CN211319165U - Low flow resistance water-cooling chip radiator - Google Patents

Abstract

The utility model discloses a low flow resistance water-cooling chip radiator, radiator comprise upper cover and collet. The upper cover is provided with two water inlets, the heat exchange cavity is positioned in the center of the upper cover, and a diversion basin is arranged on one side close to the water inlets. The water outlet is communicated with a water collecting tank of the heat exchange cavity, the water diversion tank is separated from the water collecting tank, and the space outside the water diversion tank frame is communicated with the water collecting tank. A sealing gasket is arranged in the diversion basin frame, and a water spray nozzle is arranged in the middle of the sealing gasket. The design of the water flow channel of the upper cover has the function of low resistance circulation and enhanced heat dissipation. Especially, the area of the sealing gasket of the upper cover is equal to the upper surface of the micro-channel, and cold fluid enters the micro-channel through the opening of the sealing gasket and can only flow out of the gap of the micro-fin of the channel, so that the cold fluid and the micro-channel can exchange heat fully. Since the path of the fluid flowing in the upper cover has no dead space, the resistance is remarkably reduced. The radiator is thin, but the heat exchange area is relatively large, and the radiator is very suitable for a narrow space of a server.

Description

Low flow resistance water cooling chip heat sink

technical field

The utility model belongs to the field of thermal energy engineering strengthening heat transfer, in particular to a radiator device for cooling computer CPU chips.

Background technique

The chips of all computers, including mobile phones, are heat-generating devices with high heat flux density. A computer server usually has dozens or even hundreds of multi-core CPUs. Behind the strong performance, it is accompanied by higher heat generation and heat flux density. Because of this The problem of efficient cooling of CPU chips has become a shackle to further improve computer performance. At present, the cooling of chips in data centers is mainly air-cooled, that is, fans are installed in servers, and the heat is taken away by forced cold air. As we all know, if the heat of the chip is taken away by the water cooling method, it will have a higher cooling efficiency, and there are many kinds of water cooling radiators at present. The main problem or research focus of water-cooled heat dissipation is how to improve the heat dissipation efficiency of the fluid and how to take away more heat. The key technology is the heat dissipation unit structure and the packaging structure in the radiator cavity.

The liquid cooling radiators currently used in data centers are generally composed of a bottom bracket and a sealing cover, which together form a heat exchange cavity. Different forms of fins, micro-channels, small fins and other heat dissipation units are arranged on the bottom bracket, and heat is exchanged with the cooling fluid through the heat dissipation units. The design of the sealing cover structure not only constitutes the sealing cavity, but also plays an important role in the reasonable diversion of the fluid and the heat exchange path of the fluid. At present, the focus of many R&D institutions on radiator research is mostly concentrated on the bottom bracket, and various forms of heat dissipation units have been designed for this purpose, and the focus is on how to improve the heat exchange area. The form and structure of the heat dissipation unit can be designed in various ways, and the purpose is how to increase the heat exchange area under the same external volume. However, the problem caused by this is that the resistance of cooling water flow is also greatly increased while the heat exchange area is increased, so the research on the structure of the bottom bracket heat dissipation unit has become very difficult. However, people have neglected the research on the sealing cover of the water-cooled radiator. The optimized design of the cover can improve the heat exchange efficiency of the radiator. It relatively reduces the flow resistance and forms a low-resistance flow field, which can greatly improve the efficiency and performance of the water (liquid) cooling radiator.

SUMMARY OF THE INVENTION

The purpose of this utility model is to propose a water-cooled chip radiator device with low flow resistance for cooling computer CPU chips, which can effectively improve the heat dissipation performance of the CPU on the basis of reducing the flow resistance of the cooling fluid.

The technical solution adopted to achieve the purpose of the utility model is: the radiator device is composed of an upper cover and a bottom bracket, the upper cover is provided with a water inlet and two water outlets, the water inlet is located in the middle of the upper cover, and the two The water outlet is located on the upper or lower part of the upper cover. The heat exchange cavity is located in the center of the upper cover. The heat exchange cavity is provided with a water separation pool on the side near the water inlet. The two water outlets are communicated with the water collection pool of the heat exchange cavity, and the water separation pool is separated from the water collection pool. The outer space of the water distribution tank frame is communicated with the water collection tank, the water distribution tank frame is provided with a sealing gasket, the middle of the sealing gasket is provided with a water spout, and the heat exchange cavity of the upper cover is provided with a sealing groove around it for placing the sealing ring.

As a whole radiator, the structure of the bottom bracket is as follows: the bottom bracket is provided with a rectangular micro-channel, a number of dense tiny fins are processed on the micro-channel, and the left and right edges of the micro-channel are provided with 45° slopes , a U-shaped water inlet groove is processed in the center of the micro channel. The depth of the water inlet tank is 1/2 of the height of the micro channel, and the area of the overall micro channel is equal to the area of the upper cover gasket. A water collecting tank is arranged around the micro channel, and after the upper cover and the bottom bracket are sealed and integrated, the water collecting tank is communicated with the outer space of the upper cover water dividing pool frame.

In addition to the structure of the radiator, the innovation of the flow mode of the cooling fluid on the upper cover compared with the existing technology is that, considering the low flow resistance, the design points are: (1) The fluid inlet, the water dividing pool in the heat exchange cavity is designed as (1/4 volume) cylindrical structure, that is, the fluid is injected into the rectangular micro-channel on the bottom bracket from top to bottom through the arc-shaped dividing pool (through the sealing gasket nozzle). (2) Fluid outlet. After the cooling fluid exchanges heat with the tiny fins on the micro-channel, it flows into the water collection tank through the outer space around the water separation tank frame. The corner wall is also arc-shaped, that is, there is no dead angle in the path of the fluid flowing in the upper cover. The location of the diverter pool is not in the center of the heat exchange cavity, but deviated from the center line and closer to the water inlet. The purpose of the design is to shorten the path of the cold fluid in the upper cover and enter the heat exchange cavity as soon as possible.

The direction of the small fins in the micro channel is consistent with the flow direction of the fluid, which can also reduce the flow resistance. The micro fins are immersed in the water flow, and the fluid can form a uniform flow field, which can fully cool the CPU chip and transfer heat. be strengthened.

As an important technical feature, it is the determination of the parameters of each part of the bottom bracket structure. Except that the area of the upper cover gasket is equal to the upper surface of the microchannel, the heat transfer experiments and numerical calculations are based on the heat flux density (converted temperature) of the chip to determine the microchannel heat transfer area, the fluid inlet temperature and cooling. water flow. The heat exchange area includes: the net height of the small fins, the height above the bottom support plane, the depth of the sump from the bottom support plane, the length and width of the overall micro channel. The thickness and spacing (including machinability) of the micro-channel finlets are calculated by fluid mechanics experiments and numerical simulations.

The temperature and flow of the coolant can also be adjusted according to the thermal load (heat flux density) of the CPU to achieve a good parameter matching. Experiments have shown that the pressure drop caused by this structure is very small, and the heat of the bottom bracket is transferred to the tiny fins in a highly thermally conductive manner, and then the heat is dissipated by the cooling fluid.

The features and beneficial effects of the utility model are that the design of the water flow channel on the upper cover of the radiator has the effect of low resistance circulation and enhanced heat dissipation. The key technology is that the area of the upper cover gasket is equal to the upper surface of the micro-channel, and the cold fluid entering the micro-channel through the opening of the gasket can only flow out from the gap between the micro-fins of the channel, so that the cold fluid and the micro-channel can be fully connected. heat exchange. Since the path of the fluid flowing in the upper cover has no dead ends, the resistance is significantly reduced. This kind of radiator is thin, but has a relatively large heat exchange area, so it is very suitable for the narrow space of computer servers. The liquid cooling makes the temperature average effect of the CPU chip better, and can reduce the working temperature of the CPU more effectively.

Description of drawings

FIG. 1 is a perspective structural view of the front of the cover device of the present invention.

Figure 2 is a three-dimensional structural view of the flat laying position of the sealing gasket in the present invention.

FIG. 3 is a three-dimensional structural view of the standing position of the sealing gasket in the present invention.

FIG. 4 is a three-dimensional structural view of the bottom surface of the upper cover of the device of the present invention.

FIG. 5 is a perspective structural view of the front side of the bottom bracket device of the present invention.

Detailed ways

The principle and structure of the present utility model will be further described below with reference to the accompanying drawings and through specific embodiments. It should be noted that this embodiment is descriptive rather than restrictive, and this embodiment does not limit the protection scope of the present invention.

The low-flow resistance water-cooled chip radiator device is composed of an upper cover and a bottom bracket. The water outlets 1-2 and 1-3 are located on the upper or lower part of the upper cover. The heat exchange cavity 1-4 is located in the center of the upper cover. The heat exchange cavity is provided with a water separation pool 1-5 on the side near the water inlet, and the two water outlets communicate with the water collection pool 1-6 of the heat exchange cavity. The water distribution tank is separated from the water collection tank, and the outer space of the water distribution tank frame is communicated with the water collection tank. There are gaskets 1-7 in the frame of the sub-water pool, and a water spout 1-8 is opened in the center of the gasket. There are sealing grooves 1-10 outside the heat exchange chamber for placing the sealing ring.

Only one of the two water outlets of the upper cover is used, and the position of the water outlet can be designed to be on the same side as the water inlet; it can also be designed on the opposite side of the water inlet. The angle of the water inlet and the water outlet can be adjusted arbitrarily and the interface device can be fixed to install the external movable joint.

The bottom bracket 2 is provided with a rectangular micro-channel, and a plurality of dense micro-fins are processed on the micro-channel. The left and right edges of the micro-channel are provided with 45° slopes, and the center of the micro-channel is processed with a U-shaped ( concave) into the water tank 2-1. The depth of the water inlet groove is 1/2 of the height of the micro channel, and the area of the overall micro channel is equal to the area of the gasket of the upper cover. A water collecting tank 2-2 is arranged around the micro channel. After the upper cover and the bottom bracket are sealed and integrated, the water collecting tank is communicated with the outer space of the upper cover water separation tank frame.

The gasket of the upper cover is provided with positioning grooves 1-9 (as shown in Figures 2 and 3), and there is a positioning boss at the corresponding position in the frame of the upper cover of the water separation tank for the accurate installation of the gasket. After the gasket is installed in the horizontal position, it just forms a complete plane with the frame of the sub-pool, so the thickness of the gasket is the depth reserved on the eaves of the frame of the sub-pool.

On the reverse side of the bottom bracket, from the edge to the center of the bottom bracket, there is a groove with a depth of 1mm, which is used to install a thermocouple and monitor the temperature of the bottom surface of the chip in real time.

The small fin matrix of the bottom bracket as a heat exchange unit is collectively referred to as a micro channel. The net height of the small fins in the rectangular micro channel of the bottom bracket is 2-3mm; the small fins are 1-1.5mm higher than the bottom bracket plane; The depth of the bottom support plane is 1-1.5mm; the overall micro-channel length is 30-35mm; the overall width is 20-25mm; the thickness and spacing of the small fins of the micro-channel are 0.01mm, and the bottom support is made of red copper material.

There are also sealing grooves 1-10 for placing the sealing ring at the position corresponding to the sealing groove of the heat exchange cavity of the upper cover.

When in use, the heat dissipation base is in close contact with the radiated component and fixed, and a thermal bonding layer material with high thermal conductivity is arranged between the base and the radiated component.

As an example, the area of the bottom bracket is 80×80mm; the thickness is 2.5mm; the area of the rectangular micro-channel part of the bottom bracket is 30×22mm, and the overall height of the upper cover is 15mm.

Fasten and seal the top cover, sealing ring and bottom bracket with screws. The bottom bracket is designed with special screw holes to fix it with the CPU and the base plate. When in use, the bottom surface of the top cover (Figure 4) is actually the top or front of the radiator. The heat exchange cavity is located in the center of the upper cover, but the water separation pool is not in the center of the heat exchange cavity, and the water separation pool is located on the side close to the water inlet of the heat exchange cavity of the upper cover. The cooling water enters the water distribution pool of the radiator (water inlet) from the external water pipeline, and there is a gasket under the water distribution pool. There are two functions of the gasket: one is to make the sub-tank function as a "water supply tank", that is to say, the sub-tank is always in a "full water" state during the cooling water circulation process, and its function is to make the rectangular micro-channel into the bottom bracket. The water supply (finlet) is always stable. The second function of the gasket is to allow the cooling water to enter the concave water inlet groove of the bottom bracket only through the water jet in the middle of the gasket (the concave part accounts for about 4/5 of the micro channel, as shown in Figure 5). The gasket covers the top of the heat exchange unit (the matrix of small fins), so that the cooling water can only flow out through the gaps between the tiny fins (this kind of gaps are collectively referred to as microchannels in the theory of enhanced heat transfer), and then ( The cooling water with increased temperature) converges in the water collecting tank (Fig. 5) provided around the micro channel, and finally discharges through the water outlet of the upper cover. Such a process belongs to micro-channel enhanced heat transfer. In order to reduce the flow resistance, there are 45° slopes on the left and right edges of the micro channel.

The device is mainly used for water cooling and heat dissipation of computer CPU chips, and is mounted on the server substrate. Since computer server racks are equipped with multiple layers of substrates and the components on each substrate are very dense, the area or volume of the heat sink is particularly important. In view of this, there are various types of server substrate components, so it is more critical to design the positions of the water-cooled radiator inlet and outlet on the same side or on the other side. The position of the inlet and outlet of the device can be easily replaced and installed, and the inlet and outlet of the upper cover are provided with a self-sealing self-locking structure (easy to fix the position), and the angle position of the movable joint can be arbitrarily set without water leakage.

The path of the fluid flowing in the upper cover has no dead ends, which significantly reduces the flow resistance. The overall thickness of the radiator is thin, but the heat exchange area is relatively large, which is suitable for the narrow space of the computer server.

Claims (8)

1. Low flow resistance water-cooling chip radiator, radiator device constitute characterized by upper cover and collet combination as an organic whole: the upper cover (1) is provided with a water inlet and two water outlets, the water inlet (1-1) is positioned in the middle of the upper cover, the two water outlets (1-2 and 1-3) are positioned on the upper portion or the lower portion of the upper cover, a heat exchange cavity (1-4) is positioned in the center of the upper cover, a diversion basin (1-5) is arranged on one side, close to the water inlet, in the heat exchange cavity, the two water outlets are communicated with a water collecting basin (1-6) of the heat exchange cavity, the diversion basin is separated from the water collecting basin, the outer side space of a diversion basin frame is communicated with the water collecting basin, a sealing gasket (1-7) is arranged in the diversion basin frame, a water spray opening (1-8) is formed in the middle of the sealing gasket, the sealing gasket is embedded in the diversion basin frame, the thickness of the sealing gasket is exactly equal.

2. The low flow resistance water-cooled chip heat sink of claim 1, wherein: the water inlet and the water outlet in the upper cover are provided with interface devices with angles capable of being adjusted randomly and fixed for installing external movable joints.

3. The low flow resistance water-cooled chip heat sink of claim 1, wherein: only one of the two water outlets is utilized, and the position of the water outlet is designed on the same side with the water inlet; or on the opposite side of the water inlet.

4. The low flow resistance water-cooled chip heat sink of claim 1, wherein: the improved water distribution tank is characterized in that a rectangular micro-channel is arranged on the bottom support (2), a plurality of dense micro fins are processed on the micro-channel, the edges of the left side and the right side of the micro-channel are provided with slopes of 45 degrees, a U-shaped water inlet groove (2-1) is processed in the center of the micro-channel, the depth of the water inlet groove is 1/2 of the height of the micro-channel, the area of the whole micro-channel is equal to that of the sealing gasket, water collecting grooves (2-2) are arranged around the micro-channel, and after the upper cover and the bottom support are sealed and integrated, the water collecting grooves are communicated with the space outside the upper cover water.

5. The low flow resistance water-cooled chip heat sink of claim 1, wherein: the net height of the small fins of the rectangular micro-channel on the bottom support is 2-3 mm; the small fins are 1-1.5mm higher than the plane of the bottom support; the depth of the water collecting tank from the plane of the bottom support is 1-1.5 mm; the length of the whole micro-channel is 30-35 mm; the whole width is 20-25 mm; the thickness and the interval of the micro-channel small fins are 0.01mm, and the bottom support is made of red copper materials.

6. The low flow resistance water-cooled chip heat sink of claim 1, wherein: a groove with the depth of 1mm is arranged on the reverse side of the bottom support from the edge to the center of the bottom support.

7. The low flow resistance water-cooled chip heat sink of claim 1, wherein: the sealing gasket of the upper cover is provided with positioning grooves (1-9), and positioning bosses (1-11) are arranged at corresponding positions in the upper cover diversion basin frame and used for accurately mounting the sealing gasket.

8. The low flow resistance water-cooled chip heat sink of claim 1 or 4, wherein: and sealing grooves (1-10) for placing sealing rings are also arranged at the positions of the bottom support corresponding to the sealing grooves of the upper cover heat exchange cavity.

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