CN113286497B - Jet flow micro-channel radiator with surface micro-grooves - Google Patents

Jet flow micro-channel radiator with surface micro-grooves Download PDF

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CN113286497B
CN113286497B CN202110573540.9A CN202110573540A CN113286497B CN 113286497 B CN113286497 B CN 113286497B CN 202110573540 A CN202110573540 A CN 202110573540A CN 113286497 B CN113286497 B CN 113286497B
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jet
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grooves
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CN113286497A (en
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周晓明
刘浩
李亚东
陈智源
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University of Electronic Science and Technology of China
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263—Heat dissipaters releasing heat from coolant
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to a jet flow micro-channel radiator with surface micro-grooves, and belongs to the field of electronic device heat dissipation. Comprises a jet generator and a micro-channel matrix; the micro-channel matrix is fixedly arranged at the bottom of the jet flow generator; the microchannel matrix is plate-shaped, and a plurality of microchannels which run through the top surface are uniformly distributed on the top surface; the jet holes at the bottom of the jet generator respectively correspond to a plurality of micro-channels, and the bottom surfaces at two ends of each micro-channel are respectively provided with more than two micro-grooves; when the micro-channel structure works, cooling liquid is introduced from a cooling liquid inlet, is integrated and shunted through the shunting chamber, enters the jet hole array to form jet-shaped fluid, enters a plurality of micro-channels of the micro-channel matrix, and flows out from two ends of the micro-channels respectively. Compared with the micro-channel structure with the columnar flow disturbing piece, the micro-channel structure with the micro-grooves has the advantages that the pump power consumption is reduced by about 40% to reach the same junction temperature, and meanwhile, the micro-channel structure is more practical.

Description

Jet flow micro-channel radiator with surface micro-grooves
Technical Field
The invention belongs to the field of heat dissipation of electronic devices, and relates to a jet micro-channel heat radiator with surface micro-grooves.
Background
The integration of electronic devices is increasing, so that the thermal power and the heat flux density of the IC chip are also increasing. The united states air force analysis report indicates: 55% of electronic equipment failures are caused by temperature, and the failure rate of the electronic equipment is reduced by 4% when the maximum temperature is reduced by 1 ℃. The "10 ℃ rule" also indicates that: the reliability of a semiconductor device decreases by more than half for every 10 c increase in temperature.
In order to solve the problems, the current advanced chip heat dissipation mode is jet micro-channel heat dissipation, and the mode can provide ultrahigh heat exchange efficiency. In the jet flow microchannel radiator, after cooling liquid enters a microchannel from a jet flow hole array, the cooling liquid is ideally vertically sprayed into the microchannel, the spraying flow directly impacts the bottom of the microchannel to provide a very strong heat exchange effect, and the whole chip surface uniformly radiates under the action of the jet flow array. In order to further improve the heat exchange effect, some jet micro-channel heat exchangers try to encrypt the number of jet holes or add columnar flow-surrounding devices in the micro-channels, so that more disturbed flows are generated and the heat exchange efficiency is improved.
However, in actual engineering, the existing jet micro-channel radiator is found to have two obvious problems:
firstly, along with the accumulation of local efflux in the middle of the microchannel, can strike fore-and-aft efflux behind the inside fluid lateral velocity grow of microchannel, produce "skew effect" to weaken the microchannel and be close to exit heat transfer effect. The consequence is poor temperature uniformity across the chip surface, high edge temperatures, and high temperatures that can degrade chip reliability.
Secondly, the jet flow micro-channel radiator on the market at present not only utilizes the enhanced heat exchange effect of jet flow, but also mostly adopts the mode that a columnar flow surrounding piece is added in the micro-channel to improve the heat exchange efficiency of the whole device, but also increases the pressure difference of an inlet and an outlet, which means that the pump work consumption of the radiator is increased.
Disclosure of Invention
In order to weaken the offset effect of fluid in a microchannel, improve the heat exchange efficiency, reduce the pressure difference at the inlet and the outlet of a radiator and realize the reduction of the pump power consumption, the invention provides a jet flow microchannel radiator with surface microgrooves.
A jet flow micro-channel radiator with surface micro-grooves comprises a jet flow generator 1 and a micro-channel matrix 2; the jet flow generator 1 is of a hollow cavity structure, a cooling liquid inlet 11 is formed in the middle of the top of the jet flow generator, jet holes 13 are formed in the bottom of the jet flow generator, a jet hole array is formed, and a shunting chamber 12 is formed in the hollow cavity of the jet flow generator 1; the micro-channel matrix 2 is fixedly arranged at the bottom of the jet flow generator 1;
the microchannel base body 2 is plate-shaped, a plurality of microchannels 21 penetrating through the top surface are uniformly distributed on the top surface, and fins 23 are arranged between every two adjacent microchannels 21; the jet holes 13 at the bottom of the jet generator 1 correspond to a plurality of micro-channels 21 respectively, and the bottom surfaces of two ends of each micro-channel 21 are provided with more than two micro-grooves 22 respectively;
when the micro-channel matrix works, cooling liquid is introduced from the cooling liquid inlet 11, is integrally shunted through the shunting chamber 12, enters the jet hole array to form jet-shaped fluid, enters the plurality of micro-channels 21 of the micro-channel matrix 2, and respectively flows out from two ends of the plurality of micro-channels 21.
The specific technical scheme is further defined as follows:
the width of the microchannel 21 is one third of the distance between the center lines of the adjacent microchannels, and the depth of the microchannel 21 is three quarters of the height of the microchannel matrix 2.
When the flow rate of the inlet of the jet flow generator is lower than 0.3L/min, the shape of the micro groove 22 is a rhombus; when the inlet flow of the jet generator is more than 0.3L/min, the shape of the micro-groove 22 is round.
When the micro grooves 22 are circular, the diameter of the micro grooves 22 is 0.6-0.8 times of the width of the micro channels 21, and the depth of the micro grooves is 0.2-0.4 times of the diameter of the micro channels; when the micro-grooves 22 are rhombic, the long diagonal is taken to be 0.7-0.9 times the width of the micro-channel 21 along the direction of the central line of the micro-channel 21, the short diagonal is perpendicular to the central line of the micro-channel 21, the width of the micro-channel 21 is taken to be 0.5-0.7 times, and the depth of the micro-channel is taken to be 0.3-0.5 times that of the short diagonal.
The material of the jet flow generator 1 and the material of the micro-channel matrix 2 are both copper or silicon.
The beneficial technical effects of the invention are embodied in the following aspects:
1. the micro grooves are accurately arranged at the outlets of the micro channels, fluid disturbance is applied again, secondary enhanced heat exchange is carried out at the position, the uniformity of heat dissipation of the chip is improved, and meanwhile, the surface junction temperature (namely the highest surface temperature) of the chip is reduced. The invention provides a judgment formula of 'offset effect' in a jet flow micro-channel structure, which can accurately estimate the positions of fluid in a micro-channel to generate the 'offset effect', theoretically, when the transverse speed of fluid particles is greater than a certain multiple of the downward speed of the fluid particles, the fluid particles can be seriously offset, an effective impact area is difficult to form at the bottom of the micro-channel to carry out sufficient heat exchange, the addition of micro grooves according to an offset rate formula is equivalent to the estimation of where the transverse speed of the fluid is far greater than the downward 'impact speed', a plurality of micro grooves are arranged at the offset positions of the fluid particles, and the fluid can be blocked to generate bypass to damage the boundary layer of the fluid through the micro grooves, so that the enhanced heat exchange is carried out again; on the other hand, the function of the offset rate formula is accurate estimation, so that redundant pumping work consumption caused by pit redundancy in structural design is avoided.
2. Compared with the micro-channel structure with the surface micro-grooves in the prior art, the micro-channel structure with the surface micro-grooves increases interference by adding a prism array or a multi-manifold in the micro-channel, breaks a fluid boundary layer to realize enhanced heat exchange, reduces fluid pressure drop caused by the micro-channel structure with the micro-grooves, and reduces pump work consumption. Under the working condition of micro-nano structures such as chips, the liquid supply pump is limited by space, electricity and the like, so that the power of the liquid supply pump is limited. At present, a common jet flow micro-channel radiator with a columnar flow disturbing structure in scientific research faces to the power limitation of a liquid supply pump in actual work, the pump power consumption is too large, columnar array heat dissipation is difficult to realize in a working environment with a micro-nano system size, and the liquid supply pump with the size of a few cubic centimeters is difficult to supply strong power. Compared with the micro-channel structure with the columnar turbulence member, the micro-channel structure with the micro-grooves on the surface is used, the pump power consumption is reduced by 30-50% to reach the same junction temperature, and meanwhile, the invention is more practical.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a partial cross-sectional view of FIG. 1;
FIG. 3 is a schematic diagram of a microchannel matrix structure;
FIG. 4 is a schematic view, partly in section, of an embodiment of the invention in its working condition;
FIG. 5 is a graph comparing the heat dissipation effect of a conventional fluidic microchannel heat sink (a) and an embodiment (b) of the present invention with the same structural parameters;
FIG. 6 is a graph comparing the heat dissipation effect of a fluidic microchannel heat sink with columnar flow-disturbing members (a) and an embodiment of the invention (b);
FIG. 7 is a graph of heat dissipation versus temperature cloud at higher inlet flow for example 2(a) using diamond surface microgrooves and example 1(b) using round surface microgrooves of the present invention;
FIG. 8 is a graph of heat dissipation versus temperature cloud at lower inlet flow for example 2(a) using diamond surface micro-grooves and example 1(b) using round surface micro-grooves of the present invention.
Numbers in fig. 1-4: the device comprises a jet flow generator 1, a micro-channel substrate 2, a heat source chip 3, a cooling liquid inlet 11, a flow splitting chamber 12, a jet hole 13, a micro-channel 21, a micro-groove 22 and fins 23.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. The technical features mentioned in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
Referring to fig. 1, a fluidic microchannel heat sink with surface microgrooves includes a fluidic generator 1 and a microchannel substrate 2. The jet flow generator 1 is of a hollow cavity structure, a cooling liquid inlet 11 is formed in the middle of the top of the jet flow generator, jet holes 13 are formed in the bottom of the jet flow generator, a jet hole array is formed, and a shunting chamber 12 is formed in the hollow cavity of the jet flow generator 1; the micro-channel matrix 2 is fixedly arranged at the bottom of the jet flow generator 1.
Referring to fig. 3, the microchannel base 2 is plate-shaped, a plurality of microchannels 21 penetrating the top surface are uniformly distributed on the top surface, and fins 23 are arranged between the adjacent microchannels 21; the width of the microchannel 21 is one third of the distance between the centerlines of adjacent microchannels, and the depth of the microchannel 21 is three quarters of the height of the microchannel matrix 2. The jet holes 13 at the bottom of the jet generator 1 correspond to a plurality of micro-channels 21 respectively, as shown in fig. 1 and fig. 2; three micro grooves 22 are respectively arranged on the bottom surfaces of two ends of each micro channel 21.
The material of the jet generator 1 and the material of the microchannel substrate 2 are both copper.
Referring to fig. 1, the bottom of the microchannel substrate 2 is seamlessly adhered to the heat source chip 3, and is used for conducting heat of the heat source chip 3, limiting the directional flow of the liquid after jet flow, and reducing the mutual influence of adjacent jet flow nozzles to the maximum extent.
When the inlet flow of the jet generator is more than 0.3L/min, the shape of the micro-groove 22 is round. When the micro grooves 22 are circular, the diameter of the micro grooves is 0.8 times the width of the micro channels 21, and the depth of the micro grooves 22 is 0.4 times the diameter. The micro-channel section with the micro-groove 22 at the bottom is called a groove distribution section, the groove distribution section extends from an outlet to the inside of a channel, the determination of the cut-off position of the groove distribution section is to select a micro-channel farthest from a cooling liquid inlet 11 and a plurality of jet holes above the micro-channel closest to the cooling liquid inlet, and the deviation rate alpha is calculated according to the following formula:
Figure BDA0003083443320000041
wherein, VlTaking the transverse flow velocity of the cross section of the micro-channel right below the center of the jet hole as the transverse incoming flow velocity in the micro-channelsThe vertical jet velocity of the jet hole.
In this embodiment, the vertical jet velocity and the lateral inflow velocity in the microchannel of each jet hole above the two flow channels are calculated by modeling with simulation software (or by theoretical calculation and experimental test), so as to calculate the offset rate α. Through calculation, on the flow channel farthest from the coolant inlet 11, the jet hole deviation rate α closest to the outlet is 0.26, and the other deviation rates are all smaller than 0.2, then the position right below the jet hole with α being 0.26 is selected as the cut-off position of the groove distribution section, and three circular micro grooves 22 are uniformly arranged on each micro channel from the outlet of the micro channel to the cut-off position.
Due to the existence of the micro grooves 22, the fluid in the micro channel is disturbed again before flowing out, the local heat exchange coefficient is improved, the edge temperature of the micro channel matrix 2 and the heat source chip 3 is reduced, and the uniformity of the temperature distribution of the chip is further improved.
Referring to fig. 4, when the heat source chip 3 is powered on to work, heat is dissipated and transferred to the microchannel substrate 2, externally input cooling liquid is introduced from the cooling liquid inlet 11, is integrated and shunted by the shunting chamber 12 and then enters the jet hole 13, becomes jet-shaped fluid and impacts the heated microchannel substrate 2, a plurality of impact points are formed in the microchannel 21, the heat exchange coefficient of the impacted part is improved by the turbulence, so that the heat exchange is enhanced, the temperature of the microchannel substrate 2 is uniformly distributed, when the cooling liquid flows through the micro grooves 22 of the microchannel 21, the turbulence is generated again, the local heat exchange coefficient is increased, the heat exchange effect weakened by the offset effect is corrected, and the edge temperature on the heat source chip 3 is reduced by the conduction of the microchannel substrate 2; finally, the cooling liquid flows out of the micro-channel 21, and the heat exchange process is finished.
Referring to fig. 5, a comparison graph (temperature cloud) of the heat dissipation effect between embodiment 1 of the present invention (b in fig. 5) and a conventional fluidic microchannel heat sink (a in fig. 5) with the same structural parameters shows that, under the operation of the embodiment of the present invention, the maximum surface temperature of the heat source chip is 2.14 ℃ lower than the surface temperature of the heat source chip under the conventional fluidic microchannel heat sink, and the temperature difference between the chip surfaces is reduced, which indicates that the surface temperature distribution is more uniform. Illustrating that the present invention is effective and advantageous.
Referring to fig. 6, under the same working condition, the result of comparing the jet micro-channel heat sink (a in fig. 6) with only one columnar spoiler with the result of the embodiment 1(b in fig. 6) of the present invention shows that when the junction temperature of the two is close (the highest temperature difference of the chip surface is less than 0.5 ℃), the pressure drop at the inlet and the outlet with the columnar spoiler is 156660.1768Pa, while the pressure drop at the inlet and the outlet of the embodiment is 106630.2316Pa, which is equivalent to that the pumping power consumption of the former is 46.9% higher than that of the latter, which indicates that the pumping power consumption of the present invention is lower to achieve the same heat dissipation effect.
Aiming at the problems of poor temperature uniformity and high edge temperature of the conventional chip radiator, the invention combines the advantages of small pump power consumption of a surface micro-groove structure and the like, strengthens the cooling effect on the chip with high heat flow density, reduces the edge temperature of the chip and improves the temperature distribution uniformity.
Example 2
To show the benefit of the diamond-shaped surface micro-grooves, this example 2 uses the same structural parameters as the jet micro-channel heat sink in example 1, and only changes the surface micro-grooves into diamond shapes (0.48 mm long diagonal, 0.37mm short diagonal, area equal to the circular surface micro-grooves in example 1).
Referring to fig. 7, under the condition that the inlet flow rate of the jet generator is 0.4L/min, the heat dissipation effect of the micro grooves with diamond surfaces (a in fig. 7) in the embodiment 2 of the present invention is compared with that of the micro grooves with circular surfaces (b in fig. 7) (temperature cloud chart), and it should be noted that the micro grooves with diamond surfaces and the micro grooves with circular surfaces can ideally accomplish the task of heat exchange enhancement when the inlet flow rate is higher (more than 0.3L/min).
Referring to fig. 8, the heat dissipation effect of the diamond-shaped surface micro-grooves (a in fig. 8) used in example 2 of the present invention and the heat dissipation effect of the circular-shaped surface micro-grooves used in example 1(b in fig. 8) are compared with the temperature cloud under the condition that the inlet flow rate of the jet generator is 0.2L/min, as is apparent from the comparison of the temperature cloud in fig. 8, the junction temperature of example 2 is 1.851 ℃ lower than that of example 1, which proves that the heat dissipation effect of the diamond-shaped surface micro-grooves is more ideal under the low-flow inlet condition (i.e. the inlet flow rate of the jet generator is less than 0.3L/min), and the shapes of the two surface micro-grooves are within the protection scope of the present invention.
It will be understood by those skilled in the art that the foregoing is only an exemplary embodiment of the present invention, and is not intended to limit the invention to the particular forms disclosed, since various modifications, substitutions and improvements within the spirit and scope of the invention are possible and within the scope of the appended claims.

Claims (2)

1. A jet flow micro-channel radiator with surface micro-grooves comprises a jet flow generator (1) and a micro-channel matrix (2); the jet generator (1) is of a hollow cavity structure, a cooling liquid inlet (11) is formed in the middle of the top of the jet generator, jet holes (13) are formed in the bottom of the jet generator, a jet hole array is formed, and the hollow cavity of the jet generator (1) is a shunting chamber (12); the micro-channel matrix (2) is fixedly arranged at the bottom of the jet flow generator (1); the method is characterized in that:
the microchannel base body (2) is plate-shaped, a plurality of microchannels (21) penetrating through the top surface are uniformly distributed on the top surface, and fins (23) are arranged between every two adjacent microchannels (21); the jet holes (13) at the bottom of the jet generator (1) respectively correspond to a plurality of micro-channels (21), and the bottom surfaces of two ends of each micro-channel (21) are respectively provided with more than two micro-grooves (22);
the width of the micro-channel (21) is one third of the distance between the center lines of the adjacent micro-channels, and the depth of the micro-channel (21) is three quarters of the height of the micro-channel matrix (2);
when the device works, cooling liquid is introduced from a cooling liquid inlet (11), is integrally shunted through a shunting chamber (12), enters a jet hole array to form jet-shaped fluid, enters a plurality of micro-channels (21) of a micro-channel matrix (2), and respectively flows out from two ends of the micro-channels (21);
when the flow rate of the jet flow generator inlet is lower than 0.3L/min, the shape of the micro groove (22) is a rhombus; when the flow rate of the inlet of the jet flow generator is more than 0.3L/min, the shape of the micro groove (22) is circular;
when the micro grooves (22) are circular, the diameter of the micro grooves (22) is 0.6-0.8 times of the width of the micro channels (21), and the depth of the micro grooves is 0.2-0.4 times of the diameter of the micro channels; when the micro grooves (22) are rhombic, the long diagonal is 0.7-0.9 times of the width of the micro channel (21) along the direction of the central line of the micro channel (21), the short diagonal is perpendicular to the central line of the micro channel (21), 0.5-0.7 times of the width of the micro channel (21) is taken, and the depth is 0.3-0.5 times of the short diagonal.
2. The fluidic microchannel heat sink with surface microgrooves of claim 1, wherein: the material of the jet flow generator (1) and the material of the micro-channel matrix (2) are both copper or silicon.
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