CN211860914U - Graphene electronic component water-cooling plate - Google Patents
Graphene electronic component water-cooling plate Download PDFInfo
- Publication number
- CN211860914U CN211860914U CN202020598987.2U CN202020598987U CN211860914U CN 211860914 U CN211860914 U CN 211860914U CN 202020598987 U CN202020598987 U CN 202020598987U CN 211860914 U CN211860914 U CN 211860914U
- Authority
- CN
- China
- Prior art keywords
- water
- cooling
- plate
- contact surface
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A graphene electronic component water cooling plate comprises a bottom plate, a cover plate, inner fins, a graphene coating, a water inlet and a water outlet, wherein a sealed cavity is formed by the bottom plate and the cover plate, the edge of the cavity is provided with the water inlet and the water outlet for a cooling medium to enter and exit the cavity, the fins are arranged in the cavity, the bottom surface of the bottom plate is provided with a thermal contact surface and a thermal auxiliary surface, the bottom surface of the bottom plate is punched with a boss serving as the thermal contact surface of an electronic component, the bottoms of the other bottom plates without the punched boss are thermal auxiliary surfaces, the thermal contact surface and the thermal auxiliary surfaces of the bottom plate are both coated with the graphene coating, and the water cooling. Adopt the utility model discloses can solve the uneven problem of heat contact surface and the heat auxiliary surface heat dissipation of current electronic component water-cooling board.
Description
Technical Field
The utility model relates to an electronic component heat abstractor, in particular to cooling part of high-power electronic equipment such as computer, server, network equipment specifically is a graphite alkene electronic component water-cooling board.
Background
With the appearance of high-power electronic components and the development of ultrahigh-integration electronic components towards high speed, high frequency and high power, the heat productivity of the electronic components is larger and larger, the heat flux density and the surface temperature are higher and higher, the reliability and the service life of the components are influenced, and higher requirements are provided for heat dissipation. The application of the water-cooling heat dissipation technology as an efficient heat dissipation mode in electronic equipment is more and more extensive, the water-cooling plate is a key component of a water-cooling heat dissipation system, and the design and manufacturing process of the water-cooling plate determines the indexes of heat dissipation efficiency, reliability, economy and the like. The base plate of the current water-cooled plate comprises a thermal contact surface and a thermal auxiliary surface, and the corresponding inner cavity is a water flow channel surface. Generally, the thermal contact surface is far smaller than the thermal auxiliary surface, the thermal contact surface only occupies 1/5-1/2 of the whole bottom plate, and the rest are the thermal auxiliary surfaces, so that heat is dissipated from the corresponding water flow channels of the thermal contact surface, and the heat needs to be spread from the periphery of the thermal contact surface to the peripheral thermal auxiliary surface so as to enable the cavity cooling liquid to carry out more heat. However, due to the limitation of the thermal conductivity of the material, the heat cannot be transferred to the whole bottom plate in time, so that the temperature of the heat auxiliary surface is very low except for the high temperature at the back of the heat contact surface, and thus the heat dissipation efficiency of the heat auxiliary surface corresponding to the water flow channel of the inner cavity is not fully exerted, and the overall heat dissipation effect is affected.
Disclosure of Invention
An object of the utility model is to solve the uneven problem of heat contact surface and the heat auxiliary surface heat dissipation of current electronic component water-cooling board, provide a graphite alkene electronic component water-cooling board.
In order to achieve the above purpose, the utility model adopts the technical scheme that: the utility model provides a graphite alkene electronic component water-cooling board, component element includes bottom plate, apron, inner fin, graphite alkene coating and inlet outlet, and the concrete structure and the relation of connection of component element are: the bottom plate and the cover plate form a sealed cavity as a water flow channel of cooling water, the edge of the cavity is provided with a water inlet and a water outlet for a cooling medium to enter and exit the cavity, fins are arranged in the cavity to increase the heat exchange area and strengthen the cooling capacity, the bottom surface of the bottom plate is provided with a thermal contact surface and a thermal auxiliary surface, the bottom surface of the bottom plate is punched with a boss as the thermal contact surface of an electronic element, the bottoms of the other bottom plates without punched bosses are thermal auxiliary surfaces, the thermal contact surface and the thermal auxiliary surface of the bottom plate are both coated with a graphene coating, and the water cooling plate is provided with mounting holes.
The thickness of the graphene coating is 0.05-0.5 mm.
The area of the heat contact surface of the water cooling plate is less than 50 percent of the area of the bottom surface.
The water-cooling plate is of a brazing type or combined type structure.
The base material of the water cooling plate is copper, aluminum or combination thereof.
The working principle and the process are as follows:
the heat contact surface of the bottom plate of the graphene electronic component water cooling plate absorbs heat emitted from the electronic component, the heat is diffused to the bottom plate heat auxiliary surface through the graphene coating and is transmitted to the inside of the bottom plate of the water cooling plate, the inner fins and the cover plate, low-temperature cooling media in the cavity are heated and heated, and high-temperature cooling media are taken away through circulation of the water pump, so that the effect of cooling the electronic component is achieved, and normal operation of the electronic component in a certain temperature is ensured.
The utility model has the advantages that:
1. due to the fact that the graphene coating with extremely high heat conductivity is sprayed, heat can be rapidly diffused to the heat auxiliary surface 8 after being transferred from the first heat contact surface boss 5, and therefore the temperature of the whole water cooling plate is more uniform, and the overall heat exchange efficiency is improved. Through tests, compared with the prior art, the heat dissipation efficiency of the water cooling plate provided with the graphene coating is improved by 10-15%.
2. The smaller the thermal contact surface to total floor area, the more significant the increased efficiency. The improvement of radiating efficiency can effectively reduce the surface temperature of electron heating element, is favorable to the steady operation, increase of service life.
Drawings
Fig. 1 is a schematic structural view of a water-cooling plate of a graphene electronic component according to the present invention.
Fig. 2 is a schematic diagram of a bottom structure of a bottom plate of a water-cooling plate of a graphene electronic component according to the present invention.
Fig. 3 is a cross-sectional view of a water-cooling plate of a graphene electronic component according to the present invention.
Labeled as: the heat-conducting plate comprises a bottom plate 1, a cover plate 2, a water inlet 3, a water outlet 4, a first heat contact surface boss 5, a second heat contact surface boss 6, a third heat contact surface boss 7, a heat auxiliary surface 8, a mounting hole 9, an inner fin 10 and a graphene coating 11.
Detailed Description
The technical constitution of the present invention will be described in further detail below with reference to examples.
It should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" in the description of the present invention are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1 to fig. 3, the graphene electronic component water cooling plate of the present invention includes a bottom plate 1, a cover plate 2, a water inlet 3, a water outlet 4, a first thermal contact surface boss 5, a second thermal contact surface boss 6, a third thermal contact surface boss 7, a thermal auxiliary surface 8, a mounting hole 9, an inner fin 10, and a graphene coating 11, and the specific structure and the connection relationship are as follows: the bottom plate 1 and the cover plate 2 form a sealed cavity, the edge of the cavity is provided with a water inlet 3 and a water outlet 4 for a cooling medium to enter and exit the cavity, the cooling medium flows into the inner cavity from the water inlet 3, absorbs heat from the electronic element and flows out from the water outlet 4, and therefore the effect of cooling the electronic element is achieved, and the electronic element is guaranteed to work within a normal temperature range.
The connection mode of the base plate 1 and the cover plate 2 is not limited to brazing, and the base plate and the cover plate can be connected and combined in a bolt or a buckle mode, and at the moment, a sealing ring needs to be additionally arranged to prevent a cooling medium from leaking from the connection position. The cover plate material connected by non-brazing is copper, aluminum or non-metal material.
As shown in fig. 2 and 3, an inner fin 10 is arranged inside the sealed cavity to increase the heat exchange area and enhance the cooling capacity of the liquid side, a first thermal contact surface boss 5, a second thermal contact surface boss 6 and a third thermal contact surface boss 7 are punched at the bottom of the bottom plate 1 to serve as thermal contact surfaces of the electronic element, the rest are thermal auxiliary surfaces 8, and a mounting hole 11 for fixing the electronic element is formed in the water cooling plate.
Fig. 3 is a cross sectional view of a graphene electronic component water-cooling plate, a graphene coating 11 covers the outer layer of a bottom plate 1, the thickness of the coating is 0.05-0.5mm, and due to the fact that the graphene coating with extremely high thermal conductivity is sprayed, heat can be rapidly diffused to a heat auxiliary surface 8 after being transferred from a first heat contact surface boss 5, and therefore the temperature of the whole water-cooling plate is more uniform, and the overall heat exchange efficiency is improved. Through tests, compared with the prior art, the heat dissipation efficiency of the water cooling plate provided with the graphene coating is improved by 10-15%. Moreover, the smaller the ratio of the thermal contact surface to the entire bottom surface area, the more significant the enhanced efficiency. The improvement of radiating efficiency can effectively reduce the surface temperature of electron heating element, is favorable to the steady operation, increase of service life.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; those of ordinary skill in the art will understand that: modifications and equivalents of the above-described embodiments may be made, and are considered to be within the scope of the present invention.
Claims (4)
1. The utility model provides a graphite alkene electronic component water-cooling board, component element includes bottom plate, apron, inner fin, graphite alkene coating and inlet outlet, its characterized in that, the concrete structure and the relation of connection of component element are: the bottom plate and the cover plate form a sealed cavity, the edge of the cavity is provided with a water inlet and a water outlet for cooling medium to enter and exit the cavity, fins are arranged in the cavity, the bottom surface of the bottom plate is provided with a thermal contact surface and a thermal auxiliary surface, the bottom surface of the bottom plate is punched with a boss serving as the thermal contact surface of the electronic element, the bottoms of the other bottom plates without the punched boss are the thermal auxiliary surfaces, the thermal contact surface and the thermal auxiliary surface of the bottom plate are both coated with a graphene coating, and the water cooling plate is provided with mounting holes for fixing the.
2. The graphene electronic component water-cooling plate of claim 1, wherein the graphene coating thickness is 0.05-0.5 mm.
3. The graphene electronic component water-cooling plate of claim 1, wherein the thermal contact surface of the water-cooling plate occupies < 50% of the area of the bottom surface.
4. The graphene electronic component water-cooling plate of claim 1, wherein the water-cooling plate is of a brazed or a composite structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020598987.2U CN211860914U (en) | 2020-04-21 | 2020-04-21 | Graphene electronic component water-cooling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020598987.2U CN211860914U (en) | 2020-04-21 | 2020-04-21 | Graphene electronic component water-cooling plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211860914U true CN211860914U (en) | 2020-11-03 |
Family
ID=73178362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020598987.2U Active CN211860914U (en) | 2020-04-21 | 2020-04-21 | Graphene electronic component water-cooling plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211860914U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113795114A (en) * | 2021-06-23 | 2021-12-14 | 上海市富力达科技股份有限公司 | High-heat-dissipation weather-resistant water cooling plate and application thereof |
| CN114707190A (en) * | 2022-06-06 | 2022-07-05 | 中国飞机强度研究所 | Modularized extreme high-temperature heating system for testing aerospace plane |
| WO2025138344A1 (en) * | 2023-12-29 | 2025-07-03 | 尹树彬 | Heat dissipation structure integrating heat dissipation plate and phase change heat transfer device |
-
2020
- 2020-04-21 CN CN202020598987.2U patent/CN211860914U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113795114A (en) * | 2021-06-23 | 2021-12-14 | 上海市富力达科技股份有限公司 | High-heat-dissipation weather-resistant water cooling plate and application thereof |
| CN114707190A (en) * | 2022-06-06 | 2022-07-05 | 中国飞机强度研究所 | Modularized extreme high-temperature heating system for testing aerospace plane |
| WO2025138344A1 (en) * | 2023-12-29 | 2025-07-03 | 尹树彬 | Heat dissipation structure integrating heat dissipation plate and phase change heat transfer device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211860914U (en) | Graphene electronic component water-cooling plate | |
| CN109152294B (en) | Liquid cooling type heat superconducting radiator | |
| CN212659535U (en) | High-power semiconductor device high-efficiency liquid cooling plate | |
| CN215418156U (en) | Microchannel copper-aluminum composite relieving liquid cooling radiator | |
| CN206250182U (en) | A kind of Copper-Aluminum compound cooled plate and cooled plate substrate | |
| CN106535564A (en) | Liquid cooling type heat radiator | |
| CN205356935U (en) | Water -cooled heat abstractor | |
| CN210325777U (en) | Liquid cooling heat dissipation device for copper-aluminum pipe | |
| WO2025119397A1 (en) | Battery module assembly, battery pack, and vehicle | |
| WO2024187842A1 (en) | Circuit board, circuit board assembly, and electronic device | |
| WO2025138345A1 (en) | Liquid cooling plate based on finned vapor chamber | |
| CN117937089A (en) | A three-dimensional high-efficiency cold plate for curved antenna | |
| CN219248447U (en) | A kind of cold plate device and cold plate module | |
| CN211064016U (en) | A targeted cooling microchannel liquid-cooled cold plate | |
| CN220341216U (en) | Phase-change liquid-cooling coupling heat dissipation structure and electronic chip heat dissipation device | |
| CN114122872A (en) | A laser cooling system based on microscale heat transfer | |
| CN204733510U (en) | High-effect liquid cooling plate | |
| CN209594123U (en) | The hot superconducting radiator of liquid-cooled | |
| CN211509683U (en) | High-efficient section bar liquid cooling radiator | |
| CN213403916U (en) | Plate type heat pipe radiator for electronic element | |
| CN211931145U (en) | Natural convection radiator | |
| CN212648231U (en) | Heat radiation structure of power module | |
| CN223712857U (en) | Battery module and battery pack | |
| CN220341213U (en) | Phase-change liquid-cooling coupling heat dissipation structure and electronic chip heat dissipation device | |
| CN218004840U (en) | Lightweight cooling plate for power supply |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |