CN207781583U - A kind of spider net type fluid channel radiator - Google Patents
A kind of spider net type fluid channel radiator Download PDFInfo
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- CN207781583U CN207781583U CN201820210595.7U CN201820210595U CN207781583U CN 207781583 U CN207781583 U CN 207781583U CN 201820210595 U CN201820210595 U CN 201820210595U CN 207781583 U CN207781583 U CN 207781583U
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Abstract
The utility model discloses a kind of spider net type fluid channel radiators, including substrate, it is characterized in that, it is in arachnoid fluid fluid channel that the bottom of the substrate, which is equipped with equally distributed, the center of substrate is the center of fluid fluid channel, the fluid fluid channel is from center to external radiation, it is rendered as the circle shape of different radii, fluid fluid channel is equipped with the fluid miniflow straight channel of " rice " shape on the basis of center, fluid fluid channel is uniformly divided into the symmetrical sector of 8 deciles by the fluid miniflow straight channel of " rice " shape, the both ends of the miniflow straight channel of one of them " rice " shape respectively with the cooling working medium inlet side mouthful that is located at base plate bottom, exit port connects, the inner wall of the fluid fluid channel is in wavy, heat source is placed on the center of substrate.This apparatus structure is simple, integral heat sink is more uniform, can improve the heat dissipation performance of radiator.
Description
Technical field
The utility model is related to microelectronics high-power die heat dissipation technology, specifically a kind of spider net type fluid channel heat dissipation dress
It sets.
Background technology
With the electronic products such as smart mobile phone, tablet computer, movable storage device and auto electronic equipments to it is more multi-functional,
The increasingly increase of smaller volume and more high integration demand.System on chip (SOC) integrates one completely on a single chip
System, including central processing unit, memory and peripheral circuit etc. and package system (SIP) work will have certain function
Chip be sealed in a case body adaptable with it, both technologies are also constantly progressive therewith, and microelectronic chip is real
Existing function and functional density is all in exponential increase.While function increases, power consumption and fever are consequently increased, and study table
It is bright, all it is excessively high caused by temperature more than the failure of 55% electronic equipment, therefore the encapsulation of chip or integrated system is carried
Very high requirement is gone out.The quality of package substrate performance has been largely fixed the reliability and service life of product, therefore
Heat dissipation problem, which has become, to be restricted electronic product and one of miniaturises with integrated bottleneck.To solve small size and highly integrated
Electronic product radiating problem under the conditions of degree needs to use significantly more efficient heat sinking technology, and as heat sinking technology
One of fluid channel heat dissipation technology due to having many advantages, such as low thermal resistance, high efficiency and being processed with integrated chip.
In order to solve the heat dissipation problem of electronic component, need to create novel radiating device, Luo little Bing et al. is proposed
One kind being used for microelectronic component radiator, and radiator is the straight channel of the inside substrate both ends disengaging, and cooling working medium enters
In straight channel, is conducted heat by thermal convection current and take away the heat that heat source generates, it is this traditional micro- to lead to achieve the effect that heat dissipation
Road radiating element since the micro-channel structure of straight channel has single runner direction, causes fluid to flow there are some problems
Mode is laminar flow, and this type of flow is not easy to fluid and flow path wall face heat convection, and the bulk convection coefficient of heat transfer reduces, heat dissipation
Inefficiency., can be by improving fluid-flow mode in order to improve fluid for radiating heat efficiency, and then Jin Zunlong and the superfine people of Zhang Zhi carry
A kind of warp architecture micro-channel heat exchanger has been supplied, bending micro structure has been introduced by this point, cooling working medium is no longer single
One type of flow, in the bigger turn channel of slope, fluid flow path becomes tortuous, while increasing cooling working medium
With the heat transfer process of wall surface, entire bending channel has corresponding improvement for traditional straight channel radiator, but there is also certain
Shortcoming, there are certain intervals between adjacent channel so that integral heat sink is uneven；Besides cooling working medium into
Export direction is still substrate front-back, and to the inlet and outlet of cooling working medium, there are a hidden danger in this way so that fluid source inconvenience into
Enter in fluid channel.
Summer state et al. is it is also proposed that a kind of microchannel heat sink structure, this radiator are mainly used in multi-chip module
Package cooling, the Homogeneouslly-radiating in view of many areas, the knot are needed since temperature distribution is non-uniform in multi-chip module
Multiple microchannel heat sinks are used in structure and carry out integrated heat dissipations, can thus solve in multi-chip module that heat source is uneven to ask
Topic, but the patent microchannel structure is too simple, and heat dissipation area is too small, and there are still straight channel fluid convection heat exchange efficiency is low
Lower problem, and cooling working medium inlet and outlet are excessively cumbersome.In addition, L Gong et al. are having studied wavy channel as improvement laminar flow
When heat transfer property of the fluid in microchannel heat sink, find micro- compared to straight by introducing the radiating efficiency after wavy surface structure
Channel is up to 55%, thus this ripple struction by be the following high heat-flux electronic product radiating structure best candidate.
Utility model content
The purpose of this utility model is in view of the deficiencies of the prior art, and to provide a kind of spider net type fluid channel radiator.
This apparatus structure is simple, integral heat sink is more uniform, can improve the heat dissipation performance of radiator.
Realizing the technical solution of the utility model aim is：
A kind of spider net type fluid channel radiator, including substrate, it is in spider web that the bottom of the substrate, which is equipped with equally distributed,
The fluid fluid channel of shape, the center of substrate are the center of fluid fluid channel, and the fluid fluid channel is outside by center
Radiation, is rendered as the circle shape of different radii, and fluid fluid channel is equipped with the fluid miniflow of " rice " shape on the basis of center
Fluid fluid channel is uniformly divided into the symmetrical sector of 8 deciles by straight channel, the fluid miniflow straight channel of " rice " shape,
In " rice " shape miniflow straight channel both ends respectively be located at the cooling working medium inlet side mouthful of base plate bottom, exit port connects
It connects, the inner wall of the fluid fluid channel is in wavy, and heat source is placed on the center of substrate.
The substrate is the low-temperature co-fired ceramic substrate or ceramic substrate that thickness is at least 2 millimeters.
The straight channel cross section of the fluid miniflow straight channel of " rice " shape be width be 0.5 millimeter, a length of 1 millimeter of square
Shape.
The cooling working medium inlet side mouthful, exit port are outer to be cased with annulus set, the specification of annulus set be outer diameter be 1.5 millimeters,
Internal diameter is 1.2 millimeters.
Structure in 8 sectors of the fluid fluid channel is symmetrical, and flow passage route length is identical.
Deionized water can be used in the cooling working medium of the microfluidic channel.
Traditional arc line type microchannel is become more tortuous, works as fluid by the microchannel structure of wave wall surface spider net type
When flowing through the turning point of spider web, fluid will produce reflux at node to be shown, that is, minimum whirlpool is had in corner
Volute at capableing of the heat transfer process of larger fluid and wall surface, to improve heat-sinking capability, the micro-channel structure of spider net type in this way
More fully it is covered with total, the direct current being inserted among spider web arrives, and is conducive to the flow process for accelerating cooling working medium, also more
Adding and uniformly allows fluid flow into each runner so that heat dissipation is more uniform, and wave wall surface improves the type of flow of micro-channel fluid,
Increase fluid heat transfer process.
1. the fluid fluid channel in the technical program, is connected with each other by a section circular arc, each radian is identical
Circular arc connect smoothly, whole that axially symmetric structure is presented, runner cools down working medium in runner using rectangular configuration as section
In smooth flowing, coefficient of frictional resistance is small, is beneficial to exchange heat；
2. the fluid fluid channel in the technical program, fluid flows in microchannel circular arc channel, the company of each circular arc
Contact channel direction has turning point, and fluid is susceptible to reflux after flowing to turning point, reinforces the Convective Heat Transfer of fluid, always
Body improves the convection transfer rate of micro-channel structure；
3. the fluid fluid channel in the technical program is changed the type of flow of microfluid by the structure of wave wall surface
Kind, fluid-flow mode tends to laminar flow in fluid channel, and after introducing wave wall surface, bosher's mass flow flowing mode tends to turbulent flow mould
Formula to improve heat transfer process of the working medium to wall surface, and then improves integral heat sink efficiency.
4. the fluid micro-channel fluid inlet and outlet in the technical program are by introducing a straight channel, passing through in spider web
The heart, forms zhou duicheng tuxing, and such structure has uniformly distributed a fluid in each runner so that block mold heat dissipation is equal
Even, it is the rubber port by substrate pedestal to connect external Micropump, and coolant liquid can be supplied by being inserted directly into corresponding micro-pipe；
5. the fluid fluid channel spider net type micro-channel structure in the technical program is covered with inside entire substrate, integral heat sink face
Product increases, and heat dissipation is more abundant.
This apparatus structure is simple, integral heat sink is more uniform, can improve the heat dissipation performance of radiator.
Description of the drawings
Fig. 1 is the structural schematic diagram of embodiment；
Fig. 2 is that the chip maximum temperature of the lower three kinds of microchannels of different cooling liquid speeds in embodiment compares line chart；
Fig. 3 is that cooling liquid speed is straight channel temperature simulation cloud atlas under 1m/s in embodiment；
Fig. 4 is that cooling liquid speed is bending micro temperature simulation cloud atlas under 1m/s in embodiment；
Fig. 5 is that cooling liquid speed is spider net type microchannel temperature simulation cloud atlas under 1m/s in embodiment.
In figure, 1. heat source, 2. substrate, 3. fluid fluid channel 4. cools down working medium inlet side mouthful 4-1. cooling working medium exit ports 5. " rice "
The miniflow straight channel of shape.
Specific implementation mode
The utility model content is further elaborated with reference to the accompanying drawings and examples, but is not to the utility model
Restriction.
Embodiment：
Referring to Fig.1, a kind of spider net type fluid channel radiator, including substrate 2, the bottom of the substrate 2, which is equipped with, uniformly to be divided
Cloth is in arachnoid fluid fluid channel 3, and the center of substrate 2 is the center of fluid fluid channel 3, the fluid fluid channel 3
From center to external radiation, it is rendered as the circle shape of different radii, fluid fluid channel 3 is equipped with " rice " on the basis of center
Fluid fluid channel 3 is uniformly divided into 8 deciles by the fluid miniflow straight channel 5 of shape, the fluid miniflow straight channel 5 of " rice " shape
Symmetrical sector, the both ends of the miniflow straight channel 5 of one of them " rice " shape respectively with the bosher that is located at 2 bottom of substrate
Matter is into port 4, exit port 4-1 connections, and the inner wall 3-1 of the fluid fluid channel 3 is in wavy, and heat source 1 is placed in substrate 2
On heart position.
The substrate 2 is the low-temperature co-fired ceramic substrate or ceramic substrate that thickness is at least 2 millimeters.
The straight channel cross section of the fluid miniflow straight channel 5 of " rice " shape be width be 0.5 millimeter, it is 1 millimeter a length of
Rectangle.
The cooling working medium inlet side mouthful 4, exit port 4-1 are outer to be cased with annulus set, and it is 1.5 millis that the specification of annulus set, which is outer diameter,
Rice, internal diameter are 1.2 millimeters.
Structure in 8 sectors of the fluid fluid channel 3 is symmetrical, and flow passage route length is identical.
Deionized water can be used in the cooling working medium of the microfluidic channel.
Traditional arc line type microchannel is become more tortuous, works as fluid by the microchannel structure of wave wall surface spider net type
When flowing through the turning point of spider web, fluid will produce reflux at node to be shown, that is, minimum whirlpool is had in corner
Volute at capableing of the heat transfer process of larger fluid and wall surface, to improve heat-sinking capability, the micro-channel structure of spider net type in this way
More fully it is covered with total, the direct current being inserted among spider web arrives, and is conducive to the flow process for accelerating cooling working medium, also more
Adding and uniformly allows fluid flow into each runner so that heat dissipation is more uniform, and wave wall surface improves the type of flow of micro-channel fluid,
Increase fluid heat transfer process.
For the heat dissipation effect of the present embodiment, using finite element fluid analysis software FLUENT to different micro-channel structures into
Trip temperature emulates, and for being compared in the case of different fluid flow velocity, obtains the temperature of chip and radiator entirety
Distribution map.
Wherein, the setting of parameter setting and boundary condition is as follows：
Moulded dimension：Euthermic chip size is 10mm × 10mm × 1mm；Substrate size is 40mm × 40mm × 2mm；Spider web
Microchannel cross-section size is 0.8mm × 0.6mm；Straight channel cross sectional dimensions is 0.8mm × 0.6mm；Fluid passes in and out port ruler
Very little is 1.2 × 1mm of outside cylinder Φ 1.5mm × 1mm, interior cylinder Φ.
Emulation setting:Energy equation and turbulence model are opened in fluent, cooling working medium uses water, chip material to use
Silicon chip, baseplate material use ceramic substrate, chip heat source to be set as heat flow density, and 2.2 × 106w/m3Chip and substrate heat dissipation
The surface of device and the convection transfer rate of air are 10w/m2.k, the inlet temperature of cooling working medium is 25 DEG C, and environment temperature is set
It is set to 25 DEG C.
After establishing formulated moulded dimension in simulation software, grid has been divided, has imported fluid analysis software
Corresponding parameter is set in FLUENT, is solved, different micro-channel structures is analyzed, in different micro-channel structure models
In, keep model bosher's plastid accumulated amount consistent, different flow velocity grades is arranged, finally in three kinds of model boundary condition all sames
It observes and records as a result, recording result such as table 1.
By the emulation of three kinds of microchannel heat sinks under different cooling refrigerant flow rates, maximum temperature on chip is obtained
Value, as shown in Fig. 2, it can be seen from the figure that, spider net type fluid channel in the present embodiment, heat dissipation effect is significantly and radiating efficiency is higher than it
His two kinds of structures (fluid channel is straight channel, fluid channel is bending channel), pass through the final simulation results show spider of embodiment
Network structure feature.Fig. 3,4,5 be respectively cooling liquid speed be 1m/s when difference micro-channel structure temperature simulation cloud atlas, by scheming
Known to fluid channel be straight channel maximum temperature be 132.32 DEG C, fluid channel is that bending channel maximum temperature is 149.07 DEG C, this example
Spider net type microchannel maximum temperature is 108.27 DEG C, it can thus be appreciated that the wave wall surface spider net type microchannel heat dissipation dress in the present embodiment
Set has certain superiority on solving heat dissipation problem.
Table one
Claims (5)
1. a kind of spider net type fluid channel radiator, including substrate, characterized in that the bottom of the substrate is equipped with equally distributed
In arachnoid fluid fluid channel, the center of substrate is the center of fluid fluid channel, and the fluid fluid channel is by centre bit
The circle shape that different radii is rendered as to external radiation is set, fluid fluid channel is equipped with the stream of " rice " shape on the basis of center
Fluid fluid channel is uniformly divided into the symmetrical of 8 deciles by body miniflow straight channel, the fluid miniflow straight channel of " rice " shape
Sector, the both ends of the miniflow straight channel of one of them " rice " shape respectively be located at the cooling working medium inlet side mouthful of base plate bottom, go out
Port connects, and the inner wall of the fluid fluid channel is in wavy, and heat source is placed on the center of substrate.
2. a kind of spider net type fluid channel radiator according to claim 1, characterized in that the substrate be thickness at least
For 2 millimeters of low-temperature co-fired ceramic substrate or ceramic substrate.
3. a kind of spider net type fluid channel radiator according to claim 1, characterized in that the fluid of " rice " shape
The straight channel cross section of miniflow straight channel be width be 0.5 millimeter, a length of 1 millimeter of rectangle.
4. a kind of spider net type fluid channel radiator according to claim 1, characterized in that the cooling working medium inlet side
Mouthful, exit port is outer is cased with annulus set, the specification of annulus set be outer diameter be 1.5 millimeters, internal diameter is 1.2 millimeters.
5. a kind of spider net type fluid channel radiator according to claim 1, characterized in that the 8 of the fluid fluid channel
Structure in a sector is symmetrical, and flow passage route length is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820210595.7U CN207781583U (en) | 2018-02-07 | 2018-02-07 | A kind of spider net type fluid channel radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820210595.7U CN207781583U (en) | 2018-02-07 | 2018-02-07 | A kind of spider net type fluid channel radiator |
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| CN207781583U true CN207781583U (en) | 2018-08-28 |
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| CN201820210595.7U Active CN207781583U (en) | 2018-02-07 | 2018-02-07 | A kind of spider net type fluid channel radiator |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172557A (en) * | 2018-02-07 | 2018-06-15 | 桂林电子科技大学 | A kind of spider net type fluid channel radiator |
| CN109152310A (en) * | 2018-10-22 | 2019-01-04 | 桂林电子科技大学 | A kind of more circular arc microchannel heat sinks |
-
2018
- 2018-02-07 CN CN201820210595.7U patent/CN207781583U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172557A (en) * | 2018-02-07 | 2018-06-15 | 桂林电子科技大学 | A kind of spider net type fluid channel radiator |
| CN109152310A (en) * | 2018-10-22 | 2019-01-04 | 桂林电子科技大学 | A kind of more circular arc microchannel heat sinks |
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