CN113937615A - Cooling assembly and cooling method for laser - Google Patents
Cooling assembly and cooling method for laser Download PDFInfo
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- CN113937615A CN113937615A CN202111044064.8A CN202111044064A CN113937615A CN 113937615 A CN113937615 A CN 113937615A CN 202111044064 A CN202111044064 A CN 202111044064A CN 113937615 A CN113937615 A CN 113937615A
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- 238000001816 cooling Methods 0.000 title claims abstract description 105
- 230000017525 heat dissipation Effects 0.000 claims abstract description 97
- 239000011159 matrix material Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 3
- 238000000960 laser cooling Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 description 9
- 239000002826 coolant Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
Abstract
The invention provides a cooling assembly and a cooling method for a laser, wherein the cooling assembly comprises the following components in sequential stacking arrangement: the heat dissipation device comprises a cover plate, a jet flow layer and a micro-channel layer, wherein the cover plate is provided with an inlet and an outlet, the jet flow layer is branched into a plurality of strands when a heat dissipation medium flowing into the inlet passes through the jet flow layer and is jetted to the micro-channel layer in a jet flow shape, the micro-channel layer is provided with a plurality of heat dissipation channels, each heat dissipation channel is used for receiving at least part of the jetted heat dissipation medium, and the heat dissipation medium flows out of the outlet through the heat dissipation channels. According to the cooling assembly for the laser, the high-power device is cooled in a mode of combining jet impact and a micro-channel, the cooling assembly is particularly suitable for cooling the lath of the high-power laser, the heat exchange coefficient of the lath can be improved, and the surface temperature of the lath can be uniform. In addition, the cooling assembly for the laser needs less cooling working medium, and the weight and the volume of a laser cooling system can be reduced.
Description
Technical Field
The invention relates to the technical field of cooling and temperature control, in particular to a cooling assembly and a cooling method for a laser.
Background
In recent years, with the progress and development of laser medium materials, processing, laser diode pumping sources, laser design, wavefront correction and other technologies, the average output power of a solid laser is greatly improved, laser output by continuous waves reaches hundreds of kilowatts, and the following problem is that the laser medium generates more and more waste heat in the stimulated radiation process and needs to be dissipated from the surface of the laser medium, so that higher requirements on laser thermal management are provided, and the effective thermal management of the laser is realized to achieve the lean targets of high power, high beam quality and high reliability.
At present, laser cooling technology is mainly focused on two aspects: firstly, the cooling of high heat flux density, secondly the cooling structure is miniaturized, is satisfying under laser instrument heat dissipation demand, the stable prerequisite of assurance system promptly, cooling system is small, light in weight as far as possible. Compared with the heat dissipation of the electronic element which is rapidly developed at present, the heat dissipation of the laser is similar in that the heat flux density is higher and higher, and the difference is that the laser medium is relatively weaker, and the requirements on the flatness of the environment and the optical element are higher.
The traditional cooling mode can not meet the actual heat dissipation requirement, the development of the high-efficiency solid laser cooling technology can be combined with the optical characteristics of the cooling technology, the heat dissipation mechanism of an electronic element is used for reference, and more high-efficiency and compact innovative cooling modes are provided. At present, various high-efficiency cooling and heat dissipation technologies are applied in various fields, wherein a microchannel cooling technology and a jet flow impact cooling technology are in the spotlight.
The heat sink in the micro-channel cooling technology has a large heat exchange coefficient on the whole, which is mainly benefited from a compact structure with a large heat exchange area and a high specific surface area, but has the defects of large heating surface temperature rise in the flow direction and large channel pressure drop.
The cooling medium in the jet flow impact cooling mode has higher pressure gradient and impact velocity on the solid surface, the characteristic enables the temperature boundary layer of the heat exchange surface to be thinned and also enables the temperature gradient to be increased, so that the heat exchange of the cooling medium is effectively strengthened, and the jet flow average velocity of the jet flow impact cooling mode has larger influence on the distribution of heat transfer coefficients in the axial direction and the radial direction, so that the heat exchange capacity can be effectively adjusted by changing the mode of changing the jet flow average velocity to adapt to the condition of complex heat flow boundary distribution. Particularly, for electronic components with local high heat flow density, local hot spots can be effectively eliminated, and better temperature stability is obtained.
The advantage of the single-hole jet is that it directly impacts the heat exchange surface, the heat exchange coefficient of the stagnation zone is very high, but there is a disadvantage that the heat exchange coefficient leaving the stagnation zone is sharply reduced, causing the change of the surface temperature, and it is possible to create a plurality of closely spaced stagnation zones by porous arrangement, thereby evenly impacting the temperature of the surface.
Disclosure of Invention
The invention provides a cooling assembly for a laser and a cooling method, and aims to solve the technical problem of improving the heat dissipation efficiency of the cooling assembly.
The cooling assembly for the laser comprises the following components which are sequentially stacked:
the cover plate is provided with an inlet and an outlet;
the jet flow layer is branched into a plurality of strands when the heat dissipation medium flowing in from the inlet passes through the jet flow layer and is jetted to the microchannel layer in a jet flow shape;
the micro-channel layer is provided with a plurality of heat dissipation channels, each heat dissipation channel is used for receiving at least part of ejected heat dissipation medium, and the heat dissipation medium flows out from the outlet through the heat dissipation channel.
According to the cooling assembly for the laser, disclosed by the embodiment of the invention, the high-power device is subjected to heat dissipation by adopting a mode of combining jet impact and a micro-channel, the cooling assembly is particularly suitable for heat dissipation of a high-power laser batten, the heat exchange coefficient of the batten can be improved, and the surface temperature of the batten is uniform. In addition, the cooling assembly for the laser needs less cooling working medium, and the weight and the volume of a laser cooling system can be reduced.
According to some embodiments of the invention, the jet layer is provided with a jet chamber and a plurality of jet holes communicating with the jet chamber;
after the heat-dissipating medium flowing in from the inlet enters the jet flow cavity, a plurality of jet flows are formed through the plurality of jet flow holes and are ejected.
In some embodiments of the present invention, the plurality of jet holes are arranged in a matrix in an orthographic projection, each heat dissipation channel is arranged parallel to the width or length of the matrix, each heat dissipation channel is arranged opposite to at least a part of the jet holes, and each heat dissipation channel is provided with a receiving hole at a position opposite to the jet holes.
According to some embodiments of the present invention, the plurality of jet holes each penetrate the jet layer in a thickness direction of the jet layer.
In some embodiments of the present invention, the fluidic layer is provided with a manifold port in communication with the outlet port, and the heat dissipation medium flowing out of the microchannel layer flows out of the outlet port through the manifold port.
According to some embodiments of the present invention, the microchannel layer is provided with a microchannel cavity communicated with the plurality of heat dissipation channels, and the heat dissipation medium flowing out through the plurality of heat dissipation channels flows out after being converged by the microchannel cavity.
In some embodiments of the present invention, the extending direction of the heat dissipation channel is parallel to the width direction of the microchannel layer, and a plurality of heat dissipation channels are arranged at intervals along the length direction of the microchannel layer.
A laser according to an embodiment of the present invention includes: a cooling assembly according to some embodiments of the present invention for a laser.
According to the laser provided by the embodiment of the invention, the cooling assembly for the laser provided by the embodiment of the invention is adopted, and the heat dissipation of a high-power device is carried out in a mode of combining jet impact and a micro-channel, so that the heat exchange coefficient of a laser slab can be improved, and the surface temperature of the slab can be uniform. In addition, the cooling assembly for the laser provided by the embodiment of the invention needs less cooling working medium, and the weight and the volume of the laser can be reduced.
According to the cooling method of the laser, the cooling assembly for the laser is adopted to cool the laser, and the method comprises the following steps:
allowing a heat-dissipating medium to enter the cooling module through the inlet;
the heat dissipation medium is branched into a plurality of strands when passing through the jet layer and is ejected out in a jet shape so as to cool the laser in a jet manner;
the heat dissipation medium sprayed out of the jet flow layer flows into a plurality of heat dissipation channels to dissipate heat of the micro-channel of the laser;
and the heat dissipation medium after cooling the laser flows out of the outlet.
According to the laser provided by the embodiment of the invention, the cooling assembly for the laser provided by the embodiment of the invention is adopted, and the heat dissipation of a high-power device is carried out in a mode of combining jet impact and a micro-channel, so that the heat exchange coefficient of a laser slab can be improved, and the surface temperature of the slab can be uniform. In addition, the cooling working medium required by the cooling assembly for the laser is less, and the weight and the volume of the laser can be reduced.
In some embodiments of the present invention, the heat dissipation medium is deionized water, and the temperature of the heat dissipation medium is within a predetermined temperature range before the heat dissipation medium flows into the cooling module.
Drawings
FIG. 1 is a perspective view of a cooling assembly for a laser according to an embodiment of the present invention;
FIG. 2 is an exploded view of a cooling assembly for a laser according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a fluidic layer for a cooling assembly of a laser according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a microchannel layer of a cooling assembly for a laser according to an embodiment of the invention;
FIG. 5 is a cross-sectional view of a cooling assembly for a laser according to an embodiment of the present invention;
FIG. 6 is a flow chart of a cooling method according to an embodiment of the present invention.
Reference numerals:
the cooling assembly (1000) is cooled by a cooling element,
the combination of the cover plate 10, the inlet 110, the outlet 120,
the fluidic layer 20, the fluidic chamber 210, the fluidic orifice 220, the manifold 230,
Detailed Description
To further explain the technical means and effects of the present invention adopted to achieve the intended purpose, the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.
With the development of the technology, the output power of the solid laser is increasing day by day, and the problem that the laser medium generates more and more waste heat in the process of stimulated radiation and needs to be dissipated from the surface of the laser medium is solved, which puts higher requirements on the thermal management of the laser, thereby realizing the effective thermal management of the laser to achieve the lean targets of high power, high beam quality and high reliability. Therefore, a more optimized design is required to improve the heat dissipation efficiency of the heat dissipation assembly.
The present invention is directed to solve the above technical problems to a certain extent, and provides a cooling assembly 1000 for a laser and a cooling method.
As shown in fig. 2, a cooling assembly 1000 for a laser according to an embodiment of the present invention includes, in order stacked: the heat dissipation device comprises a cover plate 10, a jet layer 20 and a microchannel layer 30, wherein the cover plate 10 is provided with an inlet 110 and an outlet 120, a heat dissipation medium flowing from the inlet 110 is branched into a plurality of strands when passing through the jet layer 20 and is jetted to the microchannel layer 30 in a jet flow shape, the microchannel layer 30 is provided with a plurality of heat dissipation channels 310, each heat dissipation channel 310 is used for receiving at least part of the jetted heat dissipation medium, and the heat dissipation medium flows out from the outlet 120 through the heat dissipation channel 310.
According to the cooling assembly 1000 for the laser, disclosed by the embodiment of the invention, the high-power device heat dissipation is carried out in a mode of combining jet impact and a micro-channel, the cooling assembly is particularly suitable for heat dissipation of a high-power laser batten, the heat exchange coefficient of the batten can be improved, and the surface temperature of the batten can be uniform. In addition, the cooling assembly 1000 for the laser needs less cooling working medium, and the weight and the volume of a laser cooling system can be reduced.
As shown in fig. 2 and 3, according to some embodiments of the present invention, the jet layer 20 is provided with a jet chamber 210 and a plurality of jet holes 220 communicated with the jet chamber 210, and after the heat dissipation medium flowing from the inlet 110 enters the jet chamber 210, a plurality of jets are formed through the plurality of jet holes 220 to be ejected. Therefore, the heat dissipation medium is sprayed out in a jet flow mode, so that the heat dissipation medium has higher pressure gradient and impact speed on the solid surface, local hot spots can be effectively eliminated, and better temperature stability is obtained.
As shown in fig. 2 and 4, in some embodiments of the present invention, the plurality of fluidic holes 220 are arranged in a matrix shape in an orthographic projection, each heat dissipation channel 310 is disposed parallel to the width or length of the matrix, each heat dissipation channel 310 is disposed opposite to at least a part of the fluidic holes 220, and each heat dissipation channel 310 is disposed with a receiving hole 320 at a position opposite to the fluidic holes 220.
It should be noted that the orthographic projection of the plurality of jet holes 220 in the embodiment of the present invention is a projection of a plane with a gaze perpendicular to the length and width directions of the cooling module 1000, and the projection is obtained when looking at the cooling module 1000 along the thickness direction of the cooling module 1000.
In the above technical solution, the jet holes 220 are arranged in a matrix shape, and a plurality of closely spaced stagnation regions are created by porous arrangement, so as to uniformly impact the temperature of the surface. Meanwhile, the receiving hole 320 of the heat dissipation channel 310 is arranged opposite to the jet hole 220, so that the loss of the flow velocity of the fluid flowing into the micro-channel layer 30 from the jet layer 20 is reduced, and the heat dissipation effect is improved.
It should be noted that there are many choices for the arrangement of the jet holes 220 and the design of the microchannel layer 30, for example, the jet holes 220 may also be arranged in a form other than a matrix, such as a diamond shape or other geometric shape or a bionic structure, to achieve the effects of reducing drag and the like, thereby improving the heat dissipation efficiency. The receiving hole 320 of the microchannel layer 30 may be configured to be a circular hole similar to the jet hole 220, or the heat dissipation channel 310 may be made into a plate-shaped heat dissipation fin, and an open space is formed at the upper portion of the heat dissipation channel 310, and the open space above the adjacent heat dissipation channel 310 may also be used as the receiving hole 320 to receive the jet flow emitted from the jet hole 220.
As shown in fig. 3, according to some embodiments of the present invention, a plurality of jet holes 220 each penetrate the jet layer 20 in the thickness direction of the jet layer 20.
As shown in fig. 3, in some embodiments of the present invention, the fluidic layer 20 is provided with a manifold port 230 in communication with the outlet port 120, and the heat dissipation medium flowing out of the microchannel layer 30 flows out of the outlet port 120 through the manifold port 230. Therefore, the heat dissipation medium can leave the heat dissipation medium through the cover plate 10 through the manifold 230, so as to take away heat, and since the manifold 230 is directly connected with the outlet 120, the flow resistance of the heat dissipation medium can be reduced, thereby further improving the heat dissipation efficiency of the cooling assembly 1000.
As shown in fig. 2 and 4, according to some embodiments of the present invention, the microchannel layer 30 has a microchannel cavity communicating with the plurality of heat dissipation channels 310, and the heat dissipation medium flowing out through the plurality of heat dissipation channels 310 flows out after being converged by the microchannel cavity.
As shown in fig. 4, in some embodiments of the present invention, the extending direction of the heat dissipation channel 310 is parallel to the width direction of the microchannel layer 30, and a plurality of heat dissipation channels 310 are arranged at intervals along the length direction of the microchannel layer 30.
A laser according to an embodiment of the present invention includes: a cooling assembly 1000, the cooling assembly 1000 being a cooling assembly 1000 for a laser according to the above.
According to the laser provided by the embodiment of the invention, the cooling assembly 1000 for the laser provided by the embodiment of the invention is adopted, and the heat dissipation of a high-power device is carried out in a mode of combining jet impact and a micro-channel, so that the heat exchange coefficient of a laser slab can be improved, and the surface temperature of the slab can be uniform. In addition, the cooling assembly 1000 for the laser needs less cooling working medium, and the weight and the volume of the laser can be reduced.
According to the cooling method of the laser in the embodiments of the present invention, the method uses the cooling assembly 1000 for the laser in some embodiments of the present invention to cool down the laser, as shown in fig. 5 and 6, the method includes:
s101: the heat-dissipating medium is brought into the cooling module through the inlet (arrow a).
S102: the heat-dissipating medium is branched into a plurality of strands (arrows C) when passing through the jet layer (arrows B) and is ejected in a jet shape to cool the laser.
S103: the heat dissipation medium sprayed out of the jet flow layer flows into a plurality of heat dissipation channels (arrows D) to dissipate heat of the micro-channel of the laser.
S104: the heat sink medium (arrow E) after cooling the laser flows out of the outlet.
According to the laser provided by the embodiment of the invention, the cooling assembly 1000 for the laser provided by the embodiment of the invention is adopted, and the heat dissipation of a high-power device is carried out in a mode of combining jet impact and a micro-channel, so that the heat exchange coefficient of a laser slab can be improved, and the surface temperature of the slab can be uniform. In addition, the cooling assembly 1000 for the laser needs less cooling working medium, and the weight and the volume of the laser can be reduced.
In some embodiments of the present invention, the heat-dissipating medium is deionized water, and the temperature of the heat-dissipating medium is within a predetermined temperature range before the heat-dissipating medium flows into the cooling assembly 1000.
The cooling assembly 1000 for a laser and the cooling method according to the present invention will be described in detail with reference to specific embodiments of the accompanying drawings. It is to be understood that the following description is only exemplary, and not a specific limitation of the invention.
The invention designs a novel high-power lath cooling assembly 1000 by utilizing the respective advantages of micro-channels and jet flow impact, the whole structure is shown as figure 1 and figure 2, the structure comprises a cover plate 10, a jet flow layer 20 and a micro-channel layer 30, and after the machining of all doors is finished, all the doors are welded together in a diffusion welding mode to prevent the cooling assembly 1000 from water leakage.
The cooling principle of the cooling assembly 1000 of the present invention is: before entering the cooling module 1000, the cooling medium needs to be cooled, the selected cooling medium is deionized water, before entering the cooling structure, the temperature is controlled at 180 ℃, the deionized water enters from the inlet 110 of the cover plate 10, passes through the jet layer 20, flows into each jet hole 220 through the jet cavity 210, is vertically sprayed out, and impacts the wall surface of the cooling module 1000 to play a role in jet impact heat exchange, the cooling medium horizontally flows along the cooling channel 310 on the microchannel layer 30, the heat exchange area is increased, the role in convective heat exchange is played, the surface impact temperature is uniform, a large amount of heat generated by a heat source is taken away, and finally, the deionized water flows out from the junction 230 and the outlet 120 of the cooling module 1000.
The structure adopts a mode of combining jet impact and a microchannel to dissipate heat of a high-power device, is particularly suitable for dissipating heat of a high-power laser batten, can improve the heat exchange coefficient of the batten and uniform the surface temperature of the batten, and can lighten the weight and the volume of a laser cooling system.
While the invention has been described in connection with specific embodiments thereof, it is to be understood that it is intended by the appended drawings and description that the invention may be embodied in other specific forms without departing from the spirit or scope of the invention.
Claims (10)
1. A cooling assembly for a laser, comprising, in sequential stacked arrangement:
the cover plate is provided with an inlet and an outlet;
the heat dissipation medium flowing in from the inlet is branched into a plurality of strands when passing through the jet layer and is jetted to the microchannel layer in a jet flow shape;
the micro-channel layer is provided with a plurality of heat dissipation channels, each heat dissipation channel is used for receiving at least part of the ejected heat dissipation medium, and the heat dissipation medium flows out of the outlet through the heat dissipation channel.
2. The cooling assembly for a laser of claim 1, wherein the fluidic layer is provided with a fluidic chamber and a plurality of fluidic holes in communication with the fluidic chamber;
after the heat dissipation medium flowing in from the inlet enters the jet cavity, a plurality of jets are formed through the plurality of jet holes and are ejected.
3. The cooling module for a laser according to claim 2, wherein the plurality of jet holes are arranged in a matrix shape in an orthographic projection, each of the heat dissipation channels is arranged parallel to the width or length of the matrix, each of the heat dissipation channels is arranged to face at least a part of the jet holes, and each of the heat dissipation channels is provided with a receiving hole at a position facing the jet hole.
4. The cooling assembly for a laser according to claim 2, wherein a plurality of the jet holes each penetrate the jet layer in a thickness direction thereof.
5. The cooling assembly as claimed in claim 1, wherein the jet layer is provided with a flow converging port communicating with the outlet, and the heat dissipating medium flowing out of the microchannel layer flows out of the outlet through the flow converging port.
6. The cooling assembly as claimed in claim 1, wherein the microchannel layer has a microchannel cavity communicating with the plurality of heat dissipation channels, and the heat dissipation medium flowing out through the plurality of heat dissipation channels flows out after converging through the microchannel cavity.
7. The cooling assembly of claim 1, wherein the heat dissipation channel extends parallel to a width of the microchannel layer, and a plurality of heat dissipation channels are spaced along a length of the microchannel layer.
8. A laser, comprising: a cooling assembly for a laser according to any one of claims 1 to 7.
9. A method for cooling a laser, wherein the method employs the cooling assembly for a laser according to any one of claims 1 to 7, and the method comprises:
passing a heat-dissipating medium into the cooling assembly through the inlet;
the heat dissipation medium is branched into a plurality of strands when passing through the jet layer and is ejected out in a jet shape so as to cool the laser in a jet manner;
the heat dissipation medium sprayed out of the jet flow layer flows into the plurality of heat dissipation channels to dissipate heat of the micro-channel of the laser;
and the heat dissipation medium after cooling the laser flows out of the outlet.
10. The cooling method according to claim 9, wherein the heat-dissipating medium is deionized water, and the temperature of the heat-dissipating medium is within a predetermined temperature range before the heat-dissipating medium flows into the cooling module.
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| CN202111044064.8A CN113937615A (en) | 2021-09-07 | 2021-09-07 | Cooling assembly and cooling method for laser |
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| CN202111044064.8A CN113937615A (en) | 2021-09-07 | 2021-09-07 | Cooling assembly and cooling method for laser |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115714297A (en) * | 2023-01-06 | 2023-02-24 | 中国电子科技集团公司第十一研究所 | Space solid laser subassembly of non-initiative control by temperature change |
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Application publication date: 20220114 |