CN115966533B - Manifold type micro-channel radiator with countercurrent region - Google Patents
Manifold type micro-channel radiator with countercurrent region Download PDFInfo
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- CN115966533B CN115966533B CN202211530818.5A CN202211530818A CN115966533B CN 115966533 B CN115966533 B CN 115966533B CN 202211530818 A CN202211530818 A CN 202211530818A CN 115966533 B CN115966533 B CN 115966533B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention discloses a manifold type micro-channel radiator with a countercurrent zone, which comprises a micro-channel upper cover plate, a Z-shaped manifold structure, a micro-channel splitter plate and a micro-channel heat sink, wherein the Z-shaped manifold structure is provided with an inlet section and an outlet section, the inlet section and the outlet section are both trapezoid areas, the inlet section is communicated with four fluid inlets, and the outlet section is communicated with four fluid outlets; the bottom of the micro-channel heat sink is in direct contact with the surface of the heat source; the micro-channel flow dividing plate adopts a unique design, so that the pure countercurrent flow of the fluid in the micro-channel is realized, and the uniformity of the temperature of a heat source surface is improved; in the Z-type manifold structure, heat sources are not applied to the bottom channels of the first fluid inlet and the fourth fluid inlet which are positioned at two sides of the manifold, and the bottom channels serve as fluid introduction inlets, so that a flow dead zone can be avoided when cooling liquid in the micro-channels flows in a countercurrent mode.
Description
Technical Field
The invention relates to the field of electronic device cooling modes, in particular to a manifold type micro-channel radiator with a countercurrent area.
Background
The disclosure of this background section is only intended to increase the understanding of the general background of the invention and is not necessarily to be construed as an admission or any form of suggestion that this information forms the prior art already known to those of ordinary skill in the art.
The electronic equipment plays an indispensable key core and supporting role in the fields of national economy and military national defense. Limited by the efficiency of the electronic device itself, nearly 80% of the electrical power dissipation of the input electronic device is converted to waste heat; if the problems of waste heat dissipation and temperature control generated by electronic components and equipment cannot be solved timely and effectively, the temperature of the electronic components is increased, the working performance of the electronic components is greatly reduced, the working reliability of the devices and the equipment is affected, and even the working temperature is allowed to exceed the limit of the working temperature, so that the electronic components and the equipment are burnt out and lose efficacy. Electronic equipment thermal management is a core element for electronic component and equipment development, is one of research hotspots in the field of international thermal science in more than ten years, and becomes one of important challenges for electronic technology development in the future 'post-molar' age.
The cooling mode of the traditional remote cooling architecture can not meet the cooling requirements of the novel high-power electronic chip and the 3D three-dimensional stacked chip, so that the development of a cooling technology to the near-junction architecture of the chip is promoted, and the interface contact thermal resistance and the component shell thermal resistance are eliminated by directly introducing a cooling medium near the chip junction in a chip processing micro-channel mode, so that the heat consumption and the heat dissipation generated by the chip can be rapidly and effectively eliminated, and the thermal shock resistance and the heat dissipation capacity of the device are greatly improved. The near-junction heat dissipation technology is a necessary trend of heat management methods and technologies for the next generation of chips with high heat flux density and 3D stacked chips in the future adapting to the 'post-mole' age, and is used for solving 1000W/cm of the chips in the future 2 The key core technology of the heat flux density.
Miniaturization of electronic equipment, improvement of packaging technology and development and application of nanotechnology lead to significant difference of heat flux density in different areas in a chip, hot spot areas are formed, generally speaking, heat in the chip is always unevenly transferred to a heat dissipation plate, and the heat flux of the hot spot areas is several times of the average heat flux of background areas. The temperature difference caused by the heat flux difference between the hot spot area and the background area can deform the chip, and the service life of the chip is reduced. Optimization of the microchannel structure is of paramount importance. In order to solve the problem of local hot spots in the partial area of the heating surface, it is necessary to raise the temperature uniformity of the heat source surface on the premise of meeting the pumping work.
Disclosure of Invention
Aiming at the problems existing in the prior art, the invention provides the manifold type microchannel radiator with the countercurrent region, which can realize the pure countercurrent flow of fluid in a microchannel and improve the temperature uniformity of a heat source surface.
The technical scheme of the invention is as follows:
in a first aspect of the present invention, there is provided a manifold-type microchannel heat sink with a counterflow region, comprising a microchannel upper cover plate, a Z-type manifold structure, a microchannel splitter plate and a microchannel heat sink, the Z-type manifold structure being provided with an inlet section and an outlet section, both of which are trapezoidal regions, the inlet section being in communication with four fluid inlets and the outlet section being in communication with four fluid outlets; the bottom of the microchannel heat sink is in direct contact with the heat source surface.
In some embodiments of the present invention, a working medium inlet and a working medium outlet are disposed on the microchannel upper cover plate, the working medium inlet is communicated with the inlet flow passage collecting region in the microchannel upper cover plate, and the working medium outlet is communicated with the outlet flow passage collecting region in the microchannel upper cover plate.
In some embodiments of the invention, the fluid inlet and the fluid outlet on the Z-manifold structure are the same in cross-section.
In some embodiments of the present invention, the upper surface of the microchannel heat sink is provided with a plurality of microchannels, which are directly obtained by etching.
In some embodiments of the invention, the plurality of micro-channels are disposed in a central rectangular portion of the micro-channel heat sink, and the heat source is in contact with the portion in which the micro-channels are disposed.
In some embodiments of the present invention, the micro-channel splitter plate is provided with a plurality of rectangular through slots, and adjacent rows or columns of through slots are staggered; the width of the rectangular through groove is consistent with the channel width of the micro-channel heat sink.
In some embodiments of the present invention, the micro-channel upper cover plate, the Z-manifold structure, the micro-channel splitter plate and the micro-channel heat sink are the same in shape and size and are hermetically connected by bonding.
In some embodiments of the invention, the materials of the microchannel heat sink and the microchannel manifold are silicon.
In some embodiments of the invention, the microchannel top cover plate and the Z-manifold structure are made of a metal material that conducts heat well.
In some embodiments of the invention, the microchannel top cover plate and the Z-manifold structure are each cut from a single piece of metallic material.
One or more of the technical schemes of the invention has the following beneficial effects:
the invention uses silicon as the micro-channel heat sink material, the etching process of the silicon material is mature, and the micro-structure and the complex structure which cannot be manufactured by other materials can be processed. The micro-channel heat sink is in direct contact with the surface of the heat source, so that a good heat dissipation effect can be achieved, and meanwhile, the micro-channel substrate can be protected, and the reliability of the device is guaranteed. And the heat radiator is connected with the micro-channel substrate in a bonding mode, so that the tightness of the heat radiator is ensured.
The micro-channel flow dividing plate adopts a unique design, so that the pure countercurrent flow of the fluid in the micro-channel is realized, and the uniformity of the temperature of the heating surface is realized; in the Z-type manifold structure, heat sources are not applied to the bottom channels of the first fluid inlet and the fourth fluid inlet which are positioned at two sides of the manifold, and the bottom channels serve as fluid introduction inlets, so that a flow dead zone can be avoided when cooling liquid in the micro-channels flows in a countercurrent mode.
The micro-channel on the substrate can be in various forms, so that the conventional excellent silicon-based micro-channel can be put into practical use, the practical use of the silicon-based micro-channel is improved, the high temperature uniformity is achieved, the highest temperature of the heat source surface is reduced, and the method has certain reference significance for reducing local hot spots of the heat source surface and improving the overall heat exchange capacity.
Drawings
FIG. 1 is an exploded schematic view of a manifold-type microchannel heat sink with a counter flow region according to the present invention;
FIG. 2 is a schematic view of a microchannel heat sink of a manifold-type microchannel heat sink with a counter flow region of the present invention;
FIG. 3 is a schematic view of a microchannel manifold of a manifold-type microchannel heat sink with a counter flow region according to the present invention;
FIG. 4 is a schematic view of a Z-manifold configuration of a manifold-type microchannel heat sink with a counter flow zone according to the present invention;
FIG. 5 is a schematic view of a microchannel top cover plate of a manifold-type microchannel heat sink with a counter flow region according to the present invention;
FIG. 6 is a schematic diagram of the countercurrent flow of a manifold-type microchannel heat sink with countercurrent flow zone according to the present invention;
FIG. 7 is a heat source side temperature cloud of a conventional manifold-type microchannel heat sink and a manifold-type microchannel heat sink with a counter flow zone of the invention under the same heat source, wherein (a) is a conventional manifold-type microchannel heat sink and (b) is a manifold-type microchannel heat sink with a counter flow zone of the invention;
FIG. 8 is a graph of maximum temperature of a heating surface of a conventional manifold-type microchannel heat sink and a manifold-type microchannel heat sink with a counter flow zone according to the present invention as a function of different mass flow rates at the inlet;
FIG. 9 is a graph of temperature difference of heating surfaces of a conventional manifold-type microchannel heat sink and a manifold-type microchannel heat sink with a counter flow zone according to the present invention as a function of different mass flow rates at the inlet;
FIG. 10 is a graph of inlet-outlet pressure drop versus inlet differential mass flow for a conventional manifold-type microchannel heat sink and a manifold-type microchannel heat sink with a counter flow zone of the invention.
In the figure: 1. a microchannel heat sink; 2. a microchannel manifold; 3. a Z-manifold structure; 31. an inlet section; 311. a first fluid inlet; 312. a second fluid inlet; 313. a third fluid inlet; 314. a fourth fluid inlet; 32. an outlet section; 321. a first fluid outlet; 322. a second fluid outlet; 323. a third fluid outlet; 324. a fourth fluid outlet; 4. a microchannel upper cover plate; 41. a working medium inlet; 42. a working medium outlet; 61. a first countercurrent zone; 62. a second countercurrent zone; 63. and a third countercurrent zone.
Detailed Description
The invention is described below with reference to the accompanying drawings.
Example 1
In an exemplary embodiment of the present invention, a manifold type micro-channel radiator with a countercurrent region is provided, as shown in fig. 1, and includes a micro-channel upper cover plate 4, a Z-type manifold structure 3, a micro-channel splitter plate 2 and a micro-channel heat sink 1, where the micro-channel upper cover plate, the Z-type manifold structure, the micro-channel splitter plate and the micro-channel heat sink have the same shape and size and are in sealing connection with each other by bonding; the bottom of the micro-channel heat sink 1 is in direct contact with the heat source surface to realize heat exchange on the heat source surface.
The structure of the micro-channel heat sink 1 is shown in fig. 2, two ends of the micro-channel heat sink 1 are trapezoidal, the middle of the micro-channel heat sink 1 is rectangular, a plurality of rectangular grooves are formed in a rectangular area on the upper surface of the micro-channel heat sink 1 and serve as micro-channels, the micro-channel heat sink 1 is made of silicon, the micro-channels can be directly obtained through etching, two adjacent micro-channels are arranged in a staggered mode, the heat source surface is only applied to the dotted line part in fig. 2, heat transfer between the heat source surface and cooling liquid can be guaranteed, and the heat exchange efficiency is improved.
The structure of the micro-channel flow dividing plate 2 is shown in fig. 3, a plurality of rectangular through grooves are arranged on the micro-channel flow dividing plate 2, the through grooves in adjacent rows or columns are staggered, and the rectangular through grooves correspond to micro-channels on the micro-channel heat sink, so that the cooling liquid is divided; the width of the rectangular through groove is consistent with the channel width of the micro-channel heat sink; the micro-channel splitter plate 2 is made of silicon, and is processed on a silicon substrate by an etching technology, and cooling liquid is split in the micro-channel splitter plate 2, so that the fluid enters different micro-channels (odd channels and even channels).
The structure of the Z-shaped manifold structure 3 is shown in fig. 4, and the Z-shaped manifold structure is provided with an inlet section 31 and an outlet section 32, wherein the inlet section 31 and the outlet section 32 are trapezoid areas, the inlet section 31 is communicated with four fluid inlets, and the four fluid inlets comprise a first fluid inlet 311, a second fluid inlet 312, a third fluid inlet 313 and a fourth fluid inlet 314; the outlet section 32 communicates with four fluid outlets, including a first fluid outlet 321, a second fluid outlet 322, a third fluid outlet 323, and a fourth fluid outlet 324. The Z-shaped manifold structure adopts a left-in and right-out structure to split the inlet fluid, so that the flow length of the fluid along the direction of the micro-channel is reduced, the pressure drop in the micro-channel is reduced, and the inlet section 31 and the outlet section 32 both adopt trapezoid areas, so that the flow of the inlet section and the outlet section of each manifold structure is consistent, and the flow non-uniformity in the micro-channel is reduced; the Z-manifold structure 3 is made of a metallic material with good heat conduction, and is obtained by cutting a monolithic material. The bottom channels of the first fluid inlet 311 and the fourth fluid inlet 314 at the two sides of the manifold do not apply heat sources and serve as fluid introduction inlets, so that the dead zone of flow can be avoided when the cooling liquid in the micro-channels flows in a countercurrent manner.
As shown in fig. 5, the structure of the micro-channel upper cover plate 4 is that a working medium inlet 41 and a working medium outlet 42 are arranged on trapezoid areas at two ends of the micro-channel upper cover plate 4, the working medium inlet 41 is communicated with an inlet flow passage collecting area in the micro-channel upper cover plate, the working medium outlet 42 is communicated with an outlet flow passage collecting area in the micro-channel upper cover plate, the inlet flow passage collecting area corresponds to an inlet section 31 of the Z-shaped manifold structure 3, and the outlet flow passage collecting area corresponds to an outlet section 32 of the Z-shaped manifold structure 3; the micro-channel upper cover plate is made of a metal material with good heat conduction and is obtained by cutting a whole piece of metal material.
The cooling liquid in the manifold type micro-channel radiator with the countercurrent area flows into the micro-channel radiator from the working medium inlet 41 of the micro-channel upper cover plate 4, passes through the flow channel of the Z-type manifold structure 3, reaches the micro-channel splitter plate 2, and is split in the micro-channel splitter plate 2, so that the fluid enters different micro-channels (odd channels and even channels), passes through the micro-channel upper cover plate 4 after fully exchanging heat, and flows out from the working medium outlet 42 of the micro-channel upper cover plate.
As shown in fig. 6, the counter-flow of the manifold-type micro-channel radiator with the counter-flow area of the present embodiment is that the second fluid inlet 312 and the third fluid inlet 313 of the second counter-flow area 62 respectively flow into the odd-numbered and even-numbered channels, so that the channels below the second counter-flow area 62 form the counter-flow area (the fluid flow directions in the bottom adjacent channels are opposite), the first fluid inlet 311 and the second fluid inlet 312 on both sides of the first counter-flow area 61 respectively flow into the even-numbered and odd-numbered channels, and flow out at the first fluid outlet 321 and the second fluid outlet 322, so that the channels below the first counter-flow area 61 form the counter-flow area (the fluid flow directions in the bottom adjacent channels are opposite), the third fluid inlet 313 and the fourth fluid inlet 314 on both sides of the third counter-flow area 63 respectively flow into the even-numbered and odd-numbered channels, and flow out at the third fluid outlet 323 and the fourth fluid outlet 324, so that the channels below the third counter-flow area 63 form the counter-flow area (the fluid flow directions in the bottom adjacent channels). The micro-channel countercurrent flow is bidirectional flow, the fluid flow directions in the adjacent channels are opposite, the fluid high-temperature area can be supplemented and cooled by the fluid with low temperature in the adjacent channels, so that the local hot spot of the heating surface is easy to reduce, the temperature uniformity of the heat source surface is improved, the heat resistance of the heat sink is reduced, meanwhile, the manifold structure is adopted, the fluid flow length is shortened, and the total pressure drop is reduced.
In order to verify the superior performance of the microchannel radiator for solving the hot spot problem, the invention provides a simulation comparison of two microchannel radiators by ANSYS-Fluent software by taking the traditional manifold type microchannel heat radiation as a reference.
Based on this, detailed thermal simulation calculation model parameters and respective boundary conditions are set as follows:
the coolant was deionized water and the inlet coolant temperature was 298.15K.
The micro-channels were 200 μm high and 20 μm wide.
The manifold microchannel with the countercurrent zone has the same inlet mass flow rate of 0.04-0.08g/s as the conventional manifold microchannel.
The other surfaces are thermally insulated except the heat source surface.
The heat sink substrate material is silicon.
The central heat source area size is 1.62mm×1.62mm, and the heat flux is 150W/cm 2 。
The same viscosity model and solution method were used for both microchannel heat sinks to obtain the results shown in fig. 7, 8, 9, 10. When the mass flow rate of the inlet of the rectangular flat micro-channel radiator is 0.06g/s, the maximum temperature of the cooling surface of the micro-channel radiator is reduced by 4K compared with that of the traditional manifold type micro-channel radiator, the temperature difference of the heating surface is reduced by 9K, and the inlet and outlet pressure is reduced by 38%.
As shown by the numerical simulation results, compared with the traditional manifold type micro-channel radiator, the micro-channel radiator provided by the invention has the advantages of stronger radiating capacity and better cooling surface temperature uniformity in the aspect of solving the problem of heat dissipation with hot spots.
While the foregoing embodiments have been described in detail in connection with the embodiments of the invention, it should be understood that the foregoing embodiments are merely illustrative of the invention and are not intended to limit the invention, and any modifications, additions, substitutions and the like made within the principles of the invention are intended to be included within the scope of the invention.
Claims (10)
1. The manifold type micro-channel radiator with the countercurrent zone is characterized by comprising a micro-channel upper cover plate, a Z-shaped manifold structure, a micro-channel flow dividing plate and a micro-channel heat sink, wherein the Z-shaped manifold structure is provided with an inlet section and an outlet section, the inlet section and the outlet section are both trapezoid areas, the inlet section is communicated with four fluid inlets, and the outlet section is communicated with four fluid outlets; the bottom of the micro-channel heat sink is in direct contact with the surface of the heat source;
in the Z-shaped manifold structure, the bottom channels of the two fluid inlets positioned at two sides of the manifold do not apply heat sources;
the fluid flow directions in adjacent channels are opposite, and the micro-channels flow reversely to be bidirectional.
2. The manifold microchannel heat sink with counter flow area of claim 1, wherein a working medium inlet and a working medium outlet are provided on the microchannel upper cover plate, the working medium inlet is communicated with the inlet flow channel collecting area in the microchannel upper cover plate, and the working medium outlet is communicated with the outlet flow channel collecting area in the microchannel upper cover plate.
3. The manifold microchannel heat sink with a counter flow zone as recited in claim 1 wherein the fluid inlet and fluid outlet on the Z-manifold structure are the same in cross-section.
4. The manifold microchannel heat sink with counter flow area as recited in claim 1 wherein the upper surface of the microchannel heat sink is provided with a plurality of microchannels, directly obtained by etching.
5. The manifold microchannel heat sink with a counter flow area as recited in claim 4 wherein said plurality of microchannels are disposed in a central rectangular portion of the microchannel heat sink, the heat source being in contact with the portion where the microchannels are disposed.
6. The manifold microchannel heat sink with counter flow area as set forth in claim 4, wherein the microchannel flow divider is provided with a plurality of rectangular through slots, and adjacent rows or columns of through slots are staggered; the width of the rectangular through groove is consistent with the channel width of the micro-channel heat sink.
7. The manifold microchannel heat sink with counter flow area of claim 1, wherein the microchannel top cover plate, the Z-shaped manifold structure, the microchannel splitter plate, and the microchannel heat sink are the same in shape and size and are sealingly connected by bonding.
8. The manifold microchannel heat sink with counterflow area of claim 1, wherein the materials of the microchannel heat sink and microchannel manifold are silicon.
9. The manifold microchannel heat sink with counter flow area of claim 1, wherein the microchannel top cover plate and the Z-manifold structure are made of a metallic material that conducts heat well.
10. The manifold microchannel heat sink with a counter flow area of claim 9, wherein the microchannel top cover plate and the Z-manifold structure are each cut from a unitary piece of metallic material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211530818.5A CN115966533B (en) | 2022-12-01 | 2022-12-01 | Manifold type micro-channel radiator with countercurrent region |
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| CN202211530818.5A CN115966533B (en) | 2022-12-01 | 2022-12-01 | Manifold type micro-channel radiator with countercurrent region |
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| CN115966533B true CN115966533B (en) | 2023-09-05 |
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| CN116469856B (en) * | 2023-06-20 | 2024-07-26 | 之江实验室 | Cooling chip with manifold micro-channel structure and cooling method |
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| CN115332204A (en) * | 2022-09-01 | 2022-11-11 | 北京工业大学 | Manifold microchannel radiator with low thermal resistance, low pumping work and good stability |
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- 2022-12-01 CN CN202211530818.5A patent/CN115966533B/en active Active
Patent Citations (6)
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| JP2007278789A (en) * | 2006-04-05 | 2007-10-25 | Aida Eng Ltd | Micro-fluidic chip |
| JP2014053359A (en) * | 2012-09-05 | 2014-03-20 | Hitachi Information & Telecommunication Engineering Ltd | Cooling jacket, and cooling system using the same |
| CN203633055U (en) * | 2014-01-02 | 2014-06-04 | 中国长江三峡集团公司 | Heat sink heat radiation device with novel heat exchange structure and self-adaptive characteristic |
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