201217736 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種使用冷卻流體之散熱模組，尤其是 指一種利用一流阻部使入口管路在進入腔體時流道變小， 用來提高散熱裝置之前的流阻，使該冷卻流體得以均勻地 流經該散熱裝置。 【先前技術】 伺服器等大型電腦設備運作時，散熱不良而使設備故 障之問題’係為目前各界亟欲解決之議題，除此之外，以 典型資料中心的伺服器在運算所使用的電力為例，通常散 熱系統需要消耗相當於一倍的電力，因此當飼服器高密度 集中於雲端資料中心，機房甚至需要高達兩倍的額外散熱 系統。由此可見，雲端高密度伺服器若未妥善處理散熱問 題，將造成伺服器工作不穩定甚至無法運轉、耗費能源、 機房無法維持維運品質、增加機房管理成本等議題。 ,在處理散熱的方式中，使用液態冷卻流體熱交換室即 為習知的一種作法，一般習知之液態冷卻流體熱交換室， 係利用冷卻流m後，流經其巾的散熱裝置，進行熱 換來將熱量帶走，以此降低系統熱量。但當冷卻流體i入 習知之液態冷卻流體熱交換室時，由於冷卻流體流速較 快，冷卻流體往往集中在液態冷卻流體熱交換室之 中央部份，而非均勾流經整個液態冷卻流體熱交 狀況使得㈣冷卻流體熱交換室巾的散熱法完 201217736 使用，而造成散熱效率較低的情形。 因此目前亟需一種可使該冷卻流體於熱交換室内均勻 分佈之液態冷卻流體熱交換室來解決習用技術所產生之問 題。 【發明内容】 本發明係為一種液態冷卻流體熱交換室，其係利用一 流阻部來增加流阻，使該冷卻流體於該容置空間内能均勻 分佈。 本發明提供一種液態冷卻流體熱交換室，其係包含： 一殼體，具有一腔體，該殼體包含一入口管路及一出口管 路，該入口管路用以提供一冷卻流體進入該腔體，該出口 管路用以提供該冷卻流體流出該腔體，該冷卻流體沿一流 動方向流經該腔體；一散熱裝置，其係設置於該腔體；以 及一流-阻部，該流阻部設置於於該腔體中靠近該入口管路 處，即該流阻部設置在該散熱裝置與該入口管路之間，該 流阻部使該入口管路在進入腔體時流道變小，用來提高散 熱裝置之前的流阻，使該冷卻流體得以均勻地流經該散熱 裝置。 【實施方式】 為使貴審查委員能對本發明之特徵、目的及功能有 更進一步的認知與瞭解，下文特將本發明之系統的相關細 部結構以及設計的理念原由進行說明，以使得審查委員可 以了解本發明之特點，詳細說明陳述如下： 201217736 本發呀提供一種液態冷卻流體熱交換室，請參閱圖 一，圖一係為本發明之液態冷卻流體熱交換室之側視示意 圖’圖二A係為本發明之第一實施例之流阻部示意圖。該 液態冷卻流體熱交換室，其係包含：一殼體1、一散熱裝 置2以及一流阻部3 ’該殼體1具有一腔體1〇，該殼體1 " 包含一入口管路11及一出口管路12，該入口管路11用以 提供一冷卻流體0進入該腔體10，該出口管路12用以提 供該冷卻流體0流出該腔體10，本實施例中，該出口管路 % 12-之口徑大於該入口管路11之口徑，以避免過多氣體積 壓在該腔體10内，進而提高該腔體1〇内的壓力，以及冷 卻流體0的沸點’而減弱散熱效果的狀況，該冷卻流體〇 沿一流動方向0 0流經該腔體10 ;該散熱裝置2設置於該 腔體10 ;該流阻部3設置於於該腔體10中靠近該入口管 路11處’即該流阻部3設置在該散熱裝置與該入口管路之 間，該流阻部3為一凸起結構，該流阻部3使該入口管路 ’ 11在進入腔體10時流道變小，用來提高散熱裝置2之前 •鲁的流阻’使該冷卻流體〇得以均勻地流經該散熱裝置2。 圖二B係為本發明之第二實施例之流阻部示意圖，圖 一 C係為本發明之第一貫施例之流阻部俯視局部示意圖， 該流阻部3包含複數個凸部30，該流阻部3使該入口管路 11在進入腔體10時流道變小，用來提高流阻，使該冷卻 流體0得以均勻地流經該散熱裝置2。每一凸部3〇兩側分 別具有一第一斜面300以及一第二斜面301」使得相鄰之 該凸部30間藉由相對應的第一斜面300形成—漸縮流道 302以及藉由相對應的第二斜面301形成一漸開流道3〇3， 201217736 门之則的流阻，但凸部30之形狀不以上述為限。 僅土物^例與第二實施例之差異在於’第-實施例中 二的目II3的凸起結構造成流道的縮減，來達到流阻 』一舟择二效果’而第二實施例中該漸縮流道302可以 今、*你阻’同時5亥漸開流道更可在冷卻流體已經均 勻 佈母個流道後，導引流向而加快流速。 广杜^外於第—以及第二實施例中，該殼體1更包含-二底件13與一發熱源4熱接觸，該發熱源4之 1、=、錢件13之熱接觸而傳至該液態冷卻流體熱 乂、至’该發熱源可是中央處理單元或是晶片模組，但不 =^為限，且該散熱裝置2亦與該底件13熱接觸，而將 熱1傳到該散熱裝置2。本發财，該流阻部3可設於該 容置空間内且於該底件13之上，亦可於該容置空間内且於 该殼體之頂面向下設置，該流阻部3之形狀與設置的方向 及位置皆不以上述為限。 本發明之液態冷卻济L體熱交換室係在腔體1〇中靠近 ，入口管路11處設置流阻部3以形成流道面積小於該入口 g路11之截面積’使冷卻流體〇在流經散熱裝置2之前時 可減慢該冷卻韻G的速度，該冷卻流體Q得以於該腔體 10中分佈均勻’或是更進-步地調整障礙物形狀來增加流 阻丄以加_流阻部的效果，❹本發明之㈣冷卻流體 熱交換室，可使該冷卻流體得以均勻地流經該散熱裝置， 提升散熱效率。 唯以上所述者，僅為本發明-之較佳實施例，當不能以 201217736 之限制本發明範圍。即大凡依本發明申請專利範圍所做之 均等變化及修飾，仍將不失本發明之要義所在，故都應視 為本發明的進一步實施狀況。 201217736 【圖式簡單說明】 圖一係為本發明之液態冷卻流體熱交換室之側視示意圖。 圖二A係為本發明之流阻之第一實施例示意圖。 圖二B係為本發明之流阻之第二實施例示意圖。 圖二C係為本發明之流阻之第二實施例之俯視局部示意 圖。. 【主要元件符號說明】 0- 冷卻流體 00-流動方向 1- 殼體 10- 腔體 11- 入口管路 12- 出口管路 13- 底件 2- 散熱裝置 20- 板體 21- 散熱鰭片 3- 流阻部 30-凸部 300- 第一斜面 301- 第二斜面 302- 漸縮流道 201217736 303-漸開流道 4-發熱源201217736 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module using a cooling fluid, and more particularly to a method for improving the flow path of an inlet pipe into a cavity by using a first-class resistance portion for improving The flow resistance before the heat sink allows the cooling fluid to flow uniformly through the heat sink. [Prior Art] When a large computer device such as a server is operating, the problem of poor heat dissipation and equipment failure is a problem that is currently being solved by all walks of life. In addition, the power used by the server in the typical data center is calculated. For example, a cooling system typically consumes twice as much power, so when the server is densely concentrated in the cloud data center, the room can even require up to twice as much additional cooling system. It can be seen that if the cloud high-density server fails to properly handle the heat-dissipation problem, it will cause the server to work unstable or even unable to operate, consume energy, the machine room can not maintain the quality of maintenance, and increase the management cost of the equipment room. In the way of dissipating heat, the use of a liquid cooling fluid heat exchange chamber is a conventional method. The conventional liquid cooling fluid heat exchange chamber uses a cooling flow m to flow through the heat dissipating device of the towel to perform heat. In exchange for taking heat away, the system heat is reduced. However, when the cooling fluid i is introduced into the conventional liquid cooling fluid heat exchange chamber, the cooling fluid tends to concentrate in the central portion of the liquid cooling fluid heat exchange chamber due to the faster cooling fluid flow rate, rather than the uniform flow through the entire liquid cooling fluid heat. The state of intersection makes (4) the heat dissipation method of the cooling fluid heat exchange room towel is used in 201217736, resulting in a low heat dissipation efficiency. Therefore, there is a need for a liquid cooling fluid heat exchange chamber that allows the cooling fluid to be evenly distributed within the heat exchange chamber to solve the problems associated with conventional techniques. SUMMARY OF THE INVENTION The present invention is a liquid cooling fluid heat exchange chamber that utilizes a flow resistance portion to increase flow resistance so that the cooling fluid can be evenly distributed in the accommodating space. The present invention provides a liquid cooling fluid heat exchange chamber comprising: a housing having a cavity, the housing including an inlet conduit and an outlet conduit for providing a cooling fluid into the chamber a cavity for providing the cooling fluid to flow out of the cavity, the cooling fluid flowing through the cavity in a flow direction; a heat dissipating device disposed in the cavity; and a first-class resistance portion The flow resistance portion is disposed in the cavity near the inlet pipe, that is, the flow resistance portion is disposed between the heat dissipation device and the inlet pipe, and the flow resistance portion makes the inlet pipe flow channel when entering the cavity The smaller, used to increase the flow resistance before the heat sink, so that the cooling fluid can flow uniformly through the heat sink. [Embodiment] In order to enable the reviewing committee to have a further understanding and understanding of the features, objects and functions of the present invention, the detailed structure of the system of the present invention and the concept of the design are explained below so that the reviewing committee can Understand the characteristics of the present invention, the detailed description is as follows: 201217736 The present invention provides a liquid cooling fluid heat exchange chamber, please refer to Figure 1, Figure 1 is a side view of the liquid cooling fluid heat exchange chamber of the present invention 'Figure 2A It is a schematic diagram of the flow resistance portion of the first embodiment of the present invention. The liquid cooling fluid heat exchange chamber comprises: a casing 1, a heat sink 2, and a first-class resistor 3'. The casing 1 has a cavity 1 quot including an inlet line 11 And an outlet line 12 for providing a cooling fluid 0 into the chamber 10, the outlet line 12 for providing the cooling fluid 0 to flow out of the chamber 10, in the embodiment, the outlet The diameter of the pipe % 12- is larger than the diameter of the inlet pipe 11 to avoid excessive gas volume pressure in the cavity 10, thereby increasing the pressure in the cavity 1 and the boiling point of the cooling fluid 0 to reduce the heat dissipation effect. The cooling fluid 流 flows through the cavity 10 along a flow direction 0 0 ; the heat sink 2 is disposed in the cavity 10; the flow resistance portion 3 is disposed in the cavity 10 near the inlet pipe 11 The flow resistance portion 3 is disposed between the heat dissipation device and the inlet pipe. The flow resistance portion 3 is a convex structure, and the flow resistance portion 3 causes the inlet pipe '11 to flow when entering the cavity 10. The passage becomes smaller and is used to increase the flow resistance of the heat sink 2 before the cooling fluid 〇 Through the heat sink 2. 2B is a schematic view of a flow resistance portion according to a second embodiment of the present invention, and FIG. 1C is a top plan view showing a flow resistance portion of the first embodiment of the present invention, the flow resistance portion 3 including a plurality of convex portions 30 The flow resistance portion 3 reduces the flow path of the inlet pipe 11 when entering the cavity 10 for increasing the flow resistance so that the cooling fluid 0 can uniformly flow through the heat dissipation device 2. Each of the convex portions 3 has a first inclined surface 300 and a second inclined surface 301 respectively on both sides of the convex portion 3 such that the adjacent convex portions 30 are formed by the corresponding first inclined surface 300 - the tapered flow path 302 The corresponding second inclined surface 301 forms a flow resistance of the involute flow path 3〇3, 201217736, but the shape of the convex portion 30 is not limited to the above. The difference between the soil only example and the second embodiment is that the convex structure of the object II3 of the second embodiment of the second embodiment causes the flow path to be reduced to achieve the flow resistance, and the second embodiment is in the second embodiment. The tapered flow path 302 can be used today, and the current flow path can be increased by directing the flow path after the cooling fluid has been uniformly distributed. In the second embodiment, the housing 1 further includes a second bottom member 13 in thermal contact with a heat source 4, and the heat source 4, 1, and the money member 13 are in thermal contact with each other. Until the liquid cooling fluid is hot, the heat source may be a central processing unit or a wafer module, but not limited thereto, and the heat sink 2 is also in thermal contact with the bottom member 13, and the heat 1 is transmitted to The heat sink 2. In the present invention, the flow resistance portion 3 can be disposed in the accommodating space and above the bottom member 13. The flow resistance portion 3 can also be disposed in the accommodating space and facing the top surface of the housing. The shape and direction and position of the setting are not limited to the above. The liquid cooling L body heat exchange chamber of the present invention is close to the cavity 1〇, and the flow resistance portion 3 is disposed at the inlet pipe 11 to form a flow channel area smaller than the cross-sectional area of the inlet g path 11 to cause the cooling fluid to lie in The velocity of the cooling G can be slowed down before flowing through the heat sink 2. The cooling fluid Q can be evenly distributed in the cavity 10 or the obstacle shape can be adjusted further to increase the flow resistance to increase _ The effect of the flow resistance portion, in the (four) cooling fluid heat exchange chamber of the present invention, allows the cooling fluid to uniformly flow through the heat dissipating device to improve heat dissipation efficiency. The above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited by 201217736. That is, the equivalent changes and modifications made by the present invention in the scope of the present invention will remain without departing from the scope of the present invention, and therefore should be considered as further implementation of the present invention. 201217736 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side elevational view of a liquid cooling fluid heat exchange chamber of the present invention. Figure 2A is a schematic view of a first embodiment of the flow resistance of the present invention. Figure 2B is a schematic view of a second embodiment of the flow resistance of the present invention. Figure 2C is a top plan view showing a second embodiment of the flow resistance of the present invention. [Main component symbol description] 0- Cooling fluid 00-Flow direction 1- Housing 10 - Cavity 11 - Inlet pipe 12 - Outlet pipe 13 - Bottom member 2 - Heat sink 20 - Plate body 21 - Heat sink fin 3- Flow resistance portion 30 - convex portion 300 - first inclined surface 301 - second inclined surface 302 - tapered flow path 201217736 303 - involute flow path 4 - heat source