CN105682434A - Composite heat dissipation device combined with thermoelectric cooling and micro channel liquid cooling - Google Patents
Composite heat dissipation device combined with thermoelectric cooling and micro channel liquid cooling Download PDFInfo
- Publication number
- CN105682434A CN105682434A CN201610247487.2A CN201610247487A CN105682434A CN 105682434 A CN105682434 A CN 105682434A CN 201610247487 A CN201610247487 A CN 201610247487A CN 105682434 A CN105682434 A CN 105682434A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- micro
- level
- order
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention discloses a composite heat dissipation device combined with thermoelectric cooling and micro channel liquid cooling. The composite heat dissipation device is mainly composed of a first stage of micro channel heat sink (4), a second stage of micro channel heat sink (6), thermoelectric cooling sheets (3) and a heat sink liquid supplying system. The thermoelectric cooling sheets (3) are arranged on the upper end of the first stage of micro channel heat sink (4), and the first stage of micro channel heat sink (4) and the second stage of micro channel heat sink (6) are connected through the heat sink liquid supplying system. According to the invention, liquid cooling and thermoelectric cooling are combined for heat dissipation, the heat dissipation amount is large, the effect is good, heat dissipation is stable, and the damages to the heat dissipation device are reduced.
Description
Technical field
The present invention relates to a kind of heat abstractor, belong to electronic equipment dissipating heat field, more particularly to a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid.
Background technology
The combination of the microminiaturization of electronic devices and components and itself and machinery, power density and the caloric value of equipment increase rapidly. The heat problem of the high integration central processing unit of computer realm and the laser scalpel of medical field is all very prominent. Mode common at present is wind-cooling heat dissipating, but the maximum heat current density of air-cooled heat convection is not over 50W/cm2, it is impossible to meet radiating requirements. Therefore, the research of radiating mode during efficient real is imperative.
Thermoelectric cooling is the logical upper rated DC current of the PN junction utilizing semi-conducting material to make, pyroelectric effect will be there is in the contact surface of two knots, mainly there is paltie effect, Joule effect, fourier effect, five kinds of pyroelectric effects such as Seebeck effect and Thomson effect, thermoelectric cooling is freezed mainly by paltie effect. In general can there is the bigger temperature difference in thermoelectric module two ends, and cooling piece hot junction heat build-up is very notable, and therefore hot junction heat takes away the normal operation of guarantee cooling piece in time. Fluid channel radiator (micro-channel heat sink) is to process fluid passage on very thin silicon chip, metal or other materials surface, when the flowing space little to a certain extent after, different fluids occurs that in the flow process of different passages the yardstick of scale effect is different; In general the equivalent diameter of microchannel is at 1mm and below, research finds, the flow regime of the wall structure convection cell of microchannel has a significant impact, and has been largely fixed the heat convection ability of structure, and the high heat dissipation characteristics of maintenance is had very important effect by rational microchannel wall structure.
Current people simple utilize thermoelectric cooling mode or the cold mode of microchannel liquid, there is a lot of deficiency: the condensation trouble that thermoelectric cooling is possible can cause the damage of equipment; The cold radiating requirements that can not meet when equipment heating amount is big of microchannel liquid, and traditional fluid channel Temperature difference is big, and temperature distributing disproportionation is even, and flow resistance is bigger; Also having tried to come for refrigeration heat-producing device in conjunction with two ways, but the problems referred to above are again without being well solved.
Summary of the invention
Instant invention overcomes the deficiencies in the prior art, it is provided that a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid, solve the technical barrier that conventional heat abstractor heat dissipation capacity is little, heat-producing device easily causes damage.
For solving above-mentioned technical problem, the present invention by the following technical solutions:
A kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid, this composite heat dissipation device is mainly made up of first order micro-channel heat sink, second level micro-channel heat sink, thermoelectric module and heat sink liquid-supplying system, described thermoelectric module is positioned at first order micro-channel heat sink upper end, and described first order micro-channel heat sink is connected by heat sink liquid-supplying system with second level micro-channel heat sink.
Concrete, described thermoelectric module and micro-channel heat sink upper end, the second level are respectively connected with radiating fin, and radiating fin upper end is respectively connected with radiator fan.
Concrete, described thermoelectric module is provided with two, two described thermoelectric modules are connected in parallel with each other, and the first order micro-channel heat sink of described thermoelectric module lower end is again provided with two, and two described first order micro-channel heat sinks are connected by heat sink liquid-supplying system.
Concrete, described first order micro-channel heat sink is made up of the heat sink body of the first order and the first order cover plate two parts being positioned at the heat sink body upper end of the first order, the described first order is heat sink, and body includes first order microchannel carrier, first order microchannel carrier is as the interior micro-passage flow duct of the first order being provided with the arrangement of multiple uniform parallel, and described first order microchannel carrier is positioned at the two ends of the micro-passage flow duct of the first order and is provided with the heat sink collecting tank of the first order.
Concrete, described second level micro-channel heat sink is made up of the heat sink body in the second level and the second level cover plate two parts being positioned at heat sink body upper end, the second level, the described second level is heat sink, and body includes microchannel, second level carrier, the micro-passage flow duct in multiple evenly distributed second level it is provided with in the carrier of microchannel, the second level, microchannel, described second level carrier is positioned at the two ends of the micro-passage flow duct in the second level and is provided with the heat sink collecting tank in the second level, the sidewall of the micro-passage flow duct in the described second level is concavo-convex staggered wavy shaped configuration, and concave surface and the convex surface of wavy shaped configuration are arc surface.
Concrete, described heat sink liquid-supplying system includes liquid supply box, the outlet pipe of liquid supply box connects with first order micro-channel heat sink, the water inlet pipe of described liquid supply box connects with second level micro-channel heat sink, by connecting pipeline communication between described first order micro-channel heat sink and second level micro-channel heat sink, described liquid supply box, outlet pipe, water inlet pipe and connection pipeline constitute liquid flow circuits.
Concrete, the outlet pipe of described liquid supply box is provided with water pump.
Concrete, described first order micro-channel heat sink and/or second level micro-channel heat sink are made of aluminum or copper.
Concrete, this composite heat dissipation device also includes the fixing device being arranged on first order micro-channel heat sink, second level micro-channel heat sink, thermoelectric module and heat sink liquid-supplying system lower end.
Compared with prior art, the invention has the beneficial effects as follows:
1, when caloric value of the present invention is little, utilize the cold mode of liquid to dispel the heat, but a part of heat is to be taken away by fin and radiator fan either directly through heat sink body simultaneously; When the cold mode of liquid can not meet demand, thermoelectric module and radiator fan startup work, the liquid flowing through the first order heat sink is cooled down by thermoelectric module, and it is heat sink that cryogenic liquid enters back into the second level, it is possible to heat dissipation equipment is maintained at very low temperature when caloric value is big. So with good conditionsi to cooling piece and corresponding fan carry out start and stop, under essential condition, heat dissipation equipment can be maintained at very low temperature, can selectively save again electricity.
2, the micro-passage flow duct of the first order of the present invention is parallel channel, so can increase the distribution area of liquid, is conducive to cooling piece that liquid is cooled down, and is unlikely to again liquid flowing is caused bigger resistance; The sidewall of the micro-passage flow duct in the second level is concavo-convex staggered wavy shaped configuration, periodically change fluid channel convex-concave internal structure, this wall structure can break fluid boundary layer, make fluid generating period disturbance, increase fluid and ooze mixed, being obviously enhanced the heat convection ability of fluid, the flow resistance of fluid is also unlikely too big simultaneously.
3, the thermoelectric module of the present invention includes two single thermoelectric module compositions being connected in parallel, it is possible to prevents from causing that whole refrigeration system lost efficacy owing to certain single thermoelectric module lost efficacy, improves the stability of refrigeration system.
4, the second level micro-channel heat sink in the present invention directly dispels the heat for heat dissipation equipment, and second level micro-channel heat sink is not direct with the cold end of thermoelectric module, thus greatly reduces the probability that heat dissipation equipment is damaged by second level micro-channel heat sink due to condensation frosting.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Fig. 1 is the structural representation of the present invention;
Fig. 2 is the partial structurtes schematic diagram of the present invention;
Fig. 3 is first order micro-channel heat sink and the structural representation of second level micro-channel heat sink;
Fig. 4 is the top view of Fig. 3, omits first order cover plate and second level cover plate in figure;
Fig. 5 is the side view of first order cover plate;
Fig. 6 is the structural representation of second level cover plate;
Fig. 7 is the sectional view in A-A face in Fig. 6;
Labelling in figure is expressed as: 1, water pump; 2, outlet pipe; 3, thermoelectric module; 4, first order micro-channel heat sink; 4-1, the first order are heat sink body; 4-11, first order microchannel carrier; The micro-passage flow duct of 4-12, the first order; 4-13, first order microchannel wall; 4-14, the first order are heat sink collecting tank; 4-2, first order cover plate; 5, pipeline is connected; 6, second level micro-channel heat sink; 6-1, the second level is heat sink body; 6-11, microchannel, second level carrier; 6-12, the micro-passage flow duct in the second level; 6-13, the micro-logical wall in the second level; 6-14, the second level is heat sink collecting tank; 6-2, second level cover plate; 7, chip; 8, fixing device; 9, radiating fin; 10, radiator fan; 11, water pump; 12, liquid supply box.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is further illustrated. Embodiments of the present invention include but not limited to the following example.
As shown in Fig. 1-Fig. 7, a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid, this composite heat dissipation device is mainly made up of first order micro-channel heat sink 4, second level micro-channel heat sink 6, thermoelectric module 3 and heat sink liquid-supplying system, described thermoelectric module 3 is positioned at first order micro-channel heat sink 4 upper end, and described first order micro-channel heat sink 4 is connected by heat sink liquid-supplying system with second level micro-channel heat sink 6.
Described thermoelectric module 3 and second level micro-channel heat sink 6 upper end are respectively connected with radiating fin 9, and radiating fin 9 upper end is respectively connected with radiator fan 10.
Described thermoelectric module 3 is provided with two, and two described thermoelectric modules 3 are connected in parallel with each other, and the first order micro-channel heat sink 4 of described thermoelectric module 3 lower end is again provided with two, and two described first order micro-channel heat sinks 4 are connected by heat sink liquid-supplying system.
Described first order micro-channel heat sink 4 is made up of with the first order cover plate 4-2 two parts being positioned at the first order heat sink body 4-1 upper end the first order heat sink body 4-1, the described first order is heat sink, and body 4-1 includes first order microchannel carrier 4-11, it is provided with the micro-passage flow duct 4-12 of the first order, described first order microchannel carrier 4-11 of the arrangement of multiple uniform parallel in the carrier 4-11 of first order microchannel to be positioned at the two ends of the first order micro-passage flow duct 4-12 and be provided with the heat sink collecting tank 4-14 of the first order.
Described second level micro-channel heat sink 6 is made up of with the second level cover plate 6-2 two parts being positioned at heat sink body 6-1 upper end, the second level the second level heat sink body 6-1, the described second level is heat sink, and body 6-1 includes microchannel, second level carrier 6-11, the micro-passage flow duct 6-12 in multiple evenly distributed second level it is provided with in the carrier 6-11 of microchannel, the second level, microchannel, described second level carrier 6-11 is positioned at the two ends of the second level micro-passage flow duct 6-12 and is provided with the heat sink collecting tank 6-14 in the second level, the sidewall of the described second level micro-passage flow duct 6-12 is concavo-convex staggered wavy shaped configuration, concave surface and the convex surface of wavy shaped configuration are arc surface.
Described heat sink liquid-supplying system includes liquid supply box 12, the outlet pipe 2 of liquid supply box 12 connects with first order micro-channel heat sink 4, the water inlet pipe 11 of described liquid supply box 12 connects with second level micro-channel heat sink 6, being connected by connection pipeline 5 between described first order micro-channel heat sink 4 and second level micro-channel heat sink 6, described liquid supply box 12, outlet pipe 2, water inlet pipe 11 and connection pipeline 5 constitute liquid flow circuits.
The outlet pipe 2 of described liquid supply box 12 is provided with water pump 1.
Described first order micro-channel heat sink 4 and/or second level micro-channel heat sink 6 are made of aluminum or copper.
This composite heat dissipation device also includes the fixing device 8 being arranged on first order micro-channel heat sink 4, second level micro-channel heat sink 6, thermoelectric module 3 and heat sink liquid-supplying system lower end.
The operation principle of the present invention is: when heat dissipation equipment distribute heat little time, thermoelectric module and corresponding fan are closed, the heat of heat dissipation equipment passes to the second level micro-channel heat sink and internal liquid thereof that contact with it, and takes away via fin and fan; When heat dissipation equipment caloric value is higher, when only can not meet radiating requirements with the cold mode of microchannel liquid, thermoelectric module and corresponding fan start under the control of control circuit, cooling piece contacts with first order microchannel upper surface, the liquid flowed through is entered cooling, cryogenic liquid is heat sink by connecting the pipeline entrance second level, heat dissipation equipment is lowered the temperature, thus being greatly improved radiating efficiency.
The radiating fin of the present invention and fan have two effects, and one is will be passed to heat sink heat be directly emitted in environment, and another is that the liquid in microchannel is cooled down. Thermoelectric module arranges two, thereby may be ensured that the stability of refrigeration system, it is to avoid single thermoelectric module lost efficacy and caused that whole refrigeration system lost efficacy. The micro-passage flow duct of the first order is the straight parallel conduit of multiple uniform parallel arrangement, thus increasing the distribution area of liquid, improve the contact area of liquid and the cold end of cooling piece of thermoelectric module, be beneficial to thermoelectric module and liquid is cooled down, be unlikely to again liquid flowing is caused bigger resistance; The sidewall of the second level micro-passage flow duct 6-12 is concavo-convex staggered wavy shaped configuration, concave surface and the convex surface of wavy shaped configuration are arc surface, it is possible to break fluid boundary layer, make fluid generating period disturbance, increase fluid and ooze mixed, be obviously enhanced the heat convection ability of fluid. Heat sink liquid-supplying system provides the coolant of first order micro-channel heat sink 4 and second level micro-channel heat sink 6 by liquid flow circuits, and be can be recycled by the liquid after heat absorption, easy to use, good heat dissipation effect; Whole heat abstractor can be fixed on the position needing heat radiation by fixing device 8.
First order micro-channel heat sink 4 and/or the second level micro-channel heat sink 6 of the present invention are made of aluminum or copper, it is contemplated that the yielding characteristic of aluminum, and the use environment higher in some temperature is proposed with material copper.
The invention has the beneficial effects as follows: when heat dissipation equipment caloric value is little, utilize the cold mode of liquid namely to utilize second level micro-channel heat sink to dispel the heat; When the cold mode of liquid can not meet demand, thermoelectric module and radiator fan startup work, the liquid flowing through the first order heat sink is cooled down by thermoelectric module, and it is heat sink that cryogenic liquid enters back into the second level, it is possible to heat dissipation equipment is maintained at very low temperature when caloric value is big. So with good conditionsi to cooling piece and corresponding fan carry out start and stop, under essential condition, heat dissipation equipment can be maintained at very low temperature, can selectively save again electricity;The micro-passage flow duct of the first order is parallel channel, so can increase the distribution area of liquid, is conducive to cooling piece that liquid is cooled down, and is unlikely to again liquid flowing is caused bigger resistance; The sidewall of the micro-passage flow duct in the second level is concavo-convex staggered wavy shaped configuration, periodically change fluid channel convex-concave internal structure, this wall structure can break fluid boundary layer, make fluid generating period disturbance, increase fluid and ooze mixed, being obviously enhanced the heat convection ability of fluid, the flow resistance of fluid is also unlikely too big simultaneously; Thermoelectric module includes two single thermoelectric module compositions being connected in parallel, it is possible to prevents from causing that whole refrigeration system lost efficacy owing to certain thermoelectric module lost efficacy, improves the stability of refrigeration system; Second level micro-channel heat sink directly dispels the heat for heat dissipation equipment, and second level micro-channel heat sink is not direct with the cold end of thermoelectric module, thus greatly reduces the probability that heat dissipation equipment is damaged by second level micro-channel heat sink due to condensation frosting.
Below, come in conjunction with specific embodiments the present invention is described in further details.
Specific embodiment
As shown in Fig. 1-Fig. 7, a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid, this composite heat dissipation device is mainly made up of first order micro-channel heat sink 4, second level micro-channel heat sink 6, thermoelectric module 3 and heat sink liquid-supplying system, described thermoelectric module 3 is positioned at first order micro-channel heat sink 4 upper end, and described first order micro-channel heat sink 4 is connected by heat sink liquid-supplying system with second level micro-channel heat sink 6, described thermoelectric module 3 and second level micro-channel heat sink 6 upper end are respectively connected with radiating fin 9, and radiating fin 9 upper end is respectively connected with radiator fan 10, described thermoelectric module 3 is provided with two, and two described thermoelectric modules 3 are connected in parallel with each other, and the first order micro-channel heat sink 4 of described thermoelectric module 3 lower end is again provided with two, and two described first order micro-channel heat sinks 4 are connected by heat sink liquid-supplying system, described first order micro-channel heat sink 4 is made up of with the first order cover plate 4-2 two parts being positioned at the first order heat sink body 4-1 upper end the first order heat sink body 4-1, the described first order is heat sink, and body 4-1 includes first order microchannel carrier 4-11, it is provided with the micro-passage flow duct 4-12 of the first order, described first order microchannel carrier 4-11 of the arrangement of multiple uniform parallel in the carrier 4-11 of first order microchannel to be positioned at the two ends of the first order micro-passage flow duct 4-12 and be provided with the heat sink collecting tank 4-14 of the first order, described second level micro-channel heat sink 6 is made up of with the second level cover plate 6-2 two parts being positioned at heat sink body 6-1 upper end, the second level the second level heat sink body 6-1, the described second level is heat sink, and body 6-1 includes microchannel, second level carrier 6-11, the micro-passage flow duct 6-12 in multiple evenly distributed second level it is provided with in the carrier 6-11 of microchannel, the second level, microchannel, described second level carrier 6-11 is positioned at the two ends of the second level micro-passage flow duct 6-12 and is provided with the heat sink collecting tank 6-14 in the second level, the sidewall of the described second level micro-passage flow duct 6-12 is concavo-convex staggered wavy shaped configuration, concave surface and the convex surface of wavy shaped configuration are arc surface, described heat sink liquid-supplying system includes liquid supply box 12, the outlet pipe 2 of liquid supply box 12 connects with first order micro-channel heat sink 4, the water inlet pipe 11 of described liquid supply box 12 connects with second level micro-channel heat sink 6, being connected by connection pipeline 5 between described first order micro-channel heat sink 4 and second level micro-channel heat sink 6, described liquid supply box 12, outlet pipe 2, water inlet pipe 11 and connection pipeline 5 constitute liquid flow circuits,The outlet pipe 2 of described liquid supply box 12 is provided with water pump 1; Described first order micro-channel heat sink 4 and second level micro-channel heat sink 6 are made of copper; This composite heat dissipation device also includes the fixing device 8 being arranged on first order micro-channel heat sink 4, second level micro-channel heat sink 6, thermoelectric module 3 and heat sink liquid-supplying system lower end.
The second level micro-channel heat sink 6 of the present embodiment is directly anchored to heat dissipation equipment chip 7 upper end by fixing device 8, for chip 7 is dispelled the heat.
As it is shown in figure 1, the present embodiment device is evacuated and fill the water of certain volume or other liquid working substances seal after liquid supply box 12. water pump 1 drives liquid to flow to first order micro-channel heat sink 4 through outlet pipe 2, first order micro-channel heat sink 4 is formed by two symmetrical rectangles are heat sink, its upper end arranges the thermoelectric module 3 being connected in parallel, when caloric value is little, thermoelectric module 3 and fan 10 are in off working state, liquid imports the collecting tank 6-14 of second level micro-channel heat sink 6 from first order micro-channel heat sink 4 via connection pipeline 5, after the heat that chip 7 produces is absorbed by second level micro-channel heat sink 6, take away in part through radiating fin 9 and radiator fan 10, another part is taken away by the liquid flowing through microchannel, then liquid flows into water inlet pipe 11 by exporting, and finally flow into liquid supply box 12, complete a circulation. when chip caloric value is bigger, when the cold mode of above-mentioned liquid cannot meet cooling requirements, thermoelectric module 3 and radiator fan 10 are started working, liquid is in the process flowing through first order micro-channel heat sink 4, distribution area can increase, such that it is able to fully cooled down by the cold end of thermoelectric module 3, flow into second level micro-channel heat sink 6 through overcooled cryogenic liquid by connecting pipeline 5, it is achieved chip 7 is distributed the exchange of heat, the heat in cooling piece hot junction is dispersed in surrounding by radiating fin 9 and radiator fan 10.
Wherein, between the internal diameter 3 ~ 6mm of outlet pipe 2 and water inlet pipe 11, in order to improve sealing and connect effect, each parts, before assembling, should be carried out ultrasonic cleaning by heat abstractor, remove the greasy dirt impurity on surface.
As shown in Figure 2, as can be seen from the figure, first order micro-channel heat sink 4 is symmetrically arranged with two, one effect is to allow coolant contact with bigger area with cooling piece thus allowing cooling piece lower the temperature for coolant, and another effect is that another can continue cooling if one of them breaks down; The cold end of thermoelectric module 3 can be connected by heat-conducting silicone grease with first order micro-channel heat sink 4 upper surface; Thermoelectric module 3 is provided with two, and two thermoelectric modules 3 are connected in parallel with each other, and so wherein when an inefficacy, another can work on, thus improve the reliability of device.
And in order to increase heat transmission effect further, the second level micro-leading to connects also by heat-conducting silicone grease between heat sink 6 upper surfaces and radiating fin 9, between thermoelectric module 3 hot junction and radiating fin 9.
As shown in Figure 3, first order cover plate 4-2 to contact with radiating fin 9 lower surface, the cold end in contact of second level cover plate 6-2 upper surface and thermoelectric module 3, therefore first order cover plate 4-2, between second level cover plate 6-2 and fluid channel body by epoxy thermostable heat-conductive glue glued joint, but need to ensure that closure is good, it is impossible to fluid seepage occurs.
The thermoelectric module 3 of the present embodiment can connect control circuit and be controlled by, and control circuit can control the cold junction temperature of thermoelectric module 3 and be unlikely to too low, can reduce the possibility of equipment frosting or condensation, improve system reliability further.
First order micro-channel heat sink 4, second level micro-channel heat sink 6 material adopt copper, meet the use of hot environment, thus being also less susceptible to high temperature while possessing high efficiency and heat radiation ability and deforming.
As shown in Figure 4, first order micro-channel heat sink 4 integral planar is of a size of 25x25mm, inside includes the first order micro-passage flow duct 4-12 and the heat sink collecting tank 4-14 of the first order, their height is identical may each be about 1.5mm, the width of the first order is heat sink collecting tank 4-14 is 3mm, and the width of the micro-passage flow duct 4-12 of the first order is 1mm, and the distance between the micro-passage flow duct 4-12 of two first order of arbitrary neighborhood is 1mm, it is arranged so as to increase so that the distribution area of liquid, and does not dramatically increase again the flow resistance of liquid, the integral planar of second level micro-channel heat sink 6 is of a size of 55x55mm, and inside includes the second level heat sink collecting tank 6-14 and the micro-passage flow duct 6-12 in the second level, is highly 1.8mm, the width of the second level is heat sink collecting tank 6-14 is 2 ~ 3mm, the width of each micro-passage flow duct of the second level micro-passage flow duct 6-12 is 0.8-1mm, distance between the micro-passage flow duct 6-12 in two second level of arbitrary neighborhood is designed as 1.5-2mm, 6-13 shown in the sidewall of the micro-passage flow duct 6-12 in the second level and Fig. 4, in concavo-convex staggered wavy shaped configuration, concave surface and the convex surface of wavy shaped configuration are arc surface, the central angle that arc surface is corresponding is 120 °, and arc diameter is 1.5mm, adjacent two spacing between concave surface and convex surface are 1.3-1.8mm, the liquid of first order micro-channel heat sink 4 and second level micro-channel heat sink 6 first flows into respective collecting tank, subsequently into respective runner, finally import respective collecting tank again, and flowed out by the pipeline being connected with respective collecting tank.
As shown in Figure 5-Figure 7, as can be seen from the figure, first order cover plate 4-2 and second level cover plate 6-2 has a boss, boss has two effects, and one is realize cover plate 4-2,6-2 and heat sink body 4-1, the close contact of 6-1, it is accurate that another is to ensure that cover plate 4-2,6-2 and heat sink body 4-1,6-1 position. The screw that cover plate 6-2 tetra-corners in the second level are arranged is used for fixing the radiating fin 9 being attached thereto.
It is embodiments of the invention as mentioned above. each preferred embodiment for the present invention described previously, preferred implementation in each preferred embodiment is if not substantially contradictory or premised on a certain preferred implementation, each preferred implementation can arbitrarily stack combinations use, design parameter in described embodiment and embodiment is merely to know the invention proof procedure of statement inventor, and it is not used to the scope of patent protection of the restriction present invention, the scope of patent protection of the present invention is still as the criterion with its claims, the equivalent structure change that the description of every utilization present invention and accompanying drawing content are made, in like manner should be included in protection scope of the present invention.
Claims (9)
1. one kind in conjunction with the cold composite heat dissipation device of thermoelectric cooling and microchannel liquid, it is characterized in that: this composite heat dissipation device is mainly made up of first order micro-channel heat sink (4), second level micro-channel heat sink (6), thermoelectric module (3) and heat sink liquid-supplying system, described thermoelectric module (3) is positioned at first order micro-channel heat sink (4) upper end, and described first order micro-channel heat sink (4) is connected by heat sink liquid-supplying system with second level micro-channel heat sink (6).
2. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to claim 1, it is characterized in that: described thermoelectric module (3) and second level micro-channel heat sink (6) upper end are respectively connected with radiating fin (9), and radiating fin (9) upper end is respectively connected with radiator fan (10).
3. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to claim 1, it is characterized in that: described thermoelectric module (3) is provided with two, two described thermoelectric modules (3) are connected in parallel with each other, the first order micro-channel heat sink (4) of described thermoelectric module (3) lower end is again provided with two, and two described first order micro-channel heat sinks (4) are connected by heat sink liquid-supplying system.
4. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to claim 1, it is characterized in that: described first order micro-channel heat sink (4) is by the heat sink body of the first order (4-1) and is positioned at first order cover plate (4-2) two parts of the first order heat sink body (4-1) upper end and forms, the described first order is heat sink, and body (4-1) includes first order microchannel carrier (4-11), the micro-passage flow duct of the first order (4-12) of multiple uniform parallel arrangement it is provided with in first order microchannel carrier (4-11), the two ends that described first order microchannel carrier (4-11) is positioned at the micro-passage flow duct of the first order (4-12) are provided with the heat sink collecting tank of the first order (4-14).
5. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to claim 1, it is characterized in that: described second level micro-channel heat sink (6) is by the heat sink body in the second level (6-1) and is positioned at second level cover plate (6-2) two parts of the second level heat sink body (6-1) upper end and forms, the described second level is heat sink, and body (6-1) includes microchannel, second level carrier (6-11), the micro-passage flow duct in multiple evenly distributed second level (6-12) it are provided with in microchannel, second level carrier (6-11), microchannel, described second level carrier (6-11) is positioned at the two ends of the micro-passage flow duct in the second level (6-12) and is provided with the heat sink collecting tank in the second level (6-14), the sidewall of the micro-passage flow duct in the described second level (6-12) is concavo-convex staggered wavy shaped configuration, concave surface and the convex surface of wavy shaped configuration are arc surface.
6. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to any one of claim 1-5, it is characterized in that: described heat sink liquid-supplying system includes liquid supply box (12), the outlet pipe (2) of liquid supply box (12) connects with first order micro-channel heat sink (4), the water inlet pipe (11) of described liquid supply box (12) connects with second level micro-channel heat sink (6), by connecting pipeline (5) connection between described first order micro-channel heat sink (4) and second level micro-channel heat sink (6), described liquid supply box (12), outlet pipe (2), water inlet pipe (11) and connection pipeline (5) constitute liquid flow circuits.
7. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to claim 6, it is characterised in that: the outlet pipe (2) of described liquid supply box (12) is provided with water pump (1).
8. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to any one of claim 1-5, it is characterised in that: described first order micro-channel heat sink (4) and/or second level micro-channel heat sink (6) are made of aluminum or copper.
9. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to any one of claim 1-5, it is characterised in that: this composite heat dissipation device also includes the fixing device (8) being arranged on first order micro-channel heat sink (4), second level micro-channel heat sink (6), thermoelectric module (3) and heat sink liquid-supplying system lower end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610247487.2A CN105682434A (en) | 2016-04-20 | 2016-04-20 | Composite heat dissipation device combined with thermoelectric cooling and micro channel liquid cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610247487.2A CN105682434A (en) | 2016-04-20 | 2016-04-20 | Composite heat dissipation device combined with thermoelectric cooling and micro channel liquid cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105682434A true CN105682434A (en) | 2016-06-15 |
Family
ID=56215448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610247487.2A Pending CN105682434A (en) | 2016-04-20 | 2016-04-20 | Composite heat dissipation device combined with thermoelectric cooling and micro channel liquid cooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105682434A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028762A (en) * | 2016-07-19 | 2016-10-12 | 南京工程学院 | Double-cooling comprehensive system for electric car control system |
| CN106444892A (en) * | 2016-09-12 | 2017-02-22 | 华东师范大学 | Temperature control system and optical console |
| CN107062896A (en) * | 2017-03-31 | 2017-08-18 | 东莞市科隆威自动化设备有限公司 | A kind of single line dries sintering furnace |
| CN108336045A (en) * | 2018-02-07 | 2018-07-27 | 电子科技大学 | The microchannel cooling system constituted using the imitative Airfoil Sections cooling fin of 3D printing |
| CN109192711A (en) * | 2018-09-21 | 2019-01-11 | 禾臻电子科技（上海）有限公司 | The air-cooled hot superconduction panel radiator of liquid-cooling combined type |
| CN110139539A (en) * | 2019-05-27 | 2019-08-16 | 天津大学 | It is a kind of for microwave from the self assembly microchannel structural design and implementation method of package platforms |
| WO2020135638A1 (en) * | 2018-12-29 | 2020-07-02 | 中兴通讯股份有限公司 | Heat dissipation structure |
| CN111554644A (en) * | 2020-06-12 | 2020-08-18 | 厦门通富微电子有限公司 | Chip, chip package and wafer |
| CN111839725A (en) * | 2020-07-28 | 2020-10-30 | 北京计算机技术及应用研究所 | Independent cooler for laser scalpel |
| CN117174675A (en) * | 2023-09-11 | 2023-12-05 | 山东大学 | Heat dissipation device and method for loop heat pipe pumpless circulating chip driven by TEC heat energy |
| WO2024021606A1 (en) * | 2022-07-27 | 2024-02-01 | 中兴通讯股份有限公司 | Chip heat dissipation method, single board, electronic device, computer device, and storage medium |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1589094A (en) * | 2004-08-30 | 2005-03-02 | 西安电子科技大学 | Micro channel circulation neat excharging system based on thermoelectric actice control |
| CN1882237A (en) * | 2005-06-17 | 2006-12-20 | 富准精密工业(深圳)有限公司 | Loop type heat-exchange device |
| CN101242729A (en) * | 2007-02-07 | 2008-08-13 | 中国科学院工程热物理研究所 | Thermal control method and system based on capillary slot group and thermal power combination |
-
2016
- 2016-04-20 CN CN201610247487.2A patent/CN105682434A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1589094A (en) * | 2004-08-30 | 2005-03-02 | 西安电子科技大学 | Micro channel circulation neat excharging system based on thermoelectric actice control |
| CN1882237A (en) * | 2005-06-17 | 2006-12-20 | 富准精密工业(深圳)有限公司 | Loop type heat-exchange device |
| US20060283577A1 (en) * | 2005-06-17 | 2006-12-21 | Tay-Jian Liu | Loop-type heat exchange device |
| CN101242729A (en) * | 2007-02-07 | 2008-08-13 | 中国科学院工程热物理研究所 | Thermal control method and system based on capillary slot group and thermal power combination |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028762A (en) * | 2016-07-19 | 2016-10-12 | 南京工程学院 | Double-cooling comprehensive system for electric car control system |
| CN106028762B (en) * | 2016-07-19 | 2018-03-27 | 南京工程学院 | A kind of double cooling integrated systems for electric vehicle control system |
| CN106444892A (en) * | 2016-09-12 | 2017-02-22 | 华东师范大学 | Temperature control system and optical console |
| CN106444892B (en) * | 2016-09-12 | 2018-06-22 | 华东师范大学 | Temperature control system and optics console |
| CN107062896A (en) * | 2017-03-31 | 2017-08-18 | 东莞市科隆威自动化设备有限公司 | A kind of single line dries sintering furnace |
| CN108336045A (en) * | 2018-02-07 | 2018-07-27 | 电子科技大学 | The microchannel cooling system constituted using the imitative Airfoil Sections cooling fin of 3D printing |
| CN109192711A (en) * | 2018-09-21 | 2019-01-11 | 禾臻电子科技（上海）有限公司 | The air-cooled hot superconduction panel radiator of liquid-cooling combined type |
| WO2020135638A1 (en) * | 2018-12-29 | 2020-07-02 | 中兴通讯股份有限公司 | Heat dissipation structure |
| CN111384006A (en) * | 2018-12-29 | 2020-07-07 | 中兴通讯股份有限公司 | Heat radiation structure |
| CN110139539A (en) * | 2019-05-27 | 2019-08-16 | 天津大学 | It is a kind of for microwave from the self assembly microchannel structural design and implementation method of package platforms |
| CN111554644A (en) * | 2020-06-12 | 2020-08-18 | 厦门通富微电子有限公司 | Chip, chip package and wafer |
| CN111839725A (en) * | 2020-07-28 | 2020-10-30 | 北京计算机技术及应用研究所 | Independent cooler for laser scalpel |
| CN111839725B (en) * | 2020-07-28 | 2023-03-10 | 北京计算机技术及应用研究所 | Independent cooler for laser scalpel |
| WO2024021606A1 (en) * | 2022-07-27 | 2024-02-01 | 中兴通讯股份有限公司 | Chip heat dissipation method, single board, electronic device, computer device, and storage medium |
| CN117174675A (en) * | 2023-09-11 | 2023-12-05 | 山东大学 | Heat dissipation device and method for loop heat pipe pumpless circulating chip driven by TEC heat energy |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105682434A (en) | Composite heat dissipation device combined with thermoelectric cooling and micro channel liquid cooling | |
| CN103477432B (en) | Semiconductor module cooler | |
| CN203943523U (en) | A kind of semiconductor refrigerating drinking water apparatus | |
| CN103413794A (en) | Radiating packaging structure of semiconductor power device | |
| CN100461995C (en) | Array jetting micro heat exchanger | |
| CN207652885U (en) | A kind of cooled plate and electronic equipment of the distribution of fin wheat head shape | |
| CN203859970U (en) | Cooling-used double-layer cooling plate and electronic component cooling device | |
| CN106288501A (en) | A kind of high load capacity CPU spraying phase-change refrigerating plant coolant circulation system and control method thereof | |
| CN106783770B (en) | Liquid direct contact cooler | |
| CN105700652A (en) | Cooler | |
| WO2017215162A1 (en) | Cooling system of working medium contact type for high-power electrical device | |
| CN206820723U (en) | A kind of novel concentrator photovoltaic cell heat transmission multichannel manifolding | |
| CN107134975A (en) | A kind of novel concentrator photovoltaic cell heat transmission multichannel manifold system | |
| CN107256075A (en) | Soldering formula CPU liquid cooling heat radiators with internal memory heat sink | |
| CN109742059B (en) | Heat dissipation structure applied to high-power semiconductor module | |
| CN114551380B (en) | Chip heat dissipation device | |
| CN207864044U (en) | A kind of engine radiator | |
| WO2017215160A1 (en) | Intermittent cooling system of working medium contact type | |
| CN203659934U (en) | Microgroove group heat radiating device of high-power LED (light emitting diode) | |
| CN200983739Y (en) | Array radiation flow micro heat exchanger | |
| CN204145971U (en) | Power electronics high-power water-cooling radiator | |
| CN206412347U (en) | Liquid direct contact type cooler | |
| CN208188773U (en) | A kind of computer housing water-cooled radiator | |
| CN207765786U (en) | A kind of semiconductor laser structure and its cooling device of directly logical coolant liquid heat dissipation | |
| CN105552049A (en) | Integrated liquid cooling heat sink device of power module and bottom plate used by power module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160615 |
|
| RJ01 | Rejection of invention patent application after publication |