CN104936423A - High-effect liquid cooling plate - Google Patents
High-effect liquid cooling plate Download PDFInfo
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- CN104936423A CN104936423A CN201510359850.5A CN201510359850A CN104936423A CN 104936423 A CN104936423 A CN 104936423A CN 201510359850 A CN201510359850 A CN 201510359850A CN 104936423 A CN104936423 A CN 104936423A
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- liquid cooling
- cooling plate
- effect liquid
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- cover plate
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a high-effect liquid cooling plate. The high-effect liquid cooling plate comprises a base plate, a cover plate and a radiating unit, wherein the cover plate is fixed on the base plate; an inlet and an outlet are formed in the base plate; the inlet and the outlet are communicated with the radiating unit; the radiating unit comprises a plurality of runners; and the runners are arranged in the radiating unit in parallel or in a serial-parallel combination mode. The high-effect liquid cooling plate has multiple independent runners, can be used for independently distributing water for different runners, and is good in thermal homogeneity and high in degree of integration.
Description
Technical field
The present invention relates to a kind of high-effect liquid cooling plate, belong to electric and electronic technical field.
Background technology
Along with the development of electronic technology, the problem of the cooling electronic component difficulty of high heat flux day by day highlights, traditional wind-cooling heat dissipating technology cannot meet user demand, and the liquid cooling mediums such as water, relative atmospheric, because it possesses higher specific heat capacity, higher heat transfer efficiency, the advantages such as running noiselessness, liquid cools technology obtains significant progress by replacing the electronic devices and components application of wind-cooling heat dissipating technology at high heat flux gradually.
The integration degree of current power equipment is more and more higher, often require that single liquid cooling plate can simultaneously for multiple different types of power component provides heat radiation, traditional standard type liquid cooling plate cannot meet this demand, under the operating mode such as high in power component density of heat flow rate, differential loss is large, radiator inner stream flow distributes and cannot rationally realize, and causes overall uniform temperature not good.In addition, adopt stirring friction-welding technique merely, easily occur the phenomenon because inner flow passage and cover plate cause internal cooling water to go here and there mutually in conjunction with imprecision, cause radiator performance to decline and even cannot use.
Summary of the invention
Technical problem to be solved by this invention is: overcome the deficiencies in the prior art, provides a kind of high-effect liquid cooling plate, and it has many independently runners, can to the water distribution of different runner independence, and uniform temperature is good and integrated level is high.
In order to solve the problems of the technologies described above, technical scheme of the present invention is: a kind of high-effect liquid cooling plate, comprise substrate, cover plate and heat-sink unit, cover plate is fixed on substrate, substrate is provided with import and outlet, import is all connected with heat-sink unit with outlet, and described heat-sink unit comprises many runners, and the form that runner combines with in parallel or connection in series-parallel is arranged in heat-sink unit.
Further provide the concrete annexation of a kind of substrate and cover plate, described substrate and cover plate adopt damascene structures to be connected, and the edge of described cover plate is rounded down, and the technique that cover plate is combined by soldering, soldering and friction stir welding is fixed on substrate.
Further, described cover plate is made up of aluminum alloy materials or Cu alloy material.
Further in order to increase anticorrosive property and increase the service life, the equal nickel plating of described substrate, cover plate and heat-sink unit or anodized.
Conveniently the walking of electrical wiring further, the side of described substrate is provided with electrical traces hole, and electrical traces hole is rounded down, and electrical traces hole is provided with protective ring.
Further in order to what position with power equipment and fix, the side of described substrate is provided with main installing hole.
Further in order to installation power components and parts, the upper surface of described substrate is provided with power component installing hole.
Further in order to install different types of power component, described power component installing hole is screw or dowel hole.
Further in order to install thermocouple monitoring surface temperature, the upper surface of described substrate is provided with temperature monitoring hole.
Further in order to realize two-side radiation, the lower surface of described substrate is provided with auxiliary installing hole and power component installing hole.
After have employed technique scheme, the present invention has following beneficial effect:
1) cooling fluid enters runner through import, in the process flowing through runner, carries out heat exchange with the power component be arranged on upper surface of base plate and lower surface, takes away the heat that power component work produces, and discharges finally by outlet;
2) separate between different runner, independent water distribution can be carried out according to the radiating requirements of each power component to corresponding runner, flow resistance is low, thermal resistance is little, uniform temperature is good and integrated level is high;
3) substrate and cover plate adopt damascene structures to be connected, and all installing holes all machine on substrate, can improve the quality of welding, avoid welding position to be destroyed by secondary operations;
4) shape of cover plate and the matching form of heat-sink unit close, and periphery adopts rounding process, can improve the processing fiting effect of cover plate and substrate;
5) technique adopting soldering, soldering and friction stir welding to combine, especially utilize friction stir welding to carry out secondary welding in the fit clearance of cover plate and substrate, the intensity that can improve welding position is high, reduces risk of leaking;
6) adopt nickel plating or anodized, anticorrosion energy can be strengthened, increase the service life;
7) arrange the temperature monitoring hole for installing thermocouple, energy is monitoring form surface temperature in time, guarantees power component reliability service.
Accompanying drawing explanation
Fig. 1 is the front view of the high-effect liquid cooling plate of the present invention;
Fig. 2 is the vertical view of the high-effect liquid cooling plate of the present invention;
Fig. 3 is the rearview of the high-effect liquid cooling plate of the present invention;
In figure, 1, substrate, 2, import, 3, outlet, 4, electrical traces hole, 5, heat-sink unit, 6, temperature monitoring hole, 7, power component installing hole, 8, main installing hole, 9, auxiliary installing hole.
Embodiment
In order to make content of the present invention more easily be clearly understood, below according to specific embodiment also by reference to the accompanying drawings, the present invention is further detailed explanation.
As shown in Figures 1 to 3, a kind of high-effect liquid cooling plate, comprise substrate 1, cover plate and heat-sink unit 5, cover plate is fixing on substrate 1, substrate 1 is provided with import 2 and outlet 3, import 2 is all connected with heat-sink unit 5 with outlet 3, and heat-sink unit 5 comprises many runners, and the form that runner combines with in parallel or connection in series-parallel is arranged in heat-sink unit 5.
As shown in Figure 1, substrate 1 and cover plate adopt damascene structures to be connected, and the edge of cover plate is rounded down, and the technique that cover plate is combined by soldering, soldering and friction stir welding is fixing on substrate 1.
Cover plate is made up of aluminum alloy materials, certainly, can adopt Cu alloy material when power is large especially and working voltage is lower, better to ensure the surperficial uniform temperature of the substrate 1 contacted with power component.
Substrate 1, cover plate and heat-sink unit 5 all nickel plating or carry out anodic oxidation.
As shown in Figure 1, 2, the side of substrate 1 is provided with electrical traces hole 4, and electrical traces hole 4 is rounded down, and electrical traces hole 4 is provided with protective ring, prevents electric wire from being weighed wounded or scratching.
As shown in Figure 2, the side of substrate 1 is provided with the main installing hole 8 for positioning with power equipment and fixing.
As shown in Figure 1, the upper surface of substrate 1 is provided with power component installing hole 7.
Power component installing hole 7 is screw.
As shown in Figure 1, the upper surface of substrate 1 is provided with temperature monitoring hole 6.
As shown in Figure 3, the lower surface of substrate 1 is provided with auxiliary installing hole 9 and power component installing hole 7.
Runner entirety in heat-sink unit 5 adopts maze-type structure, certainly offset strip fin formula, the structure such as spiral, cylindrical can also be adopted, during actual use, can do corresponding adjustment according to the quantity of power component and arrangement, heat-sink unit also can laterally or longitudinally extend.
Cooling fluid adopts the liquid medium that the thermal transmission coefficient such as pure water or nano-fluid is high, conductivity is low.
Operation principle of the present invention is as follows:
Cooling fluid enters runner through import 2, in the process flowing through runner, carries out heat exchange with the power component be arranged on substrate 1 upper surface and lower surface, takes away the heat that power component work produces, discharges finally by outlet 3.
Separate between different runner, independent water distribution can be carried out according to the radiating requirements of each power component to corresponding runner, flow resistance is low, thermal resistance is little, uniform temperature and integrated level is high; Substrate 1 and cover plate adopt damascene structures to be connected, and all installing holes machine all on substrate 1, can improve the quality of welding, avoid welding position to be destroyed by secondary operations; The shape of cover plate and the matching form of heat-sink unit 5 close, and periphery adopts rounding process, can improve the processing fiting effect of cover plate and substrate 1; Adopt the technique that soldering, soldering and friction stir welding combine, especially utilize friction stir welding to carry out secondary welding in the fit clearance of cover plate and substrate 1, the intensity that can improve welding position is high, reduces risk of leaking; Adopt nickel plating or anodized, anticorrosion energy can be strengthened, increase the service life; Arrange the temperature monitoring hole 6 for installing thermocouple, energy is monitoring form surface temperature in time, guarantees power component reliability service;
Above-described specific embodiment; technical problem, technical scheme and beneficial effect that the present invention solves are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a high-effect liquid cooling plate, comprise substrate (1), cover plate and heat-sink unit (5), cover plate is fixed on substrate (1), substrate (1) is provided with import (2) and outlet (3), import (2) is all connected with heat-sink unit (5) with outlet (3), described heat-sink unit (5) comprises many runners, it is characterized in that: the form that described runner combines with in parallel or connection in series-parallel is arranged in heat-sink unit (5).
2. high-effect liquid cooling plate according to claim 1, it is characterized in that: described substrate (1) adopts damascene structures to be connected with cover plate, the edge of described cover plate is rounded down, and cover plate is fixed on substrate (1) by the technique that soldering, soldering and friction stir welding combine.
3. high-effect liquid cooling plate according to claim 1 and 2, is characterized in that: described cover plate is made up of aluminum alloy materials or Cu alloy material.
4. high-effect liquid cooling plate according to claim 1 and 2, is characterized in that: all nickel plating or carry out anodic oxidation of described substrate (1), cover plate and heat-sink unit (5).
5. high-effect liquid cooling plate according to claim 1 and 2, it is characterized in that: the side of described substrate (1) is provided with electrical traces hole (4), and electrical traces hole (4) are rounded down, electrical traces hole (4) are provided with protective ring.
6. high-effect liquid cooling plate according to claim 1 and 2, is characterized in that: the side of described substrate (1) is provided with the main installing hole (8) for positioning with power equipment and fixing.
7. high-effect liquid cooling plate according to claim 1 and 2, is characterized in that: the upper surface of described substrate (1) is provided with power component installing hole (7).
8. high-effect liquid cooling plate according to claim 7, is characterized in that: described power component installing hole (7) is screw or dowel hole.
9. high-effect liquid cooling plate according to claim 1 and 2, is characterized in that: the upper surface of described substrate (1) is provided with temperature monitoring hole (6).
10. high-effect liquid cooling plate according to claim 1, is characterized in that: the lower surface of described substrate (1) is provided with auxiliary installing hole (9) and power component installing hole (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510359850.5A CN104936423A (en) | 2015-06-25 | 2015-06-25 | High-effect liquid cooling plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510359850.5A CN104936423A (en) | 2015-06-25 | 2015-06-25 | High-effect liquid cooling plate |
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| Publication Number | Publication Date |
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| CN104936423A true CN104936423A (en) | 2015-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510359850.5A Pending CN104936423A (en) | 2015-06-25 | 2015-06-25 | High-effect liquid cooling plate |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013187348A (en) * | 2012-03-08 | 2013-09-19 | Mitsubishi Electric Corp | Cooling unit |
| CN104244680A (en) * | 2014-09-25 | 2014-12-24 | 中国北方车辆研究所 | Composite water cooling plate |
| CN204145971U (en) * | 2014-08-27 | 2015-02-04 | 常州博瑞电力自动化设备有限公司 | Power electronics high-power water-cooling radiator |
| CN204733510U (en) * | 2015-06-25 | 2015-10-28 | 常州博瑞电力自动化设备有限公司 | High-effect liquid cooling plate |
-
2015
- 2015-06-25 CN CN201510359850.5A patent/CN104936423A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013187348A (en) * | 2012-03-08 | 2013-09-19 | Mitsubishi Electric Corp | Cooling unit |
| CN204145971U (en) * | 2014-08-27 | 2015-02-04 | 常州博瑞电力自动化设备有限公司 | Power electronics high-power water-cooling radiator |
| CN104244680A (en) * | 2014-09-25 | 2014-12-24 | 中国北方车辆研究所 | Composite water cooling plate |
| CN204733510U (en) * | 2015-06-25 | 2015-10-28 | 常州博瑞电力自动化设备有限公司 | High-effect liquid cooling plate |
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Application publication date: 20150923 |
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| RJ01 | Rejection of invention patent application after publication |