CN109548364B - Heat dissipation device and application thereof - Google Patents
Heat dissipation device and application thereof Download PDFInfo
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- CN109548364B CN109548364B CN201811280723.6A CN201811280723A CN109548364B CN 109548364 B CN109548364 B CN 109548364B CN 201811280723 A CN201811280723 A CN 201811280723A CN 109548364 B CN109548364 B CN 109548364B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation device and application thereof, and belongs to the technical field of small-space heat dissipation. The device includes apron, bottom plate and is located the efflux orifice plate between apron and the bottom plate, the apron with form first cavity between the efflux orifice plate, the bottom plate with form the second cavity between the efflux orifice plate, be equipped with the working medium entry on the apron, keep away from on the bottom plate the position department of working medium entry is equipped with the working medium export, be equipped with the efflux hole array on the efflux orifice plate, be equipped with the fin array on the bottom plate, the fin with have between the vertical plane at working medium entry and working medium export line place not 90 contained angles, and be located each of being listed with the fin the contained angle is the acute angle or is the obtuse angle, is located adjacent two the fin one of contained angle is the acute angle for the obtuse angle. The invention enhances the disturbance among working media and improves the heat exchange efficiency.
Description
Technical Field
The invention relates to a heat dissipation device and application thereof, and belongs to the technical field of small-space heat dissipation.
Background
With the rapid development of electronic technology, the increase of power and the reduction of volume lead to the rapid increase of heat productivity in unit area, and the reliability of electronic equipment is reduced along with the increase of temperature, and whether the heat can be effectively dissipated becomes a key ring for limiting the development of electronic technology. In addition, in the microwave and laser fields, due to the continuous improvement of the requirement on working power and the low efficiency of the microwave and laser systems, a large amount of waste heat needs to be discharged, otherwise, the heat accumulation causes equipment damage. Meanwhile, the integration level is high in electronic equipment, microwave and laser systems, and the space for heat dissipation is narrow, so that very high requirements are put on a heat dissipation device. In order to ensure the safe and stable operation of the equipment, a heat dissipation device is required to dissipate heat, and the heat dissipation device applied to the equipment has the characteristics of compact structure, small volume, high heat exchange efficiency, small thermal resistance, small flow resistance and the like.
At present, heat dissipation devices commonly used in the above-mentioned apparatuses include microchannel heat sinks, jet cooling devices, and the like. Because the heat boundary layer in the microchannel radiator is gradually thickened along the flowing direction of the working medium, the temperature of the working medium is gradually increased, and the heat exchange effect near the working medium outlet is deteriorated; the jet cooling device has the defects of large flow resistance and rapid deterioration of the heat exchange effect at the position other than the jet stagnation point.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a heat dissipation device and application thereof.
In order to achieve the above purpose, the invention provides the following technical scheme:
the utility model provides a heat abstractor, includes apron, bottom plate and is located jet orifice plate between apron and the bottom plate, the apron with form first cavity between the jet orifice plate, the bottom plate with form the second cavity between the jet orifice plate, be equipped with the working medium entry on the apron, keep away from on the bottom plate the position department of working medium entry is equipped with the working medium export, be equipped with jet orifice array on the jet orifice plate, be equipped with the fin array on the bottom plate, the fin with have between the vertical plane at working medium entry and working medium export line place and be not 90 contained angles, and be located each of being listed as the fin the contained angle is the acute angle or is the obtuse angle, is located adjacent two the fin the contained angle one is the acute angle for the obtuse angle.
In an alternative embodiment, in the fin array, each row is perpendicular to a vertical plane where a connecting line of the working medium inlet and the working medium outlet is located, and each row is parallel to the vertical plane.
In an optional embodiment, in the jet hole array, each column is perpendicular to a vertical plane where a connection line of the working medium inlet and the working medium outlet is located, and each row is parallel to the vertical plane.
In an alternative embodiment, each row of the fins is located between two adjacent rows of the jet holes, and each column of the fins is located between two adjacent columns of the jet holes.
In an alternative embodiment, the aperture of the jet hole near the working medium inlet is larger than the aperture of the jet hole near the working medium outlet.
In an alternative embodiment, the aperture of each row of the fluidic holes decreases.
In an optional embodiment, an included angle between the rib and a vertical plane where a connecting line of the working medium inlet and the working medium outlet is located is 30-60 degrees or 150 degrees.
In an alternative embodiment, the line connecting the working substance inlet and the working substance outlet is located on the middle section of the device.
In an alternative embodiment, the aperture of each column of the fluidic holes is the same.
In an alternative embodiment, there is a gap between the ribs in two adjacent rows.
The heat dissipation device is applied to electronic equipment, a microwave system and a laser system.
Compared with the prior art, the invention has the following beneficial effects:
according to the heat dissipation device provided by the embodiment of the invention, the fin arrays with the inclination angles are arranged, the inclination angles of two adjacent rows of fins are different, when a heat dissipation working medium flows into the second cavity after being accelerated by the jet hole, the heat dissipation working medium is blocked by the two adjacent rows of fins to flow forwards alternately, the heat exchange area is enlarged by the inclined fins, the flow distance and the heat exchange time of the working medium in the heat dissipation device are increased by the staggered fins, the development of a thermal boundary layer of the working medium along the flow direction is damaged, particularly, when the working medium flows through two ends of the fins, a vortex is formed, the disturbance among the working media is enhanced, and the heat exchange efficiency is improved; meanwhile, the jet flow and the radiating fins arranged in a staggered mode have a synergistic effect, so that the working medium with lower temperature still enters the position close to the working medium outlet, the heat exchange effect close to the working medium outlet is improved, and the temperature uniformity of the radiating device is improved.
Drawings
Fig. 1 is a schematic diagram illustrating a heat dissipation device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a jet orifice plate structure provided in an embodiment of the present invention;
FIG. 3 is a schematic diagram of a bottom plate structure according to an embodiment of the present invention;
fig. 4 is a schematic view of a combination of a jet hole array and a fin array provided in an embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention will be made with reference to the accompanying drawings and specific examples.
Referring to fig. 1, an embodiment of the present invention provides a heat dissipation device, including a cover plate 2, a base plate 4, and a jet orifice plate 3 located between the cover plate 2 and the base plate 4, a first cavity 5 is formed between the cover plate 2 and the jet orifice plate 3, a second cavity 6 is formed between the bottom plate 4 and the jet orifice plate 3, the cover plate 2 is provided with a working medium inlet 1, the bottom plate 4 is provided with a working medium outlet 7 at a position far away from the working medium inlet 1, see figure 2, the jet orifice plate 3 is provided with a jet orifice array, referring to fig. 3, the bottom plate 4 is provided with a fin array, an included angle which is not 90 degrees is formed between the rib 9 and a vertical plane where the connecting line of the working medium inlet 1 and the working medium outlet 7 is located, the included angles of the fins 9 positioned in the same row are all acute angles or all obtuse angles, and the included angles of the fins 9 positioned in two adjacent rows are obtuse angles and acute angles.
When the heat dissipation device provided by the embodiment of the invention is used, a heat dissipation working medium enters the first cavity 5 from the working medium inlet 1, flows into the second cavity 6 through each jet hole 8 on the jet hole plate 3, and flows towards the working medium outlet 7 to take away heat in the second cavity 6 under the alternate blocking of two adjacent rows of fins 9.
Specifically, in the embodiment of the present invention, the working medium inlet 1 and the working medium outlet 7 may be both disposed on the side frame or at a position of the main board close to the side frame, and the working medium inlet 1 and the working medium outlet 7 may be located on a diagonal line or on a middle cross section, which is not limited in the present invention. And the connecting line of the working medium inlet 1 and the working medium outlet 7 is the central connecting line of the working medium inlet and the working medium outlet.
According to the heat dissipation device provided by the embodiment of the invention, the fin arrays with the inclination angles are arranged, the inclination angles of two adjacent rows of fins are different, when a heat dissipation working medium flows into the second cavity after being accelerated by the jet hole, the heat dissipation working medium is blocked by the two adjacent rows of fins to flow forwards alternately, the heat exchange area is enlarged by the inclined fins, the flow distance and the heat exchange time of the working medium in the heat dissipation device are increased by the staggered fins, the development of a thermal boundary layer of the working medium along the flow direction is damaged, particularly, when the working medium flows through two ends of the fins, a vortex is formed, the disturbance among the working media is enhanced, and the heat exchange efficiency is improved; meanwhile, the jet flow and the radiating fins arranged in a staggered mode have a synergistic effect, so that the working medium with lower temperature still enters the position close to the working medium outlet, the heat exchange effect close to the working medium outlet is improved, and the temperature uniformity of the radiating device is improved.
Referring to fig. 1, 3 and 4, in an alternative embodiment, in the array of fins, each row is perpendicular to a vertical plane in which the working medium inlet 1 and the working medium outlet 7 are connected, and each row is parallel to the vertical plane.
According to the heat dissipation device provided by the embodiment of the invention, the fin arrays are orthogonally arranged, so that the working medium in the second cavity is alternately blocked by two adjacent rows of fins to flow forwards, the main flow direction of the working medium is parallel to the vertical plane where the working medium inlet and working medium outlet connecting lines are located, and the flow resistance of the working medium is reduced.
Referring to fig. 1, 2 and 4, in an alternative embodiment, in the jet hole array, each column is perpendicular to a vertical plane where the working medium inlet 1 and the working medium outlet 7 are connected, and each row is parallel to the vertical plane.
According to the heat dissipation device provided by the embodiment of the invention, the jet holes are orthogonally arranged, so that the jet hole array is symmetrically distributed relative to a vertical plane where a connecting line of the working medium inlet and the working medium outlet is located; under the same jet flow aperture, the flow distribution of the working medium in the jet flow aperture is also symmetrically distributed.
Referring to fig. 4, in an alternative embodiment, each row of the ribs 9 is located between two adjacent rows of the jet holes 8, and each column of the ribs 9 is located between two adjacent columns of the jet holes 8.
According to the heat dissipation device provided by the embodiment of the invention, the heat dissipation fin arrays and the jet hole arrays are arranged in a staggered manner, so that jet cooling heat dissipation and fin enhanced heat exchange are organically combined, and heat exchange is enhanced by arranging the heat dissipation fins at positions with weakened heat exchange outside jet stagnation points and increasing the heat exchange area, so that the heat dissipation efficiency and the heat exchange uniformity of the heat dissipation device are improved.
In an alternative embodiment, as shown in fig. 2, the aperture of the jet hole 8 near the working medium inlet 1 is larger than the aperture of the jet hole 8 near the working medium outlet 7.
According to the heat dissipation device provided by the embodiment of the invention, the aperture of the jet hole close to the working medium inlet is larger than that of the jet hole close to the working medium outlet, so that more working medium in the first cavity can enter the second cavity from the jet hole close to the working medium inlet, and less working medium enters the second cavity from the jet hole close to the working medium outlet, thereby increasing the flow distance of the unit mass of the working medium in the second cavity and the time for exchanging heat with the heat dissipation fins, and improving the heat exchange efficiency of the heat dissipation device.
In an alternative embodiment, as shown in fig. 2, the aperture of each row of the fluidic holes 8 decreases.
According to the heat dissipation device provided by the embodiment of the invention, the flow velocity of the working medium in the jet holes in each row is continuously increased through the arrangement mode that the aperture of each row of jet holes is gradually decreased, the jet impact heat exchange effect close to the working medium outlet position is improved, and the problem of heat dissipation deterioration near the working medium outlet position caused by the increase of the temperature of the working medium is solved.
In an alternative embodiment, the included angle between the rib 9 and the vertical plane where the line connecting the working medium inlet 1 and the working medium outlet 7 is 30-60 ° or 120-150 °.
The heat dissipation device provided by the embodiment of the invention finds that when the inclination angle of the heat dissipation fins is within the range of 30-60 degrees or 150 degrees through numerical analysis, the flow distance and the heat exchange time of the working medium in the heat dissipation device can be increased, the development of a thermal boundary layer of the working medium along the flow direction is damaged, the disturbance of the working medium is enhanced, the increase of the flow resistance of the heat dissipation device can be controlled, and the formation of a flow dead zone is reduced.
In an alternative embodiment, the line connecting the working medium inlet 1 and the working medium outlet 7 is located on the middle section of the device.
According to the heat dissipation device provided by the embodiment of the invention, the working medium inlet and the working medium outlet are arranged on the middle section of the heat dissipation device, so that the distance between the jet hole and the plane where the working medium inlet and the working medium outlet are located is reduced, and the flow resistance of the working medium in the heat dissipation device is reduced.
In an alternative embodiment, the aperture of each column of the fluidic holes 8 is the same.
According to the heat dissipation device provided by the embodiment of the invention, the aperture of each row of jet holes is the same, and the working medium pressure of the first cavity at the same row position is similar, so that the working medium jet speeds in the same row of jet holes are also similar, and the uniformity of heat exchange at the same row position is facilitated.
In an alternative embodiment, there is a gap between two adjacent rows of said ribs 9.
According to the heat dissipation device provided by the embodiment of the invention, the fin rows are designed discontinuously, so that a gap is formed between two adjacent fins, and a working medium forms a vortex at two ends of each fin, thereby enhancing working medium disturbance and enhancing heat exchange effect; meanwhile, the discontinuity of the fins also damages the development of the working medium along the thermal boundary layer of the fin surface, and is beneficial to improving the heat exchange efficiency.
The heat dissipation device is applied to electronic equipment, a microwave system and a laser system. The following is a specific embodiment of the present invention:
the embodiment provides a heat dissipation device made of red copper, which comprises a cover plate 2, a bottom plate 4 and a jet flow pore plate 3 positioned between the cover plate and the bottom plate, wherein the cover plate 2 comprises a square cover plate main plate with the side length of 40mm and a frame arranged around the cover plate main plate, the bottom plate 4 comprises a square bottom plate main plate and a frame arranged around the bottom plate main plate, a first cavity 5 is formed between the cover plate 2 and the jet flow pore plate 3, a second cavity 6 is formed between the bottom plate 4 and the jet flow pore plate 3, a working medium inlet 1 is arranged in the middle of the left side of the cover plate main plate, a working medium outlet 7 is arranged on the frame on the right side of the bottom plate 4, 8 rows and 8 columns of jet flow pore arrays which are uniformly distributed are arranged on the jet flow pore plate 3, 7 rows and 7 columns of fin arrays are arranged on the bottom plate 4, and an included angle is formed between the fin 9, and the included angles of the fins 9 positioned in the same row are both 45 degrees or both 135 degrees, and the included angles of the fins 9 positioned in two adjacent rows are 45 degrees and 135 degrees respectively. Each row of the fins 9 is positioned between two adjacent rows of the jet holes 8, and each row of the fins 9 is positioned between two adjacent rows of the jet holes 8. The aperture of each row of the jet holes 8 is decreased progressively, the maximum aperture is 1mm, the minimum aperture is 0.5mm, and the apertures of each row of the jet holes 8 are the same.
The water is used as the heat dissipation working medium, and the heat exchange coefficient of the heat dissipation device can reach 37000W/(m) under the condition that the volume flow of the water is 7L/min2·K)。
The above description is only one embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
The invention has not been described in detail in part of the common general knowledge of those skilled in the art.
Claims (7)
1. A heat dissipation device is characterized by comprising a cover plate, a bottom plate and a jet orifice plate positioned between the cover plate and the bottom plate, wherein a first cavity is formed between the cover plate and the jet orifice plate, a second cavity is formed between the bottom plate and the jet orifice plate, a working medium inlet is formed in the cover plate, a working medium outlet is formed in the position, far away from the working medium inlet, on the bottom plate, a jet orifice array is arranged on the jet orifice plate, a fin array is arranged on the bottom plate, an included angle of not 90 degrees is formed between each fin and a vertical plane where a connecting line of the working medium inlet and the working medium outlet is located, the included angles of all the fins positioned in the same row are acute angles or obtuse angles, and one included angle of each fin positioned in two adjacent rows is an obtuse angle and the other is an; gaps are formed between the fins positioned in two adjacent rows, the aperture of the jet hole close to the working medium inlet is larger than that of the jet hole close to the working medium outlet, and the aperture of each row of jet holes is gradually reduced; in the fin array, each row is perpendicular to a vertical plane where a connecting line of the working medium inlet and the working medium outlet is located, and each row is parallel to the vertical plane.
2. The heat dissipation device of claim 1, wherein in the jet hole array, each column is perpendicular to a vertical plane on which the working medium inlet and working medium outlet connection line is located, and each row is parallel to the vertical plane.
3. The heat dissipating device of claim 2, wherein each row of said fins is located between two adjacent rows of said jet holes, and each column of said fins is located between two adjacent columns of said jet holes.
4. The heat dissipating device as claimed in claim 1, wherein the fins and the vertical plane on which the working medium inlet and outlet are connected form an included angle of 30-60 ° or 120-150 °.
5. The heat sink of claim 1, 3 or 4, wherein the line connecting the working fluid inlet and the working fluid outlet is located on a mid-section of the device.
6. The heat dissipating device of claim 5, wherein the aperture of each column of the jet holes is the same.
7. Use of the heat sink according to any of claims 1-6 in electronic devices, microwave systems and laser systems.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811280723.6A CN109548364B (en) | 2018-10-30 | 2018-10-30 | Heat dissipation device and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811280723.6A CN109548364B (en) | 2018-10-30 | 2018-10-30 | Heat dissipation device and application thereof |
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| CN109548364A CN109548364A (en) | 2019-03-29 |
| CN109548364B true CN109548364B (en) | 2020-10-20 |
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| CN201811280723.6A Active CN109548364B (en) | 2018-10-30 | 2018-10-30 | Heat dissipation device and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110112112A (en) * | 2019-04-12 | 2019-08-09 | 中国电子科技集团公司第三十八研究所 | Misting cooling formula cold plate |
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| CN104712372A (en) * | 2014-12-29 | 2015-06-17 | 上海交通大学 | High-performance impact cooling system |
| CN107329546A (en) * | 2017-07-13 | 2017-11-07 | 电子科技大学 | The experimental system and method for a kind of heat abstractor, cooling system and heat abstractor |
| CN107567247A (en) * | 2017-09-07 | 2018-01-09 | 太原理工大学 | A kind of dissipation from electronic devices method that array jetting, solid-liquid phase change are coupled |
| CN108223022A (en) * | 2018-01-04 | 2018-06-29 | 沈阳航空航天大学 | A kind of turbulence structure in array jetting cooling |
| CN207652866U (en) * | 2017-10-27 | 2018-07-24 | 瑞典爱立信有限公司 | Radiator |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101266432B1 (en) * | 2013-03-12 | 2013-05-22 | 주식회사 세기하이텍 | A wide heat spreader for cooling down a digital information display device |
| CN104994704B (en) * | 2015-03-16 | 2017-11-10 | 中航光电科技股份有限公司 | A kind of cold plate radiator |
| CN108551750B (en) * | 2018-03-20 | 2019-09-10 | 山东超越数控电子股份有限公司 | A kind of enhancing jet stream radiator heat-dissipation efficient appliances, radiating subassembly and production method |
| CN108712852B (en) * | 2018-07-12 | 2019-07-30 | 厦门大学 | A kind of microchannel heat sink of gas-liquid two-phase mixing jetting |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104712372A (en) * | 2014-12-29 | 2015-06-17 | 上海交通大学 | High-performance impact cooling system |
| CN107329546A (en) * | 2017-07-13 | 2017-11-07 | 电子科技大学 | The experimental system and method for a kind of heat abstractor, cooling system and heat abstractor |
| CN107567247A (en) * | 2017-09-07 | 2018-01-09 | 太原理工大学 | A kind of dissipation from electronic devices method that array jetting, solid-liquid phase change are coupled |
| CN207652866U (en) * | 2017-10-27 | 2018-07-24 | 瑞典爱立信有限公司 | Radiator |
| CN108223022A (en) * | 2018-01-04 | 2018-06-29 | 沈阳航空航天大学 | A kind of turbulence structure in array jetting cooling |
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