CN112071813A - Integrated circuit chip heat radiation structure - Google Patents
Integrated circuit chip heat radiation structure Download PDFInfo
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- CN112071813A CN112071813A CN202010789249.0A CN202010789249A CN112071813A CN 112071813 A CN112071813 A CN 112071813A CN 202010789249 A CN202010789249 A CN 202010789249A CN 112071813 A CN112071813 A CN 112071813A
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- flow
- micro
- heat dissipation
- dissipation structure
- integrated circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention discloses an integrated circuit chip heat dissipation structure, which comprises a substrate and a substrate. The base is hollow, and one end of the base is opened to form a containing groove. And a first interface and a second interface which are communicated with the containing groove are respectively arranged on two opposite side walls of the substrate, the first interface is used for injecting cooling medium into the containing groove, and the second interface is used for discharging the cooling medium in the containing groove. The substrate is used for covering the opening of the substrate and is used for contacting with the integrated circuit chip. And a plurality of micro channels are formed on one side of the substrate close to the containing groove and are distributed at intervals along the flowing direction of the cooling medium. Each micro flow channel comprises a plurality of micro flow surrounding units distributed at intervals, each micro flow surrounding unit comprises a cylindrical flow dividing body, each flow dividing body extends along the flowing direction of the cooling medium to form a plate-shaped flow guiding part, and the flow guiding parts are parallel to each other. Therefore, the flow resistance and pressure fluctuation of the cooling medium can be reduced, and the heat dissipation effect is improved.
Description
Technical Field
The invention belongs to the technical field of microelectronics, and particularly relates to a heat dissipation structure of an integrated circuit chip.
Background
With the high integration of chips and the continuous improvement of processing and manufacturing technological means, the number of transistors integrated on the chips is multiplied, so that the heat flow in unit volume is increased, and the temperature of the chips is rapidly increased. In the micro radiator in the prior art, a cooling liquid is pumped into a micro flow channel through a micro pump, and a large amount of heat is taken away by the flowing liquid. The micro-channel heat dissipation capacity has many factors, such as the structure, layout, speed and pressure drop of the micro-channel, thermal wake effect, etc., and these geometric factors are related to each other and affect the heat transfer performance and pressure drop of the micro-heat exchanger.
The traditional micro heat radiator is provided with heat exchange structures with different sizes in a channel, such as a square structure, a conical cylinder structure, a triangular structure, a diamond structure, an elliptical hexagon structure and the like, and is used for reducing a fluid boundary layer so as to improve the heat exchange performance, but eddy current separation and pressure fluctuation are caused along with the increase of pressure loss, so that the micro heat exchanger needs to obtain a better enhanced heat transfer effect at a lower pressure cost.
Disclosure of Invention
In view of the above, it is desirable to provide a heat dissipation structure for an integrated circuit chip, which can reduce the flow resistance and pressure fluctuation of the cooling medium and improve the heat dissipation effect.
The technical scheme provided by the invention for achieving the purpose is as follows:
an integrated circuit chip heat dissipation structure for dissipating heat from an integrated circuit chip, the integrated circuit chip heat dissipation structure comprising:
the base is hollow, one end of the base is opened to form an accommodating groove, a first interface and a second interface which are communicated with the accommodating groove are respectively arranged on two opposite side walls of the base, the first interface is used for injecting cooling media into the accommodating groove, and the second interface is used for discharging the cooling media injected into the accommodating groove;
the substrate is used for covering the opening of the base and is used for being in contact with the integrated circuit chip, a plurality of micro channels are formed on one side of the substrate close to the accommodating groove, and the micro channels are distributed at intervals along the flowing direction of the cooling medium and are used for conducting heat emitted by the integrated circuit chip to the cooling medium;
every miniflow channel includes a plurality of little units of streaming that flow around, these little unit interval distribution that flows around, and every little unit of streaming that flows around includes the reposition of redundant personnel, the reposition of redundant personnel is cylindricly, and every reposition of redundant personnel all follows coolant flow direction extends and forms drainage portion, drainage portion all is platelike, and is parallel to each other.
Further, a plurality of micro-streaming units in each micro-channel are distributed at equal intervals with gaps of a first width along a direction perpendicular to the extending direction of the drainage part.
Further, the plurality of micro-flow channels are distributed in an equidistant and staggered mode, so that each micro-streaming unit corresponds to a gap with a first width between the micro-streaming units in the adjacent micro-flow channels.
Further, the first width is in the range of 50um to 300 um.
Further, the thickness of the drainage portion is smaller than the cross-sectional diameter of the shunt body.
Further, a ratio of a length of the drainage portion to a cross-sectional diameter of the shunt body is greater than 9.
Further, the length of drainage portion is in the within range of 90um ~ 360um, the thickness of drainage portion is in the within range of 20um ~ 80um, the cross section diameter of reposition of redundant personnel is in the within range of 40um ~ 160 um.
Further, the height of the micro-streaming units is smaller than or equal to the depth of the accommodating groove.
Further, the heights of the micro-streaming units are within the range of 50um to 500 um.
Further, the cooling medium injected into the receiving tank by the first interface may be any one of liquid, gas and gas-liquid mixture.
The invention has the beneficial effects that:
(1) by introducing the cylindrical flow splitting body and flow guiding part structure, the turbulence of the fluid is enhanced, the heat exchange capacity of the wall of the flow channel and the fluid in the micro flow channel is improved, and the heat exchange capacity of the fluid is improved; meanwhile, the auxiliary heat dissipation capacity between adjacent micro channels is enhanced, so that the heat dissipation performance of the micro-channel heat dissipation structure is greatly improved.
(2) Through introducing cylindric reposition of redundant personnel and drainage portion structure, effectively improve the drop of swirl, weaken the energy dissipation in the wake district, the resistance coefficient of streaming reduces gradually, and the pressure fluctuation basically disappears, realizes obtaining better enhancement heat transfer effect with lower pressure cost.
Drawings
Fig. 1 is an exploded view of a preferred embodiment of a heat dissipation structure of an integrated circuit chip according to the present invention.
FIG. 2 is a schematic diagram of a preferred embodiment of the substrate of FIG. 1.
FIG. 3 is a cross-sectional view of a preferred embodiment of the substrate of FIG. 1.
FIG. 4 is another cross-sectional view of a preferred embodiment of the substrate of FIG. 1.
Description of the main elements
Second interface 16
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the present invention provides a heat dissipation structure 100 for an integrated circuit chip. The ic chip heat dissipation structure 100 is used for dissipating heat of the ic chip 200. In this embodiment, the integrated circuit chip 200 is a silicon carbide chip.
The heat dissipation structure 100 of the integrated circuit chip includes a substrate 10 and a substrate 20. The substrate 10 is hollow and has an open end to form a receiving groove 12. A first interface 14 and a second interface 16, which are communicated with the accommodating groove 12, are respectively disposed on two opposite sidewalls of the substrate 10. The first port 14 is used for injecting a cooling medium (not shown) into the housing tank 12. The second port 16 is used for discharging the cooling medium injected into the housing tub 12. The substrate 20 is used for covering the opening of the substrate 10 and for contacting the integrated circuit chip 200. The substrate 20 has a plurality of micro flow channels 22 formed on a side thereof adjacent to the housing groove 12. The micro channels 22 are distributed at intervals along the flowing direction of the cooling medium, and are used for providing channels for the cooling medium.
In operation, heat generated by the integrated circuit chip 200 is conducted through the substrate 20 to the microchannels 22. The cooling medium injected through the first port 14 then flows through the microchannels 22 to exchange heat with the microchannels 22, and is finally discharged through the second port 16.
Referring to fig. 2 and 4, each micro flow channel 22 includes a plurality of micro-streaming units 24, and the micro-streaming units 24 are distributed at intervals. The height H of the plurality of micro-streaming units 24 is less than or equal to the depth of the accommodating groove 12. In the present embodiment, the height H of the plurality of micro-streaming units 24 is in the range of 50um to 500 um.
Further, each of the micro-streaming units 24 includes a diverting body 242. The diverter 242 is cylindrical. In the present embodiment, the cross-sectional diameter of the flow dividing body 242 is in the range of 40um to 160 um. The flow dividing body 242 is used for dividing the cooling medium flowing through and making the cooling medium form a vortex when flowing through, so as to achieve the effect of stirring the cooling medium. Each of the divided flow bodies 242 extends in the cooling medium flowing direction to form a flow guide 244. The drainage portions 244 are plate-shaped and parallel to each other. In the present embodiment, the length of the drainage portion is in the range of 90um to 360um, and the thickness of the drainage portion is in the range of 20um to 80 um. The flow guiding portion 244 is used for guiding the cooling medium after the flow splitting of the flow splitting body 242, so as to improve the shedding of the vortex and weaken the energy dissipation in the wake region.
In this embodiment, the thickness of the drainage portion 244 is smaller than the cross-sectional diameter of the flow dividing body 242. The ratio of the length of the flow director 244 to the cross-sectional diameter of the flow distribution 242 is greater than 9. Thus, the fluid vortex at the tail of the cylindrical flow splitting body 242 forms a flow field structure similar to a streamline shape, as the length of the flow guiding part 244 increases, the starting point of vortex shedding further moves backwards along the flow direction, the resistance coefficient of the flowing around gradually decreases, the resistance is reduced by 40% compared with the resistance without the flow guiding part 244, and the pressure fluctuation basically disappears.
In the present embodiment, the plurality of micro-streaming units 24 in each micro flow channel 22 are equally spaced by a gap of a first width in a direction perpendicular to the direction in which the drainage portion 244 extends. The first width is in the range of 50 um-300 um.
In this way, the cooling medium flows through the flow dividing body 242 to absorb heat generated by the integrated circuit chip 200, and due to the cylindrical structure of the flow dividing body 242, the cooling medium forms a vortex when flowing through, so as to achieve the effect of stirring the cooling liquid, so that the temperature boundary layer becomes thin, and the heat exchange performance is enhanced; subsequently, the cooling medium flows through the flow guide 244, which, in turn, due to the plate-like structure of the flow guide 244, effectively improves the shedding of the swirl and attenuates the energy dissipation in the wake region. After flowing through one microchannel 22, the cooling fluid will flow into the next adjacent microchannel 22. Because the micro channels 22 are distributed at intervals, the convection of the cooling liquid between the adjacent micro channels 22 is enhanced, and the heat dissipation effect is improved.
In the present embodiment, the plurality of microchannels 22 are equally spaced and distributed with a shift such that each of the micro-streaming units 24 corresponds to a gap of a first width between the micro-streaming units 24 in adjacent microchannels 22. In this way, when the coolant flows into the next adjacent microchannel 22, the coolant can sufficiently contact the divided fluid 242 in the next adjacent microchannel 22, thereby improving the effect of stirring the coolant and further enhancing the heat radiation effect.
In the present embodiment, the cooling medium injected into the accommodating tank 12 through the first port 14 may be any one of a liquid, a gas, and a gas-liquid mixture.
In this embodiment, the substrate 20 is used to contact with the substrate of the integrated circuit chip 200 to conduct heat generated by the integrated circuit chip 200. In other embodiments, the substrate of the integrated circuit chip 200 may be etched to form the structure of the base plate 20 on the bottom of the substrate.
The integrated circuit chip heat dissipation structure 100 forms a micro channel 22 through a plurality of micro-streaming units 24 to provide a heat dissipation channel for a cooling medium; the flow dividing body 242 is arranged on the micro-streaming unit 24 to form a vortex for the flowing cooling medium, so that local disturbance is generated to break the flow boundary layer, and the temperature boundary layer becomes thin; pressure fluctuation due to flow separation of the viscous fluid around the columnar structure is also reduced by the plate-shaped flow guide 244 formed to extend on the side of the flow dividing body 242. Thus, the flow resistance and pressure fluctuation of the cooling medium can be reduced, and the heat dissipation effect can be improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. An integrated circuit chip heat dissipation structure for dissipating heat from an integrated circuit chip, the integrated circuit chip heat dissipation structure comprising:
the base is hollow, one end of the base is opened to form an accommodating groove, a first interface and a second interface which are communicated with the accommodating groove are respectively arranged on two opposite side walls of the base, the first interface is used for injecting cooling media into the accommodating groove, and the second interface is used for discharging the cooling media injected into the accommodating groove;
the substrate is used for covering the opening of the base and is used for being in contact with the integrated circuit chip, a plurality of micro channels are formed on one side of the substrate close to the accommodating groove, and the micro channels are distributed at intervals along the flowing direction of the cooling medium and are used for conducting heat emitted by the integrated circuit chip to the cooling medium;
every miniflow channel includes a plurality of little units of streaming that flow around, these little unit interval distribution that flows around, and every little unit of streaming that flows around includes the reposition of redundant personnel, the reposition of redundant personnel is cylindricly, and every reposition of redundant personnel all follows coolant flow direction extends and forms drainage portion, drainage portion all is platelike, and is parallel to each other.
2. The heat dissipation structure of claim 1, wherein the plurality of micro-streaming units in each micro-channel are equally spaced by a gap of a first width along a direction perpendicular to the extension direction of the flow guiding portion.
3. The heat dissipation structure of claim 2, wherein the micro flow channels are spaced apart from each other by a distance such that each micro-flow-bypassing unit corresponds to a gap of a first width between micro-flow-bypassing units in adjacent micro flow channels.
4. The heat dissipation structure of claim 2, wherein the first width is in a range of 50um to 300 um.
5. The ic chip heat dissipation structure of claim 1, wherein the thickness of the flow-guide portion is smaller than the cross-sectional diameter of the shunt fluid.
6. The IC chip heat dissipation structure of claim 5, wherein a ratio of a length of the flow-guide to a cross-sectional diameter of the shunt is greater than 9.
7. The IC chip heat dissipation structure of claim 6, wherein the length of the flow-guiding portion is in the range of 90um to 360um, the thickness of the flow-guiding portion is in the range of 20um to 80um, and the cross-sectional diameter of the shunt is in the range of 40um to 160 um.
8. The heat dissipation structure of claim 1, wherein the height of the plurality of micro-streaming units is less than or equal to the depth of the receiving cavity.
9. The heat dissipation structure of claim 8, wherein the height of the plurality of micro-streaming units is in a range of 50um to 500 um.
10. The heat dissipation structure of claim 1, wherein the cooling medium injected into the receiving cavity by the first interface is any one of a liquid, a gas and a gas-liquid mixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010789249.0A CN112071813A (en) | 2020-08-07 | 2020-08-07 | Integrated circuit chip heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010789249.0A CN112071813A (en) | 2020-08-07 | 2020-08-07 | Integrated circuit chip heat radiation structure |
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| Publication Number | Publication Date |
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| CN112071813A true CN112071813A (en) | 2020-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010789249.0A Pending CN112071813A (en) | 2020-08-07 | 2020-08-07 | Integrated circuit chip heat radiation structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114245583A (en) * | 2021-12-17 | 2022-03-25 | 华进半导体封装先导技术研发中心有限公司 | Flow channel structure for chip cooling and manufacturing method thereof |
-
2020
- 2020-08-07 CN CN202010789249.0A patent/CN112071813A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114245583A (en) * | 2021-12-17 | 2022-03-25 | 华进半导体封装先导技术研发中心有限公司 | Flow channel structure for chip cooling and manufacturing method thereof |
| CN114245583B (en) * | 2021-12-17 | 2023-04-11 | 华进半导体封装先导技术研发中心有限公司 | Flow channel structure for chip cooling and manufacturing method thereof |
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