JP5608187B2 - heatsink - Google Patents
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- JP5608187B2 JP5608187B2 JP2012092603A JP2012092603A JP5608187B2 JP 5608187 B2 JP5608187 B2 JP 5608187B2 JP 2012092603 A JP2012092603 A JP 2012092603A JP 2012092603 A JP2012092603 A JP 2012092603A JP 5608187 B2 JP5608187 B2 JP 5608187B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
本発明は、ヒートシンクに関する。 The present invention relates to a heat sink.
パワー制御ユニット（Ｐｏｗｅｒ Ｃｏｎｔｒｏｌ Ｕｎｉｔ；ＰＣＵ）は、電池から供給されるＤＣ電流をモータを駆動するためのＡＣ電流に変換するインバータと、これを効率的に変換するための制御装置とを含む、電気自動車になくてはならない必須要素である。 A power control unit (PCU) includes an inverter that converts a DC current supplied from a battery into an AC current for driving a motor, and a controller for efficiently converting the inverter. It is an indispensable element for automobiles.
近年、自動車の効率を向上するために、パワー制御ユニット（ＰＣＵ）の軽量化、小型化及び高集積化が進められており、それとともにパワー素子の高集積化に伴う放熱問題が注目されている。 In recent years, in order to improve the efficiency of automobiles, the power control unit (PCU) has been reduced in weight, size, and high integration, and at the same time, the heat dissipation problem accompanying the high integration of power elements has attracted attention. .
一方、特許文献１には、従来方式のヒートシンクが開示されている。 On the other hand, Patent Document 1 discloses a conventional heat sink.
前記特許文献１に開示されているように、従来方式のヒートシンクは、薄いフィン（ｆｉｎ）型のカラムまたは一定直径を有するピン（ｐｉｎ）型のカラムを一定間隔で配列した構造で製造される。 As disclosed in Patent Document 1, a conventional heat sink is manufactured with a structure in which thin fin columns or pin columns having a constant diameter are arranged at regular intervals.
しかし、このような構造を有するヒートシンクは、冷却水が注入される部分の発熱部の温度は減少される反面、冷却水が排出される方向に向かって発熱部の温度が増加するという短所がある。 However, the heat sink having such a structure has a disadvantage that the temperature of the heat generating portion increases in the direction in which the cooling water is discharged, while the temperature of the heat generating portion in the portion where the cooling water is injected is reduced. .
また、フィン（ｆｉｎ）型のカラムが配列されたヒートシンクは、冷却水の流れ圧力を損失させるため、相対的に高いポンピングパワー（ｐｕｍｐｉｎｇ ｐｏｗｅｒ）が要求されるという短所がある。 In addition, the heat sink in which fin type columns are arranged has a disadvantage in that a relatively high pumping power is required because the flow pressure of the cooling water is lost.
本発明は、上記従来技術の問題点を解決するためのものであり、冷却水の流れ圧力損失を最小化するとともに、放熱効果を増大できるヒートシンクを提供することを目的とする。 An object of the present invention is to solve the above-described problems of the prior art, and an object of the present invention is to provide a heat sink that can minimize the flow pressure loss of cooling water and increase the heat dissipation effect.
また、本発明は、発熱部の全体面積の温度偏差を最小化することができるヒートシンクを提供することを他の目的とする。 Another object of the present invention is to provide a heat sink that can minimize the temperature deviation of the entire area of the heat generating portion.
本発明の一実施例によるヒートシンクは、冷却水の流入部分に連結され、第１フィンが多数個配列された第１領域と、冷却水の排出部分に連結され、前記第１フィンより表面積が大きい第２フィンが多数個配列された第２領域と、を含む。 A heat sink according to an embodiment of the present invention is connected to a cooling water inflow portion, is connected to a first region where a plurality of first fins are arranged, and a cooling water discharge portion, and has a larger surface area than the first fin. And a second region in which a plurality of second fins are arranged.
この際、前記第１領域と前記第２領域との間には、前記第１フィンより表面積が大きく、前記第２フィンよりは表面積が小さいフィンが多数個配列された一つ以上の領域をさらに含むことができる。 At this time, one or more regions in which a plurality of fins having a surface area larger than that of the first fin and smaller in surface area than the second fin are arranged between the first region and the second region are further provided. Can be included.
ここで、前記第１領域に配列された前記第１フィン間の間隔は、前記第２領域に配列された前記第２フィン間の間隔より広くてもよい。 Here, an interval between the first fins arranged in the first region may be wider than an interval between the second fins arranged in the second region.
また、前記第２領域で前記冷却水が垂直に面する面の総面積は、前記第１領域で前記冷却水が垂直に面する面の総面積より広くてもよい。 The total area of the surface of the second region where the cooling water vertically faces may be larger than the total area of the surface of the first region where the cooling water vertically faces.
また、前記第１領域及び第２領域をカバーするカバー部材をさらに含むことができる。 In addition, a cover member that covers the first region and the second region may be further included.
また、前記ヒートシンクは、銅（Ｃｕ）またはアルミニウム（Ａｌ）からなってもよい。 The heat sink may be made of copper (Cu) or aluminum (Al).
また、本発明の他の実施例によるヒートシンクは、第１フィンが多数個配列された第１領域と、前記第１フィンより表面積が大きい第２フィンが多数個配列され、前記第１領域に隣接して形成された第２領域と、前記第２フィンより表面積が大きい第３フィンが多数個配列され、前記第２領域に隣接して形成された第３領域と、を含む。 The heat sink according to another embodiment of the present invention includes a first region in which a plurality of first fins are arranged, and a plurality of second fins having a surface area larger than that of the first fins, and is adjacent to the first region. And a third region formed by arranging a plurality of third fins having a surface area larger than that of the second fin and formed adjacent to the second region.
この際、前記第１領域は冷却水の流入部分に連結され、前記第３領域は冷却水の排出部分に連結され、前記第２領域で前記冷却水に面する面の総面積は、前記第１領域で前記冷却水に面する面の総面積より広くてもよい。 At this time, the first region is connected to the cooling water inflow portion, the third region is connected to the cooling water discharge portion, and the total area of the surface facing the cooling water in the second region is the first area. It may be larger than the total area of the surface facing the cooling water in one region.
また、前記第１領域は冷却水の流入部分に連結され、前記第３領域は冷却水の排出部分に連結され、前記第３領域で前記冷却水に面する面の総面積は、前記第２領域で前記冷却水に面する面の総面積より広くてもよい。 The first region is connected to a cooling water inflow portion, the third region is connected to a cooling water discharge portion, and the total area of the surface facing the cooling water in the third region is the second area. The area may be larger than the total area of the surface facing the cooling water.
また、前記第１領域、第２領域及び第３領域における前記第１フィン、第２フィン及び第３フィンは、それぞれ一定間隔で配列形成されることができる。 In addition, the first fins, the second fins, and the third fins in the first region, the second region, and the third region may be arranged at regular intervals.
また、前記第１領域に配列された第１フィン間の間隔は、前記第２領域に配列された第２フィン間の間隔より広くてもよい。 The interval between the first fins arranged in the first region may be wider than the interval between the second fins arranged in the second region.
また、前記第２領域に配列された第２フィン間の間隔は、前記第３領域に配列された第３フィン間の間隔より広くてもよい。 The interval between the second fins arranged in the second region may be wider than the interval between the third fins arranged in the third region.
ここで、前記ヒートシンクは、銅（Ｃｕ）またはアルミニウム（Ａｌ）からなってもよい。 Here, the heat sink may be made of copper (Cu) or aluminum (Al).
また、前記ヒートシンクは、前記第１領域、第２領域及び第３領域をカバーするカバー部材をさらに含むことができる。 The heat sink may further include a cover member that covers the first region, the second region, and the third region.
本発明の特徴及び利点は、添付図面に基づいた以下の詳細な説明によってさらに明らかになるであろう。 The features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.
本発明の詳細な説明に先立ち、本明細書及び特許請求の範囲に用いられた用語や単語は、通常的かつ辞書的な意味に解釈されてはならず、発明者が自らの発明を最善の方法で説明するために用語の概念を適切に定義することができるという原則にしたがって本発明の技術的思想にかなう意味と概念に解釈されるべきである。 Prior to the detailed description of the invention, the terms and words used in the specification and claims should not be construed in a normal and lexicographic sense, and the inventor shall best understand his invention. It should be construed as meaning and concept in accordance with the technical idea of the present invention in accordance with the principle that the concept of terms can be appropriately defined to explain in a method.
本発明は、流入された冷却水が移動する際に面する総面積が、流入された部分から排出された部分に向かって徐々に増加する構造を有しているため、冷却水の流れに対抗して発生する抵抗が減少され、これにより冷却水の流れ圧力損失を減少できるという効果を有する。 The present invention has a structure in which the total area facing when the inflowing cooling water moves gradually increases from the inflowing portion toward the discharging portion, thus countering the flow of the cooling water. Thus, the generated resistance is reduced, which has the effect of reducing the flow pressure loss of the cooling water.
また、本発明は、上記のように、冷却水の流れ圧力損失を減少させることにより、消費されるポンプパワー（ｐｕｍｐ ｐｏｗｅｒ）の量を減少できるという効果を有する。 In addition, as described above, the present invention has an effect that the amount of pump power consumed can be reduced by reducing the flow pressure loss of the cooling water.
更に、本発明は、フィンの表面積を徐々に増加させる構造を有することにより、発熱部の最大温度を減少させるとともに、全体発熱面積の温度偏差を減少できるという効果を有する。 In addition, the present invention has a structure that gradually increases the surface area of the fin, thereby reducing the maximum temperature of the heat generating portion and reducing the temperature deviation of the entire heat generating area.
本発明の目的、特定の長所及び新規の特徴は、添付図面に係る以下の詳細な説明及び好ましい実施例によってさらに明らかになるであろう。本明細書において、各図面の構成要素に参照番号を付け加えるに際し、同一の構成要素に限っては、たとえ異なる図面に示されても、できるだけ同一の番号を付けるようにしていることに留意しなければならない。また、「第１」、「第２」などの用語は、一つの構成要素を他の構成要素と区分するために用いられるものであって、構成要素が前記用語により制限されるものではない。また、本発明を説明するにあたり、係わる公知技術についての具体的な説明が本発明の要旨を不明瞭にする可能性があると判断される場合は、その詳細な説明を省略する。 Objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments with reference to the accompanying drawings. In this specification, it should be noted that when adding reference numerals to the components of each drawing, the same components are given the same number as much as possible even if they are shown in different drawings. I must. Further, terms such as “first” and “second” are used to distinguish one component from other components, and the component is not limited by the terms. Further, in describing the present invention, if it is determined that a specific description of the known technique may obscure the gist of the present invention, a detailed description thereof will be omitted.
以下、添付の図面を参照して本発明の実施例を詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
図１は、本発明の一実施例によるヒートシンクの内部構造を示す平面図であり、図２は、本発明の一実施例によるヒートシンクの内部構造を示す斜視図であり、図３は、本発明の一実施例によるヒートシンク内に流入された冷却水の流速分布を示す写真であり、図４は、本発明の一実施例によるヒートシンクの全体面積の温度分布を示す写真である。 FIG. 1 is a plan view showing an internal structure of a heat sink according to an embodiment of the present invention, FIG. 2 is a perspective view showing an internal structure of the heat sink according to an embodiment of the present invention, and FIG. FIG. 4 is a photograph showing a flow rate distribution of cooling water flowing into a heat sink according to an embodiment of the present invention, and FIG. 4 is a photograph showing a temperature distribution of the entire area of the heat sink according to an embodiment of the present invention.
図１を参照すると、本実施例によるヒートシンク１００は、多数個の第１フィン１０１が配列された第１領域Ａと、多数個の第２フィン１０３が配列された第２領域Ｂと、多数個の第３フィン１０５が配列された第３領域Ｃとを含む。 Referring to FIG. 1, the heat sink 100 according to the present embodiment includes a first region A in which a large number of first fins 101 are arranged, a second region B in which a large number of second fins 103 are arranged, and a large number of heat sinks. And the third region C in which the third fins 105 are arranged.
図１では、本実施例によるヒートシンク１００が、第１領域Ａ、第２領域Ｂ及び第３領域Ｃの三つの領域を含んでいると図示しているが、冷却水の流入部分１０７に連結された第１領域Ａと、冷却水の排出部分１０９に連結された第３領域Ｃとの間に２つ以上の領域を形成することも可能である。 In FIG. 1, the heat sink 100 according to the present embodiment is illustrated as including three regions of the first region A, the second region B, and the third region C, but is connected to the cooling water inflow portion 107. It is also possible to form two or more regions between the first region A and the third region C connected to the cooling water discharge portion 109.
ここで、第２領域Ｂは、第１領域Ａに隣接して形成することができ、第３領域Ｃは、第２領域Ｂに隣接して形成することができる。即ち、第１領域Ａ、第２領域Ｂ及び第３領域Ｃは、図１のように順に形成される。 Here, the second region B can be formed adjacent to the first region A, and the third region C can be formed adjacent to the second region B. That is, the first area A, the second area B, and the third area C are sequentially formed as shown in FIG.
また、第２領域Ｂに配列された第２フィン１０３の表面積は、第１領域Ａに配列された第１フィン１０１の表面積より大きくてもよく、第３領域Ｃに配列された第３フィン１０５の表面積もまた第２領域Ｂに配列された第２フィン１０３の表面積より大きくてもよい。 Further, the surface area of the second fins 103 arranged in the second region B may be larger than the surface area of the first fins 101 arranged in the first region A, and the third fins 105 arranged in the third region C. The surface area of the second fin 103 may be larger than the surface area of the second fins 103 arranged in the second region B.
万が一、第２フィン１０３が形成された第２領域Ｂと、第３フィン１０５が形成された第３領域Ｃとの間に、第４フィン（不図示）が設けられた第４領域（不図示）が形成された場合、第４フィン（不図示）の表面積は、第２フィン１０３の表面積よりは大きく、第３フィン１０５の表面積よりは小さくてもよい。 In the meantime, a fourth region (not shown) in which a fourth fin (not shown) is provided between the second region B where the second fin 103 is formed and the third region C where the third fin 105 is formed. ) Is formed, the surface area of the fourth fin (not shown) may be larger than the surface area of the second fin 103 and smaller than the surface area of the third fin 105.
即ち、冷却水の流入部分１０７に連結された第１領域Ａから冷却水の排出部分１０９に連結された第３領域Ｃに向かって、放熱性能を向上させるために、フィンの表面積を増加させる。 That is, the fin surface area is increased from the first region A connected to the cooling water inflow portion 107 toward the third region C connected to the cooling water discharge portion 109 in order to improve the heat radiation performance.
図１及び図２では、第１領域Ａに配列された第１フィン１０１を六角形のカラム状で示したが、これは一つの実施例に過ぎず、フィンの形状は、特にこれに限定されるものではない。例えば、フィンの断面は、円形、三角形、四角形などであってもよい。 1 and 2, the first fins 101 arranged in the first region A are shown as hexagonal columns, but this is only one example, and the shape of the fins is particularly limited to this. It is not something. For example, the cross section of the fin may be a circle, a triangle, a rectangle, or the like.
本実施例では、図１の平面図を参照すると、第１領域Ａに配列された第１フィン１０１の縦方向の直径は、第２領域Ｂに配列された第２フィン１０３の縦方向の直径より大きく、第２フィン１０３の縦方向の直径は、第３領域Ｃに配列された第３フィン１０５の縦方向の直径より大きくてもよい。 In this embodiment, referring to the plan view of FIG. 1, the vertical diameter of the first fins 101 arranged in the first region A is the vertical diameter of the second fins 103 arranged in the second region B. The diameter of the second fin 103 in the vertical direction may be larger than the diameter of the third fin 105 arranged in the third region C in the vertical direction.
一方、図１を参照すると、第１領域Ａに配列された第１フィン１０１の横方向の直径は、第２領域Ｂに配列された第２フィン１０３の横方向の直径より小さく、第２フィン１０３の横方向の直径は、第３領域Ｃに配列された第３フィン１０５の横方向の直径より小さくてもよい。 Meanwhile, referring to FIG. 1, the lateral diameters of the first fins 101 arranged in the first region A are smaller than the lateral diameters of the second fins 103 arranged in the second region B. The lateral diameter of 103 may be smaller than the lateral diameter of the third fins 105 arranged in the third region C.
即ち、図１を参照すると、第１フィン１０１から第３フィン１０５の方向に向かって、フィンの縦方向の直径が減少されるとともに横方向の直径は増加して、フィンは、ピン（ｐｉｎ）形状からフィン（ｆｉｎ）形状を有するように形成される。 That is, referring to FIG. 1, the longitudinal diameter of the fin decreases and the lateral diameter increases from the first fin 101 toward the third fin 105, and the fin is pinned. It is formed to have a fin shape from the shape.
これは、第１領域Ａ、第２領域Ｂを経て第３領域Ｃに向かって、フィンの表面積、即ち、熱伝逹面積を増大して熱伝導度を増加させることにより、放熱効率を高めるためである。 This is to increase the heat dissipation efficiency by increasing the heat conductivity by increasing the surface area of the fin, that is, the heat transfer area, toward the third region C through the first region A and the second region B. It is.
また、本実施例では、図１及び図２に図示したように、第１領域Ａで冷却水が垂直に面する面（これは、第１フィン１０１と第１フィン１０１との間、即ち、冷却水が移動する部分の垂直断面を意味する。）の面積を合計した総面積より、第２領域Ｂで冷却水が垂直に面する面の面積を合計した総面積が大きい。 Further, in the present embodiment, as illustrated in FIGS. 1 and 2, a surface in which the cooling water vertically faces in the first region A (this is between the first fin 101 and the first fin 101, that is, The total area of the surfaces where the cooling water vertically faces in the second region B is larger than the total area of the areas where the cooling water moves.
また、第２領域Ｂで冷却水が垂直に面する面の面積を合計した総面積より、第３領域Ｃで冷却水が垂直に面する面の面積を合計した総面積がより大きくてもよい。 In addition, the total area of the surfaces of the third region C where the cooling water faces vertically may be larger than the total area of the surfaces where the cooling water faces vertically in the second region B. .
即ち、冷却水が流入される部分から冷却水が排出される部分に向かって、冷却水が移動する総面積が大きくなることである。 That is, the total area in which the cooling water moves from the portion where the cooling water flows into the portion where the cooling water is discharged increases.
上記のように、冷却水が流入される部分から冷却水が排出される部分に向かって、フィンの表面積と冷却水が移動する面の総面積が増加することにより、表面熱伝逹効率が増加して放熱特性を向上することができる。 As described above, the surface heat transfer efficiency increases by increasing the surface area of the fin and the total area of the surface on which the cooling water moves from the portion where the cooling water flows into the portion where the cooling water is discharged. Thus, the heat dissipation characteristics can be improved.
また、本実施例では、図１及び図２に図示したように、第１領域Ａに配列された第１フィン１０１間の間隔ａは、第２領域Ｂに配列された第２フィン１０３間の間隔ｂより広く、第２領域Ｂに配列された第２フィン１０３間の間隔ｂは、第３領域Ｃに配列された第３フィン１０５間の間隔ｃより広くてもよい。 In this embodiment, as shown in FIGS. 1 and 2, the interval a between the first fins 101 arranged in the first region A is between the second fins 103 arranged in the second region B. The interval b between the second fins 103 arranged in the second region B may be wider than the interval c between the third fins 105 arranged in the third region C.
このように、第１フィン１０１間の間隔が広いため、第１領域Ａを移動する冷却水の流速は、第２領域Ｂを移動する冷却水の流速より速く、第２領域Ｂを移動する冷却水の流速は、第３領域Ｃを移動する冷却水の流速より速い。従って、第２領域Ｂを通過して第３領域Ｃに移動する冷却水の流れ圧力（ｆｌｏｗ ｐｒｅｓｓｕｒｅ）損失を最小化することができるため、消費するポンプパワー（ｐｕｍｐ ｐｏｗｅｒ）の量を低減することができる。 Thus, since the space | interval between the 1st fins 101 is wide, the flow rate of the cooling water which moves the 1st area | region A is faster than the flow rate of the cooling water which moves the 2nd area | region B, and the cooling which moves the 2nd area | region B The flow rate of water is faster than the flow rate of the cooling water moving in the third region C. Accordingly, since the flow pressure loss of the cooling water that passes through the second region B and moves to the third region C can be minimized, the amount of pump power consumed can be reduced. Can do.
即ち、本実施例によるヒートシンク１００は、第１領域Ａが冷却水の流入部分１０７に直結された領域であり低温の冷却水が流れるため、第１フィン１０１の表面積が相対的に小さく流速が速くても、第１フィン１０１から流入された冷却水への熱伝逹を比較的容易に行うことができ、前記流入された冷却水の温度が第２領域Ｂを通過して第３領域Ｃに向かって徐々に増加しても、フィンの表面積及び冷却水の移動面積を増加させて熱伝逹を難なく容易に行うように具現したものである。 That is, in the heat sink 100 according to the present embodiment, the first region A is a region directly connected to the cooling water inflow portion 107 and low-temperature cooling water flows. Therefore, the surface area of the first fin 101 is relatively small and the flow velocity is high. However, heat transfer to the cooling water flowing from the first fin 101 can be performed relatively easily, and the temperature of the flowing cooling water passes through the second region B and enters the third region C. Even if it gradually increases, the heat transfer is realized without difficulty by increasing the surface area of the fins and the moving area of the cooling water.
本実施例によるヒートシンク１００の内部に流入された冷却水の流速分布に対する実験結果及びヒートシンク１００の全体面積の温度分布に対する実験結果を、図３及び図４に示した。 The experimental results for the flow rate distribution of the cooling water flowing into the heat sink 100 according to this embodiment and the experimental results for the temperature distribution of the entire area of the heat sink 100 are shown in FIGS.
先ず、図３を見ると、第１領域Ａの第１フィン１０１の間を移動する流速は速く、第２領域Ｂの第２フィン１０３の間を移動する流速は、第１領域Ａを移動する流速よりは多少遅く、第３領域Ｃの第３フィン１０５の間を移動する流速は、第２領域Ｂを移動する流速よりさらに遅いことが分かる。 First, referring to FIG. 3, the flow velocity moving between the first fins 101 in the first region A is fast, and the flow velocity moving between the second fins 103 in the second region B moves in the first region A. It can be seen that the flow velocity moving between the third fins 105 in the third region C is slightly slower than the flow velocity moving in the second region B.
これに比べて、従来方式のヒートシンクの内部に流入された冷却水の流速分布を示す図５を見ると、全体的に流速が遅いことが分かる。 Compared with this, when FIG. 5 which shows the flow rate distribution of the cooling water which flowed into the inside of the heat sink of a conventional system is seen, it turns out that the flow rate is slow as a whole.
また、図４を見ると、本実施例によるヒートシンク１００の第１領域Ａ、第２領域Ｂ及び第３領域Ｃ全体に亘り温度が均一に分布されていることが分かる。 4 that the temperature is uniformly distributed throughout the first region A, the second region B, and the third region C of the heat sink 100 according to the present embodiment.
これに比べて、従来方式のヒートシンクの温度分布を示す図６を見ると、冷却水が排出される方向(矢印方向)に行く程、温度が増加することが分かる。 Compared to this, FIG. 6 showing the temperature distribution of the heat sink of the conventional system shows that the temperature increases in the direction in which the cooling water is discharged (arrow direction).
また、図１及び図２では、ヒートシンク１００の内部構造を説明するために内部が露出された構造に図示したが、第１領域Ａ、第２領域Ｂ及び第３領域Ｃをカバーするカバー部材（不図示）をさらに備えることができることは、当業者であれば誰でも認識することができる。 In FIGS. 1 and 2, in order to explain the internal structure of the heat sink 100, the structure in which the inside is exposed is illustrated. However, a cover member that covers the first region A, the second region B, and the third region C ( Anyone skilled in the art can recognize that it can further include (not shown).
また、本実施例によるヒートシンク１００は、銅（Ｃｕ）またはアルミニウム（Ａｌ）からなってもよく、特にこれに限定されず、伝導性（ｃｏｎｄｕｃｔｉｖｅ）に優れた材質であれば何れも使用することができる。 In addition, the heat sink 100 according to the present embodiment may be made of copper (Cu) or aluminum (Al), and is not particularly limited thereto. Any material having excellent conductivity can be used. it can.
また、本実施例によるヒートシンク１００は、該当形状を有する金型を利用する射出成形により製造することができ、特にこれに限定されるものではない。 Further, the heat sink 100 according to the present embodiment can be manufactured by injection molding using a mold having a corresponding shape, and is not particularly limited thereto.
以上、本発明を好ましい実施例に基づいて詳細に説明したが、これは本発明を具体的に説明するためのものであり、本発明によるヒートシンクは、これに限定されず、該当分野における通常の知識を有する者であれば、本発明の技術的思想内にての変形や改良が可能であることは明白であろう。 As described above, the present invention has been described in detail based on the preferred embodiments. However, this is for the purpose of specifically explaining the present invention, and the heat sink according to the present invention is not limited thereto. It will be apparent to those skilled in the art that modifications and improvements within the technical idea of the present invention are possible.
本発明の単純な変形乃至変更はいずれも本発明の領域に属するものであり、本発明の具体的な保護範囲は添付の特許請求の範囲により明確になるであろう。 All simple variations and modifications of the present invention belong to the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.
本発明は、ヒートシンクに適用可能である。 The present invention is applicable to a heat sink.
１００ ヒートシンク
１０１ 第１フィン
１０３ 第２フィン
１０５ 第３フィン
１０７ 冷却水の流入部分
１０９ 冷却水の排出部分
DESCRIPTION OF SYMBOLS 100 Heat sink 101 1st fin 103 2nd fin 105 3rd fin 107 Cooling water inflow part 109 Cooling water discharge | emission part
Claims (11)
冷却水の排出部分に連結され、前記第１フィンより表面積が大きい第２フィンが多数個配列された第２領域と、を含み、
前記第２領域で前記冷却水の移動方向と垂直に面する第２フィンの間の総面積は、前記第１領域で前記冷却水の移動方向と垂直に面する第１フィンの間の総面積より広いヒートシンク。 A first region connected to an inflow portion of the cooling water and arranged with a plurality of first fins;
A second region connected to a cooling water discharge portion and arranged with a plurality of second fins having a larger surface area than the first fins,
The total area between the second fins facing perpendicular to the moving direction of the cooling water in the second region is the total area between the first fins facing perpendicular to the moving direction of the cooling water in the first region. A wider heat sink.
前記第１フィンより表面積が大きい第２フィンが多数個配列され、前記第１領域に隣接して形成された第２領域と、
冷却水の排出部分に連結され、前記第２フィンより表面積が大きい第３フィンが多数個配列され、前記第２領域に隣接して形成された第３領域と、を含み、
前記第２領域で前記冷却水の移動方向と垂直に面する第２フィンの間の総面積は、前記第１領域で前記冷却水の移動方向と垂直に面する第１フィンの間の総面積より広く、
前記第３領域で前記冷却水の移動方向と垂直に面する第３フィンの間の総面積は、前記第２領域で前記冷却水の移動方向と垂直に面する第２フィンの間の総面積より広いヒートシンク。 A first region connected to an inflow portion of the cooling water and arranged with a plurality of first fins;
A plurality of second fins having a larger surface area than the first fin, and a second region formed adjacent to the first region;
A plurality of third fins connected to a cooling water discharge portion and having a larger surface area than the second fins, and a third region formed adjacent to the second region;
The total area between the second fins facing perpendicular to the moving direction of the cooling water in the second region is the total area between the first fins facing perpendicular to the moving direction of the cooling water in the first region. Wider,
The total area between the third fins facing perpendicular to the moving direction of the cooling water in the third region is the total area between the second fins facing perpendicular to the moving direction of the cooling water in the second region. A wider heat sink.
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| KR10-2011-0114602 | 2011-11-04 | ||
| KR1020110114602A KR101278313B1 (en) | 2011-11-04 | 2011-11-04 | Heat sink |
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| JP2016039202A (en) * | 2014-08-06 | 2016-03-22 | スズキ株式会社 | Inverter device |
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| JP6138197B2 (en) * | 2015-06-03 | 2017-05-31 | 三菱電機株式会社 | Liquid-cooled cooler and method of manufacturing radiating fin in liquid-cooled cooler |
| US10504814B2 (en) | 2016-09-13 | 2019-12-10 | International Business Machines Corporation | Variable pin fin construction to facilitate compliant cold plates |
| EP3518638B1 (en) * | 2016-09-23 | 2022-11-09 | Sumitomo Precision Products Co., Ltd. | Cooling device |
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| JP7148276B2 (en) * | 2018-05-30 | 2022-10-05 | 京セラ株式会社 | Light-emitting element mounting package and light-emitting device |
| US10874030B2 (en) * | 2018-12-26 | 2020-12-22 | Quanta Computer Inc. | Flexible cold plate with fluid distribution mechanism |
| TWI686108B (en) * | 2019-02-26 | 2020-02-21 | 嘉聯益科技股份有限公司 | Circuit board module and heat-dissipating board structure thereof |
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