CN115966533A - A Manifold Microchannel Radiator with Counterflow Zone - Google Patents

Abstract

The invention discloses a manifold type microchannel radiator with a countercurrent zone, which comprises a microchannel upper cover plate, a Z-shaped manifold structure, a microchannel flow distribution plate and a microchannel heat sink, wherein the Z-shaped manifold structure is provided with an inlet section and an outlet section, the inlet section and the outlet section are both trapezoidal areas, the inlet section is communicated with four fluid inlets, and the outlet section is communicated with four fluid outlets; the bottom of the microchannel heat sink is in direct contact with the surface of the heat source; the microchannel splitter plate adopts a unique design, so that the pure countercurrent flow of fluid in the microchannel is realized, and the uniformity of the temperature of a heat source surface is improved; in the Z-shaped manifold structure, the bottom channels of the first fluid inlet and the fourth fluid inlet which are positioned at two sides of the manifold do not apply heat sources and are used as fluid introduction ports, so that the formation of flow dead zones when cooling liquid in the micro-channels flows in a countercurrent mode can be avoided.

Description

A Manifold Microchannel Radiator with Counterflow Zone

technical field

The invention relates to the field of electronic device cooling methods, in particular to a manifold microchannel radiator with a counterflow area.

Background technique

The information disclosed in this background section is only intended to increase the understanding of the general background of the present invention, and is not necessarily taken as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to those skilled in the art.

Electronic equipment plays an indispensable key core and supporting role in the fields of national economy and military defense. Limited by the efficiency of electronic devices, nearly 80% of the electrical power dissipated into electronic devices will be converted into waste heat; if the waste heat dissipation and temperature control problems generated by electronic components and equipment cannot be solved in a timely and effective manner, the temperature of electronic devices will rise If the temperature is too high, the performance of electronic devices will be greatly reduced, which will affect the reliability of devices and equipment, and even exceed the limit allowable operating temperature and cause burnout and failure. Thermal management of electronic equipment is a core element in the development of electronic components and equipment. It is also one of the research hotspots in the field of international thermal science for more than a decade, and it will become one of the major challenges for the development of electronic technology in the future "post-Moore" era.

The cooling method of the traditional remote heat dissipation architecture can no longer meet the heat dissipation requirements of new high-power electronic chips and 3D three-dimensional stacked chips, thus promoting the development of cooling technology to the near-junction structure of the chip. By processing microchannels on the chip, the cooling medium is directly introduced In the vicinity of the chip junction, the interface contact thermal resistance and the thermal resistance of the component shell are eliminated, which can quickly and effectively dissipate the heat dissipation generated by the chip, and greatly improve the thermal shock resistance and heat dissipation capability of the device. Near-junction heat dissipation technology is an inevitable trend of thermal management methods and technologies for next-generation high heat flux chips and 3D stacked chips adapted to the "post-Moore" era, and is the key core technology to solve the heat flux density of future chips above 1000W/cm ² .

The miniaturization of electronic equipment, the improvement of packaging technology, and the development and application of nanotechnology lead to significant differences in heat flux in different areas of the chip, forming hot spots. Generally speaking, the heat transfer from the inside of the chip to the heat sink is always uneven. The heat flux in the area is several times the average heat flux in the background area. The difference in temperature caused by the difference in heat flux between the hot spot area and the background area will deform the chip and reduce the service life of the chip. Optimization of the microchannel structure is crucial. In order to solve the problem of local hot spots in some areas of the heating surface, it is necessary to improve the temperature uniformity of the heat source surface under the premise of satisfying the pump power.

Contents of the invention

Aiming at the problems existing in the prior art, the present invention provides a manifold microchannel radiator with a counterflow zone, which can realize the pure countercurrent flow of the fluid in the microchannel and improve the temperature uniformity of the heat source surface.

Technical scheme of the present invention is as follows:

In the first aspect of the present invention, there is provided a manifold microchannel radiator with a counterflow zone, including a microchannel upper cover plate, a Z-shaped manifold structure, a microchannel splitter plate and a microchannel heat sink, the Z The type manifold structure is provided with an inlet section and an outlet section, the inlet section and the outlet section are trapezoidal areas, the inlet section communicates with four fluid inlets, and the outlet section communicates with four fluid outlets; The bottom of the microchannel heat sink is in direct contact with the surface of the heat source.

In some embodiments of the present invention, a working fluid inlet and a working fluid outlet are arranged on the upper cover of the microchannel, and the inlet of the working fluid communicates with the inlet channel collection area in the upper cover of the microchannel, and the working fluid The outlet communicates with the outlet channel collection area in the upper cover plate of the microchannel.

In some embodiments of the present invention, the section of the fluid inlet and the fluid outlet on the Z-shaped manifold structure are the same.

In some embodiments of the present invention, the upper surface of the microchannel heat sink is provided with a plurality of microchannels, which are directly obtained by etching.

In some embodiments of the present invention, the plurality of microchannels are arranged in the middle rectangular part of the microchannel heat sink, and the heat source is in contact with the part where the microchannels are arranged.

In some embodiments of the present invention, a plurality of rectangular through-slots are arranged on the microchannel distributor plate, and the through-slots of adjacent rows or columns are staggered; Same width.

In some embodiments of the present invention, the microchannel upper cover plate, the Z-shaped manifold structure, the microchannel splitter plate and the microchannel heat sink have the same shape and size, and are sealed and connected by bonding.

In some embodiments of the present invention, the material of the microchannel heat sink and the microchannel splitter plate is silicon.

In some embodiments of the present invention, the upper cover plate of the microchannel and the Z-shaped manifold structure are made of metal materials with good thermal conductivity.

In some embodiments of the present invention, both the upper cover plate of the microchannel and the Z-shaped manifold structure are cut from a single piece of metal material.

One or more technical solutions of the present invention have the following beneficial effects:

The invention uses silicon as the microchannel heat sink material, and the etching technology of the silicon material is mature, so that fine and complex structures that cannot be manufactured by other materials can be processed. The direct contact between the microchannel heat sink and the surface of the heat source can achieve a good heat dissipation effect, and can also protect the microchannel substrate to ensure the reliability of the device. It is connected with the micro-channel substrate by bonding to ensure the sealing of the heat sink.

The microchannel distribution plate of the present invention adopts a unique design to realize the pure countercurrent flow of the fluid in the microchannel and realize the uniformity of the temperature of the heating surface; in the Z-shaped manifold structure, the first fluid inlet and the fourth fluid inlet located on both sides of the manifold The bottom channel of the inlet does not apply a heat source, and acts as a fluid introduction port, which can avoid the formation of a flow dead zone when the cooling liquid in the microchannel flows countercurrently.

The microchannels on the substrate of the present invention can be in various forms, which can put existing excellent silicon-based microchannels into practical use, improve the actual use of silicon-based microchannels, have higher temperature uniformity, and heat source surface The maximum temperature has been reduced, which has certain reference significance for reducing local hot spots on the heat source surface and improving the overall heat transfer capacity.

Description of drawings

Fig. 1 is the exploded schematic view of the structure of the manifold type microchannel radiator with the counterflow zone of the present invention;

Fig. 2 is the microchannel heat sink schematic diagram of the manifold type microchannel heat sink with counterflow zone of the present invention;

Fig. 3 is the schematic diagram of the microchannel splitter plate of the manifold type microchannel radiator with counterflow zone of the present invention;

Fig. 4 is the Z-type manifold structure schematic diagram that has the manifold type microchannel radiator of counterflow zone of the present invention;

Fig. 5 is the microchannel upper cover schematic diagram that has the manifold type microchannel radiator of counterflow zone of the present invention;

Fig. 6 is the countercurrent flow schematic diagram of the manifold type microchannel radiator with counterflow zone of the present invention;

Fig. 7 is the heat source surface temperature cloud map of traditional manifold microchannel radiator and the manifold microchannel radiator with counterflow zone of the present invention under the same heat source, wherein (a) is traditional manifold microchannel radiator, (b ) is the manifold type micro-channel heat sink that has counterflow zone of the present invention;

Fig. 8 is the curve diagram of the maximum temperature of the heating surface of the traditional manifold microchannel radiator and the manifold microchannel radiator with counterflow zone of the present invention along with the different mass flow rates of the inlet;

Fig. 9 is the heating surface temperature difference of the conventional manifold microchannel radiator and the manifold microchannel radiator with the counterflow zone of the present invention along with the variation curves of different mass flow rates of the inlet;

Fig. 10 is a graph showing the pressure drop at the inlet and outlet of the traditional manifold microchannel radiator and the manifold microchannel radiator with counterflow zone of the present invention as a function of different mass flow rates at the inlet.

In the figure: 1. Microchannel heat sink; 2. Microchannel splitter plate; 3. Z-shaped manifold structure; 31. Inlet section; 311. First fluid inlet; 312. Second fluid inlet; 313. Third fluid inlet 314, the fourth fluid inlet; 32, the outlet section; 321, the first fluid outlet; 322, the second fluid outlet; 323, the third fluid outlet; 324, the fourth fluid outlet; 4, the microchannel upper cover plate; 41 . Working medium inlet; 42. Working medium outlet; 61. First countercurrent area; 62. Second countercurrent area; 63. Third countercurrent area.

Detailed ways

The present invention is described below in conjunction with accompanying drawing.

Example 1

In a typical implementation of the present invention, a manifold microchannel radiator with a counterflow area is proposed, as shown in Figure 1, including a microchannel upper cover plate 4, a Z-shaped manifold structure 3, a microchannel shunt The plate 2 and the microchannel heat sink 1, the microchannel upper cover plate, the Z-shaped manifold structure, the microchannel splitter plate and the microchannel heat sink have the same shape and size, and are sealed and connected to each other by bonding; the microchannel The bottom of the heat sink 1 is in direct contact with the surface of the heat source to realize heat exchange on the surface of the heat source.

The structure of the microchannel heat sink 1 is shown in Figure 2. The two ends of the microchannel heat sink 1 are trapezoidal, and the middle is rectangular. A plurality of rectangular grooves are set in the rectangular area on the upper surface of the microchannel heat sink 1 as microchannels. The material used for the microchannel heat sink 1 is silicon, and the microchannel can be obtained directly by etching. The adjacent two microchannels are arranged staggered from each other, and the surface of the heat source is only applied on the dotted line in Fig. Conduct heat transfer and improve heat exchange efficiency.

The structure of the microchannel splitter plate 2 is shown in Figure 3. The microchannel splitter plate 2 is provided with a plurality of rectangular through grooves, and the through grooves of adjacent rows or columns are arranged alternately. The rectangular through grooves and the microchannels on the microchannel heat sink Corresponding to the channel, the cooling liquid is divided; the width of the rectangular channel is consistent with the channel width of the micro-channel heat sink; the material of the micro-channel splitter plate 2 is silicon, and the cooling liquid The flow is divided in the microchannel splitter plate 2, so that the fluid enters different microchannels (odd-numbered channels and even-numbered channels).

The structure of Z-type manifold structure 3 is as shown in Figure 4, and described Z-type manifold structure is provided with inlet section 31 and outlet section 32, and described inlet section 31 and outlet section 32 are trapezoidal regions, and described inlet section 31 It communicates with four fluid inlets, and the four fluid inlets include a first fluid inlet 311, a second fluid inlet 312, a third fluid inlet 313, and a fourth fluid inlet 314; the outlet section 32 communicates with four fluid outlets, The four fluid outlets include a first fluid outlet 321 , a second fluid outlet 322 , a third fluid outlet 323 , and a fourth fluid outlet 324 . The Z-shaped manifold structure adopts a left-in and right-out structure, which divides the inlet fluid, reduces the flow length of the fluid along the direction of the microchannel, and reduces the pressure drop in the microchannel. Both the inlet section 31 and the outlet section 32 adopt a trapezoidal area, so that The cross-sectional flow at the inlet and outlet of each manifold structure is consistent, thereby reducing flow inhomogeneity in the microchannel; the Z-shaped manifold structure 3 is made of a metal material with good thermal conductivity, and is obtained by cutting a whole piece of material. The bottom passages of the first fluid inlet 311 and the fourth fluid inlet 314 located on both sides of the manifold do not apply a heat source, and serve as fluid inlets, which can avoid the formation of flow dead zones when the cooling liquid in the microchannel flows countercurrently.

The structure of microchannel upper cover plate 4 is as shown in Figure 5, on the trapezoidal region of microchannel cover plate 4 two ends, working fluid inlet 41 and working medium outlet 42 are set, and working fluid inlet 41 is connected with the inlet flow path in microchannel upper cover plate. The converging area is connected, and the working medium outlet 42 is connected with the outlet channel converging area in the upper cover plate of the microchannel, and the inlet channel converging area is corresponding to the inlet section 31 of the Z-shaped manifold structure 3, and the outlet channel converging area is connected to the The outlet section 32 of the Z-shaped manifold structure 3 is corresponding; the upper cover plate of the microchannel is made of a metal material with good thermal conductivity, which is obtained by cutting a whole piece of metal material.

The flow of coolant inside the manifold microchannel radiator with the counterflow area of the present embodiment is that the coolant flows in from the working medium inlet 41 of the upper cover plate 4 of the microchannel, passes through the flow channel of the Z-shaped manifold structure 3, and reaches The microchannel splitter plate 2, the coolant is divided in the microchannel splitter plate 2, so that the fluid enters different microchannels (odd-numbered channels and even-numbered channels). The working medium outlet 42 of the plate flows out.

The countercurrent flow of the manifold microchannel radiator with the counterflow area of the present embodiment is shown in Figure 6, the second fluid inlet 312 and the third fluid inlet 313 of the second counterflow area 62 flow into odd and even channels respectively, so that the second The passage below the counterflow area 62 forms a counterflow area (the direction of fluid flow in adjacent channels at the bottom is opposite), and the first fluid inlet 311 and the second fluid inlet 312 on both sides of the first counterflow area 61 flow into the even-numbered and odd-numbered channels respectively. 321, the second fluid outlet 322 flows out, so that the passage below the first counterflow area 61 forms a counterflow area (the flow direction of the fluid in the adjacent channel at the bottom is opposite), and the third fluid inlet 313 and the fourth fluid inlet 313 on both sides of the third counterflow area 63 The fluid inlet 314 flows into the even-numbered and odd-numbered channels respectively, and flows out at the third fluid outlet 323 and the fourth fluid outlet 324, so that the channel below the third counter-flow area 63 forms a counter-flow area (fluid flow directions in adjacent channels at the bottom are opposite). The reverse flow of the microchannel is a two-way flow, and the flow direction of the fluid in the adjacent channel is opposite. The high-temperature area of the fluid will be supplemented and cooled by the low-temperature fluid in the adjacent channel, which is easy to reduce the local hot spot on the heating surface, improve the temperature uniformity of the heat source surface, and reduce the heat sink. Thermal resistance, while also using a manifold structure to shorten the fluid flow length and reduce the total pressure drop.

In order to verify the superior performance of the microchannel radiator provided by the present invention in solving the hot spot problem, the traditional manifold microchannel radiator is used as a reference to simulate and compare the two microchannel radiators using ANSYS-Fluent software.

Based on this, the detailed thermal simulation calculation model parameters and various boundary conditions are set as follows:

The coolant is deionized water, and the inlet coolant temperature is 298.15K.

The microchannels are 200 μm high and 20 μm wide.

The manifold microchannel with counterflow zone has the same inlet mass flow rate of 0.04-0.08g/s as the traditional manifold microchannel.

Except for the heat source surface, other surfaces are set as thermal insulation.

The heat sink substrate material is silicon.

The size of the central heat source area is 1.62mm×1.62mm, and the heat flux is 150W/cm ² .

The results shown in Figures 7, 8, 9, and 10 are obtained by using the same viscous model and solution method for the two microchannel radiators. When the mass flow rate at the inlet of the rectangular flat microchannel radiator is 0.06g/s, the maximum temperature of the cooling surface of the microchannel radiator of the present invention is 4K lower than that of the traditional manifold microchannel radiator, the temperature difference of the heating surface is 9K lower, and the pressure drop between the inlet and outlet down 38%.

It can be seen from the numerical simulation results that, compared with the traditional manifold microchannel radiator, the microchannel radiator proposed by the present invention has the advantages of stronger heat dissipation capability and better cooling surface temperature uniformity in solving heat dissipation problems with hot spots.

The embodiments described above have described the technical solutions of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention, and are not intended to limit the present invention. All done within the principle scope of the present invention Any modification, supplement or substitution in a similar manner shall be included within the protection scope of the present invention.

Claims (10)

1. A manifold type microchannel radiator with a countercurrent zone is characterized by comprising a microchannel upper cover plate, a Z-shaped manifold structure, a microchannel flow distribution plate and a microchannel heat sink, wherein the Z-shaped manifold structure is provided with an inlet section and an outlet section, the inlet section and the outlet section are both trapezoidal areas, the inlet section is communicated with four fluid inlets, and the outlet section is communicated with four fluid outlets; the bottom of the microchannel heat sink is in direct contact with the heat source surface.

2. The manifolded microchannel heat sink with a countercurrent zone as claimed in claim 1, wherein said microchannel top cover plate is provided with a working medium inlet and a working medium outlet, said working medium inlet being in communication with an inlet channel collection region in said microchannel top cover plate, and said working medium outlet being in communication with an outlet channel collection region in said microchannel top cover plate.

3. The manifolded microchannel heat sink with a countercurrent zone of claim 1, wherein the fluid inlet and fluid outlet on the Z-shaped manifold structure are of the same cross-section.

4. The manifolded microchannel heat sink with a countercurrent zone of claim 1, wherein the upper surface of the microchannel heat sink is provided with a plurality of microchannels directly obtained by etching.

5. The manifolded microchannel heat sink with countercurrent zones according to claim 4, wherein the plurality of microchannels are disposed in the middle rectangular region of the microchannel heat sink, the heat source being in contact with the region where the microchannels are disposed.

6. The manifold microchannel heat sink having counterflow zones of claim 4, wherein the microchannel manifold has a plurality of rectangular through slots, adjacent rows or columns of through slots being staggered; the width of the rectangular through groove is consistent with the channel width of the micro-channel heat sink.

7. The manifolded microchannel heat sink with countercurrent zones according to claim 1, wherein the microchannel top plate, the Z-shaped manifold structure, the microchannel manifold plate, and the microchannel heat sink are of the same shape and size and are sealingly bonded together.

8. The manifold microchannel heat sink having a countercurrent zone of claim 1, wherein the microchannel heat sink and microchannel manifold are made of silicon.

9. The manifold microchannel heat sink having a countercurrent zone of claim 1, wherein the microchannel upper plate and the Z-manifold structure are made of a metallic material that conducts heat well.

10. The manifolded microchannel heat sink with countercurrent zones according to claim 9, wherein the microchannel top plate and the Z-shaped manifold structure are cut from a single piece of metal material.

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