CN113368914A - 3D printing integrated digital microfluidic chip structure and manufacturing method - Google Patents
3D printing integrated digital microfluidic chip structure and manufacturing method Download PDFInfo
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- CN113368914A CN113368914A CN202110630566.2A CN202110630566A CN113368914A CN 113368914 A CN113368914 A CN 113368914A CN 202110630566 A CN202110630566 A CN 202110630566A CN 113368914 A CN113368914 A CN 113368914A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
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Abstract
The invention discloses a 3D printing integrated digital microfluidic chip structure and a manufacturing method thereof, belonging to the fields of digital microfluidic technology and 3D printing technology.
Description
Technical Field
The invention belongs to the field of digital microfluidic technologies and 3D printing technologies, and particularly relates to a 3D printing integrated digital microfluidic chip structure and a manufacturing method thereof.
Background
At present, the digital microfluidic technology is a fluid control technology for micro-droplet operation. The digital microfluidic technology can realize the control of the operation of multiple droplets, so that the parallel processing and analysis test of the multiple droplets are realized in the application of a lab-on-a-chip, the analysis processes of biological and chemical sample preparation, reaction, separation, detection and the like are integrated on a detection chip with a micron size, such as the digital microfluidic chip, the generation and the droplet control of the droplets are realized, the reaction droplets are generated in a very short time, the mutual pollution of reactants is avoided, the speed is high, and the efficiency is high.
Traditional photolithography and etching techniques for fabricating semiconductor and integrated circuit chips are the most fundamental of microfluidic chip processing. The method uses photoresist, mask and ultraviolet light to perform micro-processing, has mature process, and is widely used for manufacturing micro-structural layers on silicon, glass and quartz substrates. The photoetching and etching technology consists of three procedures of film deposition, photoetching and etching. The complicated microstructure layer can be completed by repeating the three procedures of film deposition-photoetching-etching for many times. The digital microfluidic chip manufactured based on the photoetching technology mainly comprises the following basic process flows: the method comprises a series of operations of substrate pretreatment, gluing, pre-baking, exposure, development, post-baking and the like. The steps for manufacturing the microfluidic chip by the photoetching technology are complicated, the process is complex, skilled operators are required, and the mass production of the chip is difficult. If the 3D micro-structural layer needs to be manufactured, manual alignment and adhesion are needed, so that the difficulty of manufacturing the digital micro-fluidic chip is greatly increased, and the precision of manufacturing the structure is reduced. Digital microfluidic chips were fabricated using a SU 8-based material photolithography process in the literature (Zhai, j., Li, h., Wong, a.hh.et al.a digital microfluidic system with 3D microstructures for single-cell culture. microsyst Nanoeng 6,6 (2020)). The arrayed cuboid structures mentioned in the literature are not true 3D micro-structured layers. Therefore, the process and manufacture of the 3D microstructure layer using the photolithography technique have certain challenges.
Additive manufacturing technology (3D printing technology) has gained wide application in numerous fields such as industry, biomedicine, art, and the like. The more mature commercial additive manufacturing technology mainly includes the process principles of light-cured molding (SLA), layered solid molding (LOM), Fuse Deposition (FDM), Selective Laser Sintering (SLS), and the like. In view of the blending problem of manufacturing precision-efficiency, the additive manufacturing technology has more application potential in the manufacturing of micro-nano scale structures and devices. The micro-nano additive manufacturing technology is an ideal method for realizing artificial design and manufacturing of a microscopic 3D fine structure. 3D printing techniques featuring photocuring (laser direct writing, two-photon laser, projection exposure, etc.) have been commercialized, and structures with line widths of 2 μm can be easily printed.
Therefore, in view of the complicated manufacturing steps of manufacturing the dielectric layer, the hydrophobic layer and the microstructure layer of the digital microfluidic chip by the photolithography technology, how to provide a manufacturing method of 3D printing integrated digital microfluidic chip is a problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide an array microstructure layer, a digital microfluidic chip and a preparation method thereof. The method is used for solving the problems of complicated manufacturing steps, high failure rate, low forming speed and difficulty in one-step forming of the traditional chip.
In view of this, the invention provides a method for manufacturing a 3D printing integrated digital microfluidic chip, which adopts a 3D printing technology to integrate and manufacture a digital microfluidic chip with a 3D micro-structure layer in one step. By the 3D printing integration and one-step manufacturing method, one-step manufacturing of the dielectric layer, the hydrophobic layer, the 3D micro-structural layer, the electrode layer and the substrate can be realized, the problems of precision deviation and the like of multiple steps, multiple layer alignment, bonding and the like are avoided, batch and automatic production of chips can be realized, and the application of the digital micro-fluidic chip in industry and industry can be widened.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, a 3D printing integrated digital microfluidic chip structure, the digital microfluidic chip comprising: the device comprises an upper polar plate and a lower polar plate, wherein the upper polar plate is a hydrophobized electrode; the lower polar plate comprises a base plate, a dielectric layer, a hydrophobic layer and a 3D micro-structural layer which are sequentially connected; the base plate comprises a base layer and an electrode layer which are connected in sequence.
In another aspect, a method for manufacturing a 3D printing integrated digital microfluidic chip includes:
s10: manufacturing a base plate in advance, wherein the base plate is used as a first base layer of the digital microfluidic chip;
s20: obtaining a dielectric layer by 3D printing on the basis of the first substrate layer;
s30: constructing a hydrophobic layer on the basis of the dielectric layer by 3D printing;
s40: and constructing a 3D microstructure layer by 3D printing on the basis of the hydrophobic layer.
Preferably, the steps S20 to S40 are integrally printed on the first substrate layer in a one-step manner through 3D printing.
Preferably, the step S10 of preparing the base plate in advance includes:
s11: obtaining a base layer through 3D printing deposition;
s12: and constructing an electrode structure on the basis of the substrate layer through 3D printing to obtain an electrode layer, and taking the electrode layer as a substrate plate.
Preferably, the hydrophobic layer is a 3D array super-hydrophobic microstructure layer.
Preferably, the base layer is made of the following materials: any one or more of glass, PCMS, PVA, PA and photosensitive resin.
Preferably, the material of the electrode layer includes: any one or more of chromium, silver, copper and gallium.
Preferably, the dielectric layer is made of any one or more of silica gel, photosensitive resin, SU8 photoresist, polydimethylsiloxane, polyvinyl alcohol and polyimide.
Preferably, the dielectric layer is printed to any thickness.
According to the technical scheme, compared with the prior art, the invention discloses and provides a 3D printing integrated digital microfluidic chip structure and a manufacturing method, the invention is based on a 3D printing technology digital microfluidic chip manufacturing method and a preparation process, can realize digital microfluidic chip integration and one-step manufacturing, has wide material component selection range, controllable scale and configuration of each functional layer (dielectric layer, hydrophobic layer and 3D micro-structural layer) and high flexibility, can meet the requirements and performances of digital microfluidic devices with different requirements, improves the complex process of manufacturing the digital microfluidic chip by adopting SU8 material in the traditional photoetching technology, greatly saves the manufacturing cost of the microfluidic devices, and realizes the integrated and integrated manufacturing of the digital microfluidic chip with a complex structure; meanwhile, the invention avoids the problems of precision deviation and the like of multiple steps, multilayer alignment, bonding and the like, can realize batch and automatic production of the chip, and is beneficial to widening the application of the digital microfluidic chip in industry and industry.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a 3D printing digital microfluidic chip provided by the present invention;
FIG. 2 is a schematic flow chart of a manufacturing method provided by the present invention;
fig. 3 is a flow chart illustrating a one-step process for manufacturing a 3D printing dielectric layer and a 3D micro-structural layer according to this embodiment 2;
fig. 4 is a flow chart illustrating the integrated forming of the 3D printing digital microfluidic chip provided in example 3.
In the attached fig. 1: 1-upper polar plate, 2-lower polar plate, 21-base plate, 22-dielectric layer, 23-hydrophobic layer, 24-3D micro-structural layer, 211-base layer, 212 electrode layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1, an embodiment 1 of the present invention provides a 3D printing integrated digital microfluidic chip structure, where the digital microfluidic chip includes: the device comprises an upper polar plate 1 and a lower polar plate 2, wherein the upper polar plate 1 is a hydrophobization electrode; the lower polar plate 2 comprises a base plate 21, a dielectric layer 22, a hydrophobic layer 23 and a 3D micro-structural layer 24 which are connected in sequence; the base plate 21 includes a base layer 211 and an electrode layer 212 connected in this order.
Referring to fig. 2, embodiment 1 of the present invention further provides a method for manufacturing a 3D printing integrated digital microfluidic chip, including:
s10: manufacturing a base plate 21 in advance, and taking the base plate 21 as a first base layer of the digital microfluidic chip;
s20: obtaining the dielectric layer 22 by 3D printing on the basis of the first base layer 211;
s30: building a hydrophobic layer 23 on the basis of the dielectric layer 22 by 3D printing;
s40: a 3D micro-structured layer 24 is built by 3D printing on the basis of the hydrophobic layer 23.
In a specific embodiment, steps S20 through S40 are integrally printed on the first substrate layer in a one-step manner through 3D printing in sequence.
In one embodiment, the step S10 of pre-fabricating the substrate board includes:
s11: obtaining a base layer 211 by 3D printing deposition;
s12: an electrode structure is built on the base layer 211 by 3D printing, resulting in an electrode layer 212, which is used as a base plate.
Specifically, the hydrophobic layer 23 is a 3D array super-hydrophobic microstructure layer.
Specifically, the base layer 211 is made of: any one or more of glass, PCMS, PVA, PA and photosensitive resin.
Specifically, the material of the electrode layer 212 includes: any one or more of chromium, silver, copper and gallium.
Specifically, the dielectric layer 22 is made of any one or more of silicone, photosensitive resin, SU8 photoresist, polydimethylsiloxane, polyvinyl alcohol, and polyimide.
Specifically, the dielectric layer 22 is printed to any thickness.
Specifically, the microstructure layer 24 is one or more layers.
According to the technical scheme, compared with the prior art, the invention discloses and provides a 3D printing integrated digital microfluidic chip structure and a manufacturing method, the invention is based on a 3D printing technology digital microfluidic chip manufacturing method and a preparation process, can realize digital microfluidic chip integration and one-step manufacturing, has wide material component selection range, controllable dimensions and configurations of the dielectric layer 22, the hydrophobic layer 23 and the 3D micro-structural layer 24 and high flexibility, can meet the requirements and performances of digital microfluidic devices with different requirements, improves the complex process of manufacturing the digital microfluidic chip by adopting SU8 materials in the traditional photoetching technology, greatly saves the manufacturing cost of the microfluidic devices, and realizes the integrated and integrated manufacturing of the digital microfluidic chip with a complex structure; meanwhile, the invention avoids the problems of precision deviation and the like of multiple steps, multilayer alignment, bonding and the like, can realize batch and automatic production of the chip, and is beneficial to widening the application of the digital microfluidic chip in industry and industry.
Example 2
Referring to fig. 3, a flow chart for one-step manufacturing of a 3D printed dielectric layer and a 3D microstructure layer provided in this embodiment 2 includes integrally manufacturing a dielectric layer 22, a 3D microstructure 24 layer, and a hydrophobic layer 23 on the basis of a substrate and electrodes, and the following is described with respect to one-step manufacturing using the 3D printed dielectric layer and the 3D microstructure layer, and specifically includes the following operation processes:
s100: preparing a chromium plate substrate with a certain size in advance, wherein the chromium plate substrate is used as a lower substrate layer 211 of the digital microfluidic device to be 3D printed and manufactured;
s101: depositing a first layer of photosensitive resin on the chromium plate substrate layer 211 in a printing mode to serve as a dielectric layer 22 of the digital microfluidic chip, wherein the thickness of the dielectric layer 22 can be designed by self;
s102: constructing a hydrophobic layer 23 on the 22 dielectric layer according to a set pattern in a printing mode, wherein the hydrophobic layer 23 is a 3D array super-hydrophobic microstructure layer;
s103: a 3D micro-structural layer 24 is constructed on the hydrophobic layer 23, and the structural type of the 3D micro-structural layer 24 can be designed according to requirements;
the steps S101 to S103 are performed by integrally printing the first layer of substrate with a 3D printer in one step, and constructing an integrated digital microfluidic chip having a dielectric layer, a hydrophobic layer, and a 3D micro-structural layer on the chrome plate substrate.
In this embodiment, photosensitive resin is used as the material of the dielectric layer 22, the hydrophobic layer 23, and the 3D micro-structural layer 24, but in other implementation applications, photosensitive resin is not necessarily used as the base material of the dielectric layer 22, the hydrophobic layer 23, and the 3D micro-structural layer 24, and PDMS and silicone rubber materials may be used for the lamination printing.
Example 3
Referring to fig. 4, in order to provide an integrated forming flowchart of the 3D printing digital microfluidic chip provided in this embodiment 3, a 3D printer is used to print the whole digital microfluidic chip in one step, and the chrome plate substrate layer prefabricated in embodiment 2 is manufactured in a 3D printing manner, and the specific manufacturing steps are as follows:
s200: a substrate layer 211 for depositing a substrate with a certain thickness as an electrode layer by means of printing;
s201: an electrode structure is constructed on the base layer 211 by combining a multi-material 3D printing technology to obtain a chromium plate base layer;
s202: depositing a first layer of photosensitive resin on the chromium plate substrate layer in a printing mode to serve as a dielectric layer 212 of the digital microfluidic chip, wherein the thickness of the dielectric layer 212 can be designed by self;
s203: constructing a hydrophobic layer 23 on the dielectric layer 212 according to a set pattern in a printing mode, wherein the hydrophobic layer 23 is a 3D array super-hydrophobic microstructure layer;
s204: and constructing a 3D micro-structure layer 24 on the hydrophobic layer 23, wherein the structure type of the 3D micro-structure layer 24 can be designed according to requirements.
Through the steps, the one-step printing and manufacturing of the digital microfluidic chip are realized.
According to the technical scheme, compared with the prior art, the method for manufacturing the digital microfluidic chip by adopting the 3D printing technology integration and one-step mode has the following specific beneficial effects:
(1) the digital microfluidic chip containing the electrode substrate, the dielectric layer, the hydrophobic layer and the 3D micro-structural layer is printed in a 3D mode, the 3D printing adopts a rapid forming technology for manufacturing three-dimensional workpieces by superposing forming raw materials layer by layer through printing equipment by using three-dimensional software, and the digital microfluidic chip has the advantages of micro-nano-level manufacturing precision, complex printing shape, high forming speed, high integration level, low manufacturing cost, no mask and the like. According to the method for manufacturing the digital microfluidic chip in an integrated and one-step manner and the preparation process, the manufacturing problems of the chip dielectric layer, the hydrophobic layer and the 3D micro-structural layer can be directly solved through the micro-nano 3D printing technology, the problem that the dielectric layer is etched layer by using the traditional photoetching technology to be complicated in manufacturing is improved, and the integrated digital microfluidic chip is manufactured in an integrated manner.
(2) Aiming at the problem that the traditional chip is limited by a design production mode and a manufacturing process and cannot achieve optimization of efficiency, the invention simplifies the preparation of the medium electric layer, the hydrophobic layer and the 3D micro-structural layer of the traditional digital micro-fluidic chip into one-step integrated manufacturing, thereby effectively simplifying the preparation process of the digital micro-fluidic chip. Therefore, compared with the traditional digital microfluidic chip, the manufacturing method of the 3D printing micro-structure layer integrated digital microfluidic chip has the advantages of simple preparation method, automation, batch production, realization of complex structure manufacturing and the like.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. The utility model provides a 3D prints integrated digital micro-fluidic chip structure which characterized in that, digital micro-fluidic chip includes: the device comprises an upper polar plate and a lower polar plate, wherein the upper polar plate is a hydrophobized electrode; the lower polar plate comprises a base plate, a dielectric layer, a hydrophobic layer and a 3D micro-structural layer which are sequentially connected; the base plate comprises a base layer and an electrode layer which are connected in sequence.
2. A manufacturing method of a 3D printing integrated digital microfluidic chip is characterized by comprising the following steps:
s10: manufacturing a base plate in advance, wherein the base plate is used as a first base layer of the digital microfluidic chip;
s20: obtaining a dielectric layer by 3D printing on the basis of the first substrate layer;
s30: constructing a hydrophobic layer on the basis of the dielectric layer by 3D printing;
s40: and constructing a 3D microstructure layer by 3D printing on the basis of the hydrophobic layer.
3. The manufacturing method of the 3D printing integrated digital microfluidic chip according to claim 2, wherein the steps S20 to S40 are sequentially printed on the first substrate layer by 3D printing in a one-step integrated manner.
4. The manufacturing method of the 3D printing integrated digital microfluidic chip according to claim 2, wherein the step S10 of pre-fabricating the substrate plate includes:
s11: obtaining a base layer through 3D printing deposition;
s12: and constructing an electrode structure on the basis of the substrate layer through 3D printing to obtain an electrode layer, and taking the electrode layer as a substrate plate.
5. The manufacturing method of the 3D printing integrated digital microfluidic chip according to claim 3, wherein the hydrophobic layer is a 3D array super-hydrophobic microstructure layer.
6. The manufacturing method of the 3D printing integrated digital microfluidic chip according to claim 4, wherein the substrate layer is made of the following materials: any one or more of glass, PCMS, PVA, PA and photosensitive resin.
7. The manufacturing method of the 3D printing integrated digital microfluidic chip according to claim 4, wherein the material of the electrode layer comprises: any one or more of chromium, silver, copper and gallium.
8. The manufacturing method of the 3D printing integrated digital microfluidic chip according to claim 2, wherein the dielectric layer is made of any one or more of silica gel, photosensitive resin, SU8 photoresist, polydimethylsiloxane, polyvinyl alcohol and polyimide.
9. The method of claim 8, wherein the dielectric layer is printed to any thickness.
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Cited By (1)
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| CN114210376A (en) * | 2021-11-25 | 2022-03-22 | 苏州大学 | Open type flexible digital micro-fluidic chip and manufacturing method and control device thereof |
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