CN209749011U - Cooling device - Google Patents
Cooling device Download PDFInfo
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Abstract
本实用新型公开了一种降温装置，它包括热端散热器、热端出风风扇、冷端散热器、冷端出风风扇、半导体制冷片和电源；所述冷端散热器设置在半导体制冷片的冷端面处并与冷端面接触，所述冷端散热器上设置有冷端出风风扇；所述热端散热器设置在半导体制冷片的热端面处并与热端面接触，所述热端散热器上设置有热端出风风扇；所述热端出风风扇、冷端出风风扇和半导体制冷片均与电源相连。该装置能够使进入变频器机箱内的空气变冷，能够有效对机箱内的电子元件制冷。
The utility model discloses a cooling device, which comprises a hot end radiator, a hot end air outlet fan, a cold end radiator, a cold end air outlet fan, a semiconductor cooling sheet and a power supply; The cold end surface of the sheet is in contact with the cold end surface, and the cold end radiator is provided with a cold end air outlet fan; the hot end radiator is arranged at the hot end surface of the semiconductor cooling sheet and is in contact with the hot end surface. A hot end air outlet fan is arranged on the heat sink at the end; the hot end air outlet fan, the cold end air outlet fan and the semiconductor refrigerating sheet are all connected to the power supply. The device can cool the air entering the case of the frequency converter, and can effectively cool the electronic components in the case.
Description
技术领域technical field
本实用新型涉及散热领域，特指一种降温装置。The utility model relates to the field of heat dissipation, in particular to a cooling device.
背景技术Background technique
变频器工作时，由于变频器内部功率元件发热使变频器机箱内部温度升高。为了保证变频器内部电子元件正常工作，通常在变频器机箱顶部加装散热风扇，机箱底部开进气孔。空气从变频器底部进气孔进入机箱，流过电子元件及其散热器表面带走热量，由散热风扇从变频器顶部抽出。这样达到给变频器机箱内电子元件降温的目的。When the inverter is working, the internal temperature of the inverter case will rise due to the heating of the power components inside the inverter. In order to ensure the normal operation of the electronic components inside the inverter, a cooling fan is usually installed on the top of the inverter case, and an air inlet is opened at the bottom of the case. The air enters the chassis from the air inlet at the bottom of the inverter, flows through the electronic components and the surface of the radiator to take away heat, and is drawn out from the top of the inverter by the cooling fan. In this way, the purpose of cooling the electronic components in the inverter chassis can be achieved.
这种降温的办法缺点是：当机房内环境温度过高时，进入变频器底部空气温度过高，流经变频器内部电子元件及其散热器表面时，根本无法带走热量，达到降温的目的，从而导致电子元件温度过高，变频器温度保护装置动作，变频器停机。The disadvantage of this method of cooling is: when the ambient temperature in the machine room is too high, the temperature of the air entering the bottom of the frequency converter is too high, and when it flows through the internal electronic components of the frequency converter and the surface of the radiator, it cannot take away the heat at all to achieve the purpose of cooling , As a result, the temperature of the electronic components is too high, the inverter temperature protection device operates, and the inverter stops.
发明内容Contents of the invention
本实用新型的目的在于：针对上述存在的问题，提供一种降温装置，当该装置安装在变频器机箱底部进气孔位置，使进入变频器底部的空气为冷空气，从而保证了流经变频器内部电子元件的空气为冷空气，能够很好的带走电子元件的热量，达到给元器件降温的目的。The purpose of this utility model is to provide a cooling device for the above-mentioned problems. When the device is installed at the air intake hole at the bottom of the inverter case, the air entering the bottom of the inverter is cold air, thereby ensuring that the air flowing through the inverter The air of the electronic components inside the device is cold air, which can take away the heat of the electronic components and achieve the purpose of cooling the components.
本实用新型采用的技术方案如下：The technical scheme that the utility model adopts is as follows:
一种降温装置，它包括热端散热器、热端出风风扇、冷端散热器、冷端出风风扇、半导体制冷片和电源；所述冷端散热器设置在半导体制冷片的冷端面处并与冷端面接触，所述冷端散热器上设置有冷端出风风扇；所述热端散热器设置在半导体制冷片的热端面处并与热端面接触，所述热端散热器上设置有热端出风风扇；所述热端出风风扇、冷端出风风扇和半导体制冷片均与电源相连。A cooling device, which includes a hot end radiator, a hot end air outlet fan, a cold end radiator, a cold end air outlet fan, a semiconductor cooling sheet and a power supply; the cold end radiator is arranged at the cold end surface of the semiconductor cooling sheet And in contact with the cold end surface, the cold end radiator is provided with a cold end air outlet fan; the hot end radiator is arranged at the hot end surface of the semiconductor refrigeration sheet and contacts the hot end surface, the hot end radiator is provided There is a hot end air outlet fan; the hot end air outlet fan, the cold end air outlet fan and the semiconductor refrigerating sheet are all connected to the power supply.
本实用新型利用了“帕尔贴效应”，帕尔贴效应的基本原理是当一块N型半导体材料和一块P型半导体材料联结成的热电偶对中有电流通过时，两端之间就会产生热量转移，导致一端释放热量成为热端，另一端吸收热量成为冷端。The utility model utilizes the "Peltier effect". The basic principle of the Peltier effect is that when a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, there will be a flow between the two ends. Heat transfer occurs, causing one end to release heat to become the hot end, and the other end to absorb heat to become the cold end.
本实用新型的电源为半导体制冷片供电，使半导体制冷片热端的温度升高，冷端的温度变低；进而使热端散热器的温度升高，冷端散热器的温度降低；冷端出风风扇转动时，使风经过冷端散热器再由冷端出风风扇带走送往变频器的机箱内，进而对变频器机箱内的电子元件制冷；而热端出风风扇用于加快热端散器表面空气流动速度，为热端散热片降温。The power supply of the utility model supplies power to the semiconductor refrigerating sheet, so that the temperature of the hot end of the semiconductor refrigerating sheet increases and the temperature of the cold end decreases; furthermore, the temperature of the radiator at the hot end increases and the temperature of the radiator at the cold end decreases; When the fan rotates, the wind passes through the radiator at the cold end and is taken away by the fan at the cold end and sent to the case of the inverter, thereby cooling the electronic components in the case of the inverter; the fan at the hot end is used to speed up the cooling of the hot end The speed of air flow on the surface of the radiator can cool down the heat sink at the hot end.
进一步的，所述半导体制冷片至少为一个。多个半导体制冷片能够提高制冷效率。Further, there is at least one semiconductor cooling chip. A plurality of semiconductor cooling chips can improve cooling efficiency.
进一步的，所述冷端散热器上至少设置一个冷端出风风扇，所述热端散热器上至少设置一个热端出风风扇。多个风扇能够提高制冷效率和散热效率。Further, at least one cold-end air outlet fan is arranged on the cold-end radiator, and at least one hot-end air outlet fan is arranged on the hot-end radiator. Multiple fans improve cooling and cooling efficiency.
进一步的，所述半导体制冷片为多个，冷端散热器上设置有多个冷端出风风扇；热端散热器上设置有多个热端出风风扇；所述半导体制冷片、热端出风风扇、冷端出风风扇和电源通过导线构成闭合回路，其中各半导体制冷片相互并联，各热端出风风扇相互并联，各冷端出风风扇相互并联。Further, there are multiple semiconductor refrigerating sheets, and multiple cold-end air outlet fans are arranged on the cold-end radiator; multiple hot-end air-out fans are arranged on the hot-end radiator; The air outlet fan, the cold end air outlet fan and the power supply form a closed loop through the wires, wherein the semiconductor cooling chips are connected in parallel, the hot end air outlet fans are connected in parallel, and the cold end air outlet fans are connected in parallel.
进一步的，所述热端散热器和冷端散热器通过螺栓进行连接，将半导体制冷片夹在热端散热器和冷端散热器之间。Further, the hot-end radiator and the cold-end radiator are connected by bolts, and the semiconductor refrigeration sheet is sandwiched between the hot-end radiator and the cold-end radiator.
进一步的，所述热端散热器和冷端散热器结构相同，均包括底板和设置在底板上的金属散热片；所述底板上开设有螺栓连接孔。Further, the heat sink at the hot end and the radiator at the cold end have the same structure, and both include a bottom plate and metal cooling fins arranged on the bottom plate; bolt connection holes are opened on the bottom plate.
进一步的，所述冷端散热器的底板与半导体制冷片的冷端面接触，热端散热器的底板与半导体制冷片的热端面接触，所述冷端散热器的底板与热端散热器的底板通过螺栓进行连接，使半导体制冷片夹在两底板之间；所述冷端出风风扇通过螺栓固定在冷端散热器的顶部，热端出风风扇通过螺栓固定在热端散热器的顶部。Further, the bottom plate of the cold end radiator is in contact with the cold end surface of the semiconductor cooling sheet, the bottom plate of the hot end radiator is in contact with the hot end surface of the semiconductor cooling sheet, and the bottom plate of the cold end radiator is in contact with the bottom plate of the hot end radiator The connection is carried out by bolts, so that the semiconductor refrigeration sheet is sandwiched between the two bottom plates; the cold-end air outlet fan is fixed on the top of the cold-end radiator by bolts, and the hot-end air outlet fan is fixed on the top of the hot-end radiator by bolts.
进一步的，所述降温装置的冷端出风风扇设置在变频器的进风口处。Further, the air outlet fan at the cold end of the cooling device is arranged at the air inlet of the frequency converter.
进一步的，所述电源为开关电源，其中开关电源的一个进线端子直接与220V交流电源的零线相连；另一个进线端子与220V交流电源的火线相连，且该火线上串接有变频器启动继电器的常开触点；开关电源的输出正极和负极与半导体制冷片、热端出风风扇和冷端出风风扇通过导线构成闭合回路。Further, the power supply is a switching power supply, wherein one incoming terminal of the switching power supply is directly connected to the neutral line of the 220V AC power supply; the other incoming line terminal is connected to the live wire of the 220V AC power supply, and a frequency converter is connected in series on the live wire The normally open contact of the start relay; the output positive and negative poles of the switching power supply and the semiconductor cooling sheet, the hot end air outlet fan and the cold end air outlet fan form a closed circuit through wires.
综上所述，由于采用了上述技术方案，本实用新型的有益效果是：In summary, due to the adoption of the above technical solution, the beneficial effects of the utility model are:
本实用新型通过帕尔贴效应来对冷端散热器降温，使经过冷端散热器的空气温度降低，进而使冷端出风风扇送往变频器机箱内的风为冷风，有效的保证了对机箱内电子元件的降温；本实用新型的降温装置，结构简单，换热过程中不需要冷却水进行交换，减小了设备的体积和制造成本，便于使用和推广。The utility model lowers the temperature of the radiator at the cold end through the Peltier effect, so that the temperature of the air passing through the radiator at the cold end is lowered, and then the air sent by the fan at the cold end to the inverter case is cold air, which effectively ensures the cooling effect of the inverter. Cooling of electronic components in the case; the cooling device of the utility model has a simple structure, does not need cooling water for exchange in the heat exchange process, reduces the volume and manufacturing cost of the equipment, and is convenient for use and popularization.
附图说明Description of drawings
图1是本实用新型的主视图；Fig. 1 is the front view of the utility model;
图2是本实用新型的空气流动路径示意图；Fig. 2 is a schematic diagram of the air flow path of the present utility model;
图3是本实用新型的仰视图；Fig. 3 is the bottom view of the utility model;
图4是本实用新型的接线图。Fig. 4 is the wiring diagram of the present utility model.
具体实施方式Detailed ways
下面结合附图，对本实用新型作详细的说明。Below in conjunction with accompanying drawing, the utility model is described in detail.
为了使本实用新型的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.
本实施方式中公开了一种降温装置，主要用于变频器降温，该降温装置设置在变频器机箱进气口处，它包括热端散热器4、热端出风风扇5、冷端散热器2、冷端出风风扇1、半导体制冷片3和电源；所述冷端散热器2设置在半导体制冷片3的冷端面处并与冷端面接触，所述冷端散热器2上设置有冷端出风风扇1；所述冷端出风风扇1接在变频器机箱进气口处；所述热端散热器4设置在半导体制冷片3的热端面处并与热端面接触，所述热端散热器4上设置有热端出风风扇5；所述热端出风风扇5、冷端出风风扇1和半导体制冷片3均与电源相连。This embodiment discloses a cooling device, which is mainly used for cooling the inverter. The cooling device is arranged at the air inlet of the inverter chassis. It includes a hot end radiator 4, a hot end air outlet fan 5, and a cold end radiator. 2. The cold end air outlet fan 1, the semiconductor cooling sheet 3 and the power supply; the cold end radiator 2 is arranged at the cold end surface of the semiconductor cooling sheet 3 and is in contact with the cold end surface, and the cold end radiator 2 is provided with a cooling The air outlet fan 1 at the end; the air outlet fan 1 at the cold end is connected to the air inlet of the inverter case; The end radiator 4 is provided with a hot end air outlet fan 5; the hot end air outlet fan 5, the cold end air outlet fan 1 and the semiconductor refrigeration sheet 3 are all connected to the power supply.
所述半导体制冷片3可以为一个或多个，通过并联方式与电源连接；所述冷端散热器2上可以设置一个或多个冷端出风风扇1，所述热端散热器4上可以设置一个或多个热端出风风扇5。冷端出风风扇1间可以并联或串联与电源连接，热端出风风扇5间可以并联或串联与电源连接。Described semiconductor refrigeration sheet 3 can be one or more, is connected with power supply by parallel connection; One or more cold-end air outlet fans 1 can be set on the described cold-end radiator 2, can be arranged on the described hot-end radiator 4 One or more hot end air outlet fans 5 are set. 1 room of the air outlet fan at the cold end can be connected to the power supply in parallel or in series, and 5 rooms of the air outlet fan at the hot end can be connected to the power supply in parallel or in series.
在本实施方式中，所述半导体制冷片3为多个，冷端散热器2上设置有多个冷端出风风扇1,热端散热器4上设置有多个热端出风风扇5；图4所示，半导体制冷片3、冷端出风风扇1和热端出风风扇5均为3个,其中，半导体制冷片3、热端出风风扇5、冷端出风风扇1和电源通过导线构成闭合回路，其中各半导体制冷片3相互并联，各热端出风风扇5相互并联，各冷端出风风扇1相互并联。In this embodiment, there are a plurality of semiconductor refrigeration chips 3, a plurality of cold-end air outlet fans 1 are arranged on the cold-end radiator 2, and a plurality of hot-end air outlet fans 5 are arranged on the hot-end radiator 4; As shown in Figure 4, there are three semiconductor cooling sheets 3, cold end air outlet fan 1 and hot end air outlet fan 5, wherein the semiconductor cooling sheet 3, hot end air outlet fan 5, cold end air outlet fan 1 and power supply A closed loop is formed by wires, wherein the semiconductor cooling fins 3 are connected in parallel, the hot end air outlet fans 5 are connected in parallel, and the cold end air outlet fans 1 are connected in parallel.
所述热端散热器4和冷端散热器2通过螺栓进行连接，将半导体制冷片3夹在热端散热器4和冷端散热器2之间。The hot end radiator 4 and the cold end radiator 2 are connected by bolts, and the semiconductor refrigeration sheet 3 is sandwiched between the hot end radiator 4 and the cold end radiator 2 .
所述热端散热器4和冷端散热器2结构相同，均包括底板6和设置在底板6上的金属散热片；所述底板6上开设有螺栓连接孔。The hot end radiator 4 and the cold end radiator 2 have the same structure, and both include a bottom plate 6 and metal cooling fins arranged on the bottom plate 6; the bottom plate 6 is provided with bolt connection holes.
所述冷端散热器2的底板6与半导体制冷片3的冷端面接触，热端散热器4的底板6与半导体制冷片3的热端面接触，所述冷端散热器2的底板6与热端散热器4的底板6通过螺栓进行连接，使半导体制冷片3夹在两底板6之间；在热端散热器4的底板6、半导体制冷片3和冷端散热器2的底板6间的接触面上涂有一层导热硅脂。所述冷端出风风扇1通过螺栓固定在冷端散热器2的顶部，热端出风风扇5通过螺栓固定在热端散热器4的顶部。The bottom plate 6 of the cold end radiator 2 is in contact with the cold end surface of the semiconductor cooling sheet 3, the bottom plate 6 of the hot end radiator 4 is in contact with the hot end surface of the semiconductor cooling sheet 3, and the bottom plate 6 of the cold end radiator 2 is in contact with the hot end surface of the semiconductor cooling sheet 3. The bottom plate 6 of the end radiator 4 is connected by bolts, so that the semiconductor cooling fin 3 is sandwiched between the two bottom plates 6; The contact surface is coated with a layer of thermal conductive silicone grease. The cold end air outlet fan 1 is fixed on the top of the cold end radiator 2 by bolts, and the hot end air outlet fan 5 is fixed on the top of the hot end radiator 4 by bolts.
所述降温装置的冷端出风风扇1设置在变频器机箱的进风口处。The cold end air outlet fan 1 of the cooling device is arranged at the air inlet of the inverter case.
在本实施方式中，所述电源为开关电源，220V交流电的零线直接与开关电源一个输入端子相连，火线经过变频器启动继电器常开触点7后与开关电源另一个输入端子相连。三个热端出风风扇5正极并联，三个冷端出风风扇1电源正极并联，三个半导体制冷片3电源正极并联，将这三组正极线接在一起后与开关电源输出正极相连。三个热端出风风扇5负极并联，三个冷端出风风扇1负极并联，三个半导体制冷片3负极并联，将这三组负极线接在一起后与开关电源输出负极相连。In this embodiment, the power supply is a switching power supply, the neutral wire of 220V AC is directly connected to one input terminal of the switching power supply, and the live wire is connected to the other input terminal of the switching power supply after passing through the normally open contact 7 of the start relay of the frequency converter. The positive poles of the three hot end air outlet fans 5 are connected in parallel, the positive poles of the three cold end air outlet fans 1 are connected in parallel, and the positive poles of the three semiconductor cooling chips 3 are connected in parallel. The negative poles of the three hot end air outlet fans 5 are connected in parallel, the negative poles of the three cold end air outlet fans 1 are connected in parallel, and the negative poles of the three semiconductor cooling chips 3 are connected in parallel. These three sets of negative pole lines are connected together and then connected to the output negative pole of the switching power supply.
本实用新型的工作原理如下：The working principle of the utility model is as follows:
当变频器启动时，启动继电器常开触点7闭合，开关电源接通，开关电源开始工作，输出12V直流电压。冷端出风风扇1和热端出风风扇5得电开始旋转。半导体制冷片3得电，在帕尔贴效应下，半导体制冷片3的冷端和热端之间发生热量转移，使半导体制冷片3热端的温度升高，冷端的温度变低；进而使热端散热器4的温度升高，冷端散热器2的温度降低；进入冷端出风风扇1的空气经过冷端散热器2后温度降低，冷端出风风扇1输出的就为冷风，冷端出风过程中，冷端出风风扇1是将冷端散热器2周围的风引至冷端散热器2后再引出；由于冷端出风风扇1与变频器机箱底部进气口相连，这样进入变频器机箱的空气就为冷空气，这些冷空气流经变频器内部个电子元器件后就能很好的将电子元器件产生的热量带走，起到给变频器机箱降温的目的。同时热端出风风扇5，对热端散热器4降温，保证工作安全。When the frequency converter is started, the normally open contact 7 of the start relay is closed, the switching power supply is connected, the switching power supply starts to work, and outputs 12V DC voltage. The air outlet fan 1 at the cold end and the air outlet fan 5 at the hot end are energized and start to rotate. Semiconductor refrigerating sheet 3 gets electricity, under Peltier effect, heat transfer occurs between the cold end and hot end of semiconductor refrigerating sheet 3, the temperature of semiconductor refrigerating sheet 3 hot end is raised, and the temperature of cold end becomes lower; The temperature of the end radiator 4 rises, and the temperature of the cold end radiator 2 decreases; the temperature of the air entering the cold end air outlet fan 1 passes through the cold end radiator 2, and the temperature decreases, and the output of the cold end air outlet fan 1 is cold air, and the cold end air outlet fan 1 outputs cold air. During the process of air outlet at the end, the air outlet fan 1 at the cold end guides the wind around the radiator 2 at the cold end to the radiator 2 at the cold end and then draws it out; In this way, the air entering the inverter case is cold air. After passing through the electronic components inside the inverter, the cold air can take away the heat generated by the electronic components and cool down the inverter case. At the same time, the hot end air outlet fan 5 cools down the hot end radiator 4 to ensure work safety.
本实用新型结构简单无复杂的导热管路；该降温装置不受环境温度的限制，无论环境温度多高，都能很好的给变频器机箱内部降温。The utility model has a simple structure without complicated heat conduction pipelines; the cooling device is not limited by the ambient temperature, and can cool the inside of the frequency converter case well no matter how high the ambient temperature is.
以上所述仅为本实用新型的较佳实施例而已，并不用以限制本实用新型，凡在本实用新型的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本实用新型的保护范围之内。The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.
Claims (9)
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111043792A (en) * | 2019-12-31 | 2020-04-21 | 杭州非同工业设计有限公司 | Semiconductor refrigerating device |
| CN112129009A (en) * | 2020-09-17 | 2020-12-25 | 湖南泰瑞医疗科技有限公司 | Semiconductor cold drying device |
| CN115307336A (en) * | 2021-05-07 | 2022-11-08 | 成都科林分析技术有限公司 | Ultralow temperature semiconductor refrigerating device |
| CN116435668A (en) * | 2023-04-25 | 2023-07-14 | 江苏优利卡新能源科技有限公司 | Thermal management of start-up lithium batteries based on semiconductor coolers |
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2018
- 2018-11-19 CN CN201821903157.5U patent/CN209749011U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111043792A (en) * | 2019-12-31 | 2020-04-21 | 杭州非同工业设计有限公司 | Semiconductor refrigerating device |
| CN111043792B (en) * | 2019-12-31 | 2024-02-09 | 杭州非同工业设计有限公司 | Semiconductor refrigerating device |
| CN112129009A (en) * | 2020-09-17 | 2020-12-25 | 湖南泰瑞医疗科技有限公司 | Semiconductor cold drying device |
| CN115307336A (en) * | 2021-05-07 | 2022-11-08 | 成都科林分析技术有限公司 | Ultralow temperature semiconductor refrigerating device |
| CN115307336B (en) * | 2021-05-07 | 2024-05-31 | 成都科林分析技术有限公司 | Ultralow temperature semiconductor refrigerating device |
| CN116435668A (en) * | 2023-04-25 | 2023-07-14 | 江苏优利卡新能源科技有限公司 | Thermal management of start-up lithium batteries based on semiconductor coolers |
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Denomination of utility model: A cooling device Granted publication date: 20191206 Pledgee: Zhengning County Rural Credit Cooperative Association Pledgor: QINGYANG OUWEI ELECTROMECHANICAL EQUIPMENT CO.,LTD. Registration number: Y2025980069040 |