CN105188307A - Local enhanced fluid cooling assembly for high power electronic application, and electronic device - Google Patents
Local enhanced fluid cooling assembly for high power electronic application, and electronic device Download PDFInfo
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- CN105188307A CN105188307A CN201510484631.XA CN201510484631A CN105188307A CN 105188307 A CN105188307 A CN 105188307A CN 201510484631 A CN201510484631 A CN 201510484631A CN 105188307 A CN105188307 A CN 105188307A
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- radiator
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- microtrabeculae
- radiating fin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a fluid cooling assembly which can promote generation of a turbulence in the assembly so as to achieve a good heat dissipation effect. The cooling assembly includes a closed chamber comprising an inlet and an outlet which allow fluid to pass through; a heat dissipation device, a plurality of micro columns, and a plurality of heat dissipation fins are positioned in the cooling assembly; when the fluid passes through the chamber, those element combinations generate an enhanced turbulence, so that heat can be effectively dissipated from the heat dissipation by the fluid.
Description
Technical field
The present invention relates to a kind of cooling device, particularly, for the forcing fluid cooling package of high power electronic application.
Background technology
High power semiconductor chip such as igbt (IGBT) can produce a large amount of heats in use.The common operating temperature of IGBT module is up to 200 degrees Celsius, and its design service life reaches more than 10 years.Along with the progress of semiconductor fabrication, estimating can be more and more less in the size of in the future these equipment.Therefore, designing the cooling system of the high density heat flux that compact, these equipment that can fast and effeciently dissipate produces, is a more and more challenging problem.Consequently, liquid cools can be widely used in this field.
Traditional liquid cools solution uses a closed chamber usually, and it is connected to heater element, when pressurized cooling fluid flows through this chamber, can take away heat.The validity of these cooling systems depends on various factors, as the mass flowrate of cooling fluid, from heater element to closed chamber then to the heat exchanger effectiveness of cooling fluid.For many years, developing multiple cooling system, having attempted each kernel texture by disposing in liquid chamber, improved overall heat exchanger effectiveness.But, manufacture these minor structures and the complexity increased may can easily exceed the gain on the heat efficiency.Another obvious solution is the force (forcing) pump adopting higher-wattage, to increase fluid-flow rate.But this solution can increase the cost of whole system, make whole cooling system heavier.Therefore, need better method to overcome above-mentioned shortcoming.
Summary of the invention
In above-mentioned background situation, an object of the present invention is to provide a kind of replacement scheme, even if the heat exchanger effectiveness of fluid cooling package also can be improved under the fluid mobility status of nominal pressure.
Therefore, in one aspect, the first surface of the first plate of cooling package of the present invention has receiving area, it is suitable for receiving at least one heater element.Radiator has an inner surface and at least one outer surface, and radiator is disposed in cooling package.The second surface that the inner surface of radiator is fixed to described first plate closes on and relative position with receiving area, passes with the heat that at least one heater element is produced and shed.The multiple radiating fins be spaced apart from each other also are arranged in cooling package.Each radiating fin extends out from the second plate and is connected to radiator, and wherein said second plate is relative with the first plate, and and separates between the first plate, to form passage.Multiple microtrabeculae is arranged in going up at least partially of at least one outer surface of radiator, multiple microtrabeculae is arranged to predetermined pattern, when fluid flows through the passage between described first plate and the second plate, the combination of multiple radiating fin, described radiator and described multiple microtrabeculae can produce the turbulent flow of enhancing, thus effectively heat is passed through fluid for radiating heat from radiator.
In an illustrative embodiment of the invention, the shape approximation isothermal surface of at least one outer surface.When heat is distributed to the inside of radiator from least one heater element by described inner surface, just define isothermal surface.
In another exemplary embodiment, radiator is accurate funnel shaped, can be to be inverted frusta-pyramidal, inversion frusto-conical, half elliptic, hemisphere or semielliptical shape.
In another exemplary embodiment, microtrabeculae is arranged to predetermined pattern around each radiating fin.
In another embodiment, predetermined pattern is lattice, except those positions occupied by radiating fin on the grid point that microtrabeculae is disposed in lattice.
According to another embodiment of the invention, predetermined pattern is shifted grid pattern, and it comprises the first grid line alternately and the second grid line.Second grid line offsets the first grid line one segment distance, except those positions occupied by radiating fin on the grid point that microtrabeculae is arranged on described shifted grid pattern.
According to another embodiment of the invention, multiple microtrabeculae is arranged in around radiating fin, very near but do not contact radiating fin.
According to still another embodiment of the invention, multiple microtrabeculae is disposed in around each radiating fin in couples.Every a pair close each other, and on a predetermined angular between reference line and the center line of a pair.The center line of reference line and often pair is all derived from the center of corresponding radiating fin, and reference line is parallel to fluid flow direction.
According to another aspect of the present invention, at least the first to the angular range being positioned at 70 degree ~ 90 degree, and at least the second to the angular range being positioned at 130 degree ~ 150.In still further illustrative embodiments, cooling package also comprises four side plates, to form a closed chamber, also comprises the device producing pressure fluid.A side plate in four side plates comprises entrance and enters described chamber for fluid, and another side plate comprises outlet and flows out described chamber for fluid.This device can make fluid flow to described outlet from described entrance.
In another exemplary embodiment, microtrabeculae is cylindrical, and its diameter is between 200 μm ~ 300 μm, and height is between 200 μm ~ 300 μm.
In another exemplary embodiment, cooling package also comprises convex object, and it extends out from the second plate, towards radiator, and separates with radiator.
In another aspect of the present invention, an electronic installation is disclosed.This electronic installation comprises at least one electronic module and cooling package, and wherein electronic module comprises at least one heat-generating electronic elements.Cooling package has receiving area on the first surface of the first plate, and it is suitable for receiving at least one electronic module.Radiator has an inner surface and at least one outer surface, and radiator is disposed in cooling package.The second surface that the inner surface of radiator is fixed to described first plate closes on and relative position with receiving area, distributes with the heat that at least one electronic module is produced.The multiple radiating fins be spaced apart from each other also are arranged in cooling package.Each radiating fin extends out from the second plate and is connected to radiator, and wherein said second plate is relative with the first plate, and separates between the first plate, to form passage.Multiple microtrabeculae is arranged in going up at least partially of at least one outer surface of radiator, multiple microtrabeculae is arranged to predetermined pattern, when fluid flows through the passage between described first plate and the second plate, the combination of multiple radiating fin, described radiator and described multiple microtrabeculae can produce the turbulent flow of enhancing, thus effectively heat is passed through fluid for radiating heat from radiator.
The present invention has many advantages.An advantage is that the shape of radiator is designed to be similar to thermoisopleth, to save the material of radiator, reaches identical radiating effect simultaneously.Another advantage is, the passage between radiator and hot radical seat adds liquid local flow velocity, makes the pin fin on described radiator and microtrabeculae combination promote to form the turbulent flow strengthened, more effective with the heat exchange of liquid.
Accompanying drawing explanation
Fig. 1 shows the liquid-cooling system of an illustrative embodiment of the invention.
Fig. 2 shows the end view of one embodiment of the invention.
Fig. 3 shows the thermoisopleth in the radiator of one embodiment of the invention.
Fig. 4 A, 4B and 4C show three kinds of position relationships between the radiating fin of the present invention's three embodiments and multiple microtrabeculae.
Fig. 5 A to 5D shows the difference only having the turbulence intensity between the configuration having microtrabeculae around the configuration of radiating fin and radiating fin of an illustrative embodiment of the invention.
Fig. 6 A shows according to the turbulence intensity distribution around a kind of radiating fin of configuration.
Fig. 6 B shows the turbulence intensity distribution around the radiating fin of an illustrative embodiment of the invention, wherein has multiple microtrabeculae to be arranged in around radiating fin.
Fig. 7 shows hot property and the cooling agent state of often kind of combination of radiator, microtrabeculae and radiating fin.
Fig. 8 A and 8B shows the end view of the different exemplary embodiment of the present invention two.
Embodiment
" comprising " of using as used herein and in the claims means to comprise following key element but does not get rid of other.
Fig. 1 and Fig. 2 shows the exemplary embodiment of cooling package 100 of the present invention.In the present embodiment, cooling package 100 is closed chambers of the rectangular shape with six side plates.Cuboid comprises: the substrate at top, the hot radical seat of bottom, the side plate with entrance 202, another side plate with outlet 204 and two other side plate.Substrate is also referred to as the first plate 104, is used interchangeably at these two terms of paragraph subsequently.Similarly, hot radical seat is also referred to as the second plate 124, and these two terms are also used interchangeably.Device 300 produces fluid under pressure, and fluid under pressure is connected to entrance 202 by the first pipeline 302.First plate 104, second plate 124 and two side plates form a passage 206, flow to outlet 204 for liquid.Outlet 204 is connected to device 300 by second pipe 304, thus produces a fluid loop.The refrigerating module 306 being connected to device 300 is optional modules, and it is used for cooling the liquid from cooling package 100.In one embodiment, device 300 is pumps.
Cooling package 100 also comprises a receiving area 108, and it is positioned at the top surface of the first plate 104.At least one heater element 102 is fixed on receiving area 108.Radiator 112 is arranged under the opposite side of the first plate 104, heater element 102, is distributed by the heat conduction that heater element 102 produces.The inner surface 116 of radiator 112 is fixed to the bottom surface of the first plate 104; The area of inner surface 116 is greater than the area of the receiving area 108 receiving at least one heater element 102, so that better heat conduction.Towards the second plate 124 faced by the outer surface 118 of radiator 112.More than first radiating fin 122A extends out from the second plate 124 and is connected to radiator 112.More than second radiating fin 122B extends out from the second plate 124 and is connected to the first plate 104.In one embodiment, more than first radiating fin 122A and more than second radiating fin 122B are the identical but highly different cylindrical rods of diameter, and are spaced apart from each other.Form a subchannel 208 between bottom the second plate 124 and radiator 112, subchannel 208 is narrower than passage 206, and therefore, the flow rate of liquid in subchannel 208 is higher than passage 206.Outer surface 118 is provided with multiple microtrabeculae 114, round multiple radiating fin 122A.
Refer now to the operation mechanism seeing above-mentioned cooling package 100, the heat that at least one heater element 102 produces, dissipated by the heat transfer in cooling package 100 and thermal convection.First plate 104, radiator 112, microtrabeculae 114, radiating fin 122A, 122B and the second plate 124 are all heat conducting elements.The heat that at least one heater element 102 produces, is transmitted out from cooling package by two approach by these cell conducts.One of them approach is, heat conduction is through the heat conducting element in cooling package 100, until the lateral surface of arrival the second plate 124 and cooling package 100.Then heat exchange is carried out with cooling package 100 ambient air.Another approach is, as long as there is the place of liquid comes into contact in any heat conducting element and cooling package 100, first heat just conducts transfers in the liquid on border between heat conducting element and liquid.Then in liquid, just have the heat transfer of convection model.Along with liquid flows into along Way in 212 from entrance 202, fluid temperature rises gradually.So the liquid of heat can flow out outlet 204 along Way out 214, then cooled by refrigerating module 306.
Like this, liquid flows in inner passage 206 and subchannel 208, and thermal convection occurs.Fluid flowing can be divided three classes substantially: laminar flow, turbulent flow and transition flow, transition flow is a transition stage between laminar flow and turbulent flow.When there is laminar flow, fluid particles is relative to moving in an orderly manner, and when turbulent flow, fluid particles fiercely and move confusedly.According to specific fluid geometry, the parameter of Reynolds number (Reynoldsnumber) is to define laminar flow and turbulent flow to use one to be called.In convection process, turbulent flow can accelerate rate of heat exchange, therefore expects to set up a kind of fluid geometry, even if it also can turbulization under the metered flow pressure and mass flowrate of device 300 generation.Fluid geometry in the present embodiment depends on the relative geometrical arrangements between radiator 112, multiple radiating fin 112A and 112B and microtrabeculae 114 to a great extent.Following paragraph can discuss the shape of these elements and combination and they relative position each other in detail, to produce one strengthening turbulent flow in subchannel 208, even if device 300 is liquor pumps of a common low cost.
More than first radiating fin 122A and more than second radiating fin 122B is manufactured from the same material.They also can be described as pin fin (pinfin).In one embodiment, they are the cylindrical rods upwards extending from the second plate 124 and contact with radiator 112 or the first plate 104, make heat can conduct by them.In another embodiment, their uniform intervals are opened, and form a regular comb mesh pattern (when from overhead view).When liquid flows on a flat surfaces, as the flat surfaces of the first plate 104, second plate 124 or the flat surfaces of radiator 112, when liquid and surface contact, just form a boundary layer in a liquid.The thickness in this boundary layer can become a barrier of heat exchange between flat surfaces and liquid.The effect of pin fin is exactly break this boundary layer to strengthen turbulent flow to promote heat trnasfer and to contribute to being formed.
In one embodiment, radiator 112 is solid body of an inverted truncated pyramid shape.The top of this inversion truncated pyramid is wider than bottom larger, and is fixed on the first plate 106.Fig. 3 shows the two-dimensional section figure of this inversion truncated pyramid, is a trapezoidal shape.As mentioned above, an inner surface 116 is formed on the top of being inverted truncated pyramid.The heat produced when at least one heater element 102 is diffused on radiator 112 by the first plate 106, and it disperses and spreads in radiator 112, forms isothermal level along with progress.Isothermal level is a curved surface normally, the temperature that in isothermal level, each expression is identical.In a two-dimensional section figure, it is exactly the thermoisopleth as Fig. 3.Compare with other shapes such as cuboid, being inverted truncated pyramid shape has advantage.First, truncated pyramid is inverted than rectangular physical efficiency approximate isothermal surface better.Therefore, compare with cuboid edge surface point, the temperature on each edge surface point of inversion truncated pyramid can not change too large.Secondly, if two objects will cover identical receiving area, compare with cuboid, the quality of being inverted truncated pyramid can be less.Therefore, this is more cost-effective.3rd, compare with cuboid, be inverted truncated pyramid and there is larger total surface area.Therefore, more surface area and liquid comes into contact is had.This heat trnasfer that will be conducive to from radiator 112 to liquid.In addition, fall truncated pyramid, as an accurate funnel shaped, in passage 206, create a narrow subchannel 208.When liquid is forced to through this narrow subchannel 208, its mass flowrate can increase, and this promotes to form turbulent flow.
As previously discussed, multiple microtrabeculae 114 be disposed in radiator 112 outer surface 118 on around more than first radiating fin 122A.In one embodiment, use photoetching technique to make microtrabeculae, therefore, radiator 112 and microtrabeculae 114 share identical material.The shape of each microtrabeculae can be cylindrical, square or cuboid, depends on the photomask used in photoetching.From the microtrabeculae that radiator 112 flat outer surface 118 extends out, for upsetting the viscous sublayer of fluid, and local convection coefficient is brought up to a higher value.This thermal convection that will improve in liquid.Viscous sublayer is caused by fluid viscosity.At liquid-solid interface, fluid viscosity provides the laminar flow in viscous sublayer.In addition, the geometrical arrangements between multiple microtrabeculae and more than first radiating fin 122A, and the subchannel 208 narrowed, facilitate the formation of turbulent flow (when liquid flows through these structures) together further.
In one embodiment, multiple microtrabeculae 114 is disposed in around radiating fin 122A, forms pattern as shown in Figure 4 A.This pattern is a square net, and the distance between grid point is identical.Microtrabeculae is cylindrical shape, except position that radiating fin 122A takies on the grid point being arranged on square net.In another embodiment, described pattern can be a rectangular mesh.
Fig. 4 B shows the pattern of multiple microtrabeculaes 114 around radiating fin 122A of another embodiment.This pattern is the shifted grid pattern that the first grid line 122M and the second grid line 122N replace.Second grid line and the first grid line have one section of fixing offset distance.Around to many six other grid points around each grid point, these six grid points are all equal with the distance of this grid point.Except position that radiating fin 122A takies on the grid point that microtrabeculae 114 is arranged in described shifted grid pattern.
In another embodiment, around the pattern displaying of multiple microtrabeculaes of radiating fin 122A in Fig. 4 C.In the present embodiment, the four pairs of microtrabeculaes to be disposed in around radiating fin but not to contact radiating fin, and microtrabeculae is cylindrical in the present embodiment.First couple of 114A and second couple 114B is arranged in the first side of reference line 1000, and the 3rd couple of 114C and the 4th couple 114D is arranged in the opposite side of reference line 1000.Reference line 1000 is parallel to fluid flow direction 210.Often pair of microtrabeculae all separates a bit of distance, from radiating fin central point to the mid point of this bit of distance, can draw a line, separate a pair microtrabeculae.For microtrabeculae to 114A, this line is called the first center line 1002, and it and reference line 1000 form the first angle θ
1.Equally, the mid point of this bit of small distance can be put from radiating fin cylindrical center, draw the second center line 1004, separate microtrabeculae to 114D.Second center line 1004 and reference line 1000 form the second angle θ
2.Microtrabeculae is positioned near the second center line 1004 114D.In addition, second couple of 114B and the 4th couple 114D is symmetrical about reference line 1000.3rd couple of 114C and first couple 114A is symmetrical about reference line 1000.
Above-mentioned cooling package 100 can be applied to any heater element cooling and be placed on the receiving area of the first plate 104.In a particular embodiment, it is for dispelling the heat to high power electronic module, such as Insulated-gate Bipolar transistor (IGBT) module.In one exemplary embodiment of the present invention, IGBT module consumes the thermal power of 10KW, the electric current of carrying 100A.It produces 1200W/cm
2heat flux density.In addition, the life of product of IGBT is more than 10 years.Because requirement harsh like this, heat conduction must effectively and constantly shed, to guarantee the life-span of product by cooling package.
In the exemplary embodiment, IGBT module is arranged on the receiving area of substrate.Radiator, microtrabeculae, pin fin and the material at the bottom of hot radical can from high conductivity material as selected copper, aluminium, steel and copper-tungsten.Radiator is in the present embodiment an inverted truncated pyramid shape.The microtrabeculae of the present embodiment is cylindrical shape, its diameter and be highly 200 μm ~ 300 μm.Pin fin in the present embodiment is also cylindrical, and diameter is 3mm, is highly 7.5mm.The device 300 producing fluid under pressure is pumps, and liquid is water.In another embodiment, it is liquid coolant.Open below according to the experimental result of the present embodiment.
Experimental result
Around radiating fin or pin fin, dispose the impact that multiple microtrabeculae produces can easily find out from result shown in Fig. 5 A to 5D.Fig. 5 A shows the cooling package not having microtrabeculae to extend out from radiator.Fig. 5 C shows the distribution of corresponding turbulence intensity.Turbulence intensity is a dimensionless factor characterizing turbulent flow, is expressed as a percentage.0% means without turbulent flow in liquid stream, and the value of 15% then represents a high turbulent fluid.Similarly, Fig. 5 B shows six microtrabeculaes around pin fin, and Fig. 5 D shows the distribution of corresponding turbulence intensity.In Fig. 5 C and 5D, turbulence intensity is represented by gray scale, and black represents 0%, and white represents 15%.In both cases, liquid flows from left to right, and mass flowrate is 0.1kg/s.For the situation (Fig. 5 A) not having microtrabeculae, when liquid stream is through pin fin, turbulence intensity only has slight increase, and for the situation having microtrabeculae, as Fig. 5 B, near the position of microtrabeculae, turbulence intensity has 15% very high value.This clearly illustrates that, the microtrabeculae around the pin fin shown in Fig. 5 B, greatly facilitates the formation of turbulent flow.Because turbulent flow can promote heat exchange, heat more effectively can be sent to the liquid of flowing from radiating fin and microtrabeculae.
More experimental result is shown in Fig. 6 A and Fig. 6 B, and the turbulence intensity distribution to a group and do not have with the radiating fin of periphery microtrabeculae compares.Fig. 6 A display does not have the turbulence intensity of microtrabeculae to distribute.The turbulence intensity that Fig. 6 B display microtrabeculae is arranged in as Fig. 4 C pattern distributes.The same with above-mentioned, use gray scale to represent that turbulence intensity distributes, same liquid is right from the left flow direction.As can be seen from these figures, many in the drawings places, fiercer than Fig. 6 A of the turbulence intensity of Fig. 6 B.This shows to add microtrabeculae, and is arranged to illustrated pattern, than only producing higher turbulence intensity with pin fin.
The form of Fig. 7 gathers and compares five kinds of different hot propertys of configuration and the analog result of cooling agent state.The first configuration only uses radiator.The second configuration uses the combination of radiator and multiple microtrabeculae.The third configuration only uses pin fin, and the combination of the 4th kind of configuration use radiator and multiple pin fin.5th kind of configuration adopts the combination of radiator, multiple microtrabeculae and multiple pin fin.
Those row of hot property in reference table, the 4th kind of configuration (radiator+pin fin) is set as that standard scheme is for comparing, and therefore its performance setting is 100%.The hot property of the first allocation plan only has 29%, and this wants much less than standard scheme.The hot property of the second configuration is 36.7%, and this shows that adding microtrabeculae on a heat sink improves hot property; But it is still well below standard scheme.The hot property of the third configuration is 63.5%, is also less than standard performance.But, reach 137% in the hot property of the 5th kind of configuration (this is the solution of the present invention), more efficient than standard scheme.
The 3rd row in table further describe the cooling agent state in different configuration.For the first and the second configuration, cooling fluid is laminar condition.For the third and the 4th kind of configuration, cooling fluid presents transition flow state.But under the configuration of the embodiment of the present invention, cooling fluid is turbulence state completely.
Therefore exemplary embodiment of the present invention is described all sidedly.Although this description refer to specific embodiment, for a person skilled in the art, there is the change of these details, can the present invention have been realized completely.Therefore the present invention should not be construed as limited to the embodiment set forth here.
Such as, the shape of described radiator can be other be different from the shape that Fig. 2 and Fig. 3 is inverted truncated pyramid.Fig. 8 A shows the arc-shaped radiator 112B of a semielliptical shape.Outer arcuate surface 118B also can be similar to isothermal level well.Equally, other shape also can be adopted as inverted conical shape, half elliptic and semi-spherical shape.
In an alternative embodiment of the invention shown in Fig. 8 B, convex object 128 extends towards the outer surface 118C of radiator 112C from the second plate 126.This layout can form the subchannel 208 of one " H " shape, and it is also narrower than not having the original subchannel of convex object 128.In one embodiment, the shape of convex object is similar to the shape of radiator 112C, but is not inverted.The 122A of more than first radiating fin extends from convex object 128 and is connected to radiator 112C, and more than second radiating fin 122B extends from the second plate 126 and be connected to the first plate 104.But will be appreciated that, for realizing same target to set up a narrow passage, radiator and convex object can have and above-mentioned different shape.
In addition, mention in the exemplary embodiment disclosed in earlier paragraphs, multiple microtrabeculae is disposed on the outer surface 118 of radiator 112.Microtrabeculae is not can only arrange on a surface of a heat sink.In fact, microtrabeculae also can be arranged on be inverted truncated pyramid other on the surface.If radiator presents other shape, semielliptical shape shape as shown in Figure 8 A, microtrabeculae not only can be positioned at the bottom of radiator 112B, also can extend to sidewall.
Although the shape of microtrabeculae is described to cylindrical in Fig. 4 A, Fig. 4 B and Fig. 4 C, clearly, other shape and size can be used according to the hobby of user.Also other shape can be made as elliptical cylinder-shape, hexagonal prism.Similarly, the shape of radiating fin also can adopt other shape, such as elliptical cylinder-shape, hexagonal prism, and substitutes cylindrical.
In addition, above-mentioned receiving area also can be designed to hold more than one electronic module.In fact, in a three-phase power transmission system, three IGBT module can be placed in receiving area, use a single cooling package to cool.For all three heater elements, cooling package can have a radiator and micro-column structure, or for each module, it can have an independent radiator/micro-column structure.Based on instruction disclosed by the invention, those skilled in the art can assess the concrete cooling requirements of its product, the miscellaneous thoughts discussed in using the present invention open, as size and the pendulum position of radiator shape, geometrical arrangements between microtrabeculae and pin fin and each parts, design suitable cooling package, meet corresponding requirements.
Finally, although above-described embodiment mentions cooling fluid, should be clear, thought of the present invention is also applicable to Air flow.In this case, device 300 can be a fan or air pump, forces air by entrance 202.In this case, some assembly is as just dispensable in second pipe 304 and refrigerating module 306.
Claims (20)
1. a cooling package, comprising:
A) receiving area, it is positioned on the first surface of the first plate, for receiving at least one heater element;
B) radiator, it comprises an inner surface and at least one outer surface, the second surface that described inner surface is fixed on described first plate closes on and relative position with described receiving area, distributes with the heat conduction that at least one heater element described is produced;
C) multiple radiating fin spaced apart from each other, each described radiating fin is connected to the second plate and extends out from described second plate and is connected to described radiator, and wherein said second plate is relative with described first plate and separate, to form passage;
D) multiple microtrabeculae, it is disposed in going up at least partially of at least one outer surface described of described radiator, and described multiple microtrabeculae is arranged to a predetermined pattern;
Wherein when fluid flows through the described passage between described first plate and described second plate, the combination of described multiple radiating fin, described radiator and described multiple microtrabeculae can produce the turbulent flow of enhancing on described fluid, effectively to be distributed by described fluid from described radiator by heat.
2. cooling package according to claim 1, the shape approximation isothermal level of at least one outer surface described of wherein said radiator; When heat is sent to described radiator inside from least one heater element described by described inner surface, just form described isothermal level.
3. cooling package according to claim 2, wherein said radiator is accurate funnel shaped, is inverted frusta-pyramidal, inverted frustoconical, half elliptic, hemisphere or semielliptical shape.
4. cooling package according to claim 1, wherein said multiple microtrabeculae is arranged to predetermined pattern around each described radiating fin.
5. cooling package according to claim 4, wherein said predetermined pattern is lattice, except those positions that described radiator occupies on the grid point that described multiple microtrabeculae is positioned at described lattice.
6. cooling package according to claim 5, wherein said predetermined pattern is shifted grid pattern, and it comprises the first grid line alternately and the second grid line; Described first grid line one segment distance of described second grid line skew, except those positions that described radiator occupies on the grid point that wherein said multiple microtrabeculae is positioned at described shifted grid pattern.
7. cooling package according to claim 4, wherein said multiple microtrabeculae is positioned at around described radiating fin, tightly near but do not contact described radiating fin.
8. cooling package according to claim 7, wherein said multiple microtrabeculae is positioned at around each described radiating fin in couples, every a pair all close to each other, on every a pair predetermined angular all between a reference line and described right center line, the described center line of described reference line and every a pair is all derived from the center of corresponding radiating fin, and described reference line is parallel to described fluid flow direction.
9. cooling package according to claim 8, wherein at least the first pair of microtrabeculae is positioned at the angular range of 70 degree ~ 90 degree, and at least the second pair of microtrabeculae is positioned at the angular range of 130 degree ~ 150 degree.
10. cooling package according to claim 1, also comprises:
A) four side plates, described four side plates form a closed chamber with described first plate together with described second plate, side plate described in one of them comprises entrance and flows into described chamber for fluid, and side plate described in another comprise outlet flow out described chamber for fluid;
B) produce the device of pressure fluid, it makes described fluid flow to described outlet from described entrance.
11. cooling packages according to claim 1, wherein said microtrabeculae is cylindrical, and its diameter is 200 μm ~ 300 μm, and height is 200 μm ~ 300 μm.
12. cooling packages according to claim 1, also comprise convex object, and it extends out from described second plate, towards described radiator, and spaced apart with described radiator.
13. 1 kinds of electronic installations, comprising:
A) at least one electronic module, wherein said electronic module comprises at least one heat-generating electronic elements;
B) cooling package, it comprises:
1) receiving area, it is positioned on the first surface of the first plate, for receiving at least one electronic module;
2) radiator, it comprises an inner surface and at least one outer surface, the second surface that described inner surface is fixed on described first plate closes on and relative position with described receiving area, distributes with the heat conduction that at least one electronic module described is produced;
3) multiple radiating fin spaced apart from each other, each described radiating fin is connected to the second plate and extends out from described second plate and be connected to described radiator, and wherein said second plate is relative with described first plate and separate, to form passage;
4) multiple microtrabeculae, it is disposed in going up at least partially of at least one outer surface described of described radiator, and described multiple microtrabeculae is arranged to predetermined pattern;
Wherein when fluid flows through the described passage between described first plate and described second plate, the combination of described multiple radiating fin, described radiator and described multiple microtrabeculae can produce the turbulent flow of enhancing on described fluid, effectively to be distributed by described fluid from described radiator by heat.
14. electronic installations according to claim 13, the shape approximation isothermal level of at least one outer surface described of wherein said radiator; When heat is sent to described radiator inside from least one electronic module described by described inner surface, just form described isothermal level.
15. electronic installations according to claim 13, wherein said multiple microtrabeculae is arranged to predetermined pattern around each described radiating fin.
16. electronic installations according to claim 15, wherein said predetermined pattern is lattice, except those positions that described radiator occupies on the grid point that described multiple microtrabeculae is positioned at described lattice.
17. electronic installations according to claim 16, wherein said reservation pattern is shifted grid pattern, and it comprises the first grid line alternately and the second grid line; Described first grid line one segment distance of described second grid line skew, except those positions that described radiator occupies on the grid point that wherein said multiple microtrabeculae is positioned at described shifted grid pattern.
18. electronic installations according to claim 15, wherein said multiple microtrabeculae is positioned at around described radiating fin, tightly near but do not contact described radiating fin.
19. electronic installations according to claim 18, wherein said multiple microtrabeculae is positioned at around each described radiating fin in couples, every a pair all close to each other, on every a pair predetermined angular all between a reference line and described right center line, the described center line of described reference line and often pair is all derived from the center of corresponding radiating fin, and described reference line is parallel to described fluid flow direction.
20. electronic installations according to claim 13, wherein said microtrabeculae is cylindrical, and its diameter is 200 μm ~ 300 μm, and height is 200 μm ~ 300 μm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/799,594 US9713284B2 (en) | 2015-07-15 | 2015-07-15 | Locally enhanced direct liquid cooling system for high power applications |
| US14/799,594 | 2015-07-15 |
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| CN105188307A true CN105188307A (en) | 2015-12-23 |
| CN105188307B CN105188307B (en) | 2017-09-22 |
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| CN (1) | CN105188307B (en) |
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Also Published As
| Publication number | Publication date |
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| CN105188307B (en) | 2017-09-22 |
| US20170020027A1 (en) | 2017-01-19 |
| US9713284B2 (en) | 2017-07-18 |
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