CN113224018A - Low-temperature-rise local-encryption type sine corrugated micro-channel radiator - Google Patents
Low-temperature-rise local-encryption type sine corrugated micro-channel radiator Download PDFInfo
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- CN113224018A CN113224018A CN202110622232.0A CN202110622232A CN113224018A CN 113224018 A CN113224018 A CN 113224018A CN 202110622232 A CN202110622232 A CN 202110622232A CN 113224018 A CN113224018 A CN 113224018A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
A low-temperature rise local-encryption type sine corrugated micro-channel radiator belongs to the field of heat exchange enhancement. A downstream local encryption sine ripple micro-channel heat exchanger belongs to the field of enhanced heat exchange and is mainly applied to the technical field of microelectronics. With the development of microelectronics, the thermal load of advanced devices and devices is increasing. Traditional heat dissipation technology has been unable to satisfy the heat transfer demand of high heat, and microchannel heat exchanger begins to receive people's extensive attention. The device comprises a packaging sheet (1) and a substrate (2) which are sequentially stacked and packaged together; the packaging sheet (1) is provided with a fluid inlet (3) and a fluid outlet (4) which are connected with an external pipeline; the front surface of the substrate is provided with a downstream local encrypted sine ripple microchannel (5), an inlet liquid storage tank (6) and an outlet liquid storage tank (7). The device can meet the heat dissipation of the high-power electronic chip; the problem of chip temperature rise too big is effectively solved.
Description
Technical Field
The invention belongs to the technical field of enhanced heat transfer, and particularly relates to a cooling device applied to the technical field of microelectronics.
Background
With the development of scientific technologies such as microelectronics, large scale integrated circuits, high speed computers, etc., high power, high integration and miniaturization have become major development trends of electronic devices. But its higher heat flux density becomes a bottleneck that hinders its further development. The development of microelectronic technology has greatly promoted the development of micro-scale heat transfer and flow research in the engineering field, the traditional heat dissipation method cannot meet the heat dissipation requirement of high heat flux density, and the flow and heat transfer problems under the conditions of space micro-scale and time micro-scale are more and more concerned by a plurality of researchers in the heat transfer field.
Among them, the cooling of the micro-channel heat sink liquid is one of the effective heat transfer enhancement methods to remove the high heat flux density. There are three common methods for enhancing heat transfer of fluid in the channel, i.e. active method, passive method and composite method can be used to enhance heat transfer in the channel. Active methods require additional energy to enhance the heat transfer of the fluid; whereas the passive method requires the use of special surface structures or the change of working substances. The composite method is a combination of passive and active methods. Among them, passive technology is favored because it does not consume extra energy, is easy to operate, and has low cost.
Common passive techniques are increasing the channel surface roughness, expanding the surface, modifying the channel geometry, etc. The main mechanism of the heat exchange enhancement is as follows; disrupting the thermal and hydrodynamic boundary layers, enhancing mixing of the coolant by creating fluid disturbances, or increasing fluid velocity in the boundary layers.
Disclosure of Invention
The invention aims to provide a radiator which can effectively control temperature rise and enhance heat exchange on the basis of single-phase convective heat exchange and is used for solving the problems of high-efficiency heat dissipation of a chip and overlarge local temperature.
The invention designs a partially-encrypted corrugated micro-channel radiator which is characterized by comprising packaging sheets (1) and a substrate (2) which are sequentially stacked and packaged together as shown in figure 1; the packaging sheet (1) is provided with a fluid inlet (3) and a fluid outlet (4) which are connected with an external pipeline; a rectangular groove (9) is processed on the front surface of the substrate, namely the surface connected with the packaging sheet (1), the rectangular groove is divided into three sections, the middle section is a locally encrypted sine corrugated micro-channel (5), and an inlet liquid storage tank (6) and an outlet liquid storage tank (7) are respectively and correspondingly arranged on two sides of the middle section; the inlet liquid storage tank (6) is communicated with the fluid inlet (3) up and down oppositely, and the outlet liquid storage tank (7) is communicated with the fluid outlet (4) up and down oppositely;
the locally encrypted sinusoidal ripple microchannel (5) is a microchannel formed by a plurality of sinusoidal ripples arranged in parallel, wherein the ripples are divided into at least two different sections, namely, a section connected with the inlet liquid storage tank (6) is called as an upstream section, a section connected with the outlet liquid storage tank (7) is called as a downstream section, and the wavelength of the upstream ripples is larger than that of the downstream ripples, so that the downstream sinusoidal ripple microchannel is locally encrypted relative to the upstream sinusoidal ripple microchannel.
The height of the sine wave micro-channel is not more than the groove depth of the rectangular groove (9). The height of the sine wave micro-channel is less than or equal to 300 microns.
The processing area of the local encrypted sine wave micro-channel (5) provided by the invention can be determined according to the size of an electronic device. In order to further clarify the structure of the substrate (2), fig. 1(c), 1(d), and 1(e) show a front view, a cross-sectional view a-a, and a cross-sectional view B-B of the substrate (2), respectively.
As shown in fig. 2, the packaging sheet (1) and the substrate (2) are bonded together to form a partially-encrypted sine-corrugated micro-channel heat exchanger (8). In the microchannel heat exchanger, working media sequentially flow through a fluid inlet (3), an inlet liquid storage tank (6), a local encryption sine ripple microchannel (5), an outlet liquid storage tank (7) and a fluid outlet (4). After the heat exchange working medium flows through the inlet liquid storage tank (6), the heat exchange working medium enters the local encrypted sine corrugated micro-channel (5) in a uniformly dispersed mode, takes away heat from the bottom surface of the micro-channel through single-phase convection heat exchange, and then is collected into the outlet liquid storage tank (7).
The invention adopts the following technical scheme:
the main part of the heat exchanger adopts a partially-encrypted sine ripple microchannel (5). The local encrypted sine ripple microchannel (5) consists of an upstream part, a middle part and a downstream part, wherein the downstream wavelength encryption is 500 microns. The encryption position and the encryption degree of the sine ripple micro-channel can be designed and optimized according to the actual conditions of the local heat exchange environment, the size and the like of the actual chip. On one hand, the partially encrypted sine ripple micro-channel (5) can increase fluid disturbance mixing for waveform encryption, thereby effectively enhancing the heat exchange coefficient; on the other hand, compared with the traditional integral encryption design, the design of the local encryption effectively reduces the flow resistance. Therefore, the local encryption sine ripple micro-channel heat exchanger for single-phase convection heat exchange is one of effective methods for heat dissipation of the high heat flow density chip.
Considering the packaging integration of the micro heat exchanger and the chip, the inlet and the outlet of the micro heat exchanger are designed on the packaging sheet (1) and are vertical to the flowing direction of the fluid in the micro channel. Compared with a fluid inlet and outlet in the horizontal direction, the micro heat exchangers of the fluid inlet and outlet in the vertical direction are more simply and conveniently connected with the chip integrated plate, and the flow of each micro heat exchanger can be controlled according to the heat dissipation capacity of different chips, so that the temperature of each chip on the chip integrated plate is uniformly distributed.
The heat exchange working medium can be selected from deionized water, refrigerant and other insulating fluids. According to the working medium and the optimal working temperature range of the electronic device, the local encryption sine wave micro-channel single-phase convection heat exchange is formed on the heat exchange surface to realize the cooling technical requirement.
The micro heat exchanger material can be oxygen-free copper, silicon and the like. The overall geometry, dimensions may be determined based on the electronic device dimensions and overall packaging requirements. The cooling device is mainly suitable for cooling heating surfaces such as strip-shaped and square surfaces.
The invention has the following advantages and effects:
1. the vertical fluid inlet is convenient for integrated installation;
2. compared with a rectangular micro-channel heat exchanger, the flow and heat exchange comprehensive performance of the partially-encrypted sine corrugated micro-channel heat exchanger is improved.
3. Compared with the traditional sine ripple micro-channel, the pressure drop of the local encryption sine ripple micro-channel heat exchanger with the same heat exchange effect is obviously reduced.
4. The local encryption sine ripple micro-channel can effectively improve the phenomenon that the thermal boundary layer becomes thick gradually along the flowing direction.
5. The local encrypted sine ripple micro-channel can improve the situation of local overhigh temperature according to practical application.
Drawings
Fig. 1 (a): the invention is provided with a packaging sheet which is connected with an external pipeline and is provided with a fluid inlet and a fluid outlet.
Fig. 1 (b): the invention has the base plate sketch map of the downstream local encryption sine ripple micro channel
Fig. 1 (c): the invention has a front view of a substrate with downstream partially-encrypted sinusoidal corrugated microchannels.
Fig. 1 (d): the invention provides a cross-sectional view of a substrate A-A with downstream partially densified sinusoidal corrugated microchannels.
Fig. 1 (e): the invention provides a substrate B-B cross-sectional view with downstream partially densified sinusoidal corrugated microchannels.
FIG. 2: the present invention is schematically illustrated with the structure shown in fig. 1.
FIG. 3: the invention simulates a schematic diagram of a cooling chip.
FIG. 4: the single channel schematic diagram of the local encryption ripple micro-channel in the embodiment of the invention.
Reference numbers in the figures: 1-packaging piece, 2-substrate, 3-fluid inlet, 4-fluid outlet, 5-local encrypted sine ripple microchannel, 6-inlet liquid storage tank, 7-outlet liquid storage tank, 8-micro heat exchanger, 9-rectangular groove and 10-heating surface.
Detailed Description
The invention provides a partially-encrypted sine corrugated micro-channel heat exchanger for single-phase convection heat exchange, and the invention is further described with reference to the accompanying drawings and the specific embodiment.
Example 1
The local encryption sine ripple micro-channel heat exchanger consists of a packaging sheet (1) and a micro-channel base (2). The packaging sheet adopts 7740 heat-resistant glass, the substrate adopts silicon, and the working medium adopts deionized water. Because the cost of the high-power chip is very expensive, the performance of the micro-channel heat exchanger is tested by adopting a numerical simulation method. In the embodiment, three different microchannel heat exchangers are tested, the thickness of the silicon substrate is 400 micrometers, the depth of the microchannel is 300 micrometers, the diameters of an inlet and an outlet are 1mm, and the area of the heating surface of the silicon substrate is 6 multiplied by 3mm2Providing 200W/cm for micro-channel heat sink2Uniform heat flux density, and the overall dimension of the entire micro heat exchanger is 9 multiplied by 4 multiplied by 0.6mm3. The amplitude (vertical distance between the peaks and valleys) of the partially-encrypted sinusoidal corrugated microchannels was 120 microns, the wavelength at the non-encrypted part, i.e., upstream and middle, was 1000 microns (total length of upstream 4mm in the direction of water flow), and the wavelength at the downstream encrypted part was 500 microns (along the water flow)The total length downstream in the flow direction is 2 mm); the width of the microchannel is 0.1 mm. The whole simulation process is that deionized water enters an inlet liquid storage tank (6) through a fluid inlet (3), uniformly disperses to enter a local encrypted sine ripple micro-channel (5), takes away heat from the bottom surface of the channel through heat convection, collects the heat into an outlet liquid storage tank (7), and finally flows out from a fluid outlet (4).
The sine expression of the side wall sine wave of the local encrypted ripple microchannel (5) is as follows:
wherein, the amplitude A is 120 microns; downstream of the wavelength λ is 500 microns at the encryption site and 1000 microns at the non-encryption site.
And comparing simulation results of the rectangular micro-channel heat exchanger, the traditional sine ripple micro-channel heat exchanger and the local encryption sine ripple micro-channel heat exchanger. When the cross sections of the channels of the micro-channel radiator are the same and the bottom surface heat flux density is 200W/cm2When the inlet speed is 1.5m/s, the maximum temperature of the bottom surface of the rectangular microchannel radiator is 321K, and the maximum temperature difference is 28K. This is mainly due to the fact that the thermal boundary layer becomes increasingly thicker in the direction of flow, which leads to a deterioration in heat transfer, which is detrimental to the practical application of the heat sink. The maximum temperature of the bottom surface of the sine corrugated micro-channel radiator is 309K, the maximum temperature difference is 16K, and the maximum temperature is reduced by 12K compared with that of a rectangular micro-channel radiator. The heat exchange area is enhanced by the waveform wall surface, the disturbance of fluid is increased, the heat exchange strength of the heat exchanger is enhanced, but the highest temperature of the sine corrugated micro-channel still appears at the downstream of the radiator, and the temperature distribution is uneven. The maximum bottom surface temperature of the downstream encryption type sine corrugated micro-channel radiator is 307K, and the maximum bottom surface temperature difference is 14K. Compared with a rectangular microchannel radiator, the maximum temperature is reduced by 14K; compared with the sine ripple micro-channel, the maximum temperature difference is reduced by 2K. And the downstream encryption type sine corrugated micro-channel radiator effectively enhances the local heat exchange of the downstream, solves the problem of relatively poor temperature of the local heat exchange of the downstream, realizes the heat dissipation of the electronic device with high heat flux density, ensures that the temperature of the electronic device can be maintained in the optimal working temperature range, and prolongs the service life.
Claims (6)
1. A corrugated micro-channel radiator with partially encrypted is characterized by comprising packaging sheets (1) and a substrate (2) which are sequentially stacked and packaged together; the packaging sheet (1) is provided with a fluid inlet (3) and a fluid outlet (4) which are connected with an external pipeline; a rectangular groove (9) is processed on the front surface of the substrate, namely the surface connected with the packaging sheet (1), the rectangular groove is divided into three sections, the middle section is a locally encrypted sine corrugated micro-channel (5), and an inlet liquid storage tank (6) and an outlet liquid storage tank (7) are respectively and correspondingly arranged on two sides of the middle section; the inlet liquid storage tank (6) is communicated with the fluid inlet (3) up and down oppositely, and the outlet liquid storage tank (7) is communicated with the fluid outlet (4) up and down oppositely;
the locally encrypted sinusoidal ripple microchannel (5) is a microchannel formed by a plurality of sinusoidal ripples arranged in parallel, wherein the ripples are divided into at least two different sections, namely, a section connected with the inlet liquid storage tank (6) is called as an upstream section, a section connected with the outlet liquid storage tank (7) is called as a downstream section, and the wavelength of the upstream ripples is larger than that of the downstream ripples, so that the downstream sinusoidal ripple microchannel is locally encrypted relative to the upstream sinusoidal ripple microchannel.
2. A partially densified corrugated microchannel heat sink according to claim 1, wherein the height of the sinusoidal corrugated microchannel is not greater than the groove depth of the rectangular groove (9); the height of the sine wave micro-channel is less than or equal to 300 microns.
3. A partially densified corrugated micro-channel heat sink according to claim 1, wherein the partially densified sinusoidal corrugated micro-channel heat exchanger (8) is formed by bonding the package sheet (1) and the substrate (2) together.
4. The partially densified corrugated microchannel heat sink according to claim 1, wherein in the microchannel heat exchanger, the working fluid flows through the fluid inlet (3), the inlet reservoir (6), the partially densified sinusoidal corrugated microchannel (5), the outlet reservoir (7), and the fluid outlet (4) in this order. After the heat exchange working medium flows through the inlet liquid storage tank (6), the heat exchange working medium enters the local encrypted sine corrugated micro-channel (5) in an evenly dispersed mode, takes away heat from the bottom surface of the micro-channel through single-phase convection heat exchange, and then is collected into the outlet liquid storage tank (7).
5. The partially densified corrugated micro-channel heat sink according to claim 4, wherein the heat exchange medium is selected from the group consisting of deionized water, refrigerants and other insulating fluids.
6. The partially densified corrugated micro-channel heat sink of claim 1, wherein the micro heat exchanger material is selected from oxygen-free copper and silicon.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110622232.0A CN113224018A (en) | 2021-06-03 | 2021-06-03 | Low-temperature-rise local-encryption type sine corrugated micro-channel radiator |
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| CN202110622232.0A CN113224018A (en) | 2021-06-03 | 2021-06-03 | Low-temperature-rise local-encryption type sine corrugated micro-channel radiator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115791244A (en) * | 2023-02-06 | 2023-03-14 | 中国核动力研究设计院 | Modular microchannel compact heat exchange experiment body, method, equipment and medium |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115791244A (en) * | 2023-02-06 | 2023-03-14 | 中国核动力研究设计院 | Modular microchannel compact heat exchange experiment body, method, equipment and medium |
| CN115791244B (en) * | 2023-02-06 | 2023-04-28 | 中国核动力研究设计院 | Modular microchannel compact heat exchange experiment body, method, equipment and medium |
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