CN110164835B - Manifold type micro-channel micro-radiator with complex structure - Google Patents
Manifold type micro-channel micro-radiator with complex structure Download PDFInfo
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- CN110164835B CN110164835B CN201910518020.0A CN201910518020A CN110164835B CN 110164835 B CN110164835 B CN 110164835B CN 201910518020 A CN201910518020 A CN 201910518020A CN 110164835 B CN110164835 B CN 110164835B
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- 239000012530 fluid Substances 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims description 13
- 238000005516 engineering process Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 4
- 239000012809 cooling fluid Substances 0.000 claims description 2
- 238000009826 distribution Methods 0.000 abstract description 19
- 230000017525 heat dissipation Effects 0.000 abstract description 16
- 230000000694 effects Effects 0.000 abstract description 7
- 238000013461 design Methods 0.000 abstract description 6
- 238000012545 processing Methods 0.000 description 8
- 238000004377 microelectronic Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
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- 238000004088 simulation Methods 0.000 description 1
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- 238000004544 sputter deposition Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
A manifold type micro-channel micro-radiator with a complex structure belongs to the technical field of enhanced heat exchange. Comprises a cover plate (1) and a base plate (2) which are stacked and packaged together in sequence; the upper surface of the cover plate (1) is provided with a through hole connected with an external pipeline, the through hole is respectively used as a fluid inlet (3) and a fluid outlet (4), the lower surface of the cover plate is provided with a manifold channel, and the manifold channel is respectively used as an inlet main manifold (5) for fluid to flow into the complex micro-channel and an outlet main manifold (6) for fluid to flow out of the complex micro-channel; the upper surface of the base plate (2) is provided with micro-channels (7) with complex structures and rib walls (8). The manifold type design of the device effectively reduces the flow resistance and improves the uniformity of temperature distribution; meanwhile, the micro-channel with the complex structure increases the convection heat exchange area and the disturbance of fluid, enhances the convection heat exchange effect and reduces the wall temperature; the heat dissipation requirement of the high-power electronic chip can be met.
Description
Technical Field
The invention belongs to the technical field of enhanced heat exchange, and particularly relates to a design of a novel manifold type micro-channel micro-radiator with a complex structure, which is applied to heat dissipation of high-heat-flow microelectronic devices.
Background
With the rapid development of microelectronics, large-scale integrated circuits, high-speed computers, and other scientific technologies, high power, high integration, and miniaturization have become major trends in electronic devices. Microelectronic chip integration elements are increasing at a rate of 40% -50% per year, especially in some sophisticated technology areas such as high power radar microelectronic chips, transient heat flux densities even up to 10 7 W/m 2 . If the chip cannot be effectively cooled in time, heat accumulation can cause the performance of the chip to be reduced, the service life to be shortened, and even the device to be burnt. It is counted that more than 55% of the failures of microelectronic chips are caused by heat dissipation problems, and the reliability is reduced by 5% every 1 ℃ increase in the operating environment temperature of the device at 70-80 ℃. Therefore, the heat dissipation problem of the micro devices and equipment with high heat flux density severely restricts the development of the high and new technology, and is more and more paid attention to the international heat transfer field and the related industrial fields. Because of the high transient heat flux density and small heat dissipation area, the conventional cooling technology cannot meet the heat dissipation requirement, and the development of a miniature cooling technology with small volume, light weight, high heat transfer efficiency and compact structure is urgent.
At present, the micro cooler which is actively researched by students at home and abroad comprises: microchannel heat sinks, micro freezers, micro heat pipe soaking fins, integrated micro coolers, micro jet array heat sinks, and the like. The microchannel radiator has the advantages of large specific surface area, high heat exchange strength per unit area, light dead weight, small volume, capability of being directly integrated on a radiating chip to avoid the problem of thermal stress matching, and the like, is considered as one of effective methods for solving the problem of radiating of high-heat-flux micro equipment, and is highly valued and widely studied by students at home and abroad. There are two design limitations to microchannel heat exchangers. First, the large flow resistance due to the small size; secondly, the high heat flux density causes larger temperature change of the cooling medium between the inlet and the outlet, and uneven temperature distribution of the heat exchange surface is caused.
Therefore, designing a microchannel heat sink with a small pressure drop and uniform temperature distribution becomes a key technology for heat dissipation of microelectronic chips.
Disclosure of Invention
In view of the above-mentioned problems, the present invention provides a novel manifold type complex microchannel radiator, which aims to reduce pressure drop of the micro radiator, improve uniformity of temperature distribution and provide a reliable temperature environment for operation of a high heat flow chip while realizing enhanced heat exchange of the micro radiator.
The invention designs a novel manifold type complex microchannel radiator, which is characterized in that as shown in fig. 1: comprises a cover plate (1), a base plate (2), and the cover plate (1) covers the base plate (2); the upper surface of the cover plate (1) is provided with a through hole connected with an external pipeline and is respectively used as a fluid inlet (3) and a fluid outlet (4), the lower surface of the cover plate is provided with two manifold main channel grooves, and the manifold main channel grooves at the lower part of the fluid inlet (3) and the manifold main channel grooves at the lower part of the fluid outlet (4) are respectively used as an inlet main manifold (5) for fluid to flow into the complex micro-channel and an outlet main manifold (6) for fluid to flow out of the complex micro-channel; the length direction of the inlet main manifold (5) is parallel and opposite to the length direction of the outlet main manifold (6); the inlet main manifold (5) is provided with a plurality of inlet branch manifolds (9) which are perpendicular to the inlet main manifold (5) and extend to the outlet main manifold (6), gaps are reserved between the outlet main manifold (6) and the inlet branch manifolds (9), the outlet main manifold (6) is provided with a plurality of outlet branch manifolds (10) which are perpendicular to the outlet main manifold (6) and extend to the inlet main manifold (5), gaps are reserved between the inlet main manifold (5) and the outlet branch manifolds (10), and the inlet branch manifolds (9) and the outlet branch manifolds (10) are alternately distributed at intervals; the upper surface of the substrate (2) is processed with a micro-channel (7) with a complex structure, a micro-channel area is formed by a plurality of parallel micro-channels (7) with the complex structure, the inlet main manifold (5) and the outlet main manifold (6) are correspondingly positioned at two sides of the micro-channel area, and the inlet main manifold (5) and the outlet main manifold (6) are parallel to the channel direction of the micro-channel (7) with the complex structure;
two sides of the micro-channel (7) with the complex structure are formed by two rib walls (8); the top view section of the channel structure of the micro-channel (7) with the complex structure is formed by connecting a plurality of flat arrow cavities in series end to end, and the flat arrow is a flush structure with the tip of the arrow replaced by being parallel to the tail end; two adjacent micro-channels (7) with complex structures are staggered by half an arrow, namely, in the direction of the length of the vertical channel, the head end of a flat arrow cavity in a first micro-channel with complex structures corresponds to the middle position of a flat arrow cavity in a second micro-channel with complex structures, and so on; the top-down section of the rib wall (8) between the two micro-channels (7) with complex structures is a sawtooth structure formed by combining a plurality of triangles in series;
wherein the size of the region of the complex microchannel (7) is the same as the size of the cooling chip. In order to better clarify the structure of the cover plate (1) and the base plate (2), fig. 2 to 5 respectively show a three-dimensional view, a front view, A-A section view and a B-B section view of the cover plate (1); fig. 6 to 9 show a three-dimensional view, a front view, a C-C section view, and a D-D section view of the substrate (2), respectively.
As shown in fig. 1, the cover plate (1) and the base plate (2) are sealed by a bonding technique to form a micro heat sink. In a closed micro-radiator, the fluid flow path is: a fluid inlet (3), an inlet main manifold (5) of a complex microchannel, a complex structure microchannel (7), an outlet main manifold (6) of a complex microchannel, and a fluid outlet (4). The cooling fluid is uniformly dispersed into the micro-channels with complex structures through the inlet branch manifolds (9) after passing through the inlet manifolds (5) of the micro-channels with complex structures, absorbs heat from the bottom surfaces and the micro-channel surfaces of the micro-channels with complex structures, is converged into the outlet main manifold (6) through the outlet branch manifolds (10), and finally flows out from the fluid outlet (4).
The invention adopts the following technical scheme:
first, the micro-radiator employs a cover plate integrated manifold type fluid distribution, as shown in fig. 5. The manifold type fluid distribution mode comprises an inlet main manifold (5) with a serpentine thin rib structure for forming a complex microchannel and an outlet main manifold (6) with a complex microchannel. The number of fluid inlets and outlets of the manifold and the thickness of the rib wall can be designed and optimized according to the actual conditions such as the power and the size of an actual chip. The manifold type fluid distribution mode effectively reduces the flow length of the fluid in the channel and the speed of the fluid in the micro channel under the given flow rate of the micro radiator, thereby reducing the pressure drop of the micro radiator, improving the uniformity of temperature distribution and reducing the thermal stress of the micro radiator. Second, the main heat dissipation part of the micro heat sink adopts a saw-tooth type micro channel (7) with a complex structure, as shown in fig. 8. On one hand, the flat arrow-shaped micro radiator with the complex structure increases the convection heat exchange area and the disturbance of fluid, and enhances the convection heat exchange effect; on the other hand, the staggered saw-tooth micro-channels increase the cross-sectional area of the channels and reduce the flow resistance. Therefore, the problems of large flow resistance and high temperature rise of the microchannel radiator are effectively solved by combining the manifold type fluid distribution mode and the zigzag type microchannel with complex structure, and the method has very important significance for heat dissipation of high-heat-flow electronic devices.
In consideration of the processing of the miniature heat exchanger and the packaging integration of the miniature heat exchanger and the chip, the manifold type fluid distribution mode is integrated on the back surface of the cover plate, so that the steps of processing and bonding are effectively reduced, the sealing performance of the radiator is improved, and meanwhile, the manufacturing cost is reduced. The inlet and outlet of the micro radiator are arranged on the cover plate (1) and are perpendicular to the flow direction of the fluid in the manifold and the micro channel. Compared with an inlet and an outlet parallel to the flow direction in the manifold or the micro-channel, the micro-radiator with the inlet and the outlet in the vertical direction of the fluid is more convenient and simpler to integrally connect with the chip, and the fluid distribution is more uniform, so that the heat dissipation of the chip is more facilitated.
The heat exchange working medium can be selected from insulating fluids such as deionized water, refrigerant and the like. And determining the flow of the working medium according to the heat dissipation requirement of the cooled electronic chip and the selected heat exchange working medium, and cooling and dissipating the chip by adopting a manifold type complex micro-channel radiator.
Considering the processing of the miniature heat exchanger and the packaging integration of the miniature heat exchanger and the chip, the substrate (2) is made of silicon material, and the cover plate (1) is made of silicon or glass. Meanwhile, if the radiator is used for heat dissipation in other fields, the cover plate and the base plate of the micro radiator can be made of tungsten copper, oxygen-free copper, silicon and the like. The overall aggregate shape, size may be determined based on the size of the device and the overall packaging requirements. The heat dissipation device is mainly suitable for heat dissipation of devices such as strip-shaped devices, direction devices and the like.
The invention has the following advantages and effects:
1. the design of the fluid inlet and outlet of the radiator perpendicular to the fluid flowing direction of the manifold and the channel is convenient for integrated installation and has good fluid distribution uniformity;
2. the manifold type fluid distribution mode is integrated on the back surface of the cover plate (1), so that the steps of processing and bonding are effectively reduced, the sealing performance of the radiator is improved, and meanwhile, the manufacturing cost is reduced;
3. the manifold type fluid distribution mode effectively reduces the flow length of the fluid in the channel and the speed of the fluid in the micro channel under the given flow rate of the micro radiator, thereby obviously reducing the pressure drop of the micro radiator;
4. the manifold type fluid distribution mode effectively improves the uniformity of fluid distribution, thereby obviously improving the uniformity of temperature distribution of the radiator, reducing the thermal stress of the micro radiator, improving the reliability and the service life of a radiating device;
5. compared with a smooth rectangular micro-channel, the zigzag micro-channel with the complex structure increases the convection heat exchange area and the disturbance of fluid on the one hand, and enhances the convection heat exchange effect; on the other hand, the staggered saw-tooth micro-channels increase the cross-sectional area of the channels and reduce the flow resistance.
Drawings
FIG. 1 is a schematic three-dimensional view of a manifold-type microchannel micro-radiator with complex structure according to the present invention.
Fig. 2 is a schematic three-dimensional view of a cover plate of the micro heat sink of the present invention.
Fig. 3 is a front view of a cover plate of the micro heat sink of the present invention.
FIG. 4 is a cross-sectional view of a cover plate A-A of the micro heat sink of the present invention.
FIG. 5 is a cross-sectional view of a cover plate B-B of the micro heat sink of the present invention.
Fig. 6 is a three-dimensional schematic view of a substrate of the micro heat sink of the present invention.
Fig. 7 is a front view of a substrate of the micro heat sink of the present invention.
FIG. 8 is a cross-sectional view of a substrate C-C of the micro heat sink of the present invention.
Fig. 9 is a cross-sectional view of a substrate D-D of the micro heat sink of the present invention.
Figure 10 is a B-B cross-sectional dimension of a manifold wall region of a cover plate in an embodiment of the present invention.
FIG. 11 is a cross-sectional view of a C-C section of a complex microchannel region of a substrate in the practice of the invention.
FIG. 12 is a schematic diagram of complex microchannel dimensions in an implementation of the invention.
FIG. 13 is a schematic dimensional view of an analog heat source in the practice of the invention.
Reference numerals in the drawings: 1-cover plate, 2-base plate, 3-fluid inlet, 4-fluid outlet, 5-inlet main manifold; 6-outlet main manifold, 7-micro channel with complex structure, 8-channel rib wall, 9-inlet branch manifold and 10-outlet branch manifold.
Detailed Description
The invention provides a novel manifold type micro-channel micro radiator with a complex structure, which has the following core ideas: (1) Manifold type fluid distribution is realized through the cover plate, so that the processing and packaging process is simplified and the manufacturing cost is reduced from the production aspect; from the aspect of performance, the pressure drop of the micro radiator is reduced, the uniformity of fluid distribution is improved, and the heat exchange capacity of the micro radiator is improved; (2) The zigzag complex micro-channel formed by the serial connection of the flat arrows enhances the convection heat exchange area and the fluid disturbance, promotes the mixing of cold and hot fluid and enhances the convection heat exchange effect; meanwhile, the zigzag micro-channel increases the flow area of the fluid and reduces the flow resistance. In general, the novel manifold type micro-channel micro-radiator with the complex structure strengthens the convective heat transfer performance, reduces the flow resistance, simplifies the processing technology, enhances the sealing reliability, reduces the processing cost and improves the economic benefit.
The patent of the invention is further described below with reference to the drawings and detailed description. The present invention is not limited to the following examples.
Example 1
As shown in fig. 1, the novel manifold type micro-channel micro-radiator with a complex structure comprises a 7740 heat-resistant glass cover plate 1 and a silicon-based substrate 2 from top to bottom. Deionized water is adopted as working medium. Since the cost of high power chips is very expensive, this embodiment uses an analog heat source instead of a chip for performance testing. The simulated heat source adopts a platinum metal heating film. Through design optimization, the platinum metal heating film can uniformly generate heat and simulate the heating of a chip. The input voltage of the platinum heating film can be determined according to the heat generation amount of the chip.
7740 the size of the heat-resistant glass cover plate 1 is the same as that of the silicon-based substrate 2, and the specific size is 13mm x 5mm x 0.5mm. The upper surface of the 7740 heat-resistant glass cover plate 1 is processed with through holes with the depth of 0.2mm and the diameter of 1mm, which are respectively used as a fluid inlet 3 and a fluid outlet 4, the circle center of the through holes is 6.5mm away from the short side of the radiator, and 0.9mm away from the long side of the radiator; the 7740 heat-resistant glass cover plate 1 is provided with a manifold channel with a depth of 0.3mm on the lower surface, which is respectively used as an inlet main manifold 5 for fluid to flow into the complex micro-channel and an outlet main manifold 6 for fluid to flow out of the complex micro-channel, the size of the manifold region at the middle position of the radiator is 10mm x 4.2mm, the wall thickness of the manifold (i.e. the wall thickness between the adjacent inlet branch manifold and the outlet branch manifold) is 1.05mm, the width of the manifold, i.e. the width of the inlet branch manifold and the outlet branch manifold is 0.2mm, the length of the inlet branch manifold and the outlet branch manifold is 2.1mm, and the two sides are respectively half of the width of the manifold and 0.1mm, as shown in the figure. The upper surface of the silicon-based substrate 2 is processed with a complex microchannel 7 with the depth of 0.3mm as shown in the figure; the area size of the micro-channel with the complex structure is 10mm x 2mm, the structural parameters of the micro-channel with the complex structure are shown as the graph, the maximum space of the saw-tooth type complex micro-channel formed by connecting flat arrows in series, namely the width of the tail end of the arrow is 0.2mm, the minimum space, namely the width of the head end of the arrow is 0.1mm, the length of the shear head is 0.2mm, the depth of the saw-tooth structure of the rib wall is 0.05mm, and the length of the saw tooth is 0.2mm; the saw teeth on the two sides of the rib wall 8 are spaced 0.1mm in the horizontal direction, the maximum width of the rib wall is 0.1mm, and the minimum width is 0.025mm; the simulated heat source platinum metal heating film is plated on the lower surface of the substrate by a sputtering technology, and the area is the same as the micro-channel area, as shown in the area of the figure.
The inlet main manifold 5 of the fluid flowing into the complex micro-channel can uniformly distribute the fluid to the micro-channel, and the flow length of the fluid in the micro-channel is reduced to 1/8 of that of the non-manifold structure; at the same time, the flow rate of the fluid in the micro-channels is reduced to 1/8 of that of the non-manifold structure with the same total flow rate of the heat sink. The pressure drop loss is proportional to the square of the velocity and proportional to the length of the flow channel. Thus, the above two factors effectively reduce the pressure drop of the micro heat sink.
The zigzag micro-channel structure increases the convection heat exchange area and fluid disturbance, and promotes the mixing of cold and hot fluid in the channel, thereby enhancing the heat exchange effect; meanwhile, the staggered saw-tooth micro-channel structure increases the cross-sectional area of fluid circulation, so that the flow resistance is reduced.
Compared with the traditional rectangular micro-channel radiator, the numerical simulation shows that the flow is 60ml/min and the heat flow density is 200W/cm 2 When the manifold type micro radiator with the complex structure is used, the pressure drop is reduced by 95%, the highest temperature of a chip is reduced by 5 ℃, and the maximum temperature difference is reduced by 15 ℃. The thermal stress of the chip is effectively reduced, the reliable operation of the chip is ensured, and meanwhile, the operation cost of cooling the micro radiator is effectively reduced due to the reduction of the pressure drop.
The structure of the present invention is different from the conventional micro heat dissipation structure in that the micro heat sink inlets and outlets 3 and 4 and the manifold main inlets and outlets 5 and 6 are integrated on the cover plate 2. The micro radiator with the structure reduces pressure drop loss and improves heat exchange performance; in terms of production economy, the processing technology is simplified, and the economic performance is improved. Secondly, the periodic expansion and contraction of the micro-channel with variable cross section of the micro-radiator increases the convection heat exchange area and the disturbance of fluid, thereby enhancing the convection heat exchange effect; meanwhile, the staggered arrangement of the complex micro-channels increases the cross-sectional area of fluid flow, increases the number of micro-channels with the same heat dissipation area, and reduces the increase of pressure drop.
In summary, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (2)
1. The manifold type micro-channel micro-radiator with the complex structure is characterized by comprising a cover plate (1), a base plate (2), and a cover plate (1) covering the base plate (2); the upper surface of the cover plate (1) is provided with a through hole connected with an external pipeline and is respectively used as a fluid inlet (3) and a fluid outlet (4), the lower surface of the cover plate is provided with two manifold main channel grooves, and the manifold main channel grooves at the lower part of the fluid inlet (3) and the manifold main channel grooves at the lower part of the fluid outlet (4) are respectively used as an inlet main manifold (5) for fluid to flow into the complex micro-channel and an outlet main manifold (6) for fluid to flow out of the complex micro-channel; the length direction of the inlet main manifold (5) is parallel and opposite to the length direction of the outlet main manifold (6); the inlet main manifold (5) is provided with a plurality of inlet branch manifolds (9) which are perpendicular to the inlet main manifold (5) and extend to the outlet main manifold (6), gaps are reserved between the outlet main manifold (6) and the inlet branch manifolds (9), the outlet main manifold (6) is provided with a plurality of outlet branch manifolds (10) which are perpendicular to the outlet main manifold (6) and extend to the inlet main manifold (5), gaps are reserved between the inlet main manifold (5) and the outlet branch manifolds (10), and the inlet branch manifolds (9) and the outlet branch manifolds (10) are alternately distributed at intervals; the upper surface of the substrate (2) is processed with a micro-channel (7) with a complex structure, a micro-channel area is formed by a plurality of parallel micro-channels (7) with the complex structure, the inlet main manifold (5) and the outlet main manifold (6) are correspondingly positioned at two sides of the micro-channel area, and the inlet main manifold (5) and the outlet main manifold (6) are parallel to the channel direction of the micro-channel (7) with the complex structure;
two sides of the micro-channel (7) with the complex structure are formed by two rib walls (8); the top view section of the channel structure of the micro-channel (7) with the complex structure is formed by connecting a plurality of flat arrow cavities in series end to end, and the flat arrow is a flush structure with the tip of the arrow replaced by being parallel to the tail end; two adjacent micro-channels (7) with complex structures are staggered by half an arrow, namely, in the direction of the length of the vertical channel, the head end of a flat arrow cavity in a first micro-channel with complex structures corresponds to the middle position of a flat arrow cavity in a second micro-channel with complex structures, and so on; the top-down section of the rib wall (8) between the two micro-channels (7) with complex structures is a sawtooth structure formed by combining a plurality of triangles in series;
the size of the micro-channel area is the same as the size of the cooling chip;
and sealing the cover plate (1) and the base plate (2) by a bonding technology to form the micro radiator.
2. A manifold type complex structured micro-channel micro-radiator according to claim 1, wherein in the closed micro-radiator, the fluid flow path is: the cooling fluid is uniformly dispersed into the micro-channel with the complex structure through the inlet branch manifold (9) after passing through the inlet main manifold (5) of the inlet complex micro-channel, absorbs heat from the bottom surface of the micro-channel with the complex structure and the surface of the micro-channel, is converged to the outlet main manifold (6) through the outlet branch manifold (10), and finally flows out from the fluid outlet (4).
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111900143A (en) * | 2020-07-31 | 2020-11-06 | 上海交通大学 | Manifold type high depth-width ratio micro-channel heat exchanger |
| CN111970897B (en) * | 2020-08-06 | 2022-06-21 | 中国电子科技集团公司第三十八研究所 | Heat exchange radiator is reinforceed to semi-enclosed island type rib pole side hole vortex |
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