | 2016-11-17 | 2017-02-22 | 天津捷盛东辉保鲜科技有限公司 | Solar simple cold-chain logistics freshness retaining equipment |
| CN110139414A (en) * | 2018-02-02 | 2019-08-16 | 佛山市顺德区美的电热电器制造有限公司 | Cooking apparatus |
| CN108650861A (en) * | 2018-07-12 | 2018-10-12 | 江门市银河科技发展有限公司 | A kind of heat generating components high temperature water flow cooling device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: MIDEA GROUP CO., LTD. Free format text: FORMER NAME: MEIDI GROUP CO. LTD. |
|
| CP03 | Change of name, title or address |
Address after: 528311 Guangdong, Foshan, Beijiao, the United States, the United States and the United States on the avenue of the United States, the headquarters of the United States building B floor, District, 26-28 Patentee after: MIDEA GROUP Co.,Ltd. Address before: 528311 Beijiao, Foshan, Shunde District, the town of Guangdong, the United States Avenue, No. 6 Patentee before: Midea Group |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130109 |