CN114551379A - Chip radiator with high-efficient heat dispersion - Google Patents

Chip radiator with high-efficient heat dispersion Download PDF

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Publication number
CN114551379A
CN114551379A CN202210143845.0A CN202210143845A CN114551379A CN 114551379 A CN114551379 A CN 114551379A CN 202210143845 A CN202210143845 A CN 202210143845A CN 114551379 A CN114551379 A CN 114551379A
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CN
China
Prior art keywords
chip
fluid
heat dissipation
concave surface
layer
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Pending
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CN202210143845.0A
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Chinese (zh)
Inventor
丛玉琪
潘世杰
刘斯扬
孙伟锋
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Southeast University-Wuxi Institute Of Integrated Circuit Technology
Southeast University
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Southeast University-Wuxi Institute Of Integrated Circuit Technology
Southeast University
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Application filed by Southeast University-Wuxi Institute Of Integrated Circuit Technology, Southeast University filed Critical Southeast University-Wuxi Institute Of Integrated Circuit Technology
Priority to CN202210143845.0A priority Critical patent/CN114551379A/en
Publication of CN114551379A publication Critical patent/CN114551379A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4336—Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention discloses a chip radiator with high-efficiency heat dissipation performance, which comprises: the device body is provided with a fluid groove and a fluid inlet, a fluid outlet is arranged in the fluid groove, the fluid groove is connected with a fluid outflow channel, and the fluid outflow channel is connected with the upper heat dissipation layer of the chip embedding concave surface. The chip embedding concave surface is provided with a flow velocity baffle and a jet micro-channel, and the jet micro-channel is connected with a lower fluid inflow layer of the chip embedding concave surface. The chip is embedded in the chip embedding concave surface. The fluid groove is a rectangular groove, the chip embedding concave surface is square, the fluid outlet and the fluid inlet are both cylindrical, and the jet microchannel is cylindrical. The corrosion-resistant metal material used by the device main body is copper Cu, silver Ag or gold Au. The chip radiator with high heat dissipation performance provided by the invention is cooled by liquid, and has the advantages of high heat dissipation efficiency, large heat transfer coefficient, good working stability and wide application range.

Description

Chip radiator with high-efficient heat dispersion
Technical Field
The invention belongs to the field of power chip radiators, and particularly relates to a chip radiator with high-efficiency heat dissipation performance.
Background
With the development of microelectronic technology, the integration degree of chips is higher and higher, and the heat flux density of electronic devices is increasing due to the development trend of high-power, miniaturization and high-density packaging. For the effect of temperature on the operational lifetime of the chip, the approximate estimate is: within the normal operating temperature range of the chip, the operating life of the chip is halved for every 10 ℃ rise in temperature (Arrhenius equation). Heat dissipation from the chip is therefore of particular importance.
The heat dissipation or cooling method mainly comprises air cooling, liquid cooling, heat transfer of a heat pipe and the like. Conventional thermal cooling schemes contain a large amount of intermediate materials between the chip and the heat sink, such as solder, epoxy ceramic, copper molybdenum heat conductors, cold plate metal, and coolant film. Each material exhibits a series of thermal resistances that increase the heat rise from the coolant to the overall device structure. Therefore, the heat transfer coefficient of the heat radiator is small, and the heat radiation efficiency is low.
Disclosure of Invention
The invention aims to provide a chip radiator with high-efficiency heat dissipation performance, and aims to solve the technical problems of small heat transfer coefficient and low heat dissipation efficiency of the conventional radiator.
In order to solve the technical problems, the specific technical scheme of the invention is as follows:
a chip radiator with high-efficiency heat dissipation performance comprises a device body, wherein a fluid groove, a chip embedding concave surface, a fluid outflow channel and a fluid inlet are formed in the device body;
the chip embedding concave surface comprises an upper chip heat dissipation layer and a lower fluid inflow layer;
a fluid outlet is arranged in the fluid groove, the fluid groove is connected with a fluid outflow channel, and the fluid outflow channel is connected with the chip heat dissipation layer on the upper layer of the chip embedding concave surface;
the upper chip heat dissipation layer of the chip embedding concave surface is provided with a flow velocity baffle and a jet micro-channel, and the jet micro-channel is connected with the lower fluid inflow layer of the chip embedding concave surface;
the lower fluid inflow layer of the chip embedding concave surface is communicated with the fluid inlet.
Furthermore, the chip heat dissipation layer is of a concave structure.
Furthermore, two fluid outflow channels are respectively arranged on the left side and the right side of the chip heat dissipation layer, and fluid flows into the fluid grooves on the left side and the right side through the channels.
Furthermore, the chip is embedded in the chip embedding concave layer.
Furthermore, the material used by the device main body is a corrosion-resistant metal material.
Furthermore, the fluid groove is a rectangular groove, the chip embedding concave surface is square, the fluid outlet and the fluid inlet are both cylindrical, and the injection microchannel is cylindrical.
Further, the corrosion-resistant metal material is copper Cu, silver Ag or gold Au.
The chip radiator with high-efficiency heat dissipation performance has the following advantages:
1. the chip radiator with high-efficiency heat dissipation performance reduces the working junction temperature of the power chip.
In conventional chip heat sinks, a large amount of intermediate materials such as solder, epoxy ceramic, copper molybdenum heat conductors, cold plate metal, coolant film, etc. are contained between the chip and the heat sink. Each material exhibits a range of thermal resistances, resulting in a heat sink with a low heat transfer coefficient. As shown in fig. 4 and fig. 5 by comparison, the chip heat sink with high heat dissipation performance according to the present invention embeds the chip in the heat dissipation body, so that a large amount of thermal resistance between the chip and the heat sink is reduced, the heat transfer coefficient is effectively improved, and the working junction temperature of the power chip is efficiently reduced.
2. The chip radiator with high-efficiency heat dissipation performance enables the temperature distribution of the power chip to be more uniform. As shown in fig. 1 and fig. 2, the chip heat sink with high heat dissipation performance according to the present invention designs the array distribution of the micro-injection channels for the portion of the chip with higher heat dissipation power, increases the heat dissipation coefficient for the main heating area, reduces the temperature difference between other areas of the power chip and the highest temperature point, and makes the overall temperature more uniform.
3. The chip radiator with high-efficiency heat dissipation performance has small stress and good stability in the working process. As shown in fig. 1 and 6, the chip heat sink with high heat dissipation performance of the present invention is made of a metal material with good corrosion resistance and rigidity, and both the thermal stress and the pressure are within a normal range during operation, so that deformation and damage are not easily caused.
Drawings
Fig. 1 is a schematic structural diagram of a chip heat sink with high heat dissipation performance according to the present invention;
fig. 2 is a top view of a chip heat sink with high heat dissipation performance according to the present invention;
FIG. 3 is a front view of a high efficiency heat sink of the present invention;
FIG. 4 is a diagram illustrating a chip temperature distribution of a conventional chip heat sink according to the present invention;
FIG. 5 is a diagram illustrating a chip temperature distribution of a chip heat sink with high heat dissipation performance according to the present invention;
fig. 6 is a thermal stress distribution diagram of a chip heat sink with high heat dissipation performance according to the present invention.
The notation in the figure is: 100. a chip heat sink; 1. a device body; 2. the chip is embedded into the concave surface; 3. a flow velocity baffle; 4. a fluid outflow channel; 5. a fluid recess; 6. a fluid outlet; 7. a fluid inlet.
Detailed Description
In order to better understand the purpose, structure and function of the present invention, a chip heat sink with high heat dissipation performance will be described in detail with reference to the accompanying drawings.
The invention provides a chip radiator 100 with high-efficiency heat radiation performance, comprising a device body 1. The device body (1) is provided with a fluid groove (5), a chip embedding concave surface (2), a fluid outflow channel (4) and a fluid inlet (7).
The concave chip-embedding surface 2 includes an upper chip heat-dissipating layer and a lower fluid inflow layer.
And a fluid outlet 6 is arranged in the fluid groove 5, the fluid groove 5 is connected with a fluid outflow channel 4, and the fluid outflow channel 4 is connected with the upper heat dissipation layer of the chip embedding concave surface 2.
The fluid outlet 6 is a cylinder with the radius of 1 mm.
The chip embedding concave surface 2 is provided with four flow rate baffles 3 and an array of jetting micro-channels 8, the jetting micro-channels 8 are connected with an upper chip heat dissipation layer of the chip embedding concave surface 2 and a lower fluid inflow layer of the chip embedding concave surface 2, and the channels are cylinders with the radius of 0.15 mm. The lower fluid inflow layer of the chip embedding concave surface 2 is communicated with a fluid inlet 7, and the fluid inlet 7 is a cylinder with the radius of 1.5 mm.
The material used for the device body 1 is copper Cu, and the fluid used is water H2And O. The device body 1 and an external water tank are connected to form a water circulation passage.
The fluid flows into the lower fluid inflow layer of the chip embedding concave surface 2 through the fluid inlet 7 at a certain speed, is sprayed into the upper chip heat dissipation layer of the chip embedding concave surface 2 through the spraying pore channel, acts on the epoxy ceramic heat dissipation plate at the bottom of the chip, is dispersed and guided through the fluid outflow channel 4 through the flow velocity baffle plate 3, and flows out of the device body 1 through the fluid outlet 6.
Referring to fig. 1, the technical idea of the present invention is to design an embedded micro-fluid heat sink by using liquid convection heat dissipation. The technical structure of the invention is as follows: from top to bottom, there are a chip heat dissipation layer, a fluid inflow layer, and a fluid inlet 7. The overall thermal path of the present invention is: the heat source, the chip heat dissipation layer, the fluid outflow layer and the outflow fluid take away heat.
Referring to FIGS. 2 and 3, the apparatus body 1 has an overall length of 18mm, a width of 18mm and a height of 1 mm. The chip heat dissipation layer is a concave structure, the length and the width of the chip heat dissipation layer are both 12mm, the concave depth is 0.2mm, a four-division flow velocity baffle 3 is arranged in the concave structure, the length is 5mm, the height is 0.2mm, and the width is 1 mm. The chip heat dissipation layer is a fluid outflow layer, two fluid outflow channels 4 are respectively arranged on the left side and the right side, the length of the fluid outflow channels is 3mm, the width of the fluid outflow channels is 0.5mm, fluid flows into fluid grooves 5 on the left side and the right side through the channels, a fluid outlet 6 is formed in the middle of each groove and is a cylinder with the radius of 1mm, and the fluid flows out of the grooves and then flows out of the device body 1. The chip heat dissipation layer is communicated with the fluid inflow layer through a jet micro-channel, and the jet micro-channel is in a cylindrical structure with the radius of 0.15mm and the height of 0.1 mm. The fluid inflow layer is 14mm long, 14mm wide and 0.5mm high, the bottom is communicated with a fluid inlet 7, and the fluid inlet 7 is a cylinder with the radius of 1.5 mm.
Referring to fig. 4 and 5, the temperature distribution diagram of the chip heat sink with high heat dissipation performance comparing the present invention with the conventional chip heat sink shows that the highest junction temperature of the chip is reduced from 98.6 ℃ (371.75K) to 36.0 ℃ (309.15K), and the temperature distribution is between 20 ℃ (293.15K) and 36.0 ℃ (309.15K), which is more uniform.
With reference to fig. 6, under the working condition, the maximum thermal stress of the chip heat sink with high heat dissipation performance provided by the invention is 0.7 μ N, and under the combined action of the external force load and the temperature change, the thermal stress effect in the die is almost negligible, and the working property is stable.
Example 1:
aiming at high-power chips or device packages such as LED lamp chips and IGBT tubes. The thermal power distribution on the high-power chips or devices has certain characteristics, and the situation that the thermal power of one or more parts is larger exists. The heat dissipation layer of the chip radiator with high heat dissipation performance provided by the invention is provided with the jet micro-channel array designed aiming at the heat dissipation power distribution of the chip, can maximize the heat dissipation efficiency and accurately dissipate heat of a part with high heat power, and is very suitable for heat dissipation of a high-power chip.
Example 2:
for a large-surface chip, such as a server CPU or a PC CPU, it is not assumed that the chip size is 40mm × 40mm, and the power is 160W. In general, the overall size of the heat sink of the present invention depends on the size of the chip-embedded concave heat dissipation layer, which is designed according to the chip size. For power chips with different surfaces, the concave heat dissipation layer is embedded corresponding to chips with different design sizes, and then the heat radiators with different sizes are corresponding. The chip radiator with high heat dissipation performance of the invention has no sounding component, so the chip radiator is very suitable for being used for heat dissipation of servers and PC chips.
It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes in the features and embodiments, or equivalent substitutions may be made therein by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims (7)

1. A chip radiator with high-efficiency heat dissipation performance is characterized by comprising a device body (1), wherein a fluid groove (5), a chip embedding concave surface (2), a fluid outflow channel (4) and a fluid inlet (7) are arranged on the device body (1);
the chip embedding concave surface (2) comprises an upper chip heat dissipation layer and a lower fluid inflow layer;
a fluid outlet (6) is arranged in the fluid groove (5), the fluid groove (5) is connected with a fluid outflow channel (4), and the fluid outflow channel (4) is connected with a chip heat dissipation layer on the upper layer of the chip embedding concave surface (2);
a flow velocity baffle (3) and a jet micro-channel (8) are arranged on the upper chip heat dissipation layer of the chip embedding concave surface (2), and the jet micro-channel (8) is connected with the lower fluid inflow layer of the chip embedding concave surface (2);
the lower fluid inflow layer of the chip embedding concave surface (2) is communicated with the fluid inlet (7).
2. The chip heat sink with high heat dissipation efficiency as recited in claim 1, wherein the chip heat dissipation layer is a recessed structure.
3. The chip heat sink with high heat dissipation efficiency as recited in claim 1, wherein the chip heat dissipation layer has two fluid outflow channels (4) on each of the left and right sides, through which fluid flows into the fluid grooves (5) on each of the left and right sides.
4. The heat sink with high heat dissipation efficiency as recited in claim 1, wherein the chip is embedded in the chip embedding recess (2).
5. The chip heat sink with high heat dissipation performance as claimed in claim 1, wherein the device body (1) is made of a corrosion-resistant metal material.
6. The chip heat sink with high heat dissipation efficiency as recited in claim 1, wherein the fluid grooves are rectangular grooves, the concave chip-embedding surface (2) is square, the fluid outlet (6) and the fluid inlet (7) are cylindrical, and the micro-channels (8) are cylindrical.
7. The chip heat sink with high heat dissipation performance as recited in claim 1, wherein the corrosion-resistant metal material is Cu, Ag or Au.
CN202210143845.0A 2022-02-17 2022-02-17 Chip radiator with high-efficient heat dispersion Pending CN114551379A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210143845.0A CN114551379A (en) 2022-02-17 2022-02-17 Chip radiator with high-efficient heat dispersion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210143845.0A CN114551379A (en) 2022-02-17 2022-02-17 Chip radiator with high-efficient heat dispersion

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CN114551379A true CN114551379A (en) 2022-05-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114823581A (en) * 2022-06-30 2022-07-29 中国科学院西安光学精密机械研究所 Embedded cooling heat sink for power chip and semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114823581A (en) * 2022-06-30 2022-07-29 中国科学院西安光学精密机械研究所 Embedded cooling heat sink for power chip and semiconductor device
CN114823581B (en) * 2022-06-30 2022-12-09 中国科学院西安光学精密机械研究所 Embedded cooling heat sink for power chip and semiconductor device

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