CN107256075A - Soldering formula CPU liquid cooling heat radiators with internal memory heat sink - Google Patents
Soldering formula CPU liquid cooling heat radiators with internal memory heat sink Download PDFInfo
- Publication number
- CN107256075A CN107256075A CN201710731814.6A CN201710731814A CN107256075A CN 107256075 A CN107256075 A CN 107256075A CN 201710731814 A CN201710731814 A CN 201710731814A CN 107256075 A CN107256075 A CN 107256075A
- Authority
- CN
- China
- Prior art keywords
- soldering
- heat
- radiators
- liquid cooling
- internal memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The present invention relates to heat abstractor, particularly a kind of soldering formula CPU liquid cooling heat radiators with internal memory heat sink.It includes cpu heat and RAM strip heating radiator；Described cpu heat is two-section separated structure, and two radiators of split are all made up of cover plate with being combined above and below runner plate, runner are evenly equipped with inside runner plate, two radiator inner flow passages are connected with connecting tube；Described RAM strip heating radiator is with foregoing small water box by heat pipe, and the RAM strip heating radiator is made up of the first fin and the second fin for clamping memory bar.Soldering formula CPU liquid cooling heat radiators of the invention with internal memory heat sink, are not only installed simple（Soldering formula CPU liquid cooling heat radiators only need to twist the turn of the screw just）, good heat dissipation effect, it is often more important that very safe, without worrying complicated installation procedure, without worry leakage；And soldering formula CPU liquid cooling heat radiators greatly reduce power consumption, and noise very little, space-consuming seldom, greatlys save the space of cabinet.
Description
Technical field
The present invention relates to heat abstractor, particularly a kind of soldering formula CPU liquid cooling heat radiators with internal memory heat sink.
Background technology
At present, Most current CPU heat abstractor mainly uses the radiator with fan, with CPU heat dissipation capacities
Increase, the size of fan and the running speed of raising fan must be just increased to meet CPU normal work, general using scattered
The preferable liquid-cooling heat radiator of thermal effect.But internal memory, CPU radiatings in current large-scale server be all using fan collect
Body radiates, and the power consumption that radiates is very big, and volume is big, and noise is big, and poor reliability, fan life is limited.
Therefore, explore and study new CPU heat abstractors and be particularly important, wherein integrated water-cooling device is ground
Study carefully more prominent.Water-filled radiator used in current CPU mainly has two classes, a class be whole aluminum pipe or copper pipe are bent into it is snakelike
Weld or be crimped on afterwards on the bottom plate fitted with CPU, this mode area of dissipation is too small, and radiating efficiency is low, in most of fields
Close and be not so good as existing air-cooled radiator；Another kind of be coupled again by flexible pipe after first connecting radiating flow passage and cover plate with sealing ring
The form of head is connected with intake-outlet, because radiating flow passage can be individually prefabricated, and area of dissipation can be made very big, radiating efficiency
It is high.But CPU heating powers often change, the radiator temperature fitted therewith is caused often significantly to change, this kind of water-cooling
The substantial amounts of seal of device, radiator sealing structure is easily deformed under the influence of alternating temperature-changing, seal easy aging in itself,
So the life-span is very short and leakage rate is high.
The content of the invention
It is an object of the invention to provide a kind of soldering formula CPU liquid cooling heat radiators with internal memory heat sink.
The purpose of the present invention is achieved through the following channels：A kind of soldering formula CPU liquid-cooling heat radiations with internal memory heat sink
Device, it includes cpu heat and RAM strip heating radiator；
Described cpu heat is two-section separated structure, and two radiators of split are all by cover plate with being combined above and below runner plate
Constitute, be evenly equipped with runner inside runner plate, two radiator inner flow passages are connected with connecting tube, and connecting tube stage casing is provided with a point water
Block, is divided to the end of water block to be connected respectively by connecting tube with two small water box, and small water box are connected by water inlet pipe, outlet pipe respectively
Big water nozzle, big water nozzle is provided with water inlet and delivery port；
Described RAM strip heating radiator is with foregoing small water box by heat pipe, and the RAM strip heating radiator is by clamping the first of memory bar
Fin and the second fin are constituted, and heat pipe is installed on the end of the first fin.
As the further optimization of this programme, the 2 ~ 5mm of groove depth, 0.1 ~ 0.5mm of groove width of described runner.
As the further optimization of this programme, described cover plate, runner plate, connecting tube, point water block, water inlet pipe, outlet pipe,
Big water nozzle material is aluminium alloy.
As the further optimization of this programme, the soldering hole with connecting tube soldering is machined with described cover plate；Divide water block
On be machined with soldering hole with connecting tube soldering；Divide and be machined with water block and water inlet pipe, the soldering hole of outlet pipe soldering；Big water nozzle
On be machined with water inlet pipe, the soldering hole of outlet pipe soldering.
As the further optimization of this programme, described cover plate is uniformly placed with screw with runner plate both sides.
Soldering formula CPU liquid cooling heat radiators of the invention with internal memory heat sink, are not only installed simple（Soldering formula CPU liquid is cold to be dissipated
Hot device only need to twist the turn of the screw just）, good heat dissipation effect, it is often more important that very safe, without worrying complicated installation procedure, also not
With worry leakage；And soldering formula CPU liquid cooling heat radiators greatly reduce power consumption, and noise very little, space-consuming is very
It is few, greatly save the space of cabinet.
Brief description of the drawings
The present invention is described in further detail below in conjunction with the accompanying drawings：
Fig. 1 is structure overall schematic of the present invention；
Fig. 2 is that the present invention sees cpu heat structural representation；
Fig. 3 is one of RAM strip heating radiator structural representation in the present invention；
Fig. 4 is two of RAM strip heating radiator structural representation in the present invention.
Embodiment
As Figure 1-Figure 4, the soldering formula CPU liquid cooling heat radiators of the invention with internal memory heat sink, it includes cpu heat
And RAM strip heating radiator；
Described cpu heat is two-section separated structure, and two radiators of split are all on cover plate 404 and runner plate 403
Lower combination is constituted, and is evenly equipped with runner 502 inside runner plate 403, the 2 ~ 5mm of groove depth, 0.1 ~ 0.5mm of groove width of described runner 502.
Two radiator inner flow passages 502 are connected with connecting tube 402, and the stage casing of connecting tube 402 is provided with a point water block 401, point water block 401
End is connected by connecting tube 402 with two small water box respectively, and small water box are connected greatly by water inlet pipe 106, outlet pipe 105 respectively
Water nozzle 405, big water nozzle 405 is provided with water inlet 103 and delivery port 104；
Described RAM strip heating radiator is with foregoing small water box by heat pipe 204, and the RAM strip heating radiator is by clamping memory bar 202
The first fin 301 and the second fin 201 constitute, screw 203 be used for by be placed on internal memory 202 both sides first radiating
The fin 301 of piece 201 and second is fixed, and heat pipe 204 is installed on the end of the first fin 301.
Described cover plate 404, runner plate 403, connecting tube 402, point water block 401, water inlet pipe 106, outlet pipe 105, flood
The material of mouth 405 is aluminium alloy.
The soldering hole with the soldering of connecting tube 402 is machined with described cover plate 404；Divide and be machined with and connect on water block 401
The soldering hole of the soldering of pipe 402；Divide the soldering hole being machined with water block 401 with water inlet pipe 106, the soldering of outlet pipe 105；Big water nozzle
The soldering hole with water inlet pipe 106, the soldering of outlet pipe 105 is machined with 405.
Described cover plate 404 is uniformly placed with screw 501 with the both sides of runner plate 403.
During work, water flows into water inlet pipe 106 from water inlet 103, and water inlet pipe 106 is connected with water box body 206, and water enters water box
In body 206, the heat on internal memory 202 is transmitted to heat pipe 204, heat pipe 204 by the first fin 301 and the second fin 201
Heat is passed in the water in water box body 206, and water then flows into point one end of water block 401, and a point water block 401 is diverted to and a point water block 401
It is connected in the runner of cpu heat, runner 502 is to be uniformly distributed, so that the temperature in runner 502 everywhere is basically identical, from
And effectively take away CPU heat.Point other end of water block 401 is returned to again by one after being taken a round in runner 502
Deposit radiator（The groove of heat pipe 204 can be much placed on water box body 206 with cloth, that is, can be radiated to polylith internal memory 202）,
Water is flowed out by outlet pipe 105 again.Aluminum pipe that connecting tube 402, water inlet pipe 106 and outlet pipe 105 are all used and with radiator
Connection uses soldering processes, so as to prevent the hidden danger of conventional hoses and joint leak, it is to avoid damage CPU.Runner plate 403
Bottom surface is component side（With CPU contact surface）, it is necessary to essence flies, grinding and polish, increase and CPU contact area, and reduce with
Space between CPU, is conducive to improving heat transfer efficiency；The component side of CPU water-filled radiators is coated after Heat Conduction Material, is close to CPU
And locked with sunk screw, it is ensured that component side is fitted completely with CPU surfaces.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those skilled in the art disclosed herein technical scope in, the change that can expect without creative work or
Replace, should all be included within the scope of the present invention.Therefore, protection scope of the present invention should be limited with claims
Fixed protection domain is defined.
Claims (5)
1. a kind of soldering formula CPU liquid cooling heat radiators with internal memory heat sink, it is characterised in that：It includes cpu heat and internal memory
Bar radiator；
Described cpu heat is two-section separated structure, and two radiators of split are all by cover plate（404）With runner plate
（403）Combination is constituted up and down, runner plate（403）Inside is evenly equipped with runner（502）, two radiator inner flow passages（502）With connecting
Adapter（402）Connection, connecting tube（402）Stage casing is provided with a point water block（401）, point water block（401）End respectively pass through connection
Pipe（402）It is connected with two small water box, small water box pass through water inlet pipe respectively（106）, outlet pipe（105）Connect big water nozzle（405）,
Big water nozzle（405）It is provided with water inlet（103）And delivery port（104）；
Described RAM strip heating radiator passes through heat pipe with foregoing small water box（204）, the RAM strip heating radiator is by clamping memory bar
（202）The first fin（301）And second fin（201）Constitute, heat pipe（204）It is installed on the first fin（301）'s
End.
2. the soldering formula CPU liquid cooling heat radiators as claimed in claim 1 with internal memory heat sink, it is characterised in that：Described stream
Road（502）2 ~ 5mm of groove depth, 0.1 ~ 0.5mm of groove width.
3. the soldering formula CPU liquid cooling heat radiators as claimed in claim 1 with internal memory heat sink, it is characterised in that：Described lid
Plate（404）, runner plate（403）, connecting tube（402）, point water block（401）, water inlet pipe（106）, outlet pipe（105）, big water nozzle
（405）Material is aluminium alloy.
4. the soldering formula CPU liquid cooling heat radiators as claimed in claim 1 with internal memory heat sink, it is characterised in that：Described lid
Plate（404）On be machined with and connecting tube（402）The soldering hole of soldering；Divide water block（401）On be machined with and connecting tube（402）Soldering
Soldering hole；Divide water block（401）On be machined with and water inlet pipe（106）, outlet pipe（105）The soldering hole of soldering；Big water nozzle（405）
On be machined with and water inlet pipe（106）, outlet pipe（105）The soldering hole of soldering.
5. the soldering formula CPU liquid cooling heat radiators as claimed in claim 1 with internal memory heat sink, it is characterised in that：Described lid
Plate（404）With runner plate（403）Both sides are uniformly placed with screw（501）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710731814.6A CN107256075A (en) | 2017-08-23 | 2017-08-23 | Soldering formula CPU liquid cooling heat radiators with internal memory heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710731814.6A CN107256075A (en) | 2017-08-23 | 2017-08-23 | Soldering formula CPU liquid cooling heat radiators with internal memory heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107256075A true CN107256075A (en) | 2017-10-17 |
Family
ID=60026839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710731814.6A Pending CN107256075A (en) | 2017-08-23 | 2017-08-23 | Soldering formula CPU liquid cooling heat radiators with internal memory heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107256075A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107977064A (en) * | 2017-12-29 | 2018-05-01 | 华南理工大学 | The water-cooling heat radiating device and its heat dissipating method of a kind of server |
| CN108334176A (en) * | 2018-03-07 | 2018-07-27 | 商洛学院 | A kind of computer radiator |
| CN110648988A (en) * | 2019-09-21 | 2020-01-03 | 苏州浪潮智能科技有限公司 | Liquid cooling heat radiator capable of giving consideration to both CPU and memory |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201041473Y (en) * | 2007-03-29 | 2008-03-26 | 何绍林 | Heat pipe radiator |
| CN201084093Y (en) * | 2007-07-27 | 2008-07-09 | 曜嘉科技股份有限公司 | Modularized water-cooling heat radiating device |
| CN102664515A (en) * | 2012-05-18 | 2012-09-12 | 株洲南车时代电气股份有限公司 | Cooling device for converter power module |
| CN202871775U (en) * | 2012-09-20 | 2013-04-10 | 常州博瑞电力自动化设备有限公司 | Water cooling radiator |
| CN104252212A (en) * | 2013-06-29 | 2014-12-31 | 华为技术有限公司 | Liquid cooling heat dissipation device and liquid cooling heat dissipation equipment |
-
2017
- 2017-08-23 CN CN201710731814.6A patent/CN107256075A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201041473Y (en) * | 2007-03-29 | 2008-03-26 | 何绍林 | Heat pipe radiator |
| CN201084093Y (en) * | 2007-07-27 | 2008-07-09 | 曜嘉科技股份有限公司 | Modularized water-cooling heat radiating device |
| CN102664515A (en) * | 2012-05-18 | 2012-09-12 | 株洲南车时代电气股份有限公司 | Cooling device for converter power module |
| CN202871775U (en) * | 2012-09-20 | 2013-04-10 | 常州博瑞电力自动化设备有限公司 | Water cooling radiator |
| CN104252212A (en) * | 2013-06-29 | 2014-12-31 | 华为技术有限公司 | Liquid cooling heat dissipation device and liquid cooling heat dissipation equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107977064A (en) * | 2017-12-29 | 2018-05-01 | 华南理工大学 | The water-cooling heat radiating device and its heat dissipating method of a kind of server |
| CN108334176A (en) * | 2018-03-07 | 2018-07-27 | 商洛学院 | A kind of computer radiator |
| CN110648988A (en) * | 2019-09-21 | 2020-01-03 | 苏州浪潮智能科技有限公司 | Liquid cooling heat radiator capable of giving consideration to both CPU and memory |
| CN110648988B (en) * | 2019-09-21 | 2021-06-25 | 苏州浪潮智能科技有限公司 | Liquid cooling heat radiator capable of giving consideration to both CPU and memory |
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