CN115966533A - Manifold type micro-channel radiator with counter flow area - Google Patents
Manifold type micro-channel radiator with counter flow area Download PDFInfo
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- CN115966533A CN115966533A CN202211530818.5A CN202211530818A CN115966533A CN 115966533 A CN115966533 A CN 115966533A CN 202211530818 A CN202211530818 A CN 202211530818A CN 115966533 A CN115966533 A CN 115966533A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses a manifold type microchannel radiator with a countercurrent zone, which comprises a microchannel upper cover plate, a Z-shaped manifold structure, a microchannel flow distribution plate and a microchannel heat sink, wherein the Z-shaped manifold structure is provided with an inlet section and an outlet section, the inlet section and the outlet section are both trapezoidal areas, the inlet section is communicated with four fluid inlets, and the outlet section is communicated with four fluid outlets; the bottom of the microchannel heat sink is in direct contact with the surface of the heat source; the microchannel splitter plate adopts a unique design, so that the pure countercurrent flow of fluid in the microchannel is realized, and the uniformity of the temperature of a heat source surface is improved; in the Z-shaped manifold structure, the bottom channels of the first fluid inlet and the fourth fluid inlet which are positioned at two sides of the manifold do not apply heat sources and are used as fluid introduction ports, so that the formation of flow dead zones when cooling liquid in the micro-channels flows in a countercurrent mode can be avoided.
Description
Technical Field
The invention relates to the field of cooling modes of electronic devices, in particular to a manifold type micro-channel radiator with a countercurrent region.
Background
The information in this background section is only for enhancement of understanding of the general background of the invention and is not necessarily to be construed as an admission or any form of suggestion that this information forms the prior art that is already known to a person of ordinary skill in the art.
Electronic equipment plays an indispensable key core and a supporting role in the fields of national economy and military national defense. Nearly 80% of the electrical power dissipated into the electronic device is converted to waste heat, limited by the efficiency of the electronic device itself; if the problems of waste heat dissipation and temperature control generated by electronic components and equipment cannot be timely and effectively solved, the temperature of the electronic components is increased, the working performance of the electronic components is greatly reduced, the working reliability of the components and the equipment is influenced, and even the waste heat dissipation and the temperature control exceed the limit allowable working temperature to burn out and fail. Thermal management of electronic equipment is a core element for developing electronic components and equipment, is one of research hotspots in the international thermal science field for more than ten years, and becomes one of the major challenges of electronic technology development in the 'after mole' era in the future.
The cooling mode of the traditional remote heat dissipation framework can not meet the heat dissipation requirements of novel high-power electronic chips and 3D three-dimensional stacked chips, the development of a cooling technology to a chip near-junction framework is promoted, a cooling medium is directly introduced to the positions near chip nodes in a chip processing micro-channel mode, interface contact thermal resistance and assembly shell thermal resistance are eliminated, heat dissipation generated by the chips can be rapidly and effectively dissipated, and the thermal shock resistance and the heat dissipation capacity of a device are greatly improved. The near-node heat dissipation technology is a necessary trend of the future next-generation high-heat-flux-density chip and 3D stacked chip heat management method and technology in the 'post-Mole' era, and is used for solving the problem of 1000W/cm of future chips 2 Heat of the aboveThe key core technology of the flow density.
The miniaturization of electronic equipment, the improvement of packaging technology and the development and application of nanotechnology lead to that the difference of heat flux density is obvious in different areas in the chip, and form hot spot area, usually, the heat transmission in the chip is always uneven on the heating panel, and the heat flux in the hot spot area is several times of the average heat flux in the background area. The temperature difference caused by the heat flux difference between the hot spot area and the background area can deform the chip, and the service life of the chip is shortened. Optimization of the microchannel structure is of critical importance. In order to solve the problem of local hot spots in the partial area of the heating surface, the temperature uniformity of the heat source surface is necessarily improved on the premise of meeting the pumping power.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a manifold type microchannel radiator with a countercurrent region, which can realize pure countercurrent flow of fluid in a microchannel and improve the temperature uniformity of a heat source surface.
The technical scheme of the invention is as follows:
in a first aspect of the invention, a manifold type microchannel radiator with a countercurrent region is provided, which comprises a microchannel upper cover plate, a Z-shaped manifold structure, a microchannel flow distribution plate and a microchannel heat sink, wherein the Z-shaped manifold structure is provided with an inlet section and an outlet section, the inlet section and the outlet section are both trapezoidal areas, the inlet section is communicated with four fluid inlets, and the outlet section is communicated with four fluid outlets; the bottom of the microchannel heat sink is in direct contact with the heat source surface.
In some embodiments of the present invention, the microchannel upper cover plate is provided with a working medium inlet and a working medium outlet, the working medium inlet is communicated with the inlet flow channel collecting area in the microchannel upper cover plate, and the working medium outlet is communicated with the outlet flow channel collecting area in the microchannel upper cover plate.
In some embodiments of the invention, the cross-section of the fluid inlet and the fluid outlet on the Z-manifold structure is the same.
In some embodiments of the present invention, the upper surface of the microchannel heat sink is provided with a plurality of microchannels, which are directly obtained by etching.
In some embodiments of the invention, the plurality of microchannels are disposed in a central rectangular region of the microchannel heat sink, and the heat source is in contact with the region where the microchannels are disposed.
In some embodiments of the present invention, the microchannel splitter plate is provided with a plurality of rectangular through grooves, and the through grooves in adjacent rows or columns are staggered; the width of the rectangular through groove is consistent with the channel width of the micro-channel heat sink.
In some embodiments of the present invention, the microchannel upper cover plate, the Z-shaped manifold structure, the microchannel flow distribution plate and the microchannel heat sink have the same shape and size, and are hermetically connected by bonding.
In some embodiments of the present invention, the microchannel heat sink and microchannel diverter plate are made of silicon.
In some embodiments of the present invention, the microchannel upper cover plate and the Z-shaped manifold structure are made of a metal material with good thermal conductivity.
In some embodiments of the invention, the microchannel upper cover plate and the Z-manifold structure are both cut from a single piece of metal material.
One or more technical schemes of the invention have the following beneficial effects:
the invention uses silicon as the micro-channel heat sink material, the silicon material has mature etching process, and can process fine and complex structures which can not be manufactured by other materials. The microchannel heat sink is in direct contact with the surface of a heat source, so that a good heat dissipation effect can be achieved, and meanwhile, the microchannel substrate can be protected, and the reliability of the device is ensured. The heat radiator is connected with the micro-channel substrate in a bonding mode, and the sealing performance of the heat radiator is guaranteed.
The microchannel splitter plate adopts a unique design, so that the pure countercurrent flow of fluid in the microchannel is realized, and the uniformity of the temperature of a heating surface is realized; in the Z-shaped manifold structure, the bottom channels of the first fluid inlet and the fourth fluid inlet which are positioned at two sides of the manifold do not apply heat sources and are used as fluid introduction ports, so that the formation of flow dead zones when cooling liquid in the micro-channels flows in a countercurrent mode can be avoided.
The micro-channel on the substrate can be in various forms, so that the existing excellent silicon-based micro-channel can be put into practical use, the practical use of the silicon-based micro-channel is improved, the silicon-based micro-channel has higher temperature uniformity, the highest temperature of a heat source surface is reduced, and the silicon-based micro-channel has certain reference significance for reducing local hot spots of the heat source surface and improving the overall heat exchange capacity.
Drawings
FIG. 1 is an exploded view of a manifold-type microchannel heat sink with a countercurrent zone according to the present invention;
FIG. 2 is a schematic view of a microchannel heat sink of the manifolded microchannel heat sink with a counter flow region of the present invention;
FIG. 3 is a schematic view of a microchannel manifold plate of a manifold-type microchannel heat sink having a counter flow zone in accordance with the present invention;
FIG. 4 is a schematic view of a Z-shaped manifold for a manifold-type microchannel heat sink having a counter-flow zone according to the present invention;
FIG. 5 is a schematic view of the microchannel upper plate of the manifold microchannel heat sink with counterflow regions of the present invention;
FIG. 6 is a schematic diagram of the countercurrent flow of a manifold-type microchannel heat sink having countercurrent zones in accordance with the present invention;
FIG. 7 is a heat source surface temperature cloud plot of a conventional manifold-type microchannel heat sink and the manifold-type microchannel heat sink with a counter-flow zone of the present invention under the same heat source, wherein (a) is the conventional manifold-type microchannel heat sink and (b) is the manifold-type microchannel heat sink with the counter-flow zone of the present invention;
FIG. 8 is a graph of maximum heating surface temperature as a function of inlet mass flow for a conventional manifolded microchannel heat sink and a manifolded microchannel heat sink with a counter flow region of the present invention;
FIG. 9 is a graph of the heating surface temperature difference versus different mass flow rates at the inlet for a conventional manifold-type microchannel heat sink and a manifold-type microchannel heat sink with a counter-flow zone of the present invention;
fig. 10 is a graph of inlet and outlet pressure drop as a function of inlet mass flow for a conventional manifolded microchannel heat sink and a manifolded microchannel heat sink with a counter flow region of the present invention.
In the figure: 1. micro-channel heat sink; 2. a microchannel flow distribution plate; 3. a Z-manifold structure; 31. an inlet section; 311. a first fluid inlet; 312. a second fluid inlet; 313. a third fluid inlet; 314. a fourth fluid inlet; 32. an outlet section; 321. a first fluid outlet; 322. a second fluid outlet; 323. a third fluid outlet; 324. a fourth fluid outlet; 4. a microchannel upper cover plate; 41. a working medium inlet; 42. a working medium outlet; 61. a first countercurrent zone; 62. a second countercurrent zone; 63. a third countercurrent zone.
Detailed Description
The invention is described below with reference to the accompanying drawings.
Example 1
In a typical embodiment of the present invention, a manifold-type microchannel heat sink with a countercurrent region is provided, as shown in fig. 1, including a microchannel upper cover plate 4, a Z-shaped manifold structure 3, a microchannel splitter plate 2, and a microchannel heat sink 1, where the microchannel upper cover plate, the Z-shaped manifold structure, the microchannel splitter plate, and the microchannel heat sink are the same in shape and size and are hermetically connected to each other by bonding; the bottom of the micro-channel heat sink 1 is in direct contact with the surface of a heat source, so that heat exchange on the surface of the heat source is realized.
The structure of microchannel heat sink 1 is as shown in fig. 2, both ends of microchannel heat sink 1 are trapezoidal, the middle is rectangular, a plurality of rectangular grooves are arranged in the rectangular area on the upper surface of microchannel heat sink 1 to serve as microchannels, the microchannel heat sink 1 is made of silicon, the microchannels can be directly obtained through etching, two adjacent microchannels are staggered and arranged, the surface of a heat source is only applied to the dotted line position in fig. 2, the surface of the heat source can be guaranteed to be in heat transfer with cooling liquid, and the heat exchange efficiency is improved.
The structure of the microchannel flow distribution plate 2 is shown in fig. 3, a plurality of rectangular through grooves are arranged on the microchannel flow distribution plate 2, the through grooves in adjacent rows or columns are arranged in a staggered manner, and the rectangular through grooves correspond to the microchannels on the microchannel heat sinks, so that the cooling liquid is distributed; the width of the rectangular through groove is consistent with the width of the micro-channel heat sink; the microchannel flow distribution plate 2 is made of silicon, is processed on a silicon substrate by an etching technology, and is divided by cooling liquid in the microchannel flow distribution plate 2, so that the fluid enters different microchannels (odd number channels and even number channels).
The structure of the Z-shaped manifold structure 3 is shown in fig. 4, the Z-shaped manifold structure is provided with an inlet section 31 and an outlet section 32, the inlet section 31 and the outlet section 32 are both trapezoidal areas, the inlet section 31 is communicated with four fluid inlets, and the four fluid inlets include a first fluid inlet 311, a second fluid inlet 312, a third fluid inlet 313 and a fourth fluid inlet 314; the outlet section 32 communicates with four fluid outlets including a first fluid outlet 321, a second fluid outlet 322, a third fluid outlet 323, a fourth fluid outlet 324. The Z-shaped manifold structure adopts a left-in right-out structure to divide inlet fluid, so that the flow length of the fluid along the direction of the microchannel is reduced, the pressure drop in the microchannel is reduced, the inlet section 31 and the outlet section 32 both adopt trapezoidal areas, the flow of the inlet and the outlet cross section of each manifold structure is consistent, and the flow nonuniformity in the microchannel is reduced; the Z-shaped manifold structure 3 is made of a metal material with good heat conduction and is cut from a single piece of material. The bottom channels of the first fluid inlet 311 and the fourth fluid inlet 314 on both sides of the manifold are not applied with heat source and serve as fluid introduction ports, so that the formation of dead flow zone can be avoided when the cooling liquid in the micro-channel flows in a reverse flow manner.
The structure of the upper cover plate 4 of the microchannel is shown in fig. 5, a working medium inlet 41 and a working medium outlet 42 are arranged on the trapezoidal areas at the two ends of the cover plate 4 of the microchannel, the working medium inlet 41 is communicated with an inlet runner collecting area in the upper cover plate of the microchannel, the working medium outlet 42 is communicated with an outlet runner collecting area in the upper cover plate of the microchannel, the inlet runner collecting area corresponds to the inlet section 31 of the Z-shaped manifold structure 3, and the outlet runner collecting area corresponds to the outlet section 32 of the Z-shaped manifold structure 3; the upper cover plate of the micro-channel is made of a metal material with good heat conduction and is obtained by cutting a whole metal material.
The coolant inside the manifold-type microchannel radiator with the countercurrent region of the embodiment flows in from the working medium inlet 41 of the upper microchannel cover plate 4, passes through the flow channel of the Z-shaped manifold structure 3, reaches the microchannel flow distribution plate 2, and is distributed in the microchannel flow distribution plate 2, so that the fluid enters different microchannels (odd channels and even channels), passes through the upper microchannel cover plate 4 after sufficient heat exchange, and flows out from the working medium outlet 42 of the upper microchannel cover plate.
In the manifold-type microchannel heat sink with counterflow regions of the present embodiment, as shown in fig. 6, the second fluid inlet 312 and the third fluid inlet 313 of the second counterflow region 62 respectively flow into the odd-numbered and even-numbered channels, so that the channels under the second counterflow region 62 form counterflow regions (the fluid flow directions in the bottom adjacent channels are opposite), the first fluid inlet 311 and the second fluid inlet 312 on both sides of the first counterflow region 61 respectively flow into the even-numbered and odd-numbered channels, and flow out at the first fluid outlet 321 and the second fluid outlet 322, so that the counterflow regions are formed in the channels under the first counterflow region 61 (the fluid flow directions in the bottom adjacent channels are opposite), the third fluid inlet 313 and the fourth fluid inlet 314 on both sides of the third counterflow region 63 respectively flow into the even-numbered and odd-numbered channels, and flow out at the third fluid outlet 323 and the fourth fluid outlet 324, so that the counterflow regions are formed in the channels under the third counterflow region 63 (the fluid flow directions in the bottom adjacent channels are opposite). The countercurrent of the micro-channel is bidirectional flow, the flow directions of fluids in adjacent channels are opposite, a high-temperature area of the fluid can be supplemented and cooled by low-temperature fluid in the adjacent channels, local hot spots of a heating surface are easy to reduce, the temperature uniformity of a heat source surface is improved, the thermal resistance of a heat sink is reduced, and meanwhile, a manifold structure is adopted, the flow length of the fluid is shortened, and the total pressure drop is reduced.
In order to verify the superior performance of the microchannel radiator for solving the hot spot problem, the conventional manifold type microchannel heat dissipation is taken as a reference, and ANSYS-Fluent software is used for simulating and comparing two microchannel radiators.
Based on this, the detailed thermal simulation calculation model parameters and the respective boundary conditions are set as follows:
the cooling liquid is deionized water, and the temperature of the inlet cooling liquid is 298.15K.
The microchannel has a height of 200 μm and a width of 20 μm.
The manifolded microchannel with a countercurrent zone has the same inlet mass flow rate of 0.04-0.08g/s as a conventional manifolded microchannel.
The surfaces other than the heat source surface are provided with thermal insulation.
The heat sink substrate material is silicon.
The size of the central heat source area is 1.62mm multiplied by 1.62mm, and the heat flux is 150W/cm 2 。
The same viscosity model and solution method was used for both microchannel heat sinks to obtain the results shown in fig. 7, 8, 9, and 10. When the mass flow rate of the rectangular flat microchannel radiator inlet is 0.06g/s, the maximum temperature of the cooling surface of the microchannel radiator is reduced by 4K compared with the traditional manifold type microchannel radiator, the temperature difference of the heating surface is reduced by 9K, and the pressure drop of the inlet and the outlet is reduced by 38 percent.
The numerical simulation result shows that compared with the traditional manifold-type microchannel radiator, the microchannel radiator provided by the invention has the advantages of stronger heat dissipation capability in the aspect of solving the problem of hot spots and better temperature uniformity of the cooling surface.
The technical solutions of the present invention have been described in detail with reference to the above embodiments, it should be understood that the above embodiments are only specific examples of the present invention and should not be construed as limiting the present invention, and any modifications, additions or similar substitutions made within the scope of the principles of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A manifold type microchannel radiator with a countercurrent zone is characterized by comprising a microchannel upper cover plate, a Z-shaped manifold structure, a microchannel flow distribution plate and a microchannel heat sink, wherein the Z-shaped manifold structure is provided with an inlet section and an outlet section, the inlet section and the outlet section are both trapezoidal areas, the inlet section is communicated with four fluid inlets, and the outlet section is communicated with four fluid outlets; the bottom of the microchannel heat sink is in direct contact with the heat source surface.
2. The manifolded microchannel heat sink with a countercurrent zone as claimed in claim 1, wherein said microchannel top cover plate is provided with a working medium inlet and a working medium outlet, said working medium inlet being in communication with an inlet channel collection region in said microchannel top cover plate, and said working medium outlet being in communication with an outlet channel collection region in said microchannel top cover plate.
3. The manifolded microchannel heat sink with a countercurrent zone of claim 1, wherein the fluid inlet and fluid outlet on the Z-shaped manifold structure are of the same cross-section.
4. The manifolded microchannel heat sink with a countercurrent zone of claim 1, wherein the upper surface of the microchannel heat sink is provided with a plurality of microchannels directly obtained by etching.
5. The manifolded microchannel heat sink with countercurrent zones according to claim 4, wherein the plurality of microchannels are disposed in the middle rectangular region of the microchannel heat sink, the heat source being in contact with the region where the microchannels are disposed.
6. The manifold microchannel heat sink having counterflow zones of claim 4, wherein the microchannel manifold has a plurality of rectangular through slots, adjacent rows or columns of through slots being staggered; the width of the rectangular through groove is consistent with the channel width of the micro-channel heat sink.
7. The manifolded microchannel heat sink with countercurrent zones according to claim 1, wherein the microchannel top plate, the Z-shaped manifold structure, the microchannel manifold plate, and the microchannel heat sink are of the same shape and size and are sealingly bonded together.
8. The manifold microchannel heat sink having a countercurrent zone of claim 1, wherein the microchannel heat sink and microchannel manifold are made of silicon.
9. The manifold microchannel heat sink having a countercurrent zone of claim 1, wherein the microchannel upper plate and the Z-manifold structure are made of a metallic material that conducts heat well.
10. The manifolded microchannel heat sink with countercurrent zones according to claim 9, wherein the microchannel top plate and the Z-shaped manifold structure are cut from a single piece of metal material.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116469856A (en) * | 2023-06-20 | 2023-07-21 | 之江实验室 | Cooling chip with manifold micro-channel structure and cooling method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4705504B2 (en) * | 2006-04-05 | 2011-06-22 | アイダエンジニアリング株式会社 | Microfluidic chip |
| JP2014053359A (en) * | 2012-09-05 | 2014-03-20 | Hitachi Information & Telecommunication Engineering Ltd | Cooling jacket, and cooling system using the same |
| CN203633055U (en) * | 2014-01-02 | 2014-06-04 | 中国长江三峡集团公司 | Heat sink heat radiation device with novel heat exchange structure and self-adaptive characteristic |
| JP6951786B2 (en) * | 2017-08-29 | 2021-10-20 | 株式会社Ｗｅｌｃｏｎ | heat sink |
| CN110926111B (en) * | 2019-11-13 | 2021-08-17 | 天津大学 | Moving bed drying method and device for materials |
| CN115332204A (en) * | 2022-09-01 | 2022-11-11 | 北京工业大学 | Manifold microchannel radiator with low thermal resistance, low pumping work and good stability |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116469856A (en) * | 2023-06-20 | 2023-07-21 | 之江实验室 | Cooling chip with manifold micro-channel structure and cooling method |
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