CN103542748A - Needle-rib-concave composited array structure of heat sink and arrangement method for needle-rib-concave composited array - Google Patents
Needle-rib-concave composited array structure of heat sink and arrangement method for needle-rib-concave composited array Download PDFInfo
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Abstract
The invention discloses a heat sink with a needle-rib-concave composited array structure. The heat sink with the needle-rib-concave composited array structure comprises a cooling channel, a plurality of needle ribs, a plurality of concaves, a substrate and a top plate; the substrate and the top plate are provided with opposite inner wall surfaces; the cooling channel is limited between the two inner wall surfaces; the plurality of needle ribs are arranged on the inner wall surface of the substrate to form into needle rib arrays which are arranged in a stagger mode; between the substrate and the top plate, at least the inner wall surface of the substrate is provided with the plurality of concaves to form into concave arrays; smallest flow cross sections are formed between horizontal needle ribs in the cooling channel; at least one smallest flow cross section is provided with the concave; the plurality of concaves in the longitudinal direction are arranged in a stagger mode to form into the concave arrays; the needle-rib arrays and the concave arrays are formed into the needle-rib-concave composited array structure. The invention also discloses an arrangement method for the heat sink. The heat sink with the needle-rib-concave composited array structure has a higher heat transfer performance, same or lower flow resistance compared with a traditional needle rib array and accordingly has a higher comprehensive thermal performance.
Description
Technical Field
The present application is a divisional application of application No. 201110214066.7.The present invention relates to a heat dissipation device, and more particularly, to a pin fin-recess composite array structure of a heat dissipation device (or heat sink). The invention also relates to an arrangement method of the pin rib-concave composite array for the heat sink.
Background
In modern industry, there are many devices or devices that generate a large amount of heat during operation, and a high-efficiency heat dissipation device (heat sink) is required to dissipate the heat in time to maintain normal operation, normal lifetime, and ensure reliability. These heat generating devices that need to be cooled include high power integrated circuits, Central Processing Units (CPUs), high power semiconductor lasers, etc. in the electronics industry, and reactors in chemical and pharmaceutical processes, etc. On the other hand, the heat generating device is being developed toward high power and small size and weight, so that the heat dissipation heat flux density is rapidly increased, and a more compact and higher performance heat sink is urgently required to realize efficient cooling of the high power device. The cooling medium used by these heat sinks is also diverted from the air to a liquid with a higher heat transfer capacity (e.g., water, ethylene glycol, or FC-77 fluorinated liquid, etc.). Due to the stringent size and weight requirements of avionics and aerospace electronics, compact, high heat transfer performance and low flow resistance heat sinks are particularly important in the cooling of such devices.
Pin fin heat sinks are a common device used for cooling high power electronic devices. Pin-fin heatsinks using liquid cooling media typically have a base plate and a top plate with cooling channels confined between them, as described in the document entitled "Thermal conversion of a liquid-cooled AlSiC base plate with integral pin fins" (IEEE transformations on composites and Packaging Technologies, vol.24, pp.213-219,2001). A plurality of pin fin arrays are perpendicularly formed on the surface of the substrate. The pin fins increase the heat transfer area, but more importantly, as the fluid flows through the pin fin array, the pin fins can break the flow boundary layer, and a highly turbulent separation wake is generated behind each pin fin, and horseshoe vortices are generated after the fluid interacts with the substrate wall and the pin fins, which greatly improve flow mixing in the cooling channel and significantly improve heat transfer performance. The pin-fin array significantly enhances the heat dissipation performance of the heat sink. In general, the pin rib array on the substrate is arranged in a staggered manner or in a sequential manner; the cross-sectional shape of the pin rib may be circular, square, diamond, elliptical, or the like. To achieve a heat sink with high cooling performance and a more compact size, pin-fin heat sinks are mostly liquid-cooled, although the cooling medium of the heat sink may also be gas.
Conventional pin-fin heat sinks also have limitations that result in significant flow resistance of the cooling fluid, especially at high flow rates, while providing high heat transfer performance. At high flows, the flow separates prematurely from the pin fin surface and creates a large area of highly turbulent wake on the back of each pin fin, which causes a rapid increase in flow losses within the flow channel and a rapid increase in pump or fan power consumption and noise in the system. On the other hand, the development of modern power devices is moving towards the cooling with large heat flux density, and a heat sink with low flow resistance and higher heat transfer performance is urgently needed.
Accordingly, those skilled in the art have endeavored to develop a heat sink structure having higher heat transfer performance and lower flow resistance.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention provides a heat sink structure with higher heat transfer performance and lower flow resistance.
To achieve the above object, the present invention provides a pin rib-depression composite array structure of a heat sink, the heat sink including a cooling channel, a plurality of pin ribs, a plurality of depressions, a base plate, and a top plate; wherein the base plate and the top plate each have opposing inner wall surfaces; the cooling passage is defined between the opposite inner wall surfaces of the base plate and the top plate; the inner wall surface of the substrate is provided with a plurality of needle ribs, and the needle ribs form a needle rib array; wherein the pin fin array is arranged on the inner wall surface of the substrate in a staggered manner; in the substrate or the top plate, at least the inner wall surface of the substrate is provided with a plurality of depressions, and the depressions form a depression array; wherein, in the cooling channel, the needle ribs have minimum flow cross sections in the transverse direction, the recess is arranged at least one minimum flow cross section, and a plurality of the recesses are staggered in the longitudinal direction, thereby forming the recess array; the pin rib array and the concave array jointly form the pin rib-concave composite array structure.
Preferably, at least one of the recesses is further provided between every two rows of the pin ribs in the longitudinal direction, so as to further improve the heat transfer performance.
Preferably, most of the minimum flow cross-section is provided with the recess.
Preferably, the inner wall surfaces of the base plate and the top plate are both provided with the recess array composed of a plurality of the recesses.
Preferably, one end of the pin rib is connected to an inner wall surface of the base plate, and the other end of the pin rib is connected to an inner wall surface of the top plate.
Preferably, the cross section of the needle rib is circular, rhombic, square, oval or drop-shaped; the shape of the recess is a portion of a sphere, or a truncated cone, or a drop.
Preferably, the height of the needle rib is 0.5 to 4 times of the diameter of the needle rib.
Preferably, the cooling fluid in the cooling channel is liquid water, glycol, liquid nitrogen, FC-77 or FC-84 fluorinated liquid, or air or nitrogen which is a gas.
Preferably, the heat sink further comprises a partition plate extending in the longitudinal direction; the partition plate divides the cooling channel into a first channel and a second channel which are parallel to each other, wherein an outlet of the first channel is communicated with an inlet of the second channel; cooling fluid enters the heat sink from an inlet of the first channel; at the end of the first passage, the cooling fluid flow turns into the second passage; and then out of the outlet of the second passage.
The invention also provides an arrangement method of the pin rib-concave composite array, which is used for the heat sink with the pin rib-concave composite array structure and comprises the following steps: a plurality of the recesses are provided on the inner wall surface of the substrate by integral milling, punching, or casting; forming a plurality of the pin ribs on the inner wall surface of the base plate by integral milling, brazing, or casting; the diameter of the recess is similar to the diameter of the needle rib, and the depth of the recess is about 0.1-0.3 times of the diameter of the recess; after the top plate is brought into close contact with the tops of the pin ribs, the base plate and the top plate are coupled together with a fastener through the coupling hole, thereby defining the cooling passage. Preferably, the difference between the diameter of the recess and the diameter of the needle rib is not more than 10%.
The pin rib-concave composite array structure of the heat sink has higher heat transfer performance than that of the conventional pin rib array heat sink, but has the same or even lower flow resistance, so that the heat sink has higher comprehensive thermal performance. On the other hand, the heat sink has higher heat transfer performance, and the flow of the required cooling fluid is relatively smaller under the condition of meeting the same cooling power, so that the power consumption of the pump is more favorably reduced.
In the invention, when fluid flows into the cooling channel of the heat sink, the pin ribs continuously destroy the flow boundary layer, a highly turbulent separation wake area is generated behind each pin rib, and horseshoe-shaped vortex is generated after the fluid interacts with the wall surface of the substrate and the pin ribs, so that the flow mixing in the cooling channel is strongly improved by the factors, and the heat exchange effect of the wall surface of the substrate and the surface of the pin ribs is obviously improved. Meanwhile, when the cooling fluid flows through the recess, strong vortex is generated only near the wall surface, so that the mixing of the fluid near the wall surface is further improved, and the heat convection effect of the cooling fluid and the wall surface and the surfaces of the pin ribs is improved. On the other hand, due to the existence of the depression on the wall surface of the substrate between the pin ribs in the transverse direction, the flow area at the position of the minimum cross section of the flow is actually increased, the maximum speed in the channel is reduced, the obstruction of the pin ribs to the flow in the channel is relieved, and the flow loss is reduced.
Due to the adoption of the scheme, the invention has the following characteristics: the pin rib array is connected with the base plate of the heat sink cooling channel and the wall surface of the top plate, so that the heat exchange area of the cooling fluid is increased; on the other hand, the channel is reinforced. The depressions on the surface of the base plate improve the heat convection capacity between the cooling fluid and the wall surface by generating strong vortex on one hand, and the depressions between the pin ribs in the transverse direction on the other hand increase the flow area at the minimum cross section of the flow channel and reduce the flow loss in the flow channel. The wall surface of the substrate is provided with the recess, so that the heat exchange area is increased, and the heat dissipation capability of the heat sink is enhanced.
Therefore, compared with the conventional pin-fin array heat sink, the heat sink can reduce the flow of cooling fluid under the same cooling load condition, thereby reducing the power consumption of a pump or a fan; on the other hand, the density of pin ribs on the wall surface of the substrate can be reduced to lighten the weight of the heat sink, which is very beneficial to the design of the electronic equipment heat sink of the aviation and aerospace craft.
Cooling structures with arrays of dimples and pin fins are also presented in chinese invention patent application CN1727642A entitled "hot gas path component with mesh and dimple cooling". However, the content of this prior art differs from that of the present invention in the following respects:
(1) in this prior art, the dimples are positioned on the wall surface at the intersections of the plurality of flow channels, whereas in the present invention the dimples are positioned at the minimum flow area of the flow channels between the transverse pin ribs;
(2) in this prior art, the depression discharges the vortex from an angle of 45 degrees to reduce the impact of the flow on the solid part in the flow channel, whereas in the present invention the depression increases the flow area at the minimum cross section of the flow channel, thereby reducing the flow losses in the flow channel;
(3) in the prior art, the flow passage is also provided with a turbulator, but the invention does not need to be additionally provided with the turbulator.
The conception, the specific structure and the technical effects of the present invention will be further described with reference to the accompanying drawings to fully understand the objects, the features and the effects of the present invention.
Drawings
FIG. 1 is a front view of the 1 st embodiment of the present invention;
FIG. 2 is a top view of the embodiment of FIG. 1 with the top plate removed;
FIG. 3 is a partial cross-sectional view of section 3-3 of FIG. 2 of embodiment 1 of the present invention;
FIG. 4 is a top view of the 2 nd embodiment of the invention with the top plate removed;
FIG. 5 is a partial cross-sectional view of the embodiment of FIG. 4 taken along section 5-5;
FIG. 6 is a schematic view of the direction of fluid flow in the embodiment of FIG. 4;
FIG. 7 is a front view of the 3 rd embodiment of the present invention;
fig. 8 is a top view of the 4 th embodiment of the present invention with the top plate removed.
Detailed Description
The present invention is described in terms of a specific embodiment applied to a heat sink for dissipating heat from a high power electronic device. The cooling channel of the heat sink is internally provided with a pin rib and concave composite array structure. Of course, the present invention is also applicable to other fields of application for cooling heat generating devices. In the present invention, the longitudinal direction is defined as the direction that coincides with the flow direction of the cooling fluid, i.e. the direction of the arrow 11, and the cells arranged in the longitudinal direction in the array form "rows"; the lateral direction is defined as the direction within the plane parallel to the heat sink substrate, perpendicular to the direction of flow of the cooling fluid, and the cells in the array arranged in the lateral direction constitute "columns".
Specific example 1:
as shown in fig. 1, the pin-rib-recess composite array heat sink 20 in the present embodiment includes: a base plate 22, a plurality of pin ribs 16, a cooling channel 14, and a top plate 10. The wall 26 of the base 22 of the heat sink is in intimate contact with the heat generating device surface to receive heat from the device surface. This heat is then carried away by the cooling fluid in the cooling channel 14. The base plate 22 and the top plate 10 may be coupled together with fasteners through holes 23.
The pin fin 16 is formed on the substrate inner wall surface 24 by integral milling or brazing or casting or other processing. The pin ribs 16 and the substrate 22 are made of high thermal conductivity material such as copper, aluminum or AlSiC. The needle rib 16 is a column having a circular cross-sectional shape. Of course, the needle rib of the present invention can also be designed to have a rhombic, square, oval or drop-shaped cross section. To achieve compactness in the size of the heat sink, the pin ribs are typically short pin ribs. Typical pin fin diameters range from 0.5 to 10mm, with the pin fin height being about 0.5 to 4 times its diameter. The pin ribs 16 are arranged in a staggered manner within the cooling channel 14. The arrows 11 in the figure represent the direction of fluid flow. The top plate 10 is in close contact with the tops of the pin ribs 16, so that on one hand, the cooling channels 14 are also reinforced, and on the other hand, heat obtained by the pin ribs 16 from the base plate 22 through heat conduction can be transferred to the top plate 10, so that the top plate 10 also participates in heat convection, and the heat dissipation area of the heat sink 20 is remarkably increased. The pin fin 16 array on the inner wall surface 24 of the base plate increases the heat transfer area on one hand, and on the other hand, the flow mixing in the flow channel 14 is enhanced strongly, and the convection heat exchange performance is enhanced.
As shown in fig. 2 and 3, the inner wall surface 24 of the base plate and the corresponding inner wall surface 12 of the top plate are also provided with recesses 18. Of course, the recess in the present invention may be provided only on the inner wall surface 24 of the substrate depending on the actual situation. The surface of the depression 18 is shaped as a portion of a sphere, and may be shaped as a truncated cone, a teardrop, or the like. The recesses 18 are located on the substrate wall between each row of pin ribs 16 in the transverse direction at the location of the smallest cross section for throughflow; the dimples 18 are staggered in the longitudinal direction within the cooling gallery 14. Typically, the depression diameter is the same as the pin rib diameter, and the depression depth is about 0.1 to 0.3 times the depression diameter. The concave 18 generates vortex when the cooling fluid flows through, and improves the heat convection effect of the airflow and the inner wall surface 24 and the surface of the pin rib 16; meanwhile, due to the fact that the depressions 18 are formed in the inner wall surfaces 24 between the needle ribs 16 in the transverse direction, the flow area of the position with the minimum cross section of the flow channel is enlarged, the obstruction of the needle ribs 16 in the channel 14 to the flow is relieved, and flow loss is reduced. On the other hand, since the maximum velocity at the smallest cross-section of the channel is reduced, this is advantageous in reducing the wake zone behind each pin fin 16, so that the flow losses in the channel are further reduced. The arrangement of the recesses 18 in the inner wall surface 24 also increases the heat exchange area, facilitating heat dissipation.
The pin-fin-dimple array heat sink in this embodiment provides an approximately 10% improvement in overall heat exchange performance over conventional pin-fin array heat sinks, while a 20% reduction in flow resistance, under the same inlet airflow conditions. For the same heat dissipation load, the density of the pin rib arrangement can be reduced, so that the weight of the heat sink is reduced, the power consumption of a pump or a fan is reduced, and materials are saved, which is very significant for the design of the heat sink of the aviation and aerospace electronic equipment.
Specific example 2:
shown in fig. 4 and 5 is a pin rib-depression array heat sink 20 having another arrangement. Unlike the pin rib-depression array heat sink shown in fig. 2, the depressions 18 are not only arranged on the inner wall surface 24 of the substrate at the minimum flow cross section between the lateral pin ribs 16, but also one column of depressions 18 is provided between every two columns of pin ribs 16 in the longitudinal direction. The depressions 18 are arranged in a staggered manner on the inner wall surface 24 of the substrate. The inner wall surface 24 of the substrate in the arrangement shown in fig. 4 has more depressions than the pin fin-depression array arrangement shown in fig. 2. As shown in fig. 6, when fluid flows through the pin fin 16 and the array of dimples 18, strong vortices 15 are generated, and the interaction between the vortices can significantly further enhance turbulent flow mixing near the inner wall surface 24 of the substrate, which is very beneficial for improving the convective heat transfer capability of the surface of the cooling channel 14. Meanwhile, the dimples 18 arranged between each row of pin ribs 16 in the transverse direction can play a role in resistance reduction, so that the pin rib-dimple array heat sink 20 shown in fig. 4 does not significantly increase the flow resistance compared with the conventional pin rib array heat sink.
Specifically, the pin-fin-dimple array heat sink in the embodiment shown in fig. 4 provides an improvement in overall heat exchange performance of 30% -50% over conventional pin-fin array heat sinks under the same inlet airflow conditions, while the flow resistance is substantially the same. For the same heat dissipation load, the density of the pin rib arrangement can be reduced, so that the weight of the heat sink is reduced, the power consumption of a pump or a fan is reduced, and materials are saved, which is very significant for the design of the heat sink of the aviation and aerospace electronic equipment.
Specific example 3:
fig. 7 illustrates a pin-fin-dimple array heat sink 20 dissipating heat from two devices simultaneously. In this embodiment, the cooling channel 14 is confined between upper and lower substrates 22. Both substrate inner wall surfaces 24 are machined with pin ribs 16 and depressions 18. The needle rib 16 is connected to the upper and lower substrates 22. In this arrangement, therefore, there is no top plate 10. In the embodiment shown in fig. 7, the pin fin-depression arrangement in the cooling channel 14 between the two base plates 22 is similar to that shown in fig. 2 or 4. The cooling fluid flowing into the heat sink will convectively cool both the upper and lower substrates 22. Obviously, the heat dissipation scheme is very compact, is favorable for saving space, reducing weight and saving cost, and is very favorable for cooling design of aviation and aerospace electronic equipment.
Specific example 4:
fig. 8 illustrates a two-channel pin-fin-dimple composite array heat sink 20. This arrangement is similar to the single channel heat sink shown in fig. 2 or 4, except that a divider plate 32 is provided between the first and second channels. The cooling fluid enters the heat sink from the inlet 28, and at the end of the first channel, the flow turns into the second channel as shown by arrow 13, and then exits from the heat sink outlet 30. The heat sink design scheme is very suitable for the heat dissipation requirement of a device with a small wall heating heat flow density but a large area.
The foregoing detailed description of the preferred embodiments of the invention has been presented. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should be within the scope of protection defined by the claims.
Claims (9)
1. A pin-fin-dimple composite array structure of a heat sink, the heat sink comprising a cooling channel, a plurality of pin-fins, a plurality of dimples, a base plate, and a top plate; wherein,
the base plate and the top plate respectively have opposite inner wall surfaces;
the cooling passage is defined between the opposite inner wall surfaces of the base plate and the top plate;
the inner wall surface of the substrate is provided with a plurality of needle ribs, and the needle ribs form a needle rib array; wherein the pin fin array is arranged on the inner wall surface of the substrate in a staggered manner;
in the substrate or the top plate, at least the inner wall surface of the substrate is provided with a plurality of depressions, and the depressions form a depression array; wherein,
in the cooling channel, the needle ribs have minimum flow cross sections in the transverse direction, the recess is arranged at least one minimum flow cross section, and a plurality of the recesses are staggered in the longitudinal direction, so that the recess array is formed;
the pin rib array and the concave array jointly form the pin rib-concave composite array structure;
at least one concave is arranged between every two rows of the pin ribs in the longitudinal direction, so that the heat transfer performance is further improved.
2. The pin fin-dimple composite array structure of a heat sink of claim 1, wherein a majority of the smallest flow cross-section is provided with the dimples.
3. The pin fin-depression composite array structure of a heat sink according to claim 1, wherein the depression array composed of a plurality of the depressions is provided on an inner wall surface of both the base plate and the top plate.
4. The pin rib-depression composite array structure of a heat sink according to claim 1, wherein one end of the pin rib is connected to an inner wall surface of the base plate, and the other end of the pin rib is connected to an inner wall surface of the top plate.
5. The pin rib-depression composite array structure of a heat sink of claim 1, wherein the cross-sectional shape of the pin rib is circular, diamond, square, oval, or drop-shaped; the shape of the recess is a portion of a sphere, or a truncated cone, or a drop.
6. The pin rib-depression composite array structure of a heat sink of claim 1, wherein the height of the pin rib is 0.5 to 4 times the diameter of the pin rib.
7. The pin fin-dimple composite array structure of a heat sink of claim 1, wherein the cooling fluid in the cooling channel is water, glycol, liquid nitrogen, FC-77 or FC-84 fluorinated liquid, which is liquid, or air or nitrogen, which is gas.
8. The pin fin-depression composite array structure for a heat sink of claim 1, wherein the heat sink further comprises a divider plate extending in a longitudinal direction;
the partition plate divides the cooling channel into a first channel and a second channel which are parallel to each other, wherein an outlet of the first channel is communicated with an inlet of the second channel;
cooling fluid enters the heat sink from an inlet of the first channel;
at the end of the first channel, the cooling fluid flow turns into the second channel; and then out of the outlet of the second passage.
9. A method for arranging a pin rib-recess composite array structure for a heat sink according to any one of claims 1 to 8, comprising:
a plurality of the recesses are provided on the inner wall surface of the substrate by integral milling, punching, or casting;
forming a plurality of the pin ribs on the inner wall surface of the base plate by integral milling, brazing, or casting;
the diameter of the recess is similar to the diameter of the needle rib, and the depth of the recess is about 0.1-0.3 times of the diameter of the recess;
after the top plate is brought into close contact with the tops of the pin ribs, the base plate and the top plate are coupled together with a fastener through the coupling hole, thereby defining the cooling passage.
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| CN201310531065.4A CN103542748A (en) | 2011-07-28 | 2011-07-28 | Needle-rib-concave composited array structure of heat sink and arrangement method for needle-rib-concave composited array |
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| CN201310531065.4A CN103542748A (en) | 2011-07-28 | 2011-07-28 | Needle-rib-concave composited array structure of heat sink and arrangement method for needle-rib-concave composited array |
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| CN2011102140667A Division CN102410687A (en) | 2011-07-28 | 2011-07-28 | Heat sink with needle rib-recessed composite array and method for arranging needle rib-recessed composite array |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103967621A (en) * | 2014-04-08 | 2014-08-06 | 上海交通大学 | Cooling device with small inclined rib-dimple composite structure |
| CN107091467A (en) * | 2017-06-29 | 2017-08-25 | 湖南明和光电设备有限公司 | A kind of great power LED light path heat radiation combination system |
| CN108470726A (en) * | 2018-05-22 | 2018-08-31 | 杭州汉安半导体有限公司 | A kind of integrated heat dissipation thyristor |
| CN110325020A (en) * | 2018-08-20 | 2019-10-11 | 中国科学院上海技术物理研究所 | A kind of high heat flux density heat transmission compound jet cooling heat sink |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103967621A (en) * | 2014-04-08 | 2014-08-06 | 上海交通大学 | Cooling device with small inclined rib-dimple composite structure |
| CN103967621B (en) * | 2014-04-08 | 2016-06-08 | 上海交通大学 | There is the refrigerating unit of small diagonal rib-depression composite structure |
| US10584595B2 (en) | 2014-04-08 | 2020-03-10 | Shanghai Jiao Tong University | Cooling device with small structured rib-dimple hybrid structures |
| CN107091467A (en) * | 2017-06-29 | 2017-08-25 | 湖南明和光电设备有限公司 | A kind of great power LED light path heat radiation combination system |
| CN107091467B (en) * | 2017-06-29 | 2023-04-07 | 湖南明和光电设备有限公司 | High-power LED light path heat dissipation combined system |
| CN108470726A (en) * | 2018-05-22 | 2018-08-31 | 杭州汉安半导体有限公司 | A kind of integrated heat dissipation thyristor |
| CN110325020A (en) * | 2018-08-20 | 2019-10-11 | 中国科学院上海技术物理研究所 | A kind of high heat flux density heat transmission compound jet cooling heat sink |
| CN110325020B (en) * | 2018-08-20 | 2023-07-04 | 中国科学院上海技术物理研究所 | Composite jet cooling heat sink for high heat flux heat dissipation |
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Application publication date: 20140129 |