CN108172557A - A kind of spider net type fluid channel radiator - Google Patents
A kind of spider net type fluid channel radiator Download PDFInfo
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- CN108172557A CN108172557A CN201810120670.5A CN201810120670A CN108172557A CN 108172557 A CN108172557 A CN 108172557A CN 201810120670 A CN201810120670 A CN 201810120670A CN 108172557 A CN108172557 A CN 108172557A
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- 239000012530 fluid Substances 0.000 title claims abstract description 123
- 241000239290 Araneae Species 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000001816 cooling Methods 0.000 claims abstract description 20
- 241000209094 Oryza Species 0.000 claims abstract description 17
- 235000007164 Oryza sativa Nutrition 0.000 claims abstract description 17
- 235000009566 rice Nutrition 0.000 claims abstract description 17
- 230000005855 radiation Effects 0.000 claims abstract description 4
- 210000000576 arachnoid Anatomy 0.000 claims abstract description 3
- 239000000919 ceramic Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 20
- 238000000034 method Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 239000000110 cooling liquid Substances 0.000 description 5
- 238000004088 simulation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 210000002706 plastid Anatomy 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of spider net type fluid channel radiators, including substrate, it is characterized in that, it is in arachnoid fluid fluid channel that the bottom of the substrate, which is equipped with equally distributed, the center of substrate is the center of fluid fluid channel, the fluid fluid channel is from center to external radiation, it is rendered as the circle shape of different radii, fluid fluid channel is equipped with the fluid miniflow straight channel of " rice " shape on the basis of center, fluid fluid channel is uniformly divided into the symmetrical sector of 8 deciles by the fluid miniflow straight channel of " rice " shape, the both ends of the miniflow straight channel of one of them " rice " shape are respectively with being located at the cooling working medium inlet side mouthful of base plate bottom, exit port connects, the inner wall of the fluid fluid channel is in wavy, heat source is placed on the center of substrate.This apparatus structure is simple, integral heat sink is more uniform, can improve the heat dissipation performance of radiator.
Description
Technical field
The present invention relates to microelectronics high-power die heat dissipation technology, specifically a kind of spider net type fluid channel radiator.
Background technology
With the electronic products such as smart mobile phone, tablet computer, movable storage device and auto electronic equipments to it is more multi-functional,
The increasingly increase of smaller volume and more high integration demand.System on chip (SOC) integrates one completely on a single chip
System will have certain function including central processing unit, memory and peripheral circuit etc. and package system (SIP) work
Chip be sealed in a case body adaptable with it, both technologies are also constantly progressive therewith, and microelectronic chip is real
Existing function and functional density is all in exponential increase.While function increase, power consumption and fever are consequently increased, and study table
Bright, the electronic equipment failure more than 55% is all excessively high caused by temperature, therefore the encapsulation of chip or integrated system is carried
Very high requirement is gone out.The quality of package substrate performance has been largely fixed the reliability and service life of product, therefore
Heat dissipation problem, which has become, to be restricted electronic product and one of miniaturises with integrated bottleneck.To solve small size and highly integrated
Electronic product radiating problem under the conditions of degree is needed using significantly more efficient heat sinking technology, and is used as heat sinking technology
One of fluid channel heat dissipation technology since there is low thermal resistance, high efficiency and can be processed with integrated chip.
In order to solve the heat dissipation problem of electronic component, need to create novel radiating device, Luo little Bing et al. and propose
For one kind for microelectronic component radiator, radiator is the straight channel of the inside substrate both ends disengaging, and cooling working medium enters
In straight channel, conducted heat by thermal convection current and take away the heat that heat source generates, it is this traditional micro- to lead to so as to achieve the effect that heat dissipation
There are some problems for road radiating element, since the micro-channel structure of straight channel has single runner direction, fluid are caused to flow
Mode is laminar flow, and this type of flow is not easy to fluid and flow path wall face heat convection, and the bulk convection coefficient of heat transfer reduces, heat dissipation
Inefficiency., can be by improving fluid-flow mode in order to improve fluid for radiating heat efficiency, and then Jin Zunlong and the superfine people of Zhang Zhi carry
A kind of warp architecture micro-channel heat exchanger has been supplied, bending micro structure has been introduced by this point, cooling working medium is no longer single
One type of flow, in the bigger turn channel of slope, fluid flow path becomes tortuous, while increases cooling working medium
With the heat transfer process of wall surface, entire bending channel has corresponding improvement, but there is also certain for traditional straight channel radiator
Shortcoming, there are certain intervals between adjacent channel so that integral heat sink is uneven；Besides cooling working medium into
Export direction is still substrate front-back, in this way to cool down working medium inlet and outlet there are a hidden danger so that fluid source inconvenience into
Enter in fluid channel.
Summer state et al. is it is also proposed that a kind of microchannel heat sink structure, this radiator are mainly used in multi-chip module
Package cooling, the Homogeneouslly-radiating in view of many areas, the knot are needed since temperature distribution is non-uniform in multi-chip module
Multiple microchannel heat sinks are employed in structure and carry out integrated heat dissipations, can thus solve in multi-chip module that heat source is uneven to ask
Topic, but the patent microchannel structure is too simple, and heat dissipation area is too small, and there are still straight channel fluid convection heat exchange efficiency is low
Lower problem, and it is excessively cumbersome to cool down working medium inlet and outlet.In addition, L Gong et al. are having studied wavy channel as improvement layer
When flowing heat transfer property of the fluid in microchannel heat sink, find by introducing the radiating efficiency after wavy surface structure compared to straight
Microchannel is up to 55%, thus this ripple struction by be following high heat-flux electronic product radiating structure optimal candidate
Person.
Invention content
The purpose of the present invention is in view of the deficiencies of the prior art, and provide a kind of spider net type fluid channel radiator.It is this
Apparatus structure is simple, integral heat sink is more uniform, can improve the heat dissipation performance of radiator.
Realizing the technical solution of the object of the invention is：
A kind of spider net type fluid channel radiator, including substrate, it is in spider web that the bottom of the substrate, which is equipped with equally distributed,
The fluid fluid channel of shape, the center of substrate are the center of fluid fluid channel, and the fluid fluid channel is outside by center
Radiation, is rendered as the circle shape of different radii, and fluid fluid channel is equipped with the fluid miniflow of " rice " shape on the basis of center
Fluid fluid channel is uniformly divided into the symmetrical sector of 8 deciles by straight channel, the fluid miniflow straight channel of " rice " shape,
In " rice " shape miniflow straight channel both ends respectively with being located at the cooling working medium inlet side mouthful of base plate bottom, exit port connects
It connects, the inner wall of the fluid fluid channel is in wavy, and heat source is placed on the center of substrate.
The substrate is at least 2 millimeters of low-temperature co-fired ceramic substrate or ceramic substrate for thickness.
The straight channel cross section of the fluid miniflow straight channel of " rice " shape is that width is 0.5 millimeter, a length of 1 millimeter
Rectangle.
The cooling working medium inlet side mouthful, exit port are outer to be cased with annulus set, the specification of annulus set be outer diameter be 1.5 millimeters,
Internal diameter is 1.2 millimeters.
Structure in 8 sectors of the fluid fluid channel is symmetrical, and flow passage route length is identical.
Deionized water can be used in the cooling working medium of the microfluidic channel.
Traditional arc line type microchannel is become more tortuous, works as fluid by the microchannel structure of wave wall surface spider net type
When flowing through the turning point of spider web, fluid can generate reflux at node to be shown, that is, minimum whirlpool is had in corner
Volute into being capable of the heat transfer process of larger fluid and wall surface, so as to improve heat-sinking capability, the micro-channel structure of spider net type in this way
More fully it is covered with total, the direct current being inserted among spider web arrives, and is conducive to accelerate the flow process of cooling working medium, also more
Adding and uniformly allow fluid flow into each runner so that heat dissipation is more uniform, and wave wall surface improves the type of flow of micro-channel fluid,
Increase fluid heat transfer process.
1. the fluid fluid channel in the technical program is connected with each other to come by a section circular arc, each radian is identical
Circular arc be smoothly formed by connecting, whole that axially symmetric structure is presented, runner cools down working medium in runner using rectangular configuration as section
In smooth flowing, coefficient of frictional resistance is small, is beneficial to exchange heat；
2. the fluid fluid channel in the technical program, fluid flows in microchannel circular arc channel, the company of each circular arc
Contact channel direction has turning point, and fluid is susceptible to reflux after flowing to turning point, strengthens the Convective Heat Transfer of fluid, always
Body improves the convection transfer rate of micro-channel structure；
3. the fluid fluid channel in the technical program is changed the type of flow of microfluid by the structure of wave wall surface
Kind, fluid-flow mode tends to laminar flow in fluid channel, and after introducing wave wall surface, bosher's mass flow flowing mode tends to turbulent flow mould
Formula so as to improve heat transfer process of the working medium to wall surface, and then improves integral heat sink efficiency.
4. the fluid micro-channel fluid inlet and outlet in the technical program are by introducing a straight channel, across in spider web
The heart, forms zhou duicheng tuxing, and such even structure has been distributed a fluid in each runner so that block mold heat dissipation is equal
Even, it is the rubber port by substrate pedestal to connect external Micropump, and coolant can be supplied by being inserted directly into corresponding micro-pipe；
5. the fluid fluid channel spider net type micro-channel structure in the technical program is covered with inside entire substrate, integral heat sink face
Product increases, and heat dissipation is more abundant.
This apparatus structure is simple, integral heat sink is more uniform, can improve the heat dissipation performance of radiator.
Description of the drawings
Fig. 1 is the structure diagram of embodiment；
Fig. 2 is that the chip maximum temperature of the different lower three kinds of microchannels of cooling liquid speed in embodiment compares line chart；
Fig. 3 is that cooling liquid speed is straight channel temperature simulation cloud atlas under 1m/s in embodiment；
Fig. 4 is that cooling liquid speed is bending micro temperature simulation cloud atlas under 1m/s in embodiment；
Fig. 5 is that cooling liquid speed is spider net type microchannel temperature simulation cloud atlas under 1m/s in embodiment.
In figure, 1. heat source, 2. substrate, 3. fluid fluid channel 4. cooling working medium inlet side mouthful 4-1. cooling working medium exit ports 5. " rice "
The miniflow straight channel of shape.
Specific embodiment
The content of present invention is further elaborated with reference to the accompanying drawings and examples, but is not limitation of the invention.
Embodiment：
With reference to Fig. 1, a kind of spider net type fluid channel radiator, including substrate 2, the bottom of the substrate 2, which is equipped with, uniformly to be divided
Cloth in arachnoid fluid fluid channel 3, the center of substrate 2 is the center of fluid fluid channel 3, the fluid fluid channel 3
From center to external radiation, the circle shape of different radii is rendered as, fluid fluid channel 3 is equipped with " rice " on the basis of center
Fluid fluid channel 3 is uniformly divided into 8 deciles by the fluid miniflow straight channel 5 of shape, the fluid miniflow straight channel 5 of " rice " shape
Symmetrical sector, the both ends of the miniflow straight channel 5 of one of them " rice " shape are respectively with being located at the bosher of 2 bottom of substrate
Matter is into port 4, exit port 4-1 connections, and the inner wall 3-1 of the fluid fluid channel 3 is in wavy, and heat source 1 is placed on substrate 2
On center.
The substrate 2 is at least 2 millimeters of low-temperature co-fired ceramic substrate or ceramic substrate for thickness.
The straight channel cross section of the fluid miniflow straight channel 5 of " rice " shape is that width is 0.5 millimeter, a length of 1 millimeter
Rectangle.
The cooling working medium inlet side mouthful 4, exit port 4-1 are outer to be cased with annulus set, and it is 1.5 millis that the specification of annulus set, which is outer diameter,
Rice, internal diameter are 1.2 millimeters.
Structure in 8 sectors of the fluid fluid channel 3 is symmetrical, and flow passage route length is identical.
Deionized water can be used in the cooling working medium of the microfluidic channel.
Traditional arc line type microchannel is become more tortuous, works as fluid by the microchannel structure of wave wall surface spider net type
When flowing through the turning point of spider web, fluid can generate reflux at node to be shown, that is, minimum whirlpool is had in corner
Volute into being capable of the heat transfer process of larger fluid and wall surface, so as to improve heat-sinking capability, the micro-channel structure of spider net type in this way
More fully it is covered with total, the direct current being inserted among spider web arrives, and is conducive to accelerate the flow process of cooling working medium, also more
Adding and uniformly allow fluid flow into each runner so that heat dissipation is more uniform, and wave wall surface improves the type of flow of micro-channel fluid,
Increase fluid heat transfer process.
For the heat dissipation effect of the present embodiment, using finite element fluid analysis software FLUENT to different micro-channel structures into
Trip temperature emulates, and for being compared in the case of different fluid flow velocity, obtains the temperature of chip and radiator entirety
Distribution map.
Wherein, the setting of parameter setting and boundary condition is as follows：
Moulded dimension：Euthermic chip size is 10mm × 10mm × 1mm；Substrate size is 40mm × 40mm × 2mm；Spider
Net microchannel cross-section size is 0.8mm × 0.6mm；Straight channel cross sectional dimensions is 0.8mm × 0.6mm；Fluid passes in and out port
Size is 1.2 × 1mm of outside cylinder Φ 1.5mm × 1mm, interior cylinder Φ.
Emulation setting:Energy equation and turbulence model are opened in fluent, cooling working medium is used using water, chip material
Silicon chip, baseplate material use ceramic substrate, and chip heat source is set as heat flow density, and 2.2 × 106w/m3Chip and substrate heat dissipation
The surface of device and the convection transfer rate of air are 10w/m2.k, the inlet temperature for cooling down working medium is 25 DEG C, and environment temperature is set
It is set to 25 DEG C.
After formulated moulded dimension is established in simulation software, grid has been divided, has imported fluid analysis software
Corresponding parameter is set in FLUENT, is solved, analyzes different micro-channel structures, in different micro-channel structure models
In, holding model bosher's plastid accumulated amount is consistent, and three kinds of model boundary condition all sames set different flow velocity grades, finally
It observes and records as a result, recording result such as table 1.
By the emulation of three kinds of microchannel heat sinks under different cooling refrigerant flow rates, maximum temperature on chip is obtained
Value, as shown in Fig. 2, it can be seen from the figure that, spider net type fluid channel in the present embodiment, heat dissipation effect is significantly and radiating efficiency is higher than it
His two kinds of structures (fluid channel is straight channel, fluid channel is bending channel), pass through the final simulation results show spider of embodiment
Network structure feature.Fig. 3,4,5 be respectively cooling liquid speed be 1m/s when difference micro-channel structure temperature simulation cloud atlas, by
It is 132.32 DEG C that fluid channel knowable to figure, which is straight channel maximum temperature, and fluid channel is that bending channel maximum temperature is 149.07 DEG C, this
Example spider net type microchannel maximum temperature is 108.27 DEG C, it can thus be appreciated that the wave wall surface spider net type microchannel heat dissipation in the present embodiment
Device has certain superiority on heat dissipation problem is solved.
Table 1
Claims (5)
1. a kind of spider net type fluid channel radiator, including substrate, it is characterized in that, the bottom of the substrate is equipped with equally distributed
In arachnoid fluid fluid channel, the center of substrate is the center of fluid fluid channel, and the fluid fluid channel is by centre bit
It puts to external radiation, is rendered as the circle shape of different radii, fluid fluid channel is equipped with the stream of " rice " shape on the basis of center
Fluid fluid channel is uniformly divided into the symmetrical of 8 deciles by body miniflow straight channel, the fluid miniflow straight channel of " rice " shape
Sector, the both ends of the miniflow straight channel of one of them " rice " shape are respectively with being located at the cooling working medium inlet side mouthful of base plate bottom, going out
Port connects, and the inner wall of the fluid fluid channel is in wavy, and heat source is placed on the center of substrate.
2. a kind of spider net type fluid channel radiator according to claim 1, it is characterized in that, the substrate for thickness at least
Low-temperature co-fired ceramic substrate or ceramic substrate for millimeter.
3. a kind of spider net type fluid channel radiator according to claim 1, it is characterized in that, the fluid of " rice " shape
The straight channel cross section of miniflow straight channel be width be 0.5 millimeter, a length of 1 millimeter of rectangle.
4. a kind of spider net type fluid channel radiator according to claim 1, it is characterized in that, the cooling working medium inlet side
Mouthful, exit port is outer is cased with annulus set, the specification of annulus set be outer diameter be 1.5 millimeters, internal diameter is 1.2 millimeters.
5. a kind of spider net type fluid channel radiator according to claim 1, it is characterized in that, the 8 of the fluid fluid channel
Structure in a sector is symmetrical, and flow passage route length is identical.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810120670.5A CN108172557A (en) | 2018-02-07 | 2018-02-07 | A kind of spider net type fluid channel radiator |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810120670.5A CN108172557A (en) | 2018-02-07 | 2018-02-07 | A kind of spider net type fluid channel radiator |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109103156A (en) * | 2018-08-10 | 2018-12-28 | 桂林电子科技大学 | A kind of fractals microchannel heat sink |
| CN109103157A (en) * | 2018-08-28 | 2018-12-28 | 电子科技大学 | One kind imitating quincunx micro-channel heat sink cold plate and its radiator |
| CN109152310A (en) * | 2018-10-22 | 2019-01-04 | 桂林电子科技大学 | A kind of more circular arc microchannel heat sinks |
| CN109801887A (en) * | 2019-03-19 | 2019-05-24 | 江苏唯益换热器有限公司 | Fractal micro-channel heat exchanger |
| CN110081761A (en) * | 2019-06-04 | 2019-08-02 | 洛阳磊佳电子科技有限公司 | A kind of high-efficiency heat radiation structure in two-sided liquid cooling channel |
| CN110207078A (en) * | 2019-05-29 | 2019-09-06 | 集美大学 | A kind of method improving LED radiating efficiency and the LED with excellent heat dispersion performance |
| CN110822942A (en) * | 2019-11-29 | 2020-02-21 | 陕西益信伟创智能科技有限公司 | Three-dimensional cobweb laminated tube type heat exchanger based on bionics |
| CN113423240A (en) * | 2021-05-27 | 2021-09-21 | 东南大学 | Disc-shaped radiation-shaped micro-channel radiator |
| CN114144034A (en) * | 2021-11-29 | 2022-03-04 | 哈尔滨工业大学 | Spider-web-imitated shunting type microchannel liquid cooling device |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109103156A (en) * | 2018-08-10 | 2018-12-28 | 桂林电子科技大学 | A kind of fractals microchannel heat sink |
| CN109103157A (en) * | 2018-08-28 | 2018-12-28 | 电子科技大学 | One kind imitating quincunx micro-channel heat sink cold plate and its radiator |
| CN109103157B (en) * | 2018-08-28 | 2020-06-02 | 电子科技大学 | Quincunx-like micro-channel heat sink cold plate and heat dissipation device thereof |
| CN109152310A (en) * | 2018-10-22 | 2019-01-04 | 桂林电子科技大学 | A kind of more circular arc microchannel heat sinks |
| CN109801887B (en) * | 2019-03-19 | 2023-10-31 | 江苏唯益换热器有限公司 | Fractal micro-channel heat exchanger |
| CN109801887A (en) * | 2019-03-19 | 2019-05-24 | 江苏唯益换热器有限公司 | Fractal micro-channel heat exchanger |
| CN110207078A (en) * | 2019-05-29 | 2019-09-06 | 集美大学 | A kind of method improving LED radiating efficiency and the LED with excellent heat dispersion performance |
| CN110081761A (en) * | 2019-06-04 | 2019-08-02 | 洛阳磊佳电子科技有限公司 | A kind of high-efficiency heat radiation structure in two-sided liquid cooling channel |
| CN110081761B (en) * | 2019-06-04 | 2024-03-19 | 洛阳磊佳电子科技有限公司 | Efficient heat dissipation structure of double-sided liquid cooling channel and manufacturing method thereof |
| CN110822942A (en) * | 2019-11-29 | 2020-02-21 | 陕西益信伟创智能科技有限公司 | Three-dimensional cobweb laminated tube type heat exchanger based on bionics |
| CN113423240A (en) * | 2021-05-27 | 2021-09-21 | 东南大学 | Disc-shaped radiation-shaped micro-channel radiator |
| CN114144034A (en) * | 2021-11-29 | 2022-03-04 | 哈尔滨工业大学 | Spider-web-imitated shunting type microchannel liquid cooling device |
| CN114144034B (en) * | 2021-11-29 | 2024-03-22 | 哈尔滨工业大学 | Cobweb-like split-flow type micro-channel liquid cooling device |
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