CN112185914B - Electronic chip self-adaptive micro-channel cooling device and manufacturing method thereof - Google Patents
Electronic chip self-adaptive micro-channel cooling device and manufacturing method thereof Download PDFInfo
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- CN112185914B CN112185914B CN202010895556.7A CN202010895556A CN112185914B CN 112185914 B CN112185914 B CN 112185914B CN 202010895556 A CN202010895556 A CN 202010895556A CN 112185914 B CN112185914 B CN 112185914B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
Abstract
The invention discloses an electronic chip self-adaptive micro-channel cooling device and a manufacturing method thereof, wherein the device comprises a simulation chip, a hydrogel micro-valve, a manifold distribution/collector, a sealing film layer, a PCB and a substrate, wherein one surface of the simulation chip is provided with a micro-channel structure, the hydrogel micro-valve is integrated in a micro-channel, the micro-channel is communicated with the manifold distribution/collector, and the hydrogel micro-valve realizes intelligent regulation and control of micro-channel flow through the change of the volume of the hydrogel micro-valve along with the change of thermal load. When the self-adaptive micro-channel cooling device is manufactured, firstly, a micro-channel structure and a metal coating are processed, molten paraffin is filled, the outline of the hydrogel micro-valve is impressed around the micro-column structure, then, a hydrogel solution is filled into the impressed outline, the paraffin is cleaned after polymerization is completed to obtain the hydrogel micro-valve integrated in the channel, and finally, all the components are stacked and compressed. The micro-channel cooling device is simple in structure, easy to manufacture in batches, good in flow regulation effect and capable of solving the problems of pump work waste and cooling economy in the traditional micro-channel cooling.
Description
Technical Field
The invention relates to the technical field of chip heat dissipation, in particular to an electronic chip self-adaptive micro-channel cooling device and a manufacturing method thereof.
Background
With the continuous improvement of the integration level of electronic chips, the heat dissipation problem faced by the electronic chips is more and more serious, and the heat dissipation requirements of the electronic chips with high heat flux density cannot be met by adopting the modes of natural air convection, forced air cooling and the like. Compared with the air cooling technology, the water cooling technology represented by microchannel heat sinks and the like has larger convective heat transfer area and higher convective heat transfer coefficient, and has attracted much attention in recent years. Another key to electronic chip cooling is to reduce the thermal conduction resistance from the heat-generating node to the channel walls. The substrate embedded micro-channel directly processes the micro-channel structure in the chip substrate, shortens the heat conduction path from the node to the channel wall surface while utilizing the high-efficiency cooling performance of the micro-channel, and realizes the high-efficiency and near-node cooling of the electronic chip. In order to ensure the safety and reliability of cooling, the traditional microchannel usually adopts working medium flow required by the maximum heat load to operate, the heat load in the actual working process of the chip is continuously changed, and the microchannel structure has small hydraulic diameter and large flow resistance, thereby causing obvious pumping power waste and seriously reducing the economy of the microchannel cooling technology.
The self-adaptive micro-channel senses the change of the heat load by introducing a temperature-sensitive adjusting mechanism and automatically regulates and controls the flow of the channel. Compared with the traditional non-regulation micro-channel, the self-adaptive micro-channel can intelligently match the required working medium flow according to the real-time heat load while not influencing the cooling capacity, thereby achieving the purposes of reducing the pump power consumption and improving the cooling economy. The current self-adaptive cooling scheme mainly adopts a temperature-sensitive micro valve to regulate and control the flow. For example, a paraffin drive micro valve is arranged at the inlet of the cold plate, the temperature of the micro valve rises after the heat load is increased, and the volume of the paraffin changes in the phase change process, so that the aims of driving the micro valve and increasing the flow are fulfilled. Similar functions can be achieved using memory alloys as the drive element. Although the micro valve can realize the self-adaptive adjustment of the working medium flow, the structure of the micro valve is complex, and the size is limited by the processing technology and is difficult to further reduce, so that the micro valve is often only arranged in a cold plate and is difficult to integrate into a substrate embedded micro channel to realize the self-adaptive adjustment of the local heat load of a chip, and the paraffin phase change micro valve is also exposed to the risk of leakage. In comparison with document 1(Laguna, Gerard, et al, "polymeric parameter stuck of a hot-target microfluidic co-vibrating array for micro electronics." Applied Thermal Engineering 144(2018):71-80), the whole substrate is divided into a plurality of microfluidic cooling units, a metal valve plate parallel to the top surface of the channel is arranged at the outlet of each unit, and the temperature-sensitive adjustment of the flow rate of the working medium is realized by using the difference of the Thermal expansion coefficients between the metal valve plate and the silicon substrate, but at this time, an additional guide groove needs to be additionally arranged between the valve plate and the outlet of the unit to change the flow direction of the valve plate, so that the adjustment effect can be realized, the unit structure and the flow organization mode are complex, and the large-scale application is not facilitated.
Disclosure of Invention
The invention aims to solve the technical problem of providing an electronic chip self-adaptive micro-channel cooling device and a manufacturing method thereof, and solves the problems that the traditional self-adaptive micro-channel is complex in structure and difficult to realize chip-level integration.
The technical solution for realizing the purpose of the invention is as follows:
the utility model provides an electronic chip self-adaptation microchannel cooling device, its characterized in that includes that one side is equipped with simulation chip, aquogel microvalve, manifold distribution/collector, sealed rete, fretwork slot, PCB, the base plate of microchannel structure, the aquogel microvalve is integrated in the microchannel of simulation chip, and the microchannel communicates with each other with manifold distribution/collector, seals with the seal membrane layer between the two, and the simulation chip another side contacts with PCB, arranges the base plate below the PCB. The plurality of micro channels are arranged in parallel, the cross section of each micro channel is rectangular, a plurality of micro column structures are arranged on the central line of each channel, the hydrogel material is a nano composite hydrogel adopting physical crosslinking, the hydrogel is in a ring shape and is embedded around the micro columns at the centers of the micro channels, the outer diameter of the hydrogel after swelling is consistent with the width of the channels, the cross sections of the distribution channels and the collection channels in the manifold distribution/collection device are rectangular, and the positions of the distribution channels and the collection channels correspond to the micro channels on the analog chip. The sealing film layer is a silicone rubber film with a thickness of 0.2mm, wherein the number and the size of the hollow slots are consistent with those of the micro-channels.
The invention also provides a manufacturing method of the electronic chip self-adaptive micro-channel cooling device, which comprises the following steps:
and 7, stacking the manifold distribution/collector, the sealing film layer, the simulation chip with the hydrogel microvalve, the PCB and the substrate together in sequence, and pressing the whole device by applying pressure on the outer surfaces of the manifold distribution/collector and the substrate.
Further, in the step 3, the imprinting is carried out by adopting a transparent template with a circular ring-shaped bulge on the surface, the shape of the circular ring-shaped bulge is consistent with that of the hydrogel microvalve, in the step 5, the hydrogel solution is stood for polymerization at room temperature, the standing time is 24 hours, and the flexible film is a polytetrafluoroethylene film with a smooth surface.
Compared with the prior art, the invention has the following advantages:
(1) the annular hydrogel micro valve is fixed in the micro channel in a manner of being directly nested around the micro column structure, so that the formed self-adaptive micro channel structure and the flow organization manner are simpler;
(2) the hydrogel micro valve is formed by polymerizing the hydrogel solution, the assembling process of the traditional mechanical self-adaptive micro valve is not needed, the manufacturing is more convenient, the batch preparation can be carried out through the paraffin imprinting and the filling and polymerizing processes of the hydrogel solution, and the large-scale application is favorably realized;
(3) under the condition that a paraffin mold can be obtained through template imprinting, the manufacturing difficulty of the hydrogel micro valve cannot be increased along with the reduction of the size of the hydrogel micro valve, the problem that the traditional mechanical micro valve is difficult to manufacture and assemble under a micro size is solved, chip-level integration is facilitated in an array form, and therefore chip local self-adaptive adjustment which is more accurate and efficient than the arrangement of a single micro valve in a cold plate is achieved.
The present invention is described in further detail below with reference to the attached drawing figures.
Drawings
FIG. 1 is a schematic view of an adaptive microchannel cooling device for electronic chips according to the present invention.
Figure 2 is a schematic view of a manifold distribution/collector and microfluidic cell of the present invention.
FIG. 3 is a schematic diagram of the flow regulating mechanism of the electronic chip adaptive microchannel of the present invention.
Fig. 4 is a flow chart of the fabrication of the adaptive microchannel cooling device for electronic chips according to the present invention.
Detailed Description
With reference to fig. 1, the electronic chip adaptive microchannel cooling device of the present invention comprises a simulation chip 1 having a microchannel structure on one side, a hydrogel microvalve 2, a manifold distributor/collector 3, a sealing film layer 6, a hollow slot 7, a PCB8 and a substrate 9, wherein the hydrogel microvalve 2 is integrated in the microchannel of the simulation chip 1, the microchannel is communicated with the manifold distributor/collector 3, the two are sealed by the sealing film layer 6 and are in fluid communication through the hollow slot 7 in the sealing film layer 6, the other side of the simulation chip 1 is in contact with a PCB8, and the substrate 9 is disposed below the PCB 8.
A plurality of micro-channels in the simulation chip 1 are arranged in parallel, the cross section of the simulation chip is rectangular, and a plurality of micro-column structures 10 are arranged on the center line of each channel.
The hydrogel micro valve 2 is characterized in that the hydrogel material is physically cross-linked nano composite hydrogel, is in a ring shape, is embedded around the micro-column structure 10 at the center of the micro channel, and has the same outer diameter as the channel width after swelling.
The manifold distributor/collector 3 is made of PC, wherein the channel cross section is rectangular, and the position corresponds to the position of the micro-channel on the analog chip 1.
And an oxidation insulating layer is arranged on one surface of the simulation chip 1, which is in contact with the PCB8, and a metal coating is arranged on the surface of the insulating layer.
The sealing film layer 6 is a silicone rubber film with the thickness of 0.2mm, and a plurality of hollowed-out slots 7 with the size and the number consistent with those of the micro-channels are arranged in the sealing film layer.
A manufacturing method of an electronic chip self-adaptive micro-channel cooling device comprises the following steps:
In the step 3, a transparent template is used for imprinting, and the surface of the transparent template is provided with circular bulges with the same shape as the hydrogel micro-valve.
And in the step 5, the hydrogel solution filled in the imprinting contour is subjected to standing polymerization at room temperature for 24 hours.
The flexible film in the step 5 is a polytetrafluoroethylene film with a smooth surface.
The present invention will be described in further detail with reference to examples, but the embodiments of the present invention are not limited thereto.
Examples
Referring to fig. 1, an adaptive microchannel cooling device for electronic chips comprises a square silicon wafer for simulating an actual chip and having a microchannel structure on one surface, a hydrogel microvalve 2, a manifold distributor/collector 3, a sealing film layer 6, a hollow slot 7, a PCB8 and a substrate 9. The hydrogel micro valve 2 is integrated in the micro channel, the manifold distribution/collector 3 is arranged above the micro channel and connected with the micro channel to realize the distribution of working media to the micro channel and the recovery of the working media discharged from the micro channel, and a rubber film is adopted between the manifold distribution/collector 3 and the micro channel for sealing.
The method is characterized in that 9 parallel micro-channels are processed in the center of one surface of a simulation chip 1 by adopting a deep reactive ion etching process, the range of 10.6mm multiplied by 10.4mm is occupied totally, the depth is 0.22mm, the cross sections are all rectangular, and 4 micro-column structures 10 are arranged in each channel at equal intervals along the central line. An oxidation insulation layer with the thickness of 300nm is arranged on the other side of the simulation chip 1, a snakelike heating plate made of NiGr alloy with the thickness of 30 microns is attached to the insulation layer to simulate the heating of an actual chip, and a U-shaped resistor made of Cr with the thickness of 20nm and Al with the thickness of 200nm is plated in the center of the heating plate to monitor the temperature change condition of the surface of the simulation chip 1. The U-shaped resistor is in electrical communication with the copper sheet on the underlying PCB8 for resistance signal acquisition, the PCB/underlying substrate 9 being disposed. The hydrogel micro valve 2 made of the physical crosslinking nano composite hydrogel material is in a ring shape and is embedded on a micro-column structure 10 in the center of a micro channel, so that the integration with the simulation chip 1 and the fixation of the position in the micro channel are realized.
The manifold distribution/collection device 3 is provided with a fluid distribution channel 5 and a collection channel 4 by machining, and with reference to fig. 2, the fluid distribution channel 5 and the collection channel 4 are parallel to each other and are arranged perpendicular to the microchannels on the analog chip 1, and have a length of 10.6mm, which is consistent with the total width occupied by 9 microchannels on the analog chip 1. The fluid distribution channel 5 and the collection channel 4 divide each micro-channel on the analog chip 1 into different micro-fluid units 11, the number of the micro-fluid units 11 in the whole micro-channel area is 9 × 4, and the adjacent micro-fluid units 10 in the same micro-channel share one fluid inlet 12 or one fluid outlet 13. The rubber membrane between the manifold distributor/collector 3 and the microchannel had a thickness of 200 μm, and 9 rectangular slits corresponding to the microchannels were cut in a range of 10.6mm × 10.4mm at the center thereof for fluid communication between the manifold distributor/collector 3 and the microchannels.
The adaptive adjustment mechanism in the present invention is explained below, as shown in fig. 3. The hydrogel microvalve 2 in the microfluidic cell 11 is in a swollen state at room temperature, the outer diameter and height thereof are respectively consistent with the width and depth of the microchannel, and the microchannel is in a closed state. After the heat load is applied, the heat is transferred to the hydrogel micro valve 2 through the conduction of the micro-column structure 10 in the middle of the micro-fluid unit 11 and the convection of the working medium in the channel, the temperature of the hydrogel micro valve 2 rises after being heated, the volume shrinks, the channel is opened, the flow of the working medium is increased, and therefore the simulation chip 1 is cooled. After the thermal load is removed, the hydrogel microvalve 2 drops in temperature, expands in volume, and closes the channel again. The process is repeatedly circulated along with the change condition of the heat load, thereby realizing the self-adaptive adjustment of the working medium flow.
The embodiment also provides a manufacturing method of the electronic chip adaptive micro-channel cooling device, as shown in fig. 4, including the following steps: (1) etching the silicon-based micro-channel; (2) sputtering a metal layer on the surface of the insulating layer; (3) manufacturing a paraffin wax mould; (4) preparing a hydrogel solution; (5) filling and polymerizing the hydrogel solution; (6) cleaning residual paraffin; (7) stacking and pressing the components.
In the manufacturing method of the electronic chip self-adaptive micro-channel cooling device, the etching of the silicon-based micro-channel further comprises two steps of photoetching and deep reactive ion etching. Firstly, photoresist is uniformly coated on the surface of a simulation chip 1, and the photoresist layer is exposed under the coordination of a mask plate with micro-channels and central micro-column patterns after being dried. And baking the photoresist layer again after exposure, and preparing the photoresist mask with the micro-channel and micro-column patterns attached to the surface of the simulation chip 1 through a developing process. And in the etching process, etching gas and side wall protection gas are alternately introduced into the etching cavity, wherein the etching gas reacts with the silicon material which is not covered by the photoresist mask to form a groove, the side wall protection gas prevents the side wall surface of the groove from being etched, and finally a micro-channel structure with a vertical side wall is formed at the position, which is not covered by the photoresist mask, on the simulation chip 1.
The step of sputtering the metal layer on the surface of the insulating layer comprises the following steps: uniformly coating photoresist on the surface of the insulating layer, drying, exposing the photoresist layer under the coordination of a mask plate with a U-shaped resistor pattern, baking the photoresist layer again after exposure, preparing the photoresist mask with the U-shaped resistor pattern attached to the surface of the insulating layer through a developing process, sequentially sputtering Cr with the thickness of 20nm and Al with the thickness of 200nm on the surface of the photoresist mask through a magnetron sputtering process, and finally stripping the photoresist mask to form the U-shaped resistor attached to the surface of the insulating layer.
The paraffin wax mold is manufactured by the following steps: filling excessive molten paraffin in the micro-channel, scraping the excessive paraffin after the paraffin is solidified, aligning the circular bulge representing the shape of the hydrogel micro-valve 2 on the transparent template with the micro-column structure 10 in the micro-channel and impressing the circular bulge into the paraffin, pulling out the template, and scraping the extruded paraffin around the circular ring to obtain circular paraffin pits around the micro-column structure 10.
The preparation steps of the hydrogel solution are as follows: 0.613g of 2- (2-methoxyethoxy) ethyl methacrylate, 0.387g of oligo (ethylene glycol) methacrylate, 0.5g of nanoclay (Laponite XLS), 0.01g of potassium persulfate and 7.5. mu.L of tetramethylethylenediamine were weighed and added to 5mL of a 5mg/mL aqueous graphene oxide solution, followed by sufficient stirring.
And then, excessively filling the prepared hydrogel solution into a paraffin wax mold, covering a layer of smooth polytetrafluoroethylene film on the surface to prevent water from evaporating, and standing for 24 hours at room temperature.
And then, removing the polytetrafluoroethylene film covered on the surface, naturally airing the hydrogel micro-valve 2 in the air, scraping the residual hydrogel film on the surface of the simulation chip 1 due to excessive filling after the volume is shrunk, and cleaning paraffin in the micro-channel by using hot water, thereby obtaining the hydrogel micro-valve 2 fixed in the micro-channel through the micro-column structure 10.
Finally, the manifold distributor/collector 3, the sealing membrane layer 6, the analog chip 1 with hydrogel microvalves 2, the PCB8 and the base plate 9 are stacked in sequence, and the entire assembly is compressed by applying pressure on the outer surfaces of the manifold distributor/collector 3 and the base plate 9, thereby ensuring the sealing effect of the rubber membrane.
The electronic chip self-adaptive micro-channel cooling device is manufactured according to the steps, and the flowing heat exchange effect of the electronic chip self-adaptive micro-channel cooling device is compared with that of a traditional straight-through micro-channel structure for testing. Deionized water is used as a working medium, the inlet pressure is respectively 4kPa, 6kPa and 8kPa, the outlet pressure is atmospheric pressure, the inlet water temperature is room temperature, and the applied heat flow density is 100W/cm 2 In the process, the self-adaptive micro-channel cooling device can reduce the pump work consumption by 1 order of magnitude while keeping similar cooling effect, and the cooling economy is obviously improved.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art according to the above description are within the scope of the appended claims.
Claims (10)
1. A manufacturing method of an electronic chip self-adaptive micro-channel cooling device is characterized by comprising the following steps:
step 1, etching one surface of a simulation chip (1) by adopting a deep reactive ion etching technology to form a micro-channel;
step 2, sputtering a metal coating on the surface of the oxidation insulating layer on the other surface of the simulation chip (1);
step 3, filling melted paraffin into the micro-channel, and impressing the contour of the hydrogel micro-valve around the micro-column structure (10) in the micro-channel;
step 4, preparing a hydrogel solution;
step 5, filling the prepared hydrogel solution into the imprint contour in an excessive way, covering the surface with a flexible film, and standing for polymerization;
step 6, cleaning the paraffin in the micro-channel by using hot water;
and 7, stacking the manifold distribution/collector (3), the sealing film layer (6), the simulation chip (1) with the hydrogel micro valve (2), the PCB (8) and the substrate (9) in sequence, and pressing the whole device by applying pressure on the outer surfaces of the manifold distribution/collector (3) and the substrate (9).
2. The method for manufacturing the self-adaptive micro-channel cooling device for the electronic chip according to claim 1, wherein a transparent template is used for imprinting in the step 3, and the surface of the transparent template is provided with circular bulges which are consistent with the shape of the hydrogel micro-valve.
3. The method for manufacturing the electronic chip adaptive micro-channel cooling device according to claim 1, wherein the hydrogel solution filled with the imprinted contour in the step 5 is left to stand for polymerization at room temperature for 24 hours.
4. The method for manufacturing an adaptive micro-channel cooling device for electronic chips as claimed in claim 1, wherein the flexible film in step 5 is a polytetrafluoroethylene film with a smooth surface.
5. The electronic chip self-adaptive microchannel cooling device prepared by the preparation method according to claim 1, comprising a simulation chip (1) provided with a microchannel structure on one side, a hydrogel microvalve (2), a manifold distributor/collector (3), a sealing film layer (6), a hollowed-out slot (7), a PCB (8) and a substrate (9), wherein the hydrogel microvalve (2) is integrated in the microchannel of the simulation chip (1), the microchannel is communicated with the manifold distributor/collector (3), the microchannel is sealed by the sealing film layer (6) and is in fluid communication through the hollowed-out slot (7) in the sealing film layer (6), the other side of the simulation chip (1) is in contact with the PCB (8), and the substrate (9) is arranged below the PCB (8).
6. The electronic chip adaptive micro-channel cooling device according to claim 5, wherein a plurality of micro-channels in the analog chip (1) are arranged in parallel, the cross-sectional shape is rectangular, and a plurality of micro-column structures (10) are arranged on the center line of each channel.
7. The electronic chip adaptive micro-channel cooling device according to claim 6, wherein the hydrogel material in the hydrogel micro-valve (2) is a physically cross-linked nano-composite hydrogel, the hydrogel is in a circular ring shape, and is nested around the micro-column structure (10) at the center of the micro-channel, and the outer diameter after swelling is consistent with the channel width.
8. The adaptive microchannel cooling device of claim 5, wherein the manifold distributor/collector (3) is made of PC board, and the cross section of the channel is rectangular and the position of the channel corresponds to the position of the microchannel on the analog chip (1).
9. The electronic chip adaptive micro-channel cooling device according to claim 5, wherein the surface of the analog chip (1) contacting the PCB (8) is provided with an oxidized insulating layer, and the surface of the insulating layer is provided with a metal coating.
10. The electronic chip adaptive micro-channel cooling device according to claim 5, characterized in that the sealing film layer (6) is a silicone rubber film with a thickness of 0.2mm, and a plurality of hollowed-out slots (7) corresponding to the size and number of micro-channels are arranged inside the sealing film layer.
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