CN110164835A - A kind of manifold-type labyrinth microchannel minitype radiator - Google Patents
A kind of manifold-type labyrinth microchannel minitype radiator Download PDFInfo
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- CN110164835A CN110164835A CN201910518020.0A CN201910518020A CN110164835A CN 110164835 A CN110164835 A CN 110164835A CN 201910518020 A CN201910518020 A CN 201910518020A CN 110164835 A CN110164835 A CN 110164835A
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- 239000012530 fluid Substances 0.000 claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000009826 distribution Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000013461 design Methods 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 4
- 238000012545 processing Methods 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000012809 cooling fluid Substances 0.000 claims description 2
- 208000002925 dental caries Diseases 0.000 claims description 2
- 210000000779 thoracic wall Anatomy 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000004377 microelectronic Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 235000013290 Sagittaria latifolia Nutrition 0.000 description 1
- 235000015246 common arrowhead Nutrition 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 238000012536 packaging technology Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of manifold-type labyrinth microchannel minitype radiator, belongs to enhanced heat exchange technical field.Including by stacking gradually the cover board being packaged together (1), substrate (2)；The upper surface of cover board (1) is machined with the through-hole connecting with exterior line, respectively as fluid inlet (3) and fluid outlet (4), lower surface is machined with manifold passage, and the entrance main manifold (5) of complicated microchannel and the outlet main manifold (6) of the complicated microchannel of fluid outflow are flowed into respectively as fluid；Substrate (2) upper surface processes labyrinth microchannel (7), rib wall (8).The design of present apparatus manifold-type is effectively reduced flow resistance, improves the uniformity of Temperature Distribution；Labyrinth microchannel increases the disturbance of heat convection area and fluid simultaneously, enhances heat convection effect, reduces wall surface temperature；The cooling requirements of great-power electronic chip can be met.
Description
Technical field
The invention belongs to enhanced heat exchange technical field, the miniature heat dissipation in specifically a kind of novel manifold-type labyrinth microchannel
The design of device, the heat dissipation applied to high hot-fluid microelectronic component.
Background technique
With the rapid development of the science and technology such as microelectric technique, large-scale integrated circuit, high-speed computer, high power, height
Integrated level and micromation have become the Main Trends of The Development of electronic device.The integrated component of microelectronic chip is every year with 40%
~50% speed increase, the especially microelectronic chip in some sophisticated technology field such as high powered radars, transient heat flow are close
Degree even as high as 107W/m2.If cannot be timely and effectively to chip cooling, heat build-up will will cause chip performance decline, service life
It reduces, or even burns device.According to statistics, 55% or more the failure of microelectronic chip is caused by heat dissipation problem, and the work of device
Make environment temperature in 70-80 DEG C of level, every to increase by 1 DEG C, reliability decrease 5%.Therefore, it high heat flux density microdevice and sets
Standby heat dissipation problem seriously restricts the development of new and high technology, increasingly by international heat transfer circle and the height of related industrial fields
Pay attention to.Since its transient heat flow density is high, heat dissipation area is small, and conventional chilling technology has been unable to satisfy radiating requirements, develops volume
Miniature cooling technology small, light-weight, that heat transfer efficiency is high, compact-sized is extremely urgent.
At present domestic and foreign scholars actively set about the micro-cooler of research include: microchannel heat sink, it is micro- refrigerator, micro-
Heat pipe soaking piece, integrated micro-cooler and micro-fluidic array are heat sink etc..Wherein, microchannel heat sink because its large specific surface area,
Unit area heat transfer intensity is high, from heavy and light, it is small in size, can be directly integrated on heat radiation chip and avoid thermal stress matching problem
The advantages that, it is considered to be one of the effective ways for solving high heat flux density micromodule equipment heat dissipation problem have obtained domestic and foreign scholars
Great attention and extensively research.But there are the limitations in two designs for micro-channel heat exchanger.First, being by small size institute
The larger flow resistance generated；Second, heat flow density height causes cooling medium temperature change between entrance, outlet larger, cause
Heat exchange surface temperature distributing disproportionation.
Therefore, design pressure drop is smaller, and the microchannel heat sink of uniformity of temperature profile becomes the key of microelectronic chip heat dissipation
Technology.
Summary of the invention
In view of above-mentioned the problem of being previously mentioned, the invention proposes a kind of novel manifold-type complexity microchannel heat sink, purposes
While being to realize micro- radiator enhanced heat exchange, micro- radiator pressure drop is reduced, the uniformity of Temperature Distribution is improved, is high hot-fluid
The operation of chip provides reliable temperature environment.
The present invention devises a kind of novel manifold-type complexity microchannel heat sink, which is characterized in that includes as shown in Figure 1:
Cover board (1), substrate (2), cover board (1) cover substrate (2)；The upper surface of cover board (1) is machined with the through-hole connecting with exterior line,
Respectively as fluid inlet (3) and fluid outlet (4), there are two manifold main channel slot, fluid inlet (3) lower parts for lower surface processing
Manifold main channel slot and the manifold main channel slot of fluid outlet (4) lower part the entrance of complicated microchannel is flowed into respectively as fluid
Main manifold (5) and fluid flow out the outlet main manifold (6) of complicated microchannel；The main discrimination of entrance main manifold (5) length direction and outlet
It is parallel and opposite to manage (6) length direction；Between entrance main manifold (5) and outlet main manifold (6), entrance main manifold (5) is equipped with more
It is a perpendicular to entrance main manifold (5) and to stretch to the entrance branch manifold (9) of outlet main manifold (6), outlet main manifold (6) and entrance branch
There is gap, outlet main manifold (6), which is equipped with, multiple main manifold (6) and stretches to entrance main manifold perpendicular to outlet between manifold (9)
(5) outlet branch manifold (10) has gap, entrance branch manifold (9) between entrance main manifold (5) and outlet branch manifold (10)
With outlet branch manifold (10) alternate intervals distribution；Substrate (2) upper surface processes labyrinth microchannel (7), and multiple parallel answers
Miscellaneous structure microchannel (7) constitutes microchannel region, and entrance main manifold (5) and outlet main manifold (6) are corresponding positioned at microchannel area
The two sides in domain, entrance main manifold (5) and outlet main manifold (6) are parallel with the channel direction of labyrinth microchannel (7)；
The two sides of labyrinth microchannel (7) are formed by both sides of the chest wall (8)；It ties in the channel of labyrinth microchannel (7)
The top view cross section of structure is that multiple flat arrow cavitys head and the tail are connected in series composition, the flat arrow be the tip of arrow replace with
The parallel flush arrangement in end；Two adjacent labyrinth microchannels (7) are staggered half of arrow, i.e., in vertical channel length
It is flat in the corresponding second labyrinth microchannel of the head end of the flat arrow cavity in first labyrinth microchannel on direction
The medium position of arrow cavity, and so on；The top view cross section of rib wall (8) between two labyrinth microchannels (7) be by
The broached-tooth design of multiple triangle tandem compound compositions；
Wherein, the size in complicated microchannel (7) region is identical as the size of cooled wafer.For definitely cover board (1)
With the structure of substrate (2), the three-dimensional views of cover board (1), main view, A-A sectional view, B-B section are set forth in Fig. 2-Fig. 5
Figure；The three-dimensional views of substrate (2), main view, C-C sectional view, D-D sectional view are set forth in Fig. 6-Fig. 9.
As shown in Figure 1, cover board (1) and substrate (2) sealing are formed micro- radiator by bonding techniques.Closed micro- scattered
In hot device, fluid flows through route are as follows: fluid inlet (3), the entrance main manifold (5) of complicated microchannel, labyrinth microchannel
(7), outlet main manifold (6), the fluid outlet (4) of complicated microchannel.Inlet manifold of the cooling fluid through entrance complexity microchannel
(5) it afterwards by entrance branch manifold (9), will evenly spread in labyrinth microchannel, it will be from the bottom surface of labyrinth microchannel
Heat is absorbed with microchannel surface, outlet main manifold (6) is converged to by exporting branch manifold (10), finally from fluid outlet (4)
Outflow.
The present invention adopts the following technical scheme:
Firstly, micro- radiator is distributed using the manifold-type fluid of cover board integrated form, such as Fig. 5.The manifold-type fluid method of salary distribution
There is snakelike thin rib structure to form the entrance main manifold (5) of complicated microchannel and the outlet main manifold (6) of complicated microchannel.Manifold
The number of fluid inlet and outlet and the thickness of rib wall may be according to the actual conditions design optimizations such as the power of actual chips and size.
The manifold-type fluid method of salary distribution efficiently reduces length of flow of the fluid in channel, reduces and gives under micro- radiator flow
The speed of fluid in microchannel, to reduce the pressure drop of micro- radiator, the uniformity for improving Temperature Distribution, reduce micro- dissipate
The thermal stress of hot device.Secondly, the main heat sink part of micro- radiator uses sawtooth pattern labyrinth microchannel (7), such as Fig. 8.
On the one hand disturbance that the micro- radiator of arrowhead-shaped labyrinth increases heat convection area and fluid is put down, heat convection effect is enhanced
Fruit；On the other hand the sawtooth pattern microchannel of dislocation arrangement, increases the cross-sectional area in channel, reduces flow resistance.Therefore, in conjunction with
The manifold-type fluid method of salary distribution and sawtooth pattern labyrinth microchannel effective solution microchannel heat sink flow resistance is big, temperature
The problem of raising, has very important significance to the heat dissipation of high fever stream electronic device.
It is integrated in view of the processing of micro heat exchanger and its with the encapsulation of chip, the manifold-type fluid method of salary distribution is integrated in lid
Back improves the sealing performance of radiator, while reducing manufacturing cost the step of effectively reducing processing, be bonded.
The inlet and outlet of micro- radiator design on cover board (1), vertical with flow direction of the fluid in manifold and microchannel.Compared to flat
Row connects in the inlet and outlet of the flow direction in manifold or microchannel, the micro- radiator and integrated chip of fluid orthogonal direction inlet and outlet
Connect more convenient simple, fluid distributes more evenly, is more advantageous to the heat dissipation of chip.
The dielectric fluids such as deionized water, refrigerant can be selected in heat-exchange working medium.According to the radiating requirements of cooled down electronic chip
With selected heat-exchange working medium, working medium flow needed for determining cools down chip using manifold-type complexity microchannel heat sink
Heat dissipation.
It is integrated in view of the processing of micro heat exchanger and its with the encapsulation of chip, substrate (2) uses silicon materials, cover board (1)
Using silicon or glass.Meanwhile if being used for the heat dissipation of other field, tungsten copper, anaerobic is can be selected in the cover board and substrate of micro- radiator
Copper, silicon etc..Overall set shape, size can require to determine according to the size and total encapsulation of device.It is primarily adapted for use in bar shaped, direction
The heat dissipation of equal devices.
The present invention has following advantages and effect:
1, it imports and exports and designs perpendicular to the radiator fluid in manifold and fluid flows direction, convenient for integrated installation, stream
Body distributing uniformity is good；
2, the step of manifold-type fluid method of salary distribution is integrated in cover board (1) back side, effectively reduces processing, bonding, mentions
The high sealing performance of radiator, while reducing manufacturing cost；
3, the fluid method of salary distribution of manifold-type efficiently reduce length of flow of the fluid in channel, reduce give it is micro-
Under radiator flow in microchannel fluid speed, to significantly reduce the pressure drop of micro- radiator；
4, the fluid method of salary distribution of manifold-type effectively improves the uniformity of fluid distribution, to significantly improve heat dissipation
The uniformity of device Temperature Distribution, the thermal stress for reducing micro- radiator, the reliability for improving radiating element and service life；
5, compared to smooth Rectangular Microchannel, sawtooth pattern labyrinth microchannel on the one hand increase heat convection area and
The disturbance of fluid enhances heat convection effect；On the other hand the sawtooth pattern microchannel of dislocation arrangement, increases the cross section in channel
Product, reduces flow resistance.
Detailed description of the invention
A kind of schematic three dimensional views of Fig. 1 manifold-type labyrinth of present invention microchannel minitype radiator.
The cover board of Fig. 2 minitype radiator of the present invention shows schematic three dimensional views.
The cover board main view of Fig. 3 minitype radiator of the present invention.
The cover board A-A sectional view of Fig. 4 minitype radiator of the present invention.
The cover board B-B sectional view of Fig. 5 minitype radiator of the present invention.
The substrate of Fig. 6 minitype radiator of the present invention shows schematic three dimensional views.
The substrate main view of Fig. 7 minitype radiator of the present invention.
The substrate C-C sectional view of Fig. 8 minitype radiator of the present invention.
Substrate D-D the sectional view of Fig. 9 minitype radiator of the present invention.
The B-B section size figure of Figure 10 present invention specific implementation cover plate manifold wall region.
The C-C section size figure in substrate complexity microchannel region in Figure 11 present invention specific implementation.
Complicated microchannel size schematic diagram in Figure 12 present invention specific implementation.
The scale diagrams of heat source are simulated in Figure 13 present invention specific implementation.
Figure label: 1- cover board, 2- substrate, 3- fluid inlet, 4- fluid outlet, 5- entrance main manifold；6- exports main discrimination
Pipe, 7- labyrinth microchannel, the channel 8- rib wall, 9- entrance branch manifold, 10- export branch manifold.
Specific embodiment
The invention proposes a kind of novel manifold-type labyrinth microchannel minitype radiators, and core concept is: (1)
The fluid distribution that manifold-type is realized by cover board simplifies processing packaging technology, reduces manufacturing cost from production；From performance,
Reduce the pressure drop of micro- radiator, improves the uniformity of fluid distribution, improve the exchange capability of heat of micro- radiator；(2) flat arrow series connection
The sawtooth pattern complexity microchannel of composition enhances heat convection area and flow disturbance, promotes the mixing of cold fluid and hot fluid, reinforcing pair
Flow heat transfer effect；Meanwhile sawtooth pattern microchannel increases the circulation area of fluid, reduces flow resistance.Generally speaking, novel
Manifold-type labyrinth microchannel minitype radiator enhances Convective Heat Transfer, reduces flow resistance, also simplifies and adds
Work technique enhances the reliability of sealing, reduces processing cost, improves economic benefit.
The invention patent is further described with reference to the accompanying drawings and detailed description.But the present invention is not limited to
Following embodiment.
Embodiment 1
It is as shown in Figure 1 a kind of novel manifold-type labyrinth microchannel minitype radiator, overall structure is wrapped under upper
Include 7740 heat resistant glass cover boards 1 and silicon based substrate 2.Working medium uses deionized water.Since the cost of high-power chip is very expensive,
The present embodiment is tested for the property using simulation heat source instead of chip.It simulates heat source and uses platinum heating film.By design
Optimization, the platinum heating film can equably heat production, the fever of analog chip.The input voltage of platinum heating film can be according to chip
Quantity of heat production determine.
7740 heat resistant glass cover boards 1 are identical as the size of silicon based substrate 2, specific size 13mm*5mm*0.5mm.7740
1 upper surface of heat resistant glass cover board processes that 0.2mm is deep, and diameter is the through-hole of 1mm, respectively as fluid inlet 3 and fluid outlet 4,
Through hole center away from radiator short side 6.5mm, away from nearlyr radiator long side 0.9mm；The processing of 7740 heat resistant glass cover board, 1 lower surface
The manifold passage of 0.3mm depth flows into the entrance main manifold 5 of complicated microchannel respectively as fluid and fluid flows out complicated microchannel
Outlet main manifold 6, manifold areas is located at radiator middle position having a size of 10mm*4.2mm, and (i.e. adjacent enters manifold wall thickness
Wall thickness between mouthful branch manifold and outlet branch manifold) it is the serpentine-like layout of 1.05mm, the wide i.e. entrance branch manifold of manifold and outlet branch
The width of manifold is 0.2mm, a length of 2.1mm, and two sides are respectively half of manifold width 0.1mm, as shown in the figure.Silicon based substrate 2
Upper surface is machined with the complicated microchannel 7 of 0.3mm depth, as shown in the figure；The area size of labyrinth microchannel is 10mm*2mm,
The structural parameters of complicated microchannel, as shown, the sawtooth pattern complexity microchannel maximum spacing i.e. arrow that flat arrow is composed in series
Terminal end width be 0.2mm, minimum spacing, that is, arrow head end width is 0.1mm, and the length of haircut is 0.2mm, the saw of rib wall
Toothing depth 0.05mm, a length of 0.2mm of sawtooth；Alternate 0.1mm, the maximum of rib wall are wide in the horizontal direction for the sawtooth of 8 two sides of rib wall
Degree is 0.1mm, minimum widith 0.025mm；Simulating heat source platinum heating film is that the following table of substrate is plated in by sputtering technology
Face, region is identical with microchannel region, as shown in graph region.
The entrance main manifold 5 that the fluid flows into complicated microchannel can uniformly distribute a fluid to microchannel,
Length of flow of the fluid in microchannel is reduced to the 1/8 of non-manifold structure；Meanwhile the situation identical in radiator total flow
Under, flowing velocity of the fluid in microchannel is reduced to the 1/8 of non-manifold structure.Droop loss and speed it is square directly proportional,
It is directly proportional to the length of runner.Therefore, above-mentioned two factor significantly reduces the pressure drop of micro- radiator.
The sawtooth pattern microchannel structure increases heat convection area and flow disturbance, promotes cold fluid and hot fluid in channel
Mixing, to change heat transfer effect by force；Meanwhile the sawtooth pattern microchannel structure for the arrangement that misplaces increases the cross section of fluid circulation
Product, to reduce flow resistance.
It is 60ml/min in flow, heat flow density is compared with traditional Rectangular Microchannel radiator through numerical simulation
200W/cm2When, the pressure drop of this micro- radiator of manifold-type labyrinth reduces 95%, and chip maximum temperature reduces by 5 DEG C, maximum
The temperature difference reduces 15 DEG C.This will effectively reduce the thermal stress of chip, ensure the reliability service of chip, while the reduction of pressure drop
Also the cooling operating cost of micro- radiator is significantly reduced.
Structure of the present invention, micro- radiator structure different from the past, by micro- radiator inlet and outlet 3 and 4, manifold
Main inlet and outlet 5 and 6 are integrated on cover board 2.The micro- radiator of this structure reduces droop loss, and improve and change from performance
Hot property；In terms of production economy, that is, processing technology is simplified, and improve economic performance.Secondly, the week of this micro- radiator
The scalable variable cross-section microchannel of phase property, increases the disturbance of heat convection area and fluid, to enhance heat convection effect；Together
When, the dislocation arrangement of complicated microchannel increases the cross-sectional area of fluid flowing, increases the microchannel number of identical heat dissipation area
Mesh, the increase of reduced pressure drop.
In conclusion the above is only a preferred embodiment of the present invention, it is not intended to limit protection scope of the present invention.It is all
Made any modification and improvement etc., should all be included in the protection scope of the present invention within the spirit and principles in the present invention.
Claims (4)
1. a kind of manifold-type labyrinth microchannel minitype radiator, which is characterized in that including cover board (1), substrate (2), cover board
(1) substrate (2) are covered；The upper surface of cover board (1) is machined with the through-hole connecting with exterior line, respectively as fluid inlet (3)
With fluid outlet (4), there are two manifold main channel slot, the manifold main channel slots and stream of fluid inlet (3) lower part for lower surface processing
The manifold main channel slot that body exports (4) lower part flows into the entrance main manifold (5) and fluid stream of complicated microchannel respectively as fluid
The outlet main manifold (6) of complicated microchannel out；Entrance main manifold (5) length direction is parallel with outlet main manifold (6) length direction
And it is opposite；Between entrance main manifold (5) and outlet main manifold (6), entrance main manifold (5) is equipped with multiple perpendicular to entrance main manifold
(5) and the entrance branch manifold (9) for exporting main manifold (6) is stretched to, exported between having between main manifold (6) and entrance branch manifold (9)
Gap, outlet main manifold (6), which is equipped with, multiple perpendicular to outlet main manifold (6) and stretches to the outlet branch manifold of entrance main manifold (5)
(10), there is gap, entrance branch manifold (9) and outlet branch manifold (10) between entrance main manifold (5) and outlet branch manifold (10)
Alternate intervals distribution；Substrate (2) upper surface processes labyrinth microchannel (7), multiple parallel labyrinth microchannel (7) structures
At microchannel region, the corresponding two sides positioned at microchannel region of entrance main manifold (5) and outlet main manifold (6), the main discrimination of entrance
It manages (5) and outlet main manifold (6) is parallel with the channel direction of labyrinth microchannel (7)；
The two sides of labyrinth microchannel (7) are formed by both sides of the chest wall (8)；The channel design of labyrinth microchannel (7)
Top view cross section is that multiple flat arrow cavitys head and the tail are connected in series composition, and the flat arrow is that the tip of arrow replaces with and end
Parallel flush arrangement；Two adjacent labyrinth microchannels (7) are staggered half of arrow, i.e., in the direction of vertical channel length
On, the flat arrow in the corresponding second labyrinth microchannel of the head end of the flat arrow cavity in first labyrinth microchannel
The medium position of cavity, and so on；The top view cross section of rib wall (8) between two labyrinth microchannels (7) is by multiple
The broached-tooth design of triangle tandem compound composition.
2. a kind of manifold-type labyrinth microchannel described in accordance with the claim 1 minitype radiator, which is characterized in that microchannel
The size in region and the size of cooled wafer are identical.
3. a kind of manifold-type labyrinth microchannel described in accordance with the claim 1 minitype radiator, which is characterized in that pass through key
Cover board (1) and substrate (2) sealing are formed micro- radiator by conjunction technology.
4. a kind of manifold-type labyrinth microchannel described in accordance with the claim 1 minitype radiator, which is characterized in that closing
Micro- radiator in, fluid flows through route are as follows: fluid inlet (3), entrance main manifold (5), the labyrinth of complicated microchannel are micro-
Outlet main manifold (6), the fluid outlet (4) in channel (7), complicated microchannel.Entrance of the cooling fluid through entrance complexity microchannel
Manifold (5) will be evenly spread in labyrinth microchannel afterwards by entrance branch manifold (9), will be from labyrinth microchannel
Bottom surface and microchannel surface absorb heat, outlet main manifold (6) are converged to by exporting branch manifold (10), finally from fluid outlet
(4) it flows out.
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| CN201910518020.0A CN110164835B (en) | 2019-06-14 | 2019-06-14 | Manifold type micro-channel micro-radiator with complex structure |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111900143A (en) * | 2020-07-31 | 2020-11-06 | 上海交通大学 | Manifold type high depth-width ratio micro-channel heat exchanger |
| CN111970897A (en) * | 2020-08-06 | 2020-11-20 | 中国电子科技集团公司第三十八研究所 | Heat exchange radiator is reinforceed to semi-enclosed island type rib pole side hole vortex |
| CN112185914A (en) * | 2020-08-31 | 2021-01-05 | 南京理工大学 | Electronic chip self-adaptive micro-channel cooling device and manufacturing method thereof |
| CN113257763A (en) * | 2021-05-21 | 2021-08-13 | 北京大学 | Lead bonding structure comprising embedded manifold type micro-channel and preparation method thereof |
| CN113267082A (en) * | 2021-04-19 | 2021-08-17 | 北京科技大学 | Preparation method of manifold type all-diamond micro-channel radiator |
| CN113488441A (en) * | 2021-05-21 | 2021-10-08 | 北京大学 | Packaging structure based on manifold channel cover plate and preparation method thereof |
| CN114136129A (en) * | 2021-12-20 | 2022-03-04 | 山东大学 | Manifold micro-column array flat plate heat exchanger |
| CN114141733A (en) * | 2021-11-24 | 2022-03-04 | 西安交通大学 | Hierarchical formula manifold microchannel heat abstractor |
| CN114577042A (en) * | 2022-01-22 | 2022-06-03 | 合肥工业大学 | Small multichannel boiling heat exchange type uniform-temperature cooling plate |
| CN114664769A (en) * | 2022-03-13 | 2022-06-24 | 南昌大学 | Silicon-based microchannel radiator |
| CN115682796A (en) * | 2022-11-04 | 2023-02-03 | 山东高等技术研究院 | 3D printing porous medium cold plate and preparation process thereof |
| CN115768045A (en) * | 2022-11-07 | 2023-03-07 | 北京大学 | Radiator and electronic equipment |
| CN116190330A (en) * | 2023-02-21 | 2023-05-30 | 华中科技大学 | Manifold microchannel radiator based on hot spot area orientation optimization |
| CN116741725A (en) * | 2023-08-08 | 2023-09-12 | 湖南大学 | Self-cooling type near junction thermal management structure of power module |
| CN117641850A (en) * | 2023-12-04 | 2024-03-01 | 南京理工大学 | Manifold microchannel heat abstractor of bionical plant rhizome |
| CN117641850B (en) * | 2023-12-04 | 2024-07-02 | 南京理工大学 | Manifold microchannel heat abstractor of bionical plant rhizome |
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| CN111900143A (en) * | 2020-07-31 | 2020-11-06 | 上海交通大学 | Manifold type high depth-width ratio micro-channel heat exchanger |
| CN111970897A (en) * | 2020-08-06 | 2020-11-20 | 中国电子科技集团公司第三十八研究所 | Heat exchange radiator is reinforceed to semi-enclosed island type rib pole side hole vortex |
| CN111970897B (en) * | 2020-08-06 | 2022-06-21 | 中国电子科技集团公司第三十八研究所 | Heat exchange radiator is reinforceed to semi-enclosed island type rib pole side hole vortex |
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| CN115682796A (en) * | 2022-11-04 | 2023-02-03 | 山东高等技术研究院 | 3D printing porous medium cold plate and preparation process thereof |
| CN115768045B (en) * | 2022-11-07 | 2023-10-03 | 北京大学 | Radiator and electronic equipment |
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| CN116741725A (en) * | 2023-08-08 | 2023-09-12 | 湖南大学 | Self-cooling type near junction thermal management structure of power module |
| CN117641850A (en) * | 2023-12-04 | 2024-03-01 | 南京理工大学 | Manifold microchannel heat abstractor of bionical plant rhizome |
| CN117641850B (en) * | 2023-12-04 | 2024-07-02 | 南京理工大学 | Manifold microchannel heat abstractor of bionical plant rhizome |
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