CN217642122U - Pump source heat radiation structure - Google Patents
Pump source heat radiation structure Download PDFInfo
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- CN217642122U CN217642122U CN202221443209.1U CN202221443209U CN217642122U CN 217642122 U CN217642122 U CN 217642122U CN 202221443209 U CN202221443209 U CN 202221443209U CN 217642122 U CN217642122 U CN 217642122U
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Abstract
The utility model discloses a pump source heat radiation structure, which comprises a heat radiation pipeline, a heat sink and a heat radiation plate; the heat dissipation pipeline is positioned between the heat sink and the heat dissipation plate, the heat sink is provided with an installation groove and is connected with the heat dissipation pipeline in an embedded manner; the inlet of the heat dissipation pipeline is connected with a cooling medium source, the outlet of the heat dissipation pipeline penetrates through the heat sink, and the outlet of the heat dissipation pipeline is connected with the cooling medium source; through set up the mounting groove on the heat sink to and set up independent heat dissipation pipeline between pumping source and heating panel, carry out the laminating with heat dissipation pipeline with the mode of embedding connection and heat sink and be connected. Therefore, the heat transfer distance between the heat sink and the cooling medium can be shortened, the direct contact between the cooling medium and the heat sink is isolated, the cooling medium is prevented from leaking, and the safety and reliability of the working process of the pumping source are improved. Meanwhile, the effect of convenience in production, test, installation, maintenance and transportation of the pumping source can be improved by independently arranging the independent heat dissipation pipeline and the heat dissipation plate.
Description
Technical Field
The utility model belongs to the technical field of the laser instrument, concretely relates to pumping source heat radiation structure.
Background
The existing fiber laser needs a plurality of pumping sources to generate pumping light, and the laser energy level of a laser working substance is subjected to population inversion under the action of the pumping light to generate coherent laser beams. The greater the fiber laser output power, the greater the pump source power required, and correspondingly, the greater the current required to drive the pump source. The part of current drives the pump source to generate useful optical energy and also generates useless heat energy, and meanwhile, a part of heat energy is also formed in the process of coupling and spreading of the optical energy, so that the pump source needs to be effectively cooled in time.
The existing cooling mode adopts an independent cooling mode and a relative direct cooling mode, the independent cooling mode and the relative direct cooling mode sinter a laser chip in a pumping source on a heat sink through aluminum nitride ceramics, and then the heat sink is connected with a heat dissipation plate. And the independent cooling mode is that the packaged pump source is directly installed on a heat dissipation plate, and then the heat is taken away by a cooling medium flowing through the inside of the heat dissipation plate so as to cool the laser chip. However, the laser chip in this cooling method is far from the cooling medium, the cooling efficiency is low, and the package of the pump source is expensive, which increases the cooling cost.
The relatively direct cooling mode is that fluid channels are processed on the heat sink and the heat dissipation plate, and the two fluid channels are hermetically connected through the O-ring, so that a cooling medium sequentially flows through the two fluid channels to cool the laser chip. Although the cooling mode shortens the distance between the cooling medium and the laser chip, high sealing performance is required between the heat sink and the heat dissipation plate to prevent the cooling medium from leaking, so that the requirements on the processing precision and the assembly precision of the heat sink and the heat dissipation plate are improved, and the cooling cost is further improved.
SUMMERY OF THE UTILITY MODEL
To the above problem, the utility model discloses a pumping source heat radiation structure to overcome above-mentioned problem or solve above-mentioned problem at least partially.
In order to realize the purpose, the utility model adopts the following technical scheme:
a pump source heat radiation structure comprises a heat radiation pipeline, a heat sink and a heat radiation plate; the heat dissipation pipeline is positioned between the heat sink and the heat dissipation plate, the heat sink is provided with a mounting groove, and the heat dissipation pipeline is connected with the mounting groove in an embedded manner; the heat dissipation pipeline penetrates through the heat sink, an inlet of the heat dissipation pipeline is connected with a cooling medium source, and the cooling medium penetrates through the heat sink through an outlet of the cooling medium source.
Optionally, the mounting groove is located right below the laser chip.
Optionally, the mounting groove is connected with the heat dissipation pipeline in an interference fit manner.
Optionally, the pump source heat dissipation structure further includes a heat conductive adhesive; the heat-conducting glue is located between the heat dissipation pipeline and the mounting groove and is respectively and fixedly connected with the heat dissipation pipeline and the mounting groove.
Optionally, the cross section of the heat dissipation pipeline is rectangular.
Optionally, be equipped with two mounting grooves on the heat sink, the heat dissipation pipeline divide into the section of flowing back and backward flow section, the section of flowing back with the form of buckling is embedded into respectively the inside of mounting groove, the stiff end of the section of flowing back with the stiff end of the section of flowing back is connected, the expansion end of the section of flowing back with the expansion end of the section of flowing back does respectively as the import and the export of heat dissipation pipeline.
Optionally, the connection part between the fixed end of the inflow section and the fixed end of the backflow section is arc-shaped.
Optionally, the inflow section is arranged separately from the return section.
Optionally, the movable end of the inflow section and the movable end of the backflow section are disposed adjacent to each other and located on the same side of the heat sink.
Optionally, the inlet of the heat dissipation pipeline and/or the outlet of the heat dissipation pipeline are/is provided with a quick-screwing joint or a quick-plugging joint.
The utility model has the advantages and the beneficial effects that:
the utility model discloses an among the pump source heat radiation structure, through set up the mounting groove on heat sink to and set up independent heat dissipation pipeline between pump source and heating panel, and with the mode that the heat dissipation pipeline is connected with embedding and heat sink laminating and be connected. Like this, not only can shorten under the condition of heat transfer distance between heat sink and the cooling medium, keep apart the direct contact of cooling medium and heat sink, prevent that the cooling medium from leaking, promote the fail safe nature of pumping source work, embedded connection can improve the effect of the convenience of laser heat dissipation pipeline installation at heat sink moreover.
Drawings
Various additional advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a schematic structural diagram of an external shape of a pump source heat dissipation structure according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a mounting groove in a pump source heat dissipation structure according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heat dissipation pipe in a pump source heat dissipation structure according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another heat dissipation pipeline in the pump source heat dissipation structure according to an embodiment of the present invention.
Detailed Description
In order to make the purpose, technical solution and effect of the present invention clearer, the following will combine the embodiments of the present invention and the corresponding drawings to the technical solution of the present invention to perform clear and complete description. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
The technical solutions provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 3, the present embodiment discloses a pump source heat dissipation structure, which includes a heat dissipation pipe 1, a heat sink 2, and a heat dissipation plate 3. The heat dissipation pipeline 1 is located between the heat sink 2 and the heat dissipation plate 3, the heat sink 2 is provided with an installation groove 21, and the heat dissipation pipeline 1 and the installation groove 21 are connected in an embedded mode. The heat dissipation pipeline 1 penetrates through the heat sink 2, the inlet of the heat dissipation pipeline 1 is connected with a cooling medium source, and the heat dissipation pipeline 1 guides the cooling medium in the cooling medium source to penetrate through the heat sink 2.
In this embodiment, the installation groove is arranged on the heat sink, the independent heat dissipation pipeline is arranged between the pumping source and the heat dissipation plate, and the heat dissipation pipeline is attached to the heat sink in an embedded connection mode. Like this, just can utilize the cooling medium that flows in the heat dissipation pipeline and the heat sink between the heat conduction heat temperature difference, heat on with the heat sink is transmitted to cooling medium fast, and take this heat out the pumping source by cooling medium, thereby reach the temperature of laser chip and be in safe temperature range all the time, utilize the embedded of independent heat dissipation pipeline and heating panel to be connected simultaneously, not only can be under the condition of heat transfer distance between shortening heat sink and the cooling medium, keep apart cooling medium and the direct contact of heat sink, prevent cooling medium leakage, promote the fail safe nature of pumping source work, and embedded connection can improve the convenience of laser heat dissipation pipeline installation at heat sink. Meanwhile, the effect of convenience in production, test, maintenance and transportation of the pumping source can be improved by utilizing the independent arrangement between the heat dissipation pipeline and the heat dissipation plate.
Preferably, the mounting groove 21 is located right below the laser chip in the packaged pump source 4, and the distance between the laser chip and the heat dissipation pipeline 1 is reduced, so that the thermal resistance is reduced, the heat dissipation time is shortened, and the heat dissipation efficiency is improved.
In this embodiment, the heat sink is connected with the cooling plate through screws, so that the connection stability of the heat sink and the cooling plate is improved.
Further, in this embodiment, the mounting groove is connected with the heat dissipation pipeline in an interference fit manner. Specifically, the width of the mounting groove is slightly larger than that of the heat dissipation pipeline, and the tolerance is +0.04mm. In the height direction, the two are tightly matched by the pressure of the screw. Under this condition, through pressing the heat dissipation pipeline, with the heat dissipation pipeline chucking in heat sink to avoid the relative displacement between heat dissipation pipeline and the heat sink, promote the convenience and the stability that heat dissipation pipeline and heat sink are connected, and can increase coefficient of heat conduction through the interference fit between heat dissipation pipeline and the heat sink in order to reduce the thermal resistance, thereby improve the radiating rate.
Preferably, the pump source heat radiation structure further comprises heat conducting glue, and the heat conducting glue is located between the heat radiation pipeline and the installation groove and is respectively and fixedly connected with the heat radiation pipeline and the installation groove. Like this, carry out the embedment through setting up the clearance of heat conduction glue between with heat dissipation pipeline and mounting groove, not only can strengthen the laminating nature between heat dissipation pipeline 1 and the heat sink 2, it has heat conduction glue to fill between the clearance moreover, can make the clearance also have good heat conductivity, makes the heat quick conduction of heat sink to heat dissipation pipeline, improves the radiating efficiency.
As shown in fig. 3, in the present embodiment, the cross section of the heat dissipation pipe is rectangular. Therefore, the contact area between the heat dissipation pipeline and the heat sink can be increased, the heat exchange area between the cooling medium and the heat sink is increased, and the heat dissipation efficiency of the pump source heat dissipation structure is improved. At this time, when the cooling medium is deionized water, the length and width of the inside of the cross section of the heat dissipation pipe is 4mm × 4mm, and the thickness of the heat dissipation pipe is 1mm, and the heat dissipation effect of the heat dissipation pipe of this size is optimal through simulation calculation.
Referring to fig. 2 and 3, in this embodiment, two mounting grooves are disposed on one heat sink, and the two mounting grooves are spaced apart from each other, for example, the center distance between the two mounting grooves is 9.4mm, the wall thickness between the two mounting grooves is 3.4mm, meanwhile, the heat dissipation pipeline 1 is divided into an inflow section 11 and a backflow section 12, the inflow section 11 and the backflow section 12 are respectively inserted into the corresponding mounting grooves 21, and the separation between the inflow section 11 and the backflow section 12 is formed. The fixed end 111 of the inflow section is connected with the fixed end 121 of the backflow section, the heat dissipation pipeline 1 sequentially penetrates through the heat sinks 2 from the movable end 112 of the inflow section in a bending mode to guide cooling media in a cooling medium source to penetrate through the heat sinks to reach the movable end 122 of the backflow section, and the movable end 112 of the inflow section and the movable end 122 of the backflow section are respectively used as an inlet and an outlet of the heat dissipation pipeline 1.
Therefore, the two mounting grooves on the heat sink are utilized and are respectively embedded with the inflow section and the backflow section, so that the contact area between the heat dissipation pipeline and the heat sink can be increased, and the heat dissipation efficiency of the pump source heat dissipation structure is improved. Further, the part of separating between two mounting grooves can increase the area of contact between inflow section and backward flow section and the mounting groove to improve the cooling efficiency of inflow section and backward flow section, and then promote heat dissipation pipeline's radiating effect.
In other embodiments, the number of the mounting grooves can be adjusted according to the difference of the number of the laser chips and the difference of the heat dissipation efficiency.
In this embodiment, the movable end of the inflow section and the movable end of the backflow section are disposed adjacent to each other and are located on the same side of the heat sink. Like this, can reduce the distance between heat dissipation pipeline import and the export through the expansion end of the inflow section of adjacent setting and the expansion end of backward flow section to reduce the heat sink that is close to heat dissipation pipeline import department and the difference in temperature between the heat sink that is close to heat dissipation pipeline exit, and then ensure the stability of every laser chip output beam, reduce the drift of the wavelength of output beam, and guarantee the stability of pump source output beam.
Referring to fig. 2 and 3, in this embodiment, the heat dissipation pipeline 1 sequentially passes through a plurality of heat sinks in the form of a plurality of square waves, respectively, starting from the movable end 112 of the inflow section and ending at the movable end 122 of the backflow section, each heat sink 2 is located at the vertical portion 13 of the square waveform, the horizontal portion 14 of each square wave is a transition portion between adjacent heat sinks, and the distance between two bent portions can be increased by using the horizontal portion, which not only facilitates the processing of the heat dissipation pipeline, but also reduces the flow resistance of the cooling medium.
In the present embodiment, as shown in fig. 1 and 3, the connection position between the fixed end of the inflow section and the fixed end of the backflow section is in an arc shape, which further reduces the flow resistance of the cooling medium and facilitates the processing of the connection position.
In addition, preferably, a cooling medium is circulated through the heat dissipation pipeline to dissipate heat of the laser chip. Therefore, quantitative cooling media can be used for heat dissipation to achieve the effect of saving the cooling media, and the effect of continuously cooling the heat dissipation pipeline can be achieved by utilizing a circulating heat dissipation mode, so that the cooling efficiency is improved.
In this embodiment, the pump source heat dissipation structure further includes a water cooler. The water outlet of the water cooler is connected with the inlet of the heat dissipation pipeline, and the water inlet of the water cooler is connected with the outlet of the heat dissipation pipeline. The cooling speed of the cooling medium is increased through the water cooler, the cyclic utilization of the cooling medium is ensured, the water cooler is used for directly driving the cooling medium to circulate through the heat dissipation pipeline, the use of circulating equipment such as a circulating pump is reduced, and the manufacturing cost of the pump source heat dissipation structure is further saved.
In this embodiment, the inlet of the heat dissipation pipe and the outlet of the heat dissipation pipe are provided with a quick-screw joint or a quick-plug joint. Like this, can improve the convenience of being connected between the import of heat dissipation pipeline and the export of heat dissipation pipeline and the water-cooled generator. Of course, in other embodiments, a quick-fit joint may be provided only at the inlet or outlet of the heat dissipation pipe.
Preferably, the heat dissipation plate is provided with a fluid channel, in this case, one end of the fluid channel is connected with the quick-screwing joint at the outlet of the heat dissipation pipeline, the other end of the fluid channel is connected with the water inlet of the water cooling machine, and at the moment, the fluid channel of the heat dissipation plate is connected with the heat dissipation pipeline in a series connection mode. Therefore, the cooling medium further flows into the fluid channel from the heat dissipation pipeline to radiate the heat dissipation position required by the heat dissipation plate in a targeted manner, so that the heat dissipation efficiency of the heat dissipation plate is improved, and the heat dissipation efficiency of the pump source heat dissipation mechanism is further enhanced.
Certainly, in other embodiments, the fluid channel of the heat dissipation plate and the heat dissipation pipeline can be connected to the water cooling machine in a parallel connection mode, and at the moment, the fluid channel of the heat dissipation plate and the heat dissipation pipeline share the outlet and the inlet after being connected in parallel, so that the convenience of connection with the water cooling machine is improved.
In other embodiments, as shown in fig. 4, according to different manufacturing processes of the heat dissipation pipes and different required costs, the shape design of the heat dissipation pipes and the number of the heat dissipation pipes may be changed, for example, the heat dissipation pipe is only a bent pipe, so as to reduce the design of the reflow section, thereby saving the required material of the heat dissipation pipes and further saving the costs.
Preferably, the heat dissipation pipeline is made of heat conduction materials such as red copper, and the materials not only have a good heat dissipation effect, but also have lower cost than other materials with equivalent heat dissipation effects.
Further, in this embodiment, be equipped with the constant head tank on the heating panel, utilize the constant head tank to play limiting displacement between heating panel and the heat dissipation pipeline, promote the stability of position between heating panel and the heat dissipation pipeline.
The connection method among the heat dissipation pipeline, the heat sink and the heat dissipation plate in the pump source heat dissipation structure of the embodiment is specifically as follows:
and step S1, respectively processing an installation groove 21 and a positioning groove on the contact surface connected with the heat sink 2 and the heat dissipation plate 3.
And S2, connecting the heat dissipation pipeline with the heat sink. The surface coating that will dispel the heat pipeline 1 has the heat conduction glue, then presses heat pipeline 1, makes the section 11 that advances of heat pipeline 1 and the joint of backward flow section 12 in heat sink 2's mounting groove 21 to glue through the heat conduction and make heat pipeline 1 and heat sink 2 seamless contact, improve the radiating effect.
And S3, connecting the heat dissipation pipeline with the heat dissipation plate. The heat dissipation pipeline 1 is embedded in the positioning groove of the heat dissipation plate 3, and the heat sink is connected with the cooling plate through screws, so that the connection stability between the heat dissipation pipeline and the heat dissipation plate is enhanced.
In view of the above, it is only the specific embodiments of the present invention that other modifications and variations can be made by those skilled in the art based on the above-described embodiments in light of the above teachings. It should be understood by those skilled in the art that the detailed description above is only for the purpose of better explaining the present invention, and the scope of protection of the present invention should be subject to the scope of protection of the claims.
Claims (10)
1. A pump source heat radiation structure is characterized in that: the heat dissipation device comprises a heat dissipation pipeline, a heat sink and a heat dissipation plate; the heat dissipation pipeline is positioned between the heat sink and the heat dissipation plate, the heat sink is provided with an installation groove, and the heat dissipation pipeline is connected with the installation groove in an embedded manner; the heat dissipation pipeline penetrates through the heat sink, an inlet of the heat dissipation pipeline is connected with a cooling medium source, and the cooling medium penetrates through the heat sink through an outlet of the cooling medium source.
2. The pump source heat dissipation structure of claim 1, wherein: the mounting groove is located under the laser chip.
3. The pump source heat dissipation structure of claim 1, wherein: the mounting groove with the heat dissipation pipeline adopts interference fit's mode to be connected.
4. The pump source heat dissipation structure of claim 1, wherein: the pump source heat radiation structure also comprises heat conducting glue; the heat-conducting glue is located between the heat dissipation pipeline and the mounting groove and is respectively and fixedly connected with the heat dissipation pipeline and the mounting groove.
5. The pump source heat dissipation structure of claim 1, wherein: the cross section of the heat dissipation pipeline is rectangular.
6. The pump source heat dissipation structure of claim 1, wherein: be equipped with two mounting grooves on the heat sink, the heat dissipation pipeline divide into the section of flowing back and backward flow section, the section of flowing back with the form of buckling is embedded into respectively the inside of mounting groove, the stiff end of the section of flowing back with the stiff end of the section of flowing back is connected, the expansion end of the section of flowing back with the expansion end of the section of flowing back does not conduct the import and the export of heat dissipation pipeline.
7. The pump source heat dissipation structure of claim 6, wherein: the fixed end of the inflow section and the fixed end of the backflow section are connected in an arc shape.
8. The pump source heat dissipation structure of claim 6, wherein: the inflow section is spaced apart from the return section.
9. The pump source heat dissipation structure of claim 6, wherein: the movable end of the inflow section and the movable end of the backflow section are arranged adjacently and are positioned on the same side of the heat sink.
10. The pump source heat dissipation structure of any of claims 1-9, wherein: and a quick-screwing joint or a quick-inserting joint is arranged at the inlet of the heat dissipation pipeline and/or the outlet of the heat dissipation pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221443209.1U CN217642122U (en) | 2022-06-09 | 2022-06-09 | Pump source heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221443209.1U CN217642122U (en) | 2022-06-09 | 2022-06-09 | Pump source heat radiation structure |
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| Publication Number | Publication Date |
|---|---|
| CN217642122U true CN217642122U (en) | 2022-10-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221443209.1U Active CN217642122U (en) | 2022-06-09 | 2022-06-09 | Pump source heat radiation structure |
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| CN (1) | CN217642122U (en) |
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- 2022-06-09 CN CN202221443209.1U patent/CN217642122U/en active Active
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