CN212695143U - Micro-channel heat sink with vein-shaped flow dividing structure - Google Patents

Micro-channel heat sink with vein-shaped flow dividing structure Download PDF

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CN212695143U
CN212695143U CN202022177568.4U CN202022177568U CN212695143U CN 212695143 U CN212695143 U CN 212695143U CN 202022177568 U CN202022177568 U CN 202022177568U CN 212695143 U CN212695143 U CN 212695143U
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channel
sub
flow splitting
vein
outflow
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董潇潇
唐巍
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Abstract

The utility model discloses a microchannel heat sink with a vein-shaped flow dividing structure, which belongs to the technical field of heat exchangers, and comprises a main inflow and outflow structure, a vein-shaped flow dividing layer, an overflow channel layer and a top cover plate, wherein a main inflow channel and a main outflow channel are arranged in the main inflow and outflow structure; the vein-shaped flow distribution layer and the overflow channel layer are positioned between the main inflow channel and the main outflow channel, and the vein-shaped flow distribution layer is positioned above the overflow channel layer; the overflow channel layer comprises a plurality of trapezoidal grooves, the vein-shaped flow splitting layer comprises a first-level flow splitting sub-channel and a first-level flow splitting sub-channel, a plurality of secondary first-level flow splitting sub-channels are arranged on two sides of the first-level flow splitting sub-channel, and a plurality of secondary first-level flow splitting sub-channels are arranged on two sides of the first-level flow splitting sub-channel. The utility model discloses a special reposition of redundant personnel structure and overflow channel structural design make the distribution process homogenization of heat sink inside flow, and then improve heat sink whole heat exchange efficiency and heat transfer homogeneity.

Description

Micro-channel heat sink with vein-shaped flow dividing structure
Technical Field
The utility model belongs to the technical field of the heat exchanger technique and specifically relates to a microchannel heat sink with vein shape reposition of redundant personnel structure is particularly useful for the cooling of miniaturized high heat release equipment such as high heat release electronic chip, high-power laser diode, spotlight type solar cell.
Background
Heat exchange, which refers to the transfer of heat between two substances, is a unit operation belonging to the heat transfer process. In daily life and production, most of used equipment can generate heat during operation, and heat exchange and cooling are required to be carried out in time to ensure normal operation of the equipment.
Many miniaturized, high heat-generating devices, such as high-performance electronic chips, high-power laser diodes, concentrating solar cells, etc., generate strong heat release (even exceeding 100W/cm) during operation2) Effective cooling of the devices becomes an important prerequisite for reliable operation of the devices, and related technologies are always hot spots.
For the cooling of the above-mentioned types of equipment, currently, air-cooled heat exchangers are mostly adopted, but the air-cooled heat exchangers have large loss and low heat exchange efficiency when in use, and compared with the traditional air-cooled heat exchangers, the liquid-cooled heat exchangers have stronger heat exchange capacity, are more suitable for the cooling of high-heat-release equipment, and are the main development direction of the cooling technology of future high-heat-generation electronic equipment.
Split-flow microchannel heat sinks were proposed by G.M. Harpole and J.E. Eninger in 1991 (G.M. Harpole, J.E. Eninger, Micro-channel heat exchange optimization, in: Proc. 7th IEEE Semi-Heat. Symp. (1991) 59-63). Compared with the traditional microchannel heat sink, the shunting-type microchannel heat sink has the advantages that the shunting structure is added on the basis of the microchannel heat sink, and the better heat dissipation uniformity and comprehensive performance are realized. Based on the split-flow microchannel heat sink design, new design patterns have been developed in recent years, such as self-similar microchannel heat sink structures proposed by the scholars of Brighenti and Kamaruzaman (F. Brighenti, N. Kamaruzaman, J.J. Brandner, investment of self-similar heat sources for liquid-cooled electronics, applied. Therm. Eng. 59 (1-2) (2013) 725-. Both the traditional microchannel heat sink and the shunt microchannel heat sinks in various types have the problems of uneven internal flow distribution and uneven heat exchange caused by uneven internal flow distribution, and the application and popularization of the microchannel heat sink are greatly limited. The distribution process of the internal flow of the divided-flow microchannel heat sink, the overall heat dissipation performance, the heat dissipation uniformity and the like need to be further improved, and a plurality of related research works are urgently needed to be carried out.
SUMMERY OF THE UTILITY MODEL
In order to solve the deficiencies in the prior art, the utility model aims to provide a microchannel heat sink with vein-shaped flow dividing structure, the heat sink has the characteristics of good heat exchange effect, uniform flow distribution, compact structure and the like.
The utility model provides a technical scheme that its technical problem adopted does:
provides a micro-channel heat sink with a vein-shaped flow distribution structure, which comprises a main inflow and outflow structure, a vein-shaped flow distribution layer, an overflow channel layer and a top cover plate,
the main inflow and outflow structure comprises a groove-shaped shell, one side of the shell is provided with a cooling working medium inlet, the other side of the shell is provided with a cooling working medium outlet, and the cooling working medium inlet and the cooling working medium outlet are arranged diagonally; a main inflow channel and a main outflow channel are arranged inside the shell, the main inflow channel is communicated with the cooling working medium inlet, and the main outflow channel is communicated with the cooling working medium outlet;
the vein-shaped flow distribution layer and the overflow channel layer are positioned in the shell and between the main inflow channel and the main outflow channel, and the vein-shaped flow distribution layer is positioned above the overflow channel layer; the overflow channel layer comprises a plurality of trapezoidal grooves, the vein-shaped flow splitting layer comprises a primary flow splitting sub-channel communicated with the main flow inlet channel and a primary flow outlet sub-channel communicated with the main flow outlet channel, a plurality of secondary flow splitting sub-channels communicated with the primary flow splitting sub-channel are arranged on two sides of the primary flow splitting sub-channel, a plurality of secondary flow outlet sub-channels communicated with the primary flow splitting sub-channel are arranged on two sides of the primary flow outlet sub-channel, and the trapezoidal grooves and the secondary flow splitting sub-channels form an intermittent overflow channel structure;
the top cover plate fits over and closes the open side of the housing.
Furthermore, the secondary primary flow distribution sub-channel is symmetrically distributed on two sides of the primary flow distribution sub-channel, and the secondary primary flow outflow sub-channel is symmetrically distributed on two sides of the primary flow outflow sub-channel.
Furthermore, the cross-sectional dimension of the main inflow channel is gradually reduced from the position of the cooling working medium inlet to the other side of the main inflow and outflow structure.
Furthermore, the cross-sectional dimension of the primary flow distribution sub-channel is gradually reduced from one end close to the main flow inlet channel to the other end.
Furthermore, two sides of the first-stage outflow sub-channel are vertically connected with the second-stage outflow sub-channel.
Further, the overflow channel structure is an isosceles trapezoid, and the cross-sectional size of the overflow channel structure is gradually reduced from one side close to the main inflow channel to the other side.
Further, the cross-sectional shape of the main inflow channel and/or the main outflow channel is rectangular.
Furthermore, the secondary flow-dividing sub-channel and the secondary flow-discharging sub-channel are arranged at intervals.
Furthermore, the adjacent side of the main inflow channel and the first-stage flow splitting sub-channel is vertically connected, and the adjacent side of the main outflow channel and the first-stage flow splitting sub-channel is vertically connected.
Further, the width of the first stage outflow sub-channel at the two ends is 1/2 of the width of the first stage outflow sub-channel at the middle.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses the microchannel heat sink with vein shape reposition of redundant personnel structure of example, through main inflow passageway, the special structural design of one-level reposition of redundant personnel subchannel and overflow channel, one-level reposition of redundant personnel subchannel and inferior one-level reposition of redundant personnel subchannel on the reposition of redundant personnel layer, the one-level is flowed the subchannel and form vein shape structure with its unique distribution form with inferior one-level, realize the microchannel heat sink internal flow distribution's that has the reposition of redundant personnel structure homogenization, and then improve the comprehensive ability of heat sink, especially can improve the heat transfer homogeneity.
2. The utility model discloses the microchannel heat sink with vein shape reposition of redundant personnel structure of example, main inlet channel's cross-section is the convergent structure, and cooling medium is at first flowed into by main inlet channel and is heat sink, shunts to the one-level reposition of redundant personnel subchannel from main inlet channel afterwards, because main inlet channel cross-section reduces gradually, restricts too much flow and distributes downstream, makes the flow ratio of each one-level reposition of redundant personnel subchannel distribution more even, realizes the homogenization of the inside flow distribution of heat exchanger, and then improves the heat transfer homogeneity.
3. The utility model discloses the microchannel heat sink with vein shape reposition of redundant personnel structure of example, the cross-section that the subchannel was shunted to the one-level is the convergent structure to increase downstream side flow resistance, make the one-level each time shunt the flow ratio of subchannel more even, further play the effect of flow equalizing.
4. The utility model discloses the microchannel heat sink with vein shape reposition of redundant personnel structure of example, overflow passage structure are isosceles trapezoid, and the width reduces, has further restricted the next one-level reposition of redundant personnel passageway's of downstream side flow to make the inside flow distribution homogenization of whole heat sink, and then ensured the homogeneity of heat sink heat transfer.
5. The utility model discloses the microchannel heat sink with vein shape reposition of redundant personnel structure of example, each connection position adopts perpendicularly to link to each other more, guarantees whole heat sink internal flow distribution homogenization, and the one-level that is located both ends is flowed the subchannel width and is flowed 1/2 of subchannel width for the complete one-level that is located in the middle of to this guarantees that heat sink inside each flow unit geometric dimensions is unanimous, guarantees the heat transfer homogeneity.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic external structural view of an embodiment of the present invention;
FIG. 2 is an exploded view of the components of FIG. 1;
fig. 3 is a schematic perspective view of an internal structure of an embodiment of the present invention;
fig. 4 is a schematic plan view of the internal structure of the embodiment of the present invention;
FIG. 5 is a sectional view taken along line A-A of FIG. 4;
fig. 6 is a flow equalization effect display diagram of the embodiment of the present invention.
In the figure:
1-main inflow and outflow structure, 1.1-main inflow channel, 1.2-main outflow channel;
2-vein-shaped flow-splitting layer, 2.1-first-level flow-splitting sub-channel, 2.2-first-level outflow sub-channel, 2.3-second-level flow-splitting sub-channel and 2.4-second-level outflow sub-channel;
3-an overflow channel layer, 3.1-an overflow channel structure;
4-top cover plate.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention.
The components of the embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
As shown in fig. 1-5, an embodiment of the present invention provides a microchannel heat sink with a vein-shaped flow splitting structure, which includes a main inflow and outflow structure 1, a vein-shaped flow splitting layer 2, an overflow channel layer 3, and a top cover plate 4.
The main inflow and outflow structure 1 comprises a groove-shaped shell, one side of the shell is provided with a cooling working medium inlet, the other side of the shell is provided with a cooling working medium outlet, and the cooling working medium inlet and the cooling working medium outlet are arranged diagonally; a main inflow channel 1.1 and a main outflow channel 1.2 are arranged inside the shell, the main inflow channel 1.1 is communicated with the cooling working medium inlet, and the main outflow channel 1.2 is communicated with the cooling working medium outlet.
The vein-shaped flow distribution layer 2 and the overflow channel layer 3 are positioned in the shell and between the main inflow channel 1.1 and the main outflow channel 1.2, and the vein-shaped flow distribution layer 2 is positioned above the overflow channel layer 3; as shown in fig. 2, the overflow channel layer includes a plurality of trapezoidal grooves, as shown in fig. 3 and fig. 4, the vein-shaped flow-splitting layer 2 includes a first-stage flow-splitting sub-channel 2.1 communicated with the main inflow channel 1.1 and a first-stage flow-splitting sub-channel 2.2 communicated with the main outflow channel 1.2, a plurality of second-stage flow-splitting sub-channels 2.3 communicated with the first-stage flow-splitting sub-channel 2.1 are disposed on two sides of the first-stage flow-splitting sub-channel 2.1, a plurality of second-stage flow-splitting sub-channels 2.4 communicated with the first-stage flow-splitting sub-channel 2.2 are disposed on two sides of the first-stage flow-splitting sub-channel 2.2, and the trapezoidal grooves.
The top cover plate 4 fits into and closes the open side of the housing.
The secondary sub-channel 2.3 is symmetrically distributed on both sides of the primary sub-channel 2.1, and the secondary sub-channel 2.4 is symmetrically distributed on both sides of the primary sub-channel 2.2, so that the sub-layers form a vein-shaped structure.
As shown in fig. 3 and 4, in order to improve the uniformity of heat exchange, the cross-sectional size of the main inflow channel 1.1 is gradually reduced from the position of the cooling medium inlet to the other side of the main inflow and outflow structure 1. The cross-sectional dimension of the primary flow distribution sub-channel 2.1 is gradually reduced from one end close to the main flow inlet channel 1.1 to the other end. The overflow channel structure 3.1 is an isosceles trapezoid, and the cross-sectional dimension of the structure is gradually reduced from one side close to the main inflow channel 1.1 to the other side. The cross section reducing structure limits excessive flow to be distributed downstream, so that the flow distributed in each area is uniform, the homogenization of the flow distribution in the heat sink is realized, and the heat exchange uniformity is improved.
Specifically, the inclined surface of the main inflow channel 1.1 has an inclination angle of 6.48o. The starting point of the inclined surface is 0.2mm away from the section of the cooling working medium inlet. The height, the width and the length of the section of the inlet of the primary flow distribution sub-channel 2.1 are respectively 0.6mm, 0.8mm and 6.6 mm. The inclined angle of two side walls of the first-stage flow distribution sub-channel 2.1 facing the center is 2.17o. As shown in fig. 3 and 4, two overflow channel structures 3.1 are arranged below the diversion channel of each unit, and the interval between the starting ends of the adjacent channels is 0.1 mm. The width of the starting end of the overflow channel structure 3.1 is 0.75mm, the height and the length of the overflow channel structure are 0.1mm and 2.4mm respectively, and the inclination angles of two side walls of the overflow channel structure 3.1 facing the center are 2.68o
The two sides of the first-stage outflow sub-channel 2.2 are vertically connected with the second-stage outflow sub-channel 2.4, and the second-stage flow-dividing sub-channel 2.3 and the second-stage outflow sub-channel 2.4 are arranged at intervals. In this embodiment, the height and width of the cross section of the inlet of the secondary first-stage flow distribution sub-channel 2.3 are respectively 0.6mm and 0.4mm, and the length from the channel end to the center line of the primary flow distribution sub-channel 2.1 is 2.2 mm. The secondary outflow sub-channel 2.4 has a rectangular cross section, and the height, width and length of the secondary outflow sub-channel 2.4 are respectively 0.6mm, 0.4mm and 1.8 mm. The primary outflow sub-channel 2.2 has a rectangular cross-section, and has a height, width and length of 0.6mm, 0.8mm and 6.6mm, respectively.
In this embodiment, the cross-sectional shapes of the main inflow channel 1.1 and the main outflow channel 1.2 are rectangular. The height and the width of the section of the cooling working medium inlet are respectively 0.7mm and 1.2mm, and the total length of the main inflow channel is 1.1 mm and 9 mm. The height, width and length of the main outflow channel 1.2 are 0.6mm, 1.2mm and 11.4mm respectively. The adjacent side of the main inflow channel 1.1 and the first-stage flow dividing sub-channel 2.1 is vertically connected, and the adjacent side of the main outflow channel 1.2 and the first-stage flow dividing sub-channel 2.2 is vertically connected.
In order to make the geometric dimensions of each flow unit in the heat sink consistent and ensure the uniformity of heat exchange, the width of the primary outflow sub-channel 2.2 at the two ends is 1/2 of the width of the complete primary outflow sub-channel 2.2 in the middle.
In this embodiment, the thicknesses of the bottom plate, the side wall and the top cover plate 4 of the inflow and outflow structure 1 are all 0.2mm, and the thin-wall structure is helpful for improving the heat exchange efficiency.
When the heat sink is used, through the special design of the main inflow channel 1.1, the primary flow-dividing sub-channel 2.1 and the overflow channel structure 3.1, the primary flow-dividing sub-channel 2.1 and the secondary flow-dividing sub-channel 2.3, the primary flow-dividing sub-channel 2.2 and the secondary flow-dividing sub-channel 2.4 on the flow-dividing layer form a vein structure in a unique distribution form, so that the homogenization of the internal flow distribution of the micro-channel heat sink with the flow-dividing structure is realized, the comprehensive capacity of the heat sink is further improved, and the heat exchange uniformity can be particularly improved.
As shown in fig. 6, the current sharing effect is shown, the data is the result of numerical simulation calculation, commercial numerical simulation software is used for calculation, and the calculation method and the model are verified and analyzed; the calculation model is one of the heat sinksAn internal heat exchange unit. The ratio of the distribution flow of each sub-stage flow splitting sub-channel to the total flow of the flow splitting sub-channels under a certain inlet flow condition is given in fig. 6, and the relative size of the flow distribution among the sub-stage flow splitting sub-channels can be reflected. The cooling working medium is water, and the solid material is silicon; the inlet flow rates of the first-stage flow splitting sub-channels are respectively set to be 0.86kg/h, 1.08kg/h and 1.29kg/h, and the outlet is set as a free outflow boundary condition; bottom heating surface applying 1MW/m2Constant heat flow of (a); the sections on both sides of the computing unit are set as symmetrical boundary conditions, and the other outer surfaces are processed according to heat insulation wall surfaces. Fig. 6 shows that the current sharing effect of the present invention is significant.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be understood by those skilled in the art that the scope of the present invention is not limited to the specific combination of the above-mentioned features, but also covers other embodiments formed by any combination of the above-mentioned features or their equivalents without departing from the spirit of the present invention. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Besides the technical features described in the specification, other technical features are known to those skilled in the art, and further description of the other technical features is omitted here in order to highlight the innovative features of the present invention.

Claims (10)

1. A micro-channel heat sink with a vein-shaped flow splitting structure is characterized by comprising a main inflow and outflow structure (1), a vein-shaped flow splitting layer (2), an overflow channel layer (3) and a top cover plate (4),
the main inflow and outflow structure (1) comprises a groove-shaped shell, one side of the shell is provided with a cooling working medium inlet, the other side of the shell is provided with a cooling working medium outlet, and the cooling working medium inlet and the cooling working medium outlet are arranged diagonally; a main inflow channel (1.1) and a main outflow channel (1.2) are arranged inside the shell, the main inflow channel (1.1) is communicated with the cooling working medium inlet, and the main outflow channel (1.2) is communicated with the cooling working medium outlet;
the vein-shaped flow distribution layer (2) and the overflow channel layer (3) are positioned in the shell and between the main inflow channel (1.1) and the main outflow channel (1.2), and the vein-shaped flow distribution layer (2) is positioned above the overflow channel layer (3); the overflow channel layer (3) comprises a plurality of trapezoidal grooves, the vein-shaped flow splitting layer (2) comprises a primary flow splitting sub-channel (2.1) communicated with the main inflow channel and a primary flow splitting sub-channel (2.2) communicated with the main outflow channel, a plurality of secondary flow splitting sub-channels (2.3) communicated with the primary flow splitting sub-channel are arranged on two sides of the primary flow splitting sub-channel (2.1), a plurality of secondary flow splitting sub-channels (2.4) communicated with the primary flow splitting sub-channel are arranged on two sides of the primary flow splitting sub-channel (2.2), and the trapezoidal grooves and the secondary flow splitting sub-channels (2.3) form an intermittent overflow channel structure (3.1);
the top cover plate (4) is adapted to the open side of the housing and closes off the open side.
2. The microchannel heat sink with vein-shaped flow splitting structure of claim 1, wherein the secondary sub-channels (2.3) are symmetrically distributed on both sides of the primary sub-channel (2.1), and the secondary outflow sub-channels (2.4) are symmetrically distributed on both sides of the primary outflow sub-channel (2.2).
3. The microchannel heat sink with a vein-shaped flow splitting structure according to claim 1 or 2, wherein the cross-sectional dimension of the main inflow channel (1.1) is gradually reduced from the position of the cooling medium inlet to the other side of the main inflow and outflow structure (1).
4. The microchannel heat sink with the vein-shaped flow splitting structure as claimed in claim 3, wherein the cross-sectional size of the primary flow splitting sub-channel (2.1) is gradually reduced from one end close to the main inflow channel (1.1) to the other end.
5. The microchannel heat sink with vein-like flow splitting structure of claim 2, wherein the first stage outflow sub-channel (2.2) is vertically connected to the second stage outflow sub-channel (2.4) on both sides.
6. The microchannel heat sink with the vein-shaped flow splitting structure as claimed in claim 1, wherein the overflow channel structure (3.1) is an isosceles trapezoid, whose cross-sectional dimension is gradually reduced from one side close to the main inflow channel (1.1) to the other side.
7. The microchannel heat sink with vein-shaped flow splitting structure according to claim 3, wherein the cross-sectional shape of the main inflow channel (1.1) and/or the main outflow channel (1.2) is rectangular.
8. The microchannel heat sink with vein-shaped flow splitting structure according to claim 1 or 2, wherein the secondary flow splitting sub-channel (2.3) is spaced apart from the secondary outflow sub-channel (2.4).
9. The microchannel heat sink with the vein-shaped flow splitting structure as claimed in claim 1, wherein the side of the main inflow channel (1.1) adjacent to the primary flow splitting sub-channel (2.1) is vertically connected, and the side of the main outflow channel (1.2) adjacent to the primary flow splitting sub-channel (2.2) is vertically connected.
10. The microchannel heat sink with vein-like flow splitting structure of claim 1, wherein the width of the first stage outflow subchannel (2.2) at both ends is 1/2 times the width of the first stage outflow subchannel (2.2) in the middle.
CN202022177568.4U 2020-09-28 2020-09-28 Micro-channel heat sink with vein-shaped flow dividing structure Expired - Fee Related CN212695143U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113692206A (en) * 2021-09-27 2021-11-23 四川农业大学 Dividing wall type heat exchanger with flow dividing channel structure
WO2024032028A1 (en) * 2022-08-10 2024-02-15 南京先进激光技术研究院 Laser cooling heat sink having micro-channel structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113692206A (en) * 2021-09-27 2021-11-23 四川农业大学 Dividing wall type heat exchanger with flow dividing channel structure
WO2024032028A1 (en) * 2022-08-10 2024-02-15 南京先进激光技术研究院 Laser cooling heat sink having micro-channel structure

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