WO2014174336A1 - Power thyristor unit cooling system - Google Patents

Power thyristor unit cooling system Download PDF

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Publication number
WO2014174336A1
WO2014174336A1 PCT/IB2013/001292 IB2013001292W WO2014174336A1 WO 2014174336 A1 WO2014174336 A1 WO 2014174336A1 IB 2013001292 W IB2013001292 W IB 2013001292W WO 2014174336 A1 WO2014174336 A1 WO 2014174336A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
thyristors
liquid cooler
shape
liquid
Prior art date
Application number
PCT/IB2013/001292
Other languages
French (fr)
Inventor
Andrey Pavlovich ILIN
Original Assignee
KIM, No, Eul
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KIM, No, Eul filed Critical KIM, No, Eul
Priority to PCT/IB2013/001292 priority Critical patent/WO2014174336A1/en
Priority to KR1020157008281A priority patent/KR101551874B1/en
Priority to CN201380063026.4A priority patent/CN104823279B/en
Publication of WO2014174336A1 publication Critical patent/WO2014174336A1/en
Priority to IN2629DEN2015 priority patent/IN2015DN02629A/en
Priority to HK16101422.8A priority patent/HK1213691A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to heat technology, equipment and semiconductor devices for electric control and adjustment, power engineering and the heating by using electricity for the heating of a liquid, for example, water, steam generation, direct transformation of electric power into heat.
  • a liquid for example, water, steam generation
  • the invention is meant for liquid cooling of power electric semiconductor devices of control and adjustment, in particular, for the cooling of semiconducting thyristors.
  • This could be applied in the systems for control and adjustment of hot-water heating, self-regulated heaters of liquids, independent heating and hot water supply, mobile heating and hot water supply.
  • it could be applied as a device for liquid cooling of various electric semiconducting power devices efficiently ensuring preset operation modes for control and adjustment components.
  • the put forward invention is applied in control and adjustment systems of electric water heating boilers, however it as well could be applied in general as a component for liquid cooling system of any power semiconducting devices.
  • General shortcomings of common knowledge cooling systems may include geometrical symmetry of the design for main cooling components used to supply a cooling liquid, geometric symmetry of thyristors and symistors disposition at heat eliminating surfaces. This to a significant extent reduces fabricability of the product and complicates the device in general due to thorough preparation and components high precision processing required in order to ensure such a symmetry.
  • a precise alignment of cooling circuit inner counter of cross lateral and longitudinal sections to that of outer counter is inherent in virtually all common knowledge devices for cooling the semiconducting power devices.
  • the common knowledge devices do not make use of all available options for boosting the heat elimination efficiency by way of adjusting all the interior shape of flow-through cooling elements.
  • the set of those reasons cause the common knowledge devices insecurity as regards to the assembly inaccuracy and poor reliability in service when permanently affected by mechanical, chemical corrosion and thermal factors of symmetry disruption.
  • such symmetry is functionless, does not influence the device operation and is not justified in terms of production costs associated with retention of the symmetry whatsoever.
  • This also aggravates reparability of common knowledge devices, as any repair may affect symmetry.
  • it is the type of installation symmetry for the semiconducting elements being cooled and the design symmetry for inner sections of cooling liquid channels and piping that aggravates the convection conditions thus aggravating heat release. This could be explained with inability to install semiconducting power elements into the spots of intensified heat release and inability of flexible adjustment of cross sections internal shapes of heat eliminating components with the view of heat elimination efficiency optimization.
  • WO2012143784 (A2) — 2012-10-26 - Semiconductor device and manufacturing method thereof— two-sided cooling of thyristor crystals.
  • EP0046825 (Al)— 1982-03-10 - Method of producing an assembly of electrical elements clamped between cooling members, and assembly made by such method— thyristors tightly springily pressed to cooling elements in order to reduce heat resistance.
  • Liquid cooling is the most beneficial way to manage high voltages and amperages directly in the power circuits. Besides, where such a control is performed for the purposes of liquid heating and cooling, for example, in water heating electric boilers, the use of liquid flow for cooling capacious thyristors is the most beneficial, yet is the simplest way.
  • the shortcoming for this case is a poor mechanical reliability of the design.
  • the main flat piping is symmetric in its cross-section, which is to be precisely followed, thus this reduces fabricability of the device, complicates it and increases its production costs.
  • EP0582217 (Al)— 1994-02-09 - Liquid-cooled current rectifier module with a codant flow generated by a coolant pump - fan of extra ventilation duct driven by the running flow of liquid.
  • WO2004031588 (Al)— 2004-04-15 - Arrangement and method for removing heat from a component which is to be cooled— cooling of the pump setting into motion the flow of liquid for thyristors cooling.
  • Thyristors cooling with a combination of directed flows of a chilling liquid Thyristors cooling with a combination of directed flows of a chilling liquid.
  • Fluid-cooled electrical resistor esp. for GTO-thyristor switching - consists of coaxial tubes cooled by contra-flow of liquid over entire surface of resistive elements— parallel water cooling. Cooling ducts precise parallel and right angle disposition makes its shortcoming.
  • EP0099092B1 1984-01-25— Series-parallel flow cooling apparatus — parallel-parallel thyristors cooling by way of their successive group disposition and simultaneous association of the groups by coolant flows.
  • US4023616 (A) 1977-05-17 — Thyristor cooling arrangement - successive parallel module of direct-flow liquid cooling of thyristors, the thyristors pressed to radiator ends.
  • KR20050034526 (A)— 2005-04-14 - Liquid cooling jacket - direct-flow liquid cooling disc ducts located in parallel.
  • CN201655786 U— 2010-11-24 Water-cooling radiator for high-power thyristor; CN101984507 (A)— 2011-03-09 - Novel water-cooled radiator for thyristor CN201229939 (Y) — 2009-04-29 - Ceramic casing of integral water-cooling heat radiation thyristor - Archimedean spiral type liquid radiators, their inner cross section replicates the outer cross section. CN101308826 (A) — 2008-11-19 Novel integrated water-cooling thyristor ceramic housing - Round ceramic housing of a round body cavity arranged in perfect symmetry.
  • KR20110046302 (A) — 2011-05-04 — ridged hollow plate, cooling liquid flowing through it, however, its outer housing exactly replicates its inner housing, that badly restricts options for of variation of the liquid flow at the spots requiring the cooling. Those variations are minimal and are restricted to the rounded angles of the corrugation only.
  • RU 74010 (M ) - 2008-06-10 - device to chill out semiconducting transistors is a plane hollow plate used as an electric lead.
  • Cooler housing design varies geometrically. Principal shortcomings include complexity and high production costs, its low reliability and repairability, poor functionality that disable to schedule the topology of heat flows allocation to specific tasks and specifically for each thyristor, restricted product range.
  • EP0930480 (A2) 1999-07-21 - Heat exchanger— vesicular heat exchanger needs to be located over main pipeline in symmetric array.
  • Cooling water supply unit for parts of electric welding installations Hybrid plastic unit, its cylindrical duct arranged asymmetrically against the symmetry axes of longitudinal section, being, however, true to the shape of right-angled outer housing (plastic box).
  • Liquid-cooled group heat sink - panel heat exchanger of liquid cooling that contains a housing designed as a parallelepiped made of highly heat-conductive material, at which inner mutually crossing round ducts are installed, the thyristors to be cooled are mounted above.
  • the round ducts are individually strictly symmetric against their own symmetry axes, while all the ducts are aligned against common symmetry axis of the housing. That aggravates the production technology due to the increased manufacturing accuracy and requires precise thyristors mounting against the ducts.
  • Thyristor module for power control unit for operation electric boiler 2005-02-10
  • thyristor module for power unit of control over electric boiler operation is distinguished by perfect symmetry of thyristors installation at regular shape symmetric housing of the liquid direct flow cooling system for thyristors or symistors.
  • Objective of the Invention is to enhance fabricability, the ease of fabrication and exploitation for cooling systems of thyristor modules of the electrode heating boiler control units. Another task is to enhance the device design reliability, to prevent it from mechanical misalignment, to simplify the requirements to the assembling accuracy of the entire unit and the cooling system by following the recommended type of the housing design, as well as the type of thyristors arrangement against each other and the device housing. There are also tasks of repairability and endurance enhancement for the device, its life-span extension. Besides, the invention is meant to extend functionality, applicability and adjustability of the device, its possible product range and the intended use available options.
  • the invention enables to facilitate cooling performance of radiators of the power thyristor unit for water boilers control improving the convection conditions for circulating liquid and the recommended thyristors arrangement.
  • the objective of invention also encompasses the increase of efficient thyristors protection against heating both for static and dynamic operation mode.
  • the housing of liquid cooler is hollow - such, that the shape of counter of its longitudinal axial section inside is the shape of counter of its longitudinal axial section outside.
  • the inside longitudinal axial section counter of liquid cooler housing is arranged asymmetrically against the counter symmetry axes of its outer axial longitudinal section.
  • the housing of liquid cooler is plane-shaped, such that its inside lateral section counter shape is different from counter shape of its outer lateral section. Sides of the counter of the liquid cooler housing body cavity longitudinal section inside are not parallel to the sides of the counters of its lateral section outside.
  • the housing body cavity inside is made to the shape of an asymmetrical flattened cone.
  • the counter of longitudinal section inside the liquid cooler housing is made to the shape of a closed polygon.
  • the counter of longitudinal section inside the liquid cooler housing is made to the shape of an asymmetrical ellipse.
  • the liquid cooler housing inside is made to the shape of a Laval asymmetric nozzle.
  • the liquid cooler housing inside is made to the shape of a asymmetrical screw thread.
  • the counter longitudinal section inside the liquid cooler housing is made to the shape of a smooth closed curve.
  • the liquid cooler housing and its piping jumpers make an integral part of the piping.
  • the liquid cooler housing outside that has the thyristors mounted to it, is made to the shape of a flat outside face of the liquid cooler housing; thyristors are mounted to the flat outside face of the liquid cooler housing in such a way that heat absorbing surface of each is installed at a flat face with minimal clearance.
  • the flat face parts at the liquid cooler housing outside surface that exchange heat with absorbing surfaces of thyristors are made as smoothly as possible. Between flat face parts at the liquid cooler housing outside surface that exchange heat with absorbing surfaces of thyristors and the thyristors there are heat absorbing gaskets installed.
  • a flat face outside the liquid cooler housing surface is located at the housing side of the thinnest wall; the thyristors density at a flat face outside the liquid cooler housing surface is maximal for the segments of the thinnest wall of liquid cooler housing.
  • Figure 1 illustrates the drawing of the cooling channel longitudinal section and the installation diagram for semiconducting power elements. It provides an example of its inner counter asymmetry against the longitudinal and lateral axes of the housing longitudinal section, namely a conic shape. Thyristors are installed asymmetrically against lateral symmetry axis of the housing longitudinal section.
  • the cross section inner and outer counters do not match in shape, are asymmetrical against the symmetry axis of outer counter cross section housing.
  • the longitudinal section inner counter sides are not parallel to the sides of its outer counter.
  • Figure 2 illustrates the drawing of housing cross section for a round-shaped device in cross section, its longitudinal section corresponds to the Figure 1 and its ellipsoid-shaped body cavity is asymmetrically arranged in the housing cross section.
  • Figures 3 and 4 diagram the view in longitudinal and lateral sections, respectively, for the housing of the device externally round- shaped in its cross section.
  • the body cavity flares towards the cooling liquid flow direction.
  • the body cavity is asymmetrically arranged against the housing outer counter as shown at Figure 4 for the cross section.
  • the inner and outer counters cross section shapes differ qualitatively (an ellipsoid and a circle, see Figure 4). Neither side of inner counter of the longitudinal section is parallel to the outer counter sides, too.
  • Figure 5 diagrams the view of the device housing longitudinal section.
  • the body cavity tapers towards the cooling liquid flow direction.
  • the body cavity is also asymmetrically arranged against the housing outer counter and is not parallel to the housing outer counter as in the longitudinal section ( Figure 5), so in the cross section ( Figure 6).
  • the housing cross section is rectangular, cross section of body cavity is tetragonal, its shape does not conform to the outer counter of the housing cross section .
  • Figures 7, 8 diagram the view in longitudinal and lateral sections, respectively, for the housing of the device externally round-shaped in its cross section.
  • the body cavity has two tapers linked to the cylinder in between.
  • the body cavity cylinder is tilted about the housing.
  • the cross section of body cavity is elliptic-shaped, the shape is different from the outer counter circle shape.
  • Figures 9, 10 diagram the longitudinal section view for the housing of the device of tetragonal shape and rectangular shape in its cross section, respectively, thyristors attached to two different faces of the housing.
  • the body cavity cross section is similar to elliptic, its shape is adapted to thyristors disposition. Longitudinal sections of body cavity corresponds to Figure7, however there is a certain variation in relevant proportions.
  • Figures 11, 12 diagram the view of longitudinal and lateral sections, respectively, for the housing of the device of externally rectangular longitudinal section and round-shaped cross section.
  • the body cavity, in its lateral and longitudinal sections, is elliptic-shaped, and is asymmetrically arranged inside the housing in its lateral and longitudinal sections.
  • Figures 13, 14 diagram the view in longitudinal and lateral sections, respectively, for the housing of the device of external tetragonal longitudinal section with rounded end sides and multi-faceted housing cross section.
  • the body cavity is made to the shape similar to Laval asymmetrical nozzle in its longitudinal section, arranged asymmetrically against the housing outer counter longitudinal and lateral sections.
  • Figure 15, 16 diagram the view in longitudinal and lateral sections, respectively, for the housing of the device of externally multangular longitudinal section, the housing cross section is elliptic-shaped.
  • the body cavity is shaped similar to two successively installed and lengthwise- linked Laval nozzles, located asymmetrically against outer counter of the housing longitudinal section and mutually differing in their counter longitudinal section shape.
  • Figures 17, 18 diagram the view in longitudinal and lateral sections, respectively, for the most generic type device housing of external multangular longitudinal section and of rectangular lateral section, with its inner counter cavity shape in lateral and longitudinal sections designed as a random smooth closed curve.
  • Figures 19, 20 diagram the device of the most generic type cross section views featuring externally round-shaped housing cross section and its inner counter cavity shape in lateral section designed as a random smooth closed curve (Figure 19); the same for unspecified housing outer counter cross section shape - Figure 20.
  • Figures 21, 22 diagram the device housing rectangular longitudinal section and rectangular (in particular, quadratic) lateral section, respectively.
  • the projections of housing cross section are asymmetrical as shown at Figure 22 for the cross section.
  • the inner counter sides of the cavity in their longitudinal and cross section are not parallel to the housing outer counter sides.
  • Figures 23, 24 diagram the view of longitudinal and lateral sections, respectively, for the housing of the device of externally multangular shape in its longitudinal section and quadrangular (rhombic) in its lateral section. There are large triangular projections of longitudinal section of the housing at the inner surface of the cavity.
  • the cross section housing projections are asymmetrical as shown at Figure 22 for the cross section. Uneven and asymmetric disposition of the thyristors in longitudinal and cross sections is illustrated.
  • Figure 25, 26 diagram the view of longitudinal and lateral sections, respectively, for the housing of the device of externally multangular shape in its longitudinal section and quadrangular in its lateral section, the inner counter cavity shape in its cross section has a shape of zigzag line. There are large projections of longitudinal section of the housing at the inner surface of the cavity. Uneven and asymmetric disposition of the thyristors in longitudinal and cross sections is illustrated.
  • Figures 27, 28 diagram the view of longitudinal and lateral sections, respectively, for the housing of the device of multangular longitudinal section external counter, of elliptic-shaped outer counter of the housing cross section and round-shaped body cavity cross section.
  • Longitudinal sections of the housing has a shape of a polygon of two big zigzag line longitudinal sides with small triangular projections.
  • Figures 29, 30 diagram the view of longitudinal and lateral sections, respectively, for the housing of the device of external multangular longitudinal section and rectangular cross section, the inner counter cavity shape in its cross and lateral section has a shape of a random zigzag line.
  • Figures 31, 32 diagram the view of longitudinal and lateral sections, respectively, for the device of the most generic type featuring as its housing a rounded in its cross section piping of irregular generatrix as in its longitudinal, so in its lateral sections.
  • Figure 33 diagrams the cross section view for the device housing designed as a rectangular piping of external and internal irregular shape of the cross section counters; there is a layer of heat-conducting pasta between the piping face and the thyristors.
  • Figure 34 diagrams view of the cross section subtype of the housing of the device designed as a multifaceted piping in its cross section according to the Figure 31, its housing cross section inner counter is elliptic-shaped.
  • Figures 1-6 provide the view of longitudinal and lateral sections of the thyristors power unit cooling system housing according to the Option 1 of the embodiment of the utility invention in question. All the Figures hereinafter mark out with axial dotted lines the symmetry axes of lateral and longitudinal sections outer counters of the housing.
  • control power thyristors and symistors (1) of the device are mounted to the casing (2) of the device at the mounting plate (3), which is made as a part of the housing or is separated from it, in the case of the housing (2) design close to round-shaped.
  • the housing shape in its inner longitudinal axial section (4) at Figures 1, 2 differs from outer counter shape of its longitudinal axial section (5), as well as in its lateral section.
  • the inner counter could be shaped as a trapezoid (truncated cone of body cavity (6) cross section), which could be located in the longitudinal section asymmetrically against its longitudinal axis, Figure 1 , and asymmetrically against the symmetry axes of the rounded housing lateral section, Figure 2.
  • the coned shape of the body cavity (6) against its longitudinal section namely a trapezoid shape, and its position inside the housing (2), it is asymmetrical against lateral and longitudinal symmetry axis of the housing (2) cross section.
  • Thyristors (1) if their number is more than one, are mounted unevenly to the plate (3) grouping into clusters at a reduced thickness wall.
  • Figures 1-6 show various sub-options of the thyristors uneven installation. Besides, an intended combination of the housing (2) wall thickness reduction (2) at a specific site and uneven installation of the thyristors (1) is provided for. Misalignment of the counter shape of the inner (4) and outer (5) longitudinal axial section (2) for both inner (7) and outer (8) parts of the housing (2) cross section enables to simplify the manufacturing technology and reduce the requirements to the manufacturing accuracy. Non-parallelism of the sides of inner (4), (7) and outer (5), (8) counters of longitudinal and lateral sections, respectively, also contributes to the above.
  • the utility design also enables to allow for the housing longitudinal section longitudinal and later symmetry axes misalignment ( Figure 1 , 3, 5) and the misalignment of lateral section symmetry axes ( Figure 2, 4, 6). All of these improve convective properties of the heat exchange of the cooling liquid and mounting plate (3) and thyristors (1) and, unlike in common knowledge utilities, enables varying and programming the quantitative indices of the heat exchange.
  • the option for the thyristors uneven installation (1) into mounting plate (3) enables flexible adjustment of their location and the selection of the most appropriate mounting spots in terms of head- conducting.
  • the available inlet (9) and outlet (10) hoses connected to the housing (2) at its opposite side ends enable simple mounting of the device into flow-through piping of, for example, electric water boilers.
  • the Figures 5-6 depict the device sub-option of rectangular, in particular quadratic, cross section of the housing, that, in certain conditions, may simplify the manufacturing technology, the assembly, installation and reparability of the device, as well as to extend its fail-safe operational life-span due to the housing reasonable strengthening with thickened walls.
  • the body cavity (6) position against the outer counter (8) of lateral section, as well as of longitudinal section (5) could also symmetric and non-parallel (Figure 6). This simplifies manufacturing technology and reduces the requirements to the housing manufacturing accuracy, as well as enhance the housing durability and the device overall reliability, as long as that reduces the requirements to deformability of the housing under mechanical, chemical and heat impacts.
  • Figures 7-20 illustrate the view of longitudinal and lateral sections of the thyristors power unit cooling system housing according to the Option 2 of the embodiment of the utility invention.
  • the Figures 7-10 show drawing of the device of flaring body cavity (6) connected with its truncated cone (12) to the inlet (9) and outlet (10) hoses.
  • the cavity (6) design provides for an increased cross section against the piping, thereby enabling to increase the instant volume of the cooling liquid flowing in unit time, thereby improving the conditions for heat removal out of thyristors (1) and boost their operational efficiency, reliability and lifespan.
  • a cylindrical cavity (6) could also be located asymmetrically inside the housing (2) as in longitudinal, so in lateral sections, the cross section counter sides unparallel, thereby significantly simplifying the manufacturing technology, as long as reducing the requirements to the assembly accuracy.
  • the thyristors (1) mounting outside the housing (2) at the spots where the wall is least thick, thereby the heat removal conditions improve. Since the thyristors (1) are mounted to the plate (3), which makes an additional functionally strengthening element, durability of the housing (2) at such arrangement of the thyristors (1) does not drop, distributing more evenly through the cross section outer counter (8) compared to the case of the cavity (6) perfect symmetry. This facilitates operational lifespan extension, overall reliability of the device and its safe exploitation.
  • Figures 11-12 illustrate a sub-Option of the body cavity shape (6) close to elliptic in both longitudinal and lateral sections of the housing (2). Such a shape could be applied, for example, only in longitudinal section (4) or only in lateral section (7) or simultaneously in both of these.
  • the cavity (6) shape similar to elliptic also facilitates the improvement of cooling conditions by way of increasing the instant volume of cooling liquid supplied and, in the meantime, does not disrupt laminarity of a liquid flow in the piping. This reduces generation of slime deposits at the piping and the device housing inner walls.
  • the elliptic shape of inner cavity sections could be significantly asymmetrical, up to its proximity to Laval nozzle ( Figure 13, 14) or another hydrodynamic shape, including several successively linked Laval nozzles (for instance, two, as provided for with Figures 15, 16).
  • This enables to schedule the rate of a cooling liquid flow, to slow it down or speed it up in the area of heat absorption maximum immediately at the sites of the thyristors (1) mounting.
  • Such a solution significantly enhances the device functionality and its adaptability of use, thereby enabling its utilization in a wide range of refrigeration capacities and extending product range of the device samples.
  • the thyristors (1) could be mounted directly into one or several (for instance, two, as in Figure 10, 14) faces of the housing (2) without interim plate (3). This facilitates the housing simplification, increases its reliability and reduces its heat resistance from the thyristors to cooling liquid.
  • the same solution could be applied for the housing (2) cross section outer counter (8) of a rectangular shape ( Figure 14).
  • the body cavity (6) of the device in general case could have such a shape that the counters of longitudinal (4) and lateral (7) sections would make random smooth closed curves (Figure 17-20).
  • the outer counter in its longitudinal (5) and lateral (8) sections could be quadrangle (rectangle) (Figure 18), multangular (Figure 14), rounded ( Figure 8, 12, 19), or have a shape of a random closed counter ( Figure 20).
  • Any conjunction of the above in any combinations is possible, hence the functionality extends significantly, as well as applicability, operating conditions, options range, thus enabling to make adjustments specific to any individual case. That, unlike in the common knowledge devices, virtually without renewing the manufacturing technology enables at minimum expense to provide customization to any required conditions of use.
  • Figures 21-30 illustrate the view of longitudinal and lateral sections of the thyristors power unit cooling system housing according to the Option 3 of the embodiment of the utility invention.
  • Option 3 is distinguished from Options 1 and 2 by the following features.
  • inner counter (4) of the housing longitudinal section (2) differs in its shape from outer counter (5) of the housing longitudinal section (2), is not parallel to its sides and has a saw- toothed broken generatrix (Figure 21, 23, 25) with blunt angled tooth tips.
  • the teeth could be uneven and asymmetrical ( Figure 23).
  • the teeth disposition could align with thyristors (1) position, for instance, in such a way as to ensure there is a minimal wall thickness segment under each thyristor, thereby providing the efficiency increase for heat removal.
  • the cavity (6) inner counter shape (7) of the housing cross sections (2) may differ from the shape of outer counter (8) by proportion, angles at the tips ( Figure 22), surface disposition of the cross section ( Figure 24), or by more complicated shape deviations within the counter broken line, which has teeth of blunt angle at its tips.
  • Such a solution for the task specified enables to induce turbulence at laminary liquid flow of the piping at the housing segments right under the thyristors, thereby enabling better arrangement for mixing action in the running flow of liquid and enhancing the heat exchange.
  • the Figures 27, 28 illustrate the sub-Option when there are multiple small teeth at the counter (4) generatrix of the housing (2) cavity(6) cross section.
  • the teeth of longitudinal section counter (4) in the lateral section (7) in the very space of the body cavity (6) may make a threaded surface. That ensures, apart from the turbulization at the teeth, greater overall vorticity of the flow of the cooling liquid and, consequentially, in addition, its better mixing action, thereby further improving the cooling convective features.
  • this option contains inner counter (4) of the housing (2) body cavity (6) longitudinal section and the (2) inner counter of the housing (2) body cavity (6) lateral section (7) designed as individual broken lines or in any combinations of conjunction with other options. That enables, while retaining the turbulence modes for the liquid inside the housing (2) of the device, to compute and freely arrange to the case the map of their distribution across the space of the housing (2) body cavity (6). Such a feature enables to increase the heat exchange efficiency at any individual case of the utility embodiment corresponding to any specific quantitative characteristics of the conditions of use.
  • Figures 31-34 provide the view of longitudinal and lateral sections of the thyristors power unit cooling system housing according to the Option 4 of the embodiment of the utility invention.
  • the piping itself for example, of an electric water heating boiler, could be used as a device housing (2).
  • the thyristors (1) are mounted to its outer surface (14) via joint plate (3), which has a plate for the thyristors (1) installation; the joint plate (3), as a rule, has its smooth surfaces in the areas of direct contact with the thyristor (1) radiators.
  • the outer counter of the pipe (13) longitudinal section (14) is not aligned with the inner counter (15) of its longitudinal section ( Figure 31), thereby reducing the requirements to the manufacturing accuracy, simplifying, and reducing the price of, the device and its manufacturing technology. This is also facilitated by misalignment of the inner (16) and outer (17) counters of the pipe (13) cross section and their asymmetrical mutual disposition ( Figure 32-34).
  • the thyristors (1) could be mounted immediately into the outer surface (14) of the pipe (13).
  • the thyristors installation area at one or more face(s) of the pipes are implemented as smoothly as possible.
  • the smooth segments are available for treatment with heat-conducting paste (18) or the installation of heat-conducting gaskets for better contact of the pipe (13) outer surface with the thyristor (1) radiator and in order to ensure the heat- conducting resistance.
  • the heat-conducting paste application or the installation of heat-conducting gaskets under the thyristors could also be provided for in any embodiments of the utility.
  • the housing (2) of the device in case of following the 1-3 Options is integrated with inlet (9) and outlet (10) hoses into the main pipe of a flow-through piping.
  • inlet (9) and outlet (10) hoses into the main pipe of a flow-through piping are integrated with inlet (9) and outlet (10) hoses into the main pipe of a flow-through piping.
  • Such integration is the most efficient at the pipe string that has a minimal temperature of the flow running through it, for instance, the strings supplying cold water to the electric water heating boiler.
  • the efficient chilling out occurs, as the maximum permitted operational temperature of the thyristors range within 120° tol30° Celsius.
  • thyristors (1) are chilling out, is not used in vain, and actually restored and utilized, thereby in line with its main intended use of water heating, thus increasing the performance factor for the device.
  • the thyristors are arranged according to the Option 4 of the utility invention at any appropriate spot of the piping at its input line.
  • the water constantly flowing through inside the housing (2) and the pipe (13) segment, over which the thyristors (1) are installed, efficientely absorbs the heat, for its temperature is significantly lower of that of the thyristors (1), mounting plates (3), housing walls contacting, with good heat exchange rate, the plates (3) or immediately the thyristor (1) radiators.
  • the efficiency of this process increases to a considerable extent due to the embodiment of inner shape of the housing body cavity (6) according to the utility invention, as in the case of retaining laminarity of the cooling liquid flow, so in the case of a planned turbulization of the flow at the thyristors (1) mounting spots.
  • the setting of liquid flow current does not exceed the time for the thyristors warming-up, which, unlike in the common knowledge devices, is available to adjustment by changing the housing cross section and its body cavity shape; that enables, in line with the utility invention, to intentionally speed up or slow down the flow of a cooling liquid.
  • the flow turbulization prevents the slime deposits at walls of the casing and the piping, thereby contributes to the proper functioning of the device, eclectic water heating boilers, their life span extension and operational safety.

Abstract

The invention relates to heat technology, equipment and semiconductor devices for electric control and adjustment, power engineering and the heating by using electricity for the heating of a liquid, for example, water, steam generation, direct transformation of electric power into heat. Naturally the invention is meant for liquid cooling of power electric semiconductor devices of control and adjustment, in particular, for the cooling of semiconducting thyristors. Another task is to simplify the requirements to the assembling accuracy of the entire unit and the cooling system by following the recommended type of the housing design, as well as the type of thyristors arrangement against each other and the device housing. The invention enables convection conditions for circulating liquid for the recommended thyristors arrangement. Fig. 17 is a diagram of the embodiment 2, wherein the power thyristors or triacs (1) are set non-symmetrically and non- uniformly on the body (2) or on an interim plate (3). The body cavity (6) of the device in general case could have such a shape that the contours of longitudinal (4) and lateral (7) sections would make random smooth closed curves. There at the outer contour in its longitudinal (5) and lateral (8) sections could be a shape of a random closed contour.

Description

Power thyristor unit cooling system
FIELD OF THE INVENTION
The invention relates to heat technology, equipment and semiconductor devices for electric control and adjustment, power engineering and the heating by using electricity for the heating of a liquid, for example, water, steam generation, direct transformation of electric power into heat. Naturally the invention is meant for liquid cooling of power electric semiconductor devices of control and adjustment, in particular, for the cooling of semiconducting thyristors. This could be applied in the systems for control and adjustment of hot-water heating, self-regulated heaters of liquids, independent heating and hot water supply, mobile heating and hot water supply. Besides, it could be applied as a device for liquid cooling of various electric semiconducting power devices efficiently ensuring preset operation modes for control and adjustment components.
BACKGROUND OF THE INVENTION
It is a matter of common knowledge that a significant amount of heat disperses at electric power control components available in control and adjustment systems as semiconducting thyristors and symistors. The loss results from operating principle of those devices, as well as significant amperage and voltage for which those devices are used, for example in the condition of thermoelectric heating, in particular, in the electrode boilers of water heating. In the meantime, it is a matter of common knowledge that semiconducting devices, including thyristors and symistors, are highly sensitive to overheating and require efficient cooling systems. This is aggravated by the specific nature of their utilization in control and adjustment systems which apply these as AC controlled transistors. In addition, they are subjected to re-distribution of adjustable voltage drop with considerable current running through, which is exactly why these are subjected to considerable heat energy release, which must be eliminated.
The put forward invention is applied in control and adjustment systems of electric water heating boilers, however it as well could be applied in general as a component for liquid cooling system of any power semiconducting devices.
The most efficient is a liquid cooling of power semiconducting devices, especially in the systems of electric water heating boilers, which have already featured the functions of circulation of liquid flows as a solution for key issues. Utilization of such liquid flows for forced cooling of control and adjustment elements is quite expedient and promising.
General shortcomings of common knowledge cooling systems may include geometrical symmetry of the design for main cooling components used to supply a cooling liquid, geometric symmetry of thyristors and symistors disposition at heat eliminating surfaces. This to a significant extent reduces fabricability of the product and complicates the device in general due to thorough preparation and components high precision processing required in order to ensure such a symmetry. A precise alignment of cooling circuit inner counter of cross lateral and longitudinal sections to that of outer counter is inherent in virtually all common knowledge devices for cooling the semiconducting power devices. Apart from the above shortcomings, that facilitates poor features preventing the mounting spots for cooling devices from being customized with the view of enabling the selection of the most efficient heat release. In that connection, the common knowledge devices do not make use of all available options for boosting the heat elimination efficiency by way of adjusting all the interior shape of flow-through cooling elements. The set of those reasons cause the common knowledge devices insecurity as regards to the assembly inaccuracy and poor reliability in service when permanently affected by mechanical, chemical corrosion and thermal factors of symmetry disruption. In the meantime, such symmetry is functionless, does not influence the device operation and is not justified in terms of production costs associated with retention of the symmetry whatsoever. This also aggravates reparability of common knowledge devices, as any repair may affect symmetry. Besides, it is the type of installation symmetry for the semiconducting elements being cooled and the design symmetry for inner sections of cooling liquid channels and piping that aggravates the convection conditions thus aggravating heat release. This could be explained with inability to install semiconducting power elements into the spots of intensified heat release and inability of flexible adjustment of cross sections internal shapes of heat eliminating components with the view of heat elimination efficiency optimization.
Common knowledge devices could be classified into the following groups:
First group. Two-sided absorption of heat.
a) There are commonly known systems for semiconducting devices chilling out, including the thyristors of two-sided heat absorption and its recycling in the system of heat generation. The systems using no liquid are only applied for low capacities dispersed over semiconducting devices of low capacity. For instance, the following inventions are known:
Extra heat release at the other side of semiconducting device, with heat recycled at main radiator thus providing two-sided heat release. The same is EP2178117 (Al)— 2010-04-21 - Power semiconductor module with double side cooling. Also, US2003122242 (Al) — 2003-07-03 Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core, US2007108594 (Al)— 2007-05-17 Semiconductor apparatus, KR20120057330 (A) — 2012-06-05 - Semiconductor chip package.
WO2012143784 (A2) — 2012-10-26 - Semiconductor device and manufacturing method thereof— two-sided cooling of thyristor crystals. EP0046825 (Al)— 1982-03-10 - Method of producing an assembly of electrical elements clamped between cooling members, and assembly made by such method— thyristors tightly springily pressed to cooling elements in order to reduce heat resistance.
Parallel and symmetrical array of two-sided heat release out of the crystal of semiconducting device, its unit elastically compressed.
b) Liquid cooling is the most beneficial way to manage high voltages and amperages directly in the power circuits. Besides, where such a control is performed for the purposes of liquid heating and cooling, for example, in water heating electric boilers, the use of liquid flow for cooling capacious thyristors is the most beneficial, yet is the simplest way. RU2184998 (C2)— 2002-07-10 Wafer thyristor unit— two-sided water current cooling with main cooling channel designed as a flat pipe. The shortcoming for this case is a poor mechanical reliability of the design. The main flat piping is symmetric in its cross-section, which is to be precisely followed, thus this reduces fabricability of the device, complicates it and increases its production costs.
c) A combination of liquid coiling enhanced by air cooling, its actuation enabled with the energy of the running flow of liquid.
EP0582217 (Al)— 1994-02-09 - Liquid-cooled current rectifier module with a codant flow generated by a coolant pump - fan of extra ventilation duct driven by the running flow of liquid.
Or vice versa, WO2004031588 (Al)— 2004-04-15 - Arrangement and method for removing heat from a component which is to be cooled— cooling of the pump setting into motion the flow of liquid for thyristors cooling.
Second group. Thyristors cooling with a combination of directed flows of a chilling liquid.
a) DE4112677 (Al) — 1992-10-22 - Fluid-cooled electrical resistor esp. for GTO-thyristor switching - consists of coaxial tubes cooled by contra-flow of liquid over entire surface of resistive elements— parallel water cooling. Cooling ducts precise parallel and right angle disposition makes its shortcoming.
EP0099092B1— 1984-01-25— Series-parallel flow cooling apparatus — parallel-parallel thyristors cooling by way of their successive group disposition and simultaneous association of the groups by coolant flows. US4023616 (A) — 1977-05-17 — Thyristor cooling arrangement - successive parallel module of direct-flow liquid cooling of thyristors, the thyristors pressed to radiator ends.
US5043797 (A) - 1990-04-03 - Cooling header connection for a thyristor stack— alternation of thyristors liquid cooling components grouped into columns.
US2009284922 (Al) — 2009-11-19 — High-power thyristor module having cooling effect - System of direct-flow liquid cooling with interim oil filling into the space between heat exchanger and thyristors.
US4475152 (A)— 1984-10-02 - Water-cooled high voltage device - successively parallel thyristors cooling when cooling liquid supply pipes cross section is selected to provide optimal liquid flow rate.
FR2715773 (Al) — 1995-08-04 Liquid cooling device for electronic power component fixed to base in electric vehicles - successively parallel system of liquid cooling pipes.
CN1688086A — 2005-10-26 - Mechanical mounting structure for controllable series compensation thyristor valve - parallel and right angle disposition of liquid cooling thyristor pipes.
CN201156539 (Y)— 2008-11-26 - Radiator for DC power transmission thyristor converter valve component; CN201450002 (U)— 2010-05-05 - Radiator used for high-voltage direct current transmission thyristor converter valve component -Units for the liquid cooling of thyristors, ducts are right-angled and parallel.
b) KR20050034526 (A)— 2005-04-14 - Liquid cooling jacket - direct-flow liquid cooling disc ducts located in parallel.
CN201655786 (U)— 2010-11-24 Water-cooling radiator for high-power thyristor; CN101984507 (A)— 2011-03-09 - Novel water-cooled radiator for thyristor CN201229939 (Y) — 2009-04-29 - Ceramic casing of integral water-cooling heat radiation thyristor - Archimedean spiral type liquid radiators, their inner cross section replicates the outer cross section. CN101308826 (A) — 2008-11-19 Novel integrated water-cooling thyristor ceramic housing - Round ceramic housing of a round body cavity arranged in perfect symmetry.
c) KR200462248 (Yl)— 2012-09-04 - Water Register -liquid cooling cylindrical module, its chilling target installed within cylindrical housing.
KR20080053550 (A)— 2008-06- 16 Brake resistor for fuel cell vehicle - cylindrical round direct flow liquid cooler, its cavity is equally spaced within its housing and its outlet and inlet hoses are right-angled to the housing outer surface .
Third group. Plate plane liquid cooling radiator.
US4142231 (A)— 1979-02-27 - High current low voltage liquid cooled switching regulator DC power supply - thyristors are mounted to liquid cooling plane hollow plate.
US2009057882 (Al) (US7834448) — 2009-03-05 Fluid cooled semiconductor power module having double-sided cooling - cooled from within plane hollow plate, its thyristors are located within.
KR20060051066 (A)— 2006-05-19 - High power resistor - liquid direct- flow cooler designed as a plane plate.
KR20110046302 (A) — 2011-05-04 — ridged hollow plate, cooling liquid flowing through it, however, its outer housing exactly replicates its inner housing, that badly restricts options for of variation of the liquid flow at the spots requiring the cooling. Those variations are minimal and are restricted to the rounded angles of the corrugation only.
RU 74010 (M ) - 2008-06-10 - device to chill out semiconducting transistors is a plane hollow plate used as an electric lead.
Fourth group. Cooler housing design varies geometrically. Principal shortcomings include complexity and high production costs, its low reliability and repairability, poor functionality that disable to schedule the topology of heat flows allocation to specific tasks and specifically for each thyristor, restricted product range.
EP0930480 (A2) — 1999-07-21 - Heat exchanger— vesicular heat exchanger needs to be located over main pipeline in symmetric array.
EP0453763B1— 1991-10-30 - Compliant fluidic cooling hat - sloped inlet for cooling liquid (plastic).
KR20100085999 (A)— 2010-07-29 Iquid-cooled cooling device -sloped inlet for cooling liquid into parallel lines.
DE19921663 (Al)— 1999-12-16 - Cooling water supply unit for parts of electric welding installations— Hybrid plastic unit, its cylindrical duct arranged asymmetrically against the symmetry axes of longitudinal section, being, however, true to the shape of right-angled outer housing (plastic box).
US3361195 (A) 1968-01-02 - Heat sink member for a semiconductor device, CH461648 (A)— 1968-08-31 - Durch stromendes uhlmittel kuhlbare Kuhlanordnung, GB1135526 (A) — 1968-12-04 - Heat sink member for a semiconductor device, DE1639047 (Al)— 1971-01-21 - Durch stroemendes Kuehlmittel rueckgekuehlter Kuehlkoerper fuer Halbleiterbauelemente— a multitude of liquid cooling ducts in the housing of thyristor cooler, which cross section shape differs from the housing shape; however, these are equally spaced throughout the housing, with their sides parallel to the housing sides.
RU2093923 (Al)— 20.10.1997 Liquid-cooled group heat sink - panel heat exchanger of liquid cooling that contains a housing designed as a parallelepiped made of highly heat-conductive material, at which inner mutually crossing round ducts are installed, the thyristors to be cooled are mounted above. The round ducts are individually strictly symmetric against their own symmetry axes, while all the ducts are aligned against common symmetry axis of the housing. That aggravates the production technology due to the increased manufacturing accuracy and requires precise thyristors mounting against the ducts.
RU38999 (Ul)— 2004-07-10, RU39220 (Ul)— 2004-07-20, RU43997 (Ul) Thyristor module for power control unit for operation electric boiler — 2005-02-10 - thyristor module for power unit of control over electric boiler operation is distinguished by perfect symmetry of thyristors installation at regular shape symmetric housing of the liquid direct flow cooling system for thyristors or symistors.
CONCEPT OF THE INVENTION IN BRIEF
Objective of the Invention is to enhance fabricability, the ease of fabrication and exploitation for cooling systems of thyristor modules of the electrode heating boiler control units. Another task is to enhance the device design reliability, to prevent it from mechanical misalignment, to simplify the requirements to the assembling accuracy of the entire unit and the cooling system by following the recommended type of the housing design, as well as the type of thyristors arrangement against each other and the device housing. There are also tasks of repairability and endurance enhancement for the device, its life-span extension. Besides, the invention is meant to extend functionality, applicability and adjustability of the device, its possible product range and the intended use available options. Apart from that, the invention enables to facilitate cooling performance of radiators of the power thyristor unit for water boilers control improving the convection conditions for circulating liquid and the recommended thyristors arrangement. The objective of invention also encompasses the increase of efficient thyristors protection against heating both for static and dynamic operation mode.
There is also an objective of functional design adjustment range extension for the heat removal regulation without resetting design and size parameters.
For the tasks specified could be fulfilled there is at least one thyristor in the cooling system of thyristor power unit that also contains a liquid cooling housing, elements connecting liquid cooler to the pipe; the housing of liquid cooler is hollow - such, that the shape of counter of its longitudinal axial section inside is the shape of counter of its longitudinal axial section outside. The inside longitudinal axial section counter of liquid cooler housing is arranged asymmetrically against the counter symmetry axes of its outer axial longitudinal section. The housing of liquid cooler is plane-shaped, such that its inside lateral section counter shape is different from counter shape of its outer lateral section. Sides of the counter of the liquid cooler housing body cavity longitudinal section inside are not parallel to the sides of the counters of its lateral section outside. Sides of the counter of the liquid cooler housing body cavity lateral section inside are not parallel to the sides of the counters of its lateral section outside. Each element that connects housing to the piping has a hole for a liquid to flow, while a liquid cooler housing is connected to piping jumpers (the elements for its integration into piping) in such a way that links the hollow part of housing to the holes of housing jumpers. Besides, there are thyristors mounted to the outside of the liquid cooler housing, which are arranged asymmetrically and unevenly on the liquid cooler housing outside surface.
The housing body cavity inside is made to the shape of an asymmetrical flattened cone.
The counter of longitudinal section inside the liquid cooler housing is made to the shape of a closed polygon.
The counter of longitudinal section inside the liquid cooler housing is made to the shape of an asymmetrical ellipse.
The liquid cooler housing inside is made to the shape of a Laval asymmetric nozzle.
The liquid cooler housing inside is made to the shape of a asymmetrical screw thread.
The counter longitudinal section inside the liquid cooler housing is made to the shape of a smooth closed curve.
The liquid cooler housing and its piping jumpers make an integral part of the piping.
The liquid cooler housing outside that has the thyristors mounted to it, is made to the shape of a flat outside face of the liquid cooler housing; thyristors are mounted to the flat outside face of the liquid cooler housing in such a way that heat absorbing surface of each is installed at a flat face with minimal clearance.
The flat face parts at the liquid cooler housing outside surface that exchange heat with absorbing surfaces of thyristors, are made as smoothly as possible. Between flat face parts at the liquid cooler housing outside surface that exchange heat with absorbing surfaces of thyristors and the thyristors there are heat absorbing gaskets installed.
Between flat face parts at the liquid cooler housing outside surface that exchange heat with absorbing surfaces of thyristors and the thyristors there is a heat-conducting paste.
A flat face outside the liquid cooler housing surface is located at the housing side of the thinnest wall; the thyristors density at a flat face outside the liquid cooler housing surface is maximal for the segments of the thinnest wall of liquid cooler housing.
DRAWINGS BRIEF DESCRIPTION
Figure 1 illustrates the drawing of the cooling channel longitudinal section and the installation diagram for semiconducting power elements. It provides an example of its inner counter asymmetry against the longitudinal and lateral axes of the housing longitudinal section, namely a conic shape. Thyristors are installed asymmetrically against lateral symmetry axis of the housing longitudinal section. The cross section inner and outer counters do not match in shape, are asymmetrical against the symmetry axis of outer counter cross section housing. The longitudinal section inner counter sides are not parallel to the sides of its outer counter.
Figure 2 illustrates the drawing of housing cross section for a round-shaped device in cross section, its longitudinal section corresponds to the Figure 1 and its ellipsoid-shaped body cavity is asymmetrically arranged in the housing cross section.
Figures 3 and 4 diagram the view in longitudinal and lateral sections, respectively, for the housing of the device externally round- shaped in its cross section. The body cavity flares towards the cooling liquid flow direction. The body cavity is asymmetrically arranged against the housing outer counter as shown at Figure 4 for the cross section. The inner and outer counters cross section shapes differ qualitatively (an ellipsoid and a circle, see Figure 4). Neither side of inner counter of the longitudinal section is parallel to the outer counter sides, too.
Figure 5 diagrams the view of the device housing longitudinal section. The body cavity tapers towards the cooling liquid flow direction. The body cavity is also asymmetrically arranged against the housing outer counter and is not parallel to the housing outer counter as in the longitudinal section (Figure 5), so in the cross section (Figure 6). The housing cross section is rectangular, cross section of body cavity is tetragonal, its shape does not conform to the outer counter of the housing cross section .
Figures 7, 8 diagram the view in longitudinal and lateral sections, respectively, for the housing of the device externally round-shaped in its cross section. The body cavity has two tapers linked to the cylinder in between. The body cavity cylinder is tilted about the housing. The cross section of body cavity is elliptic-shaped, the shape is different from the outer counter circle shape.
Figures 9, 10 diagram the longitudinal section view for the housing of the device of tetragonal shape and rectangular shape in its cross section, respectively, thyristors attached to two different faces of the housing. The body cavity cross section is similar to elliptic, its shape is adapted to thyristors disposition. Longitudinal sections of body cavity corresponds to Figure7, however there is a certain variation in relevant proportions.
Figures 11, 12 diagram the view of longitudinal and lateral sections, respectively, for the housing of the device of externally rectangular longitudinal section and round-shaped cross section. The body cavity, in its lateral and longitudinal sections, is elliptic-shaped, and is asymmetrically arranged inside the housing in its lateral and longitudinal sections.
Figures 13, 14 diagram the view in longitudinal and lateral sections, respectively, for the housing of the device of external tetragonal longitudinal section with rounded end sides and multi-faceted housing cross section. The body cavity is made to the shape similar to Laval asymmetrical nozzle in its longitudinal section, arranged asymmetrically against the housing outer counter longitudinal and lateral sections.
Figure 15, 16 diagram the view in longitudinal and lateral sections, respectively, for the housing of the device of externally multangular longitudinal section, the housing cross section is elliptic-shaped. The body cavity is shaped similar to two successively installed and lengthwise- linked Laval nozzles, located asymmetrically against outer counter of the housing longitudinal section and mutually differing in their counter longitudinal section shape.
Figures 17, 18 diagram the view in longitudinal and lateral sections, respectively, for the most generic type device housing of external multangular longitudinal section and of rectangular lateral section, with its inner counter cavity shape in lateral and longitudinal sections designed as a random smooth closed curve.
Figures 19, 20 diagram the device of the most generic type cross section views featuring externally round-shaped housing cross section and its inner counter cavity shape in lateral section designed as a random smooth closed curve (Figure 19); the same for unspecified housing outer counter cross section shape - Figure 20.
Figures 21, 22 diagram the device housing rectangular longitudinal section and rectangular (in particular, quadratic) lateral section, respectively. There are large triangular projections of longitudinal section of the housing body cavity at the inner surface of the cavity, which , in its cross section, is of tetragonal (rhombic) shape different from the housing outer counter cross section. The projections of housing cross section are asymmetrical as shown at Figure 22 for the cross section. The inner counter sides of the cavity in their longitudinal and cross section are not parallel to the housing outer counter sides.
Figures 23, 24 diagram the view of longitudinal and lateral sections, respectively, for the housing of the device of externally multangular shape in its longitudinal section and quadrangular (rhombic) in its lateral section. There are large triangular projections of longitudinal section of the housing at the inner surface of the cavity. The cross section housing projections are asymmetrical as shown at Figure 22 for the cross section. Uneven and asymmetric disposition of the thyristors in longitudinal and cross sections is illustrated.
Figure 25, 26 diagram the view of longitudinal and lateral sections, respectively, for the housing of the device of externally multangular shape in its longitudinal section and quadrangular in its lateral section, the inner counter cavity shape in its cross section has a shape of zigzag line. There are large projections of longitudinal section of the housing at the inner surface of the cavity. Uneven and asymmetric disposition of the thyristors in longitudinal and cross sections is illustrated.
Figures 27, 28 diagram the view of longitudinal and lateral sections, respectively, for the housing of the device of multangular longitudinal section external counter, of elliptic-shaped outer counter of the housing cross section and round-shaped body cavity cross section. Longitudinal sections of the housing has a shape of a polygon of two big zigzag line longitudinal sides with small triangular projections. There is a screw thread in the cavity; the cavity is arranged asymmetrically against the longitudinal axis of the housing outer counter .
Figures 29, 30 diagram the view of longitudinal and lateral sections, respectively, for the housing of the device of external multangular longitudinal section and rectangular cross section, the inner counter cavity shape in its cross and lateral section has a shape of a random zigzag line.
Figures 31, 32 diagram the view of longitudinal and lateral sections, respectively, for the device of the most generic type featuring as its housing a rounded in its cross section piping of irregular generatrix as in its longitudinal, so in its lateral sections.
Figure 33 diagrams the cross section view for the device housing designed as a rectangular piping of external and internal irregular shape of the cross section counters; there is a layer of heat-conducting pasta between the piping face and the thyristors.
Figure 34 diagrams view of the cross section subtype of the housing of the device designed as a multifaceted piping in its cross section according to the Figure 31, its housing cross section inner counter is elliptic-shaped.
DESCRIPTION OF PREVAILING EMBODIMENTS OF THE UTILITY INVENTION
Option 1.
Figures 1-6 provide the view of longitudinal and lateral sections of the thyristors power unit cooling system housing according to the Option 1 of the embodiment of the utility invention in question. All the Figures hereinafter mark out with axial dotted lines the symmetry axes of lateral and longitudinal sections outer counters of the housing.
According to the Option 1 , the control power thyristors and symistors (1) of the device, at least one of these, are mounted to the casing (2) of the device at the mounting plate (3), which is made as a part of the housing or is separated from it, in the case of the housing (2) design close to round-shaped. The housing shape in its inner longitudinal axial section (4) at Figures 1, 2 differs from outer counter shape of its longitudinal axial section (5), as well as in its lateral section. Thereat in the simplest case, the inner counter could be shaped as a trapezoid (truncated cone of body cavity (6) cross section), which could be located in the longitudinal section asymmetrically against its longitudinal axis, Figure 1 , and asymmetrically against the symmetry axes of the rounded housing lateral section, Figure 2. In such a case, due to the coned shape of the body cavity (6) against its longitudinal section, namely a trapezoid shape, and its position inside the housing (2), it is asymmetrical against lateral and longitudinal symmetry axis of the housing (2) cross section. Thyristors (1), if their number is more than one, are mounted unevenly to the plate (3) grouping into clusters at a reduced thickness wall. Figures 1-6 show various sub-options of the thyristors uneven installation. Besides, an intended combination of the housing (2) wall thickness reduction (2) at a specific site and uneven installation of the thyristors (1) is provided for. Misalignment of the counter shape of the inner (4) and outer (5) longitudinal axial section (2) for both inner (7) and outer (8) parts of the housing (2) cross section enables to simplify the manufacturing technology and reduce the requirements to the manufacturing accuracy. Non-parallelism of the sides of inner (4), (7) and outer (5), (8) counters of longitudinal and lateral sections, respectively, also contributes to the above. The utility design also enables to allow for the housing longitudinal section longitudinal and later symmetry axes misalignment (Figure 1 , 3, 5) and the misalignment of lateral section symmetry axes (Figure 2, 4, 6). All of these improve convective properties of the heat exchange of the cooling liquid and mounting plate (3) and thyristors (1) and, unlike in common knowledge utilities, enables varying and programming the quantitative indices of the heat exchange. The option for the thyristors uneven installation (1) into mounting plate (3) enables flexible adjustment of their location and the selection of the most appropriate mounting spots in terms of head- conducting. The available inlet (9) and outlet (10) hoses connected to the housing (2) at its opposite side ends enable simple mounting of the device into flow-through piping of, for example, electric water boilers. The available feature of mounting the device into piping increasing (Figure 3) or decreasing (Figure 4) the cavity tapering (6) along the flow (11) of a cooling liquid enable to adjust the device to the current flow rate, schedule its speeding up and slowing down, thereby enhancing its cooling feature.
The Figures 5-6 depict the device sub-option of rectangular, in particular quadratic, cross section of the housing, that, in certain conditions, may simplify the manufacturing technology, the assembly, installation and reparability of the device, as well as to extend its fail-safe operational life-span due to the housing reasonable strengthening with thickened walls. The body cavity (6) position against the outer counter (8) of lateral section, as well as of longitudinal section (5) could also symmetric and non-parallel (Figure 6). This simplifies manufacturing technology and reduces the requirements to the housing manufacturing accuracy, as well as enhance the housing durability and the device overall reliability, as long as that reduces the requirements to deformability of the housing under mechanical, chemical and heat impacts.
Option 2.
Figures 7-20 illustrate the view of longitudinal and lateral sections of the thyristors power unit cooling system housing according to the Option 2 of the embodiment of the utility invention.
The Figures 7-10 show drawing of the device of flaring body cavity (6) connected with its truncated cone (12) to the inlet (9) and outlet (10) hoses. The cavity (6) design provides for an increased cross section against the piping, thereby enabling to increase the instant volume of the cooling liquid flowing in unit time, thereby improving the conditions for heat removal out of thyristors (1) and boost their operational efficiency, reliability and lifespan. A cylindrical cavity (6) could also be located asymmetrically inside the housing (2) as in longitudinal, so in lateral sections, the cross section counter sides unparallel, thereby significantly simplifying the manufacturing technology, as long as reducing the requirements to the assembly accuracy. That also enable the thyristors (1) mounting outside the housing (2) at the spots where the wall is least thick, thereby the heat removal conditions improve. Since the thyristors (1) are mounted to the plate (3), which makes an additional functionally strengthening element, durability of the housing (2) at such arrangement of the thyristors (1) does not drop, distributing more evenly through the cross section outer counter (8) compared to the case of the cavity (6) perfect symmetry. This facilitates operational lifespan extension, overall reliability of the device and its safe exploitation.
Figures 11-12 illustrate a sub-Option of the body cavity shape (6) close to elliptic in both longitudinal and lateral sections of the housing (2). Such a shape could be applied, for example, only in longitudinal section (4) or only in lateral section (7) or simultaneously in both of these. The cavity (6) shape similar to elliptic also facilitates the improvement of cooling conditions by way of increasing the instant volume of cooling liquid supplied and, in the meantime, does not disrupt laminarity of a liquid flow in the piping. This reduces generation of slime deposits at the piping and the device housing inner walls. The elliptic shape of inner cavity sections could be significantly asymmetrical, up to its proximity to Laval nozzle (Figure 13, 14) or another hydrodynamic shape, including several successively linked Laval nozzles (for instance, two, as provided for with Figures 15, 16). This enables to schedule the rate of a cooling liquid flow, to slow it down or speed it up in the area of heat absorption maximum immediately at the sites of the thyristors (1) mounting. Such a solution significantly enhances the device functionality and its adaptability of use, thereby enabling its utilization in a wide range of refrigeration capacities and extending product range of the device samples.
Where the outer counter casing (2) is rectangular in its cross section (8) as in Figures 10, 14, 18, the thyristors (1) could be mounted directly into one or several (for instance, two, as in Figure 10, 14) faces of the housing (2) without interim plate (3). This facilitates the housing simplification, increases its reliability and reduces its heat resistance from the thyristors to cooling liquid. The same solution could be applied for the housing (2) cross section outer counter (8) of a rectangular shape (Figure 14).
The body cavity (6) of the device in general case could have such a shape that the counters of longitudinal (4) and lateral (7) sections would make random smooth closed curves (Figure 17-20). Thereat the outer counter in its longitudinal (5) and lateral (8) sections could be quadrangle (rectangle) (Figure 18), multangular (Figure 14), rounded (Figure 8, 12, 19), or have a shape of a random closed counter (Figure 20). Any conjunction of the above in any combinations is possible, hence the functionality extends significantly, as well as applicability, operating conditions, options range, thus enabling to make adjustments specific to any individual case. That, unlike in the common knowledge devices, virtually without renewing the manufacturing technology enables at minimum expense to provide customization to any required conditions of use.
Option 3.
Figures 21-30 illustrate the view of longitudinal and lateral sections of the thyristors power unit cooling system housing according to the Option 3 of the embodiment of the utility invention. Option 3 is distinguished from Options 1 and 2 by the following features. According to the Option 3, inner counter (4) of the housing longitudinal section (2) differs in its shape from outer counter (5) of the housing longitudinal section (2), is not parallel to its sides and has a saw- toothed broken generatrix (Figure 21, 23, 25) with blunt angled tooth tips. The teeth could be uneven and asymmetrical (Figure 23). The teeth disposition could align with thyristors (1) position, for instance, in such a way as to ensure there is a minimal wall thickness segment under each thyristor, thereby providing the efficiency increase for heat removal. The cavity (6) inner counter shape (7) of the housing cross sections (2) may differ from the shape of outer counter (8) by proportion, angles at the tips (Figure 22), surface disposition of the cross section (Figure 24), or by more complicated shape deviations within the counter broken line, which has teeth of blunt angle at its tips. Such a solution for the task specified enables to induce turbulence at laminary liquid flow of the piping at the housing segments right under the thyristors, thereby enabling better arrangement for mixing action in the running flow of liquid and enhancing the heat exchange.
The Figures 27, 28 illustrate the sub-Option when there are multiple small teeth at the counter (4) generatrix of the housing (2) cavity(6) cross section. In such a case, the teeth of longitudinal section counter (4) in the lateral section (7) in the very space of the body cavity (6) may make a threaded surface. That ensures, apart from the turbulization at the teeth, greater overall vorticity of the flow of the cooling liquid and, consequentially, in addition, its better mixing action, thereby further improving the cooling convective features.
In the most generic case (Figures 29, 30) this option contains inner counter (4) of the housing (2) body cavity (6) longitudinal section and the (2) inner counter of the housing (2) body cavity (6) lateral section (7) designed as individual broken lines or in any combinations of conjunction with other options. That enables, while retaining the turbulence modes for the liquid inside the housing (2) of the device, to compute and freely arrange to the case the map of their distribution across the space of the housing (2) body cavity (6). Such a feature enables to increase the heat exchange efficiency at any individual case of the utility embodiment corresponding to any specific quantitative characteristics of the conditions of use.
Option 4.
Figures 31-34 provide the view of longitudinal and lateral sections of the thyristors power unit cooling system housing according to the Option 4 of the embodiment of the utility invention.
In such a case, the piping itself, for example, of an electric water heating boiler, could be used as a device housing (2). Thereat in the case of the pipe rounded cross section (13), the thyristors (1) are mounted to its outer surface (14) via joint plate (3), which has a plate for the thyristors (1) installation; the joint plate (3), as a rule, has its smooth surfaces in the areas of direct contact with the thyristor (1) radiators. Such a solution significantly simplify the entire device compared to all the common knowledge counterparts, as well as its instillation and repairability. The outer counter of the pipe (13) longitudinal section (14) is not aligned with the inner counter (15) of its longitudinal section (Figure 31), thereby reducing the requirements to the manufacturing accuracy, simplifying, and reducing the price of, the device and its manufacturing technology. This is also facilitated by misalignment of the inner (16) and outer (17) counters of the pipe (13) cross section and their asymmetrical mutual disposition (Figure 32-34).
In case of the pipe (13) cross section similar to a quadrangle (Figure 33) or its multifaceted cross section (Figure 34), the thyristors (1) could be mounted immediately into the outer surface (14) of the pipe (13). For this purpose, the thyristors installation area at one or more face(s) of the pipes are implemented as smoothly as possible. Besides, the smooth segments are available for treatment with heat-conducting paste (18) or the installation of heat-conducting gaskets for better contact of the pipe (13) outer surface with the thyristor (1) radiator and in order to ensure the heat- conducting resistance. The heat-conducting paste application or the installation of heat-conducting gaskets under the thyristors could also be provided for in any embodiments of the utility.
The operation of the power thyristor unit cooling system in all the options consist of the following.
The housing (2) of the device in case of following the 1-3 Options is integrated with inlet (9) and outlet (10) hoses into the main pipe of a flow-through piping. Such integration is the most efficient at the pipe string that has a minimal temperature of the flow running through it, for instance, the strings supplying cold water to the electric water heating boiler. In that case the efficient chilling out occurs, as the maximum permitted operational temperature of the thyristors range within 120° tol30° Celsius.
In any case, such schemes of integration are preferred, especially where the device for water heating is applied, because only some portion of a heat power intended for recycling as the control devices, thyristors (1), are chilling out, is not used in vain, and actually restored and utilized, thereby in line with its main intended use of water heating, thus increasing the performance factor for the device. In the case of housing (2) embodiment as a part of main pipe (13) of the boiler, the thyristors are arranged according to the Option 4 of the utility invention at any appropriate spot of the piping at its input line. The water constantly flowing through inside the housing (2) and the pipe (13) segment, over which the thyristors (1) are installed, efficientely absorbs the heat, for its temperature is significantly lower of that of the thyristors (1), mounting plates (3), housing walls contacting, with good heat exchange rate, the plates (3) or immediately the thyristor (1) radiators. The efficiency of this process increases to a considerable extent due to the embodiment of inner shape of the housing body cavity (6) according to the utility invention, as in the case of retaining laminarity of the cooling liquid flow, so in the case of a planned turbulization of the flow at the thyristors (1) mounting spots. In the dynamic modes of switching the boiler on/off, the setting of liquid flow current does not exceed the time for the thyristors warming-up, which, unlike in the common knowledge devices, is available to adjustment by changing the housing cross section and its body cavity shape; that enables, in line with the utility invention, to intentionally speed up or slow down the flow of a cooling liquid. Besides, the flow turbulization prevents the slime deposits at walls of the casing and the piping, thereby contributes to the proper functioning of the device, eclectic water heating boilers, their life span extension and operational safety.

Claims

1. Power thyristor unit cooling system comprising:
a) a liquid cooling housing;
b) elements connecting liquid cooler to the pipe;
c) there is at least one thyristor,
wherein the housing of liquid cooler is hollow - such, that the shape of counter of its longitudinal axial section inside is the shape of counter of its longitudinal axial section outside; wherein the inside longitudinal axial section counter of liquid cooler housing is arranged asymmetrically against the counter symmetry axes of its outer axial longitudinal section; wherein the housing of liquid cooler is plane-shaped, such that its inside lateral section counter shape is different from counter shape of its outer lateral section; wherein the inside contour of the cross section of the body of liquid cooler is located asymmetrically relative to the symmetry axes of the outer contour of its cross-sectional; wherein sides of the counter of the liquid cooler housing body cavity longitudinal section inside are not parallel to the sides of the counters of its lateral section outside; wherein sides of the counter of the liquid cooler housing body cavity lateral section inside are not parallel to the sides of the counters of its lateral section outside; wherein each element that connects housing to the piping has a hole for a liquid to flow, while a liquid cooler housing is connected to piping jumpers (the elements for its integration into piping) in such a way that links the hollow part of housing to the holes of housing jumpers; wherein besides, there are thyristors mounted to the outside of the liquid cooler housing, which are arranged asymmetrically and unevenly on the liquid cooler housing outside surface.
2. Power thyristor unit cooling system according to claim 1, wherein: the housing body cavity inside is made to the shape of an asymmetrical flattened cone.
3. Power thyristor unit cooling system according to claim 1 , wherein: the counter of longitudinal section inside the liquid cooler housing is made to the shape of a closed polygon.
4. Power thyristor unit cooling system according to claim 1, wherein: the counter of longitudinal section inside the liquid cooler housing is made to the shape of an asymmetrical ellipse.
5. Power thyristor unit cooling system according to claim 1, wherein: the liquid cooler housing inside is made to the shape of a Laval asymmetric nozzle.
6. Power thyristor unit cooling system according to claim 1, wherein: the liquid cooler housing inside is made to the shape of a asymmetrical screw thread.
7. Power thyristor unit cooling system according to claim 1 , wherein: the counter longitudinal section inside the liquid cooler housing is made to the shape of a smooth closed curve.
8. Power thyristor unit cooling system according to claim 1 , wherein: the liquid cooler housing and its piping jumpers make an integral part of the piping.
9. Power thyristor unit cooling system according to claim 1, wherein:
a) the liquid cooler housing outside that has the thyristors mounted to it, is made to the shape of a flat outside face of the liquid cooler housing;
b) thyristors are mounted to the flat outside face of the liquid cooler housing in such a way that heat absorbing surface of each is installed at a flat face with minimal clearance.
10. Power thyristor unit cooling system according to claim 9, wherein: the flat face parts at the liquid cooler housing outside surface that exchange heat with absorbing surfaces of thyristors, are made as smoothly as possible.
11. Power thyristor unit cooling system according to claim 9, wherein: between flat face parts at the liquid cooler housing outside surface that exchange heat with absorbing surfaces of thyristors and the thyristors there are heat absorbing gaskets installed.
12. Power thyristor unit cooling system according to claim 9, wherein: between flat face parts at the liquid cooler housing outside surface that exchange heat with absorbing surfaces of thyristors and the thyristors there is a heat-conducting paste.
13. Power thyristor unit cooling system according to claim 9, wherein: a) a flat face outside the liquid cooler housing surface is located at the housing side of the thinnest wall;
b) the thyristors density at a flat face outside the liquid cooler housing surface is maximal for the segments of the thinnest wall of liquid cooler housing.
PCT/IB2013/001292 2013-04-24 2013-04-24 Power thyristor unit cooling system WO2014174336A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/IB2013/001292 WO2014174336A1 (en) 2013-04-24 2013-04-24 Power thyristor unit cooling system
KR1020157008281A KR101551874B1 (en) 2013-04-24 2013-04-24 Power thyristor unit cooling system
CN201380063026.4A CN104823279B (en) 2013-04-24 2013-04-24 Power scr unit cooling system
IN2629DEN2015 IN2015DN02629A (en) 2013-04-24 2015-03-31
HK16101422.8A HK1213691A1 (en) 2013-04-24 2016-02-05 Power thyristor unit cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2013/001292 WO2014174336A1 (en) 2013-04-24 2013-04-24 Power thyristor unit cooling system

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CN (1) CN104823279B (en)
HK (1) HK1213691A1 (en)
IN (1) IN2015DN02629A (en)
WO (1) WO2014174336A1 (en)

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JP2019129238A (en) * 2018-01-25 2019-08-01 三菱電機株式会社 Heat sink and semiconductor module

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KR102473908B1 (en) * 2021-12-03 2022-12-06 네덱 주식회사 Casting product for cooling heating element and manufacturing method for the same

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DE1639047A1 (en) * 1966-09-23 1971-01-21 Westinghouse Electric Corp Cooling element for semiconductor components, cooled back by flowing coolant
US5453911A (en) * 1994-02-17 1995-09-26 General Motors Corporation Device for cooling power electronics
US5719444A (en) * 1996-04-26 1998-02-17 Tilton; Charles L. Packaging and cooling system for power semi-conductor
WO1999014807A1 (en) * 1997-09-17 1999-03-25 Advanced Energy's Voorhees Operations Cooling module for electronic components

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IN2015DN02629A (en) 2015-06-05
KR20150041187A (en) 2015-04-15
KR101551874B1 (en) 2015-09-18
HK1213691A1 (en) 2016-07-08
CN104823279B (en) 2017-09-08

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