CN219873497U - Silicon carbide chip module and heat radiation structure thereof - Google Patents
Silicon carbide chip module and heat radiation structure thereof Download PDFInfo
- Publication number
- CN219873497U CN219873497U CN202321022404.1U CN202321022404U CN219873497U CN 219873497 U CN219873497 U CN 219873497U CN 202321022404 U CN202321022404 U CN 202321022404U CN 219873497 U CN219873497 U CN 219873497U
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- Prior art keywords
- heat dissipation
- inlet channel
- channel
- water inlet
- heat
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- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 28
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 230000005855 radiation Effects 0.000 title claims description 9
- 230000017525 heat dissipation Effects 0.000 claims abstract description 84
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000000919 ceramic Substances 0.000 claims description 13
- 239000002826 coolant Substances 0.000 abstract description 16
- 238000001816 cooling Methods 0.000 abstract description 14
- 239000000110 cooling liquid Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of chip heat dissipation, in particular to a silicon carbide chip module and a heat dissipation structure thereof, which comprises a shell, a water inlet channel, a water drain channel and a heat dissipation bottom plate, wherein the heat dissipation bottom plate comprises a base plate and heat dissipation columns, the base plate is arranged on the shell in a covering mode, gaps are arranged between the heat dissipation columns, the water inlet channel and the water drain channel are arranged in the shell, the side walls of the water inlet channel and the water drain channel are communicated with the base plate, one ends of the water inlet channel and the water drain channel are arranged in the shell, the other ends of the water inlet channel and the water drain channel extend out of the shell, and the outer edge of one side, close to the water inlet channel, of the heat dissipation columns is arc-shaped. When the cooling device is used, a cooling medium is input from the water inlet channel, enters the gap between the substrate and the shell, is blocked by the heat dissipation column in the flowing process, flows in a rotating mode along the arc-shaped outer surface of the heat dissipation column to form a plurality of eddies, so that cooling liquid is stirred, the cooling liquid which is fully flowing can be in contact with the heat dissipation bottom plate, heat is taken away from the heat dissipation column, and the cooling efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of chip heat dissipation, in particular to a silicon carbide chip module and a heat dissipation structure thereof.
Background
The highest working junction temperature of the silicon carbide chip can reach more than 500 ℃ theoretically, and the highest junction temperature of the traditional silicon-based chip does not exceed 175 ℃. In addition, the high-temperature operation of the silicon carbide chip also means that the whole thermal cycle range born by the device is larger, the temperature cycle range is usually more than 250 ℃, and the temperature cycle range of the traditional silicon-based device is not more than 200 ℃ at maximum. Therefore, in the process of smashing silicon carbide chips for use, a heat dissipation structure needs to be added to dissipate heat of the silicon carbide chips so as to ensure safe and reliable operation of the chips, and in the existing direct water cooling mode, due to poor flowability of cooling media, poor heat dissipation effect is caused, and failure is caused by poor heat dissipation effect and uneven heat dissipation, which causes overhigh temperature of individual chips.
Disclosure of Invention
Based on the above, the utility model provides a silicon carbide chip module with higher heat dissipation effect and a heat dissipation structure thereof.
The technical scheme of the utility model is as follows: the utility model provides a carborundum chip module and heat radiation structure thereof, includes casing, inlet channel, drainage channel and heat radiation bottom plate, the heat radiation bottom plate includes base plate and a plurality of heat dissipation post, the base plate lid is located the casing, a plurality of the heat dissipation post shop in the base plate is close to the one side of casing, and a plurality of be equipped with the clearance between the heat dissipation post, the inlet channel the drainage channel is all located in the casing, the inlet channel the lateral wall of drainage channel with the base plate intercommunication, the inlet channel the one end of drainage channel is located in the casing, the other end is followed the casing stretches out, the heat dissipation post is close to the outward flange of inlet channel one side is the arc.
Optionally, the radial cross section of the heat dissipation column is circular, and a plurality of heat dissipation columns are arranged along the same direction.
Optionally, the radial cross section of the heat dissipation column is oval, and a plurality of heat dissipation columns are arranged along the same direction, and the direction of the long axis of the heat dissipation column is the same as the extending direction of the water inlet channel.
Optionally, the ratio of the long axis to the short axis of the radial section of the heat dissipation column is X, and X is more than or equal to 1.2 and less than or equal to 2.0.
Optionally, the distance between the long axes of two adjacent heat dissipation columns is D, and D is more than or equal to 2mm and less than or equal to 3mm.
Optionally, the extension length of the heat dissipation column from the plane of the substrate is H, and D is more than or equal to 3mm and less than or equal to 6mm.
Optionally, the water inlet channel and the water drain channel are arranged in parallel, and the extending directions of the water inlet channel and the water drain channel are opposite.
Another object of the present utility model is to provide a silicon carbide chip module, which includes a silicon carbide chip, a copper-clad ceramic substrate and the heat dissipation structure, wherein the copper-clad ceramic substrate is welded with the housing, the heat dissipation base plate is disposed between the copper-clad ceramic substrate and the housing, and the silicon carbide chip is adhered to a surface of the copper-clad ceramic substrate, which is far away from the housing.
Compared with the prior art, the embodiment of the utility model has the following beneficial effects:
when the silicon carbide chip module and the radiating structure thereof are used, a cooling medium is input from the water inlet channel, enters the gap between the substrate and the shell, is blocked by the radiating columns in the flowing process, flows along the arc-shaped outer surfaces of the radiating columns in a rotating mode to form a plurality of eddies, so that cooling liquid is stirred, the fully flowing cooling liquid enables the cooling liquid originally positioned at the lower layer to be in contact with the radiating bottom plate, and heat is taken away from the radiating columns, so that the cooling efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of a silicon carbide chip module and a heat dissipation structure thereof according to an embodiment of the utility model.
Fig. 2 is a top view of a silicon carbide chip module and a heat dissipation structure thereof according to an embodiment of the utility model.
FIG. 3 is a cross-sectional view of section A-A of FIG. 2, in accordance with an embodiment of the present utility model.
Fig. 4 is a left side view of a silicon carbide chip module and a heat dissipation structure thereof according to an embodiment of the utility model.
Fig. 5 is a cross-sectional view of section B-B of fig. 4, in accordance with an embodiment of the present utility model.
Reference numerals illustrate:
100. a silicon carbide chip module, the silicon carbide chip module,
1. the shell body is provided with a plurality of grooves,
2. a water inlet channel is arranged on the water inlet channel,
3. the water is discharged from the water discharge channel,
4. a heat dissipation base plate 41, a base plate 42, a heat dissipation post,
5. the silicon carbide chip is formed from a silicon carbide substrate,
6. a copper-clad ceramic substrate,
D. distance between long axes of two adjacent heat dissipation columns.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like are used herein to describe various information, but such information should not be limited to these terms, which are merely used to distinguish one type of information from another. For example, a "first" message may also be referred to as a "second" message, and similarly, a "second" message may also be referred to as a "first" message, without departing from the scope of the utility model.
Referring to fig. 1 to 5, the present embodiment provides a heat dissipation structure, including a housing 1, a water inlet channel 2, a water drain channel 3 and a heat dissipation bottom plate 4, the heat dissipation bottom plate 4 includes a substrate 41 and a plurality of heat dissipation columns 42, the substrate 41 is covered and is located the housing 1, a plurality of heat dissipation columns 42 are laid in the one side that the substrate 41 is close to the housing 1, and be equipped with the clearance between a plurality of heat dissipation columns 42, in the housing 1 is all located to water inlet channel 2, water drain channel 3's lateral wall and substrate 41 intercommunication, in housing 1 is located to water inlet channel 2, water drain channel 3's one end, the other end stretches out from housing 1, the outward flange that heat dissipation column 42 is close to water inlet channel 2 one side is the arc. When the cooling device is used, a cooling medium is input from the water inlet channel 2, enters a gap between the substrate 41 and the shell 1, is blocked by the heat dissipation column 42 in the flowing process, flows along the arc-shaped outer surface of the heat dissipation column 42 in a rotating mode to form a plurality of eddies, so that cooling liquid is stirred, the cooling liquid which is fully flowing can be in contact with the heat dissipation bottom plate 4, and heat is taken away from the heat dissipation column 42, so that the cooling efficiency is improved.
Preferably, referring to fig. 1 to 5, in the present embodiment, the radial cross section of the heat dissipation columns 42 is elliptical, and the plurality of heat dissipation columns 42 are disposed along the same direction, and the direction of the long axis of the heat dissipation column 42 is the same as the extending direction of the water inlet channel 2. Specifically, in the present embodiment, the ratio of the major axis to the minor axis of the radial cross section of the heat dissipation columns 42 is X, X is 1.2.ltoreq.2.0, the distance between the major axes of two adjacent heat dissipation columns 42 is D, D is 2 mm.ltoreq.3 mm, the extension length of the heat dissipation columns 42 from the plane of the substrate 41 is H, and D is 3 mm.ltoreq.6 mm. When the cooling medium enters from the cold water channel, the cooling medium flows in the direction of the long axis of the heat dissipation column 42, the contact area of the cooling medium and the heat dissipation column 42 is increased under the action of the long axis of the heat dissipation column 42, the cooling efficiency is improved, in addition, when the cooling medium flows into the gaps between the heat dissipation columns 42 due to the oval heat dissipation columns 42 with the cross sections, the cooling medium transversely flows in the unit flow distance along the extending direction of the water inlet channel 2, the resistance coefficient of the bypass flow is reduced, the vortex shedding condition in the flowing process of the cooling medium is improved, and the cooling efficiency is ensured.
Preferably, referring to fig. 1 to 5, in the present embodiment, the water inlet channel 2 and the water outlet channel 3 are arranged in parallel, the extending directions of the water inlet channel 2 and the water outlet channel 3 are opposite, the cooling medium enters from one side of the casing 1 provided with the water inlet channel 2, and flows out from the other side of the casing 1 provided with the water outlet channel 3, so that the contact range between the cooling medium and the heat dissipation bottom plate 4 can be improved as much as possible, and the cooling efficiency is ensured.
Embodiment two:
preferably, in the present embodiment, the radial cross section of the heat dissipation columns 42 is circular, and the heat dissipation columns 42 are disposed along the same direction. Compared with a structure with a circular cross section and an oval cross section, the structure with the circular cross section has lower processing difficulty and lower assembly time, and can reduce production cost.
The embodiment also provides a silicon carbide chip 5 module 100, which comprises a silicon carbide chip 5, a copper-clad ceramic substrate 6 and the heat dissipation structure, wherein the copper-clad ceramic substrate 6 is welded with the shell 1, the heat dissipation bottom plate 4 is arranged between the copper-clad ceramic substrate 6 and the shell 1, and the silicon carbide chip 5 is adhered to one surface of the copper-clad ceramic substrate 6 far away from the shell 1.
The silicon carbide chip module and the heat radiation structure thereof have the following beneficial effects:
1. when the cooling device is used, a cooling medium is input from the water inlet channel 2, enters a gap between the substrate 41 and the shell 1, is blocked by the heat dissipation column 42 in the flowing process, flows along the arc-shaped outer surface of the heat dissipation column 42 in a rotating mode to form a plurality of eddies, so that cooling liquid is stirred, the cooling liquid which is fully flowing can be in contact with the heat dissipation bottom plate 4, and heat is taken away from the heat dissipation column 42, so that the cooling efficiency is improved.
2. When the radial cross section of the heat dissipation column 42 is elliptical, the cooling medium flows in the direction of the long axis of the heat dissipation column 42 when entering from the cold water channel, the contact area of the cooling medium and the heat dissipation column 42 is increased under the action of the long axis of the heat dissipation column 42, and the cooling efficiency is improved.
3. The cooling medium enters from one side of the shell 1 provided with the water inlet channel 2 and flows out from the other side of the shell 1 provided with the water discharge channel 3, so that the contact range of the cooling medium and the radiating bottom plate 4 can be improved as much as possible, and the cooling efficiency is ensured.
While the foregoing is directed to the preferred embodiments of the present utility model, it should be noted that modifications and variations could be made by those skilled in the art without departing from the principles of the present utility model, and such modifications and variations are to be regarded as being within the scope of the utility model.
Claims (8)
1. The utility model provides a heat radiation structure, its characterized in that includes casing, inlet channel, drainage channel and heat radiation bottom plate, the heat radiation bottom plate includes base plate and a plurality of heat dissipation post, the base plate lid is located the casing, a plurality of the heat dissipation post shop in the base plate is close to the one side of casing, and a plurality of be equipped with the clearance between the heat dissipation post, the inlet channel the drainage channel is all located in the casing, the inlet channel the lateral wall of drainage channel with the base plate intercommunication, the inlet channel the one end of drainage channel is located in the casing, the other end is followed the casing stretches out, the heat dissipation post is close to the outward flange of inlet channel one side is the arc.
2. The heat dissipating structure of claim 1, wherein the radial cross section of the heat dissipating studs is circular, and a plurality of the heat dissipating studs are disposed in the same direction.
3. The heat dissipation structure according to claim 1, wherein the radial cross section of the heat dissipation column is elliptical, and the plurality of heat dissipation columns are arranged along the same direction, and the direction of the long axis of the heat dissipation column is the same as the extending direction of the water inlet channel.
4. The heat dissipating structure of claim 3 wherein the ratio of the major axis to the minor axis of the radial cross section of said heat dissipating post is X, 1.2.ltoreq.X.ltoreq.2.0.
5. A heat dissipating structure according to claim 3, wherein the distance between the long axes of two adjacent heat dissipating studs is D, and D is 2 mm.ltoreq.d.ltoreq.3 mm.
6. The heat dissipating structure of claim 1 wherein the heat dissipating post has a protrusion length from the plane of the substrate of H,3mm D6 mm.
7. The heat dissipating structure of claim 1, wherein the water inlet channel and the water outlet channel are disposed in parallel, and the water inlet channel and the water outlet channel extend in opposite directions.
8. A silicon carbide chip module, comprising a silicon carbide chip, a copper-clad ceramic substrate and a heat dissipation structure as claimed in any one of claims 1 to 7, wherein the copper-clad ceramic substrate is welded to the housing, the heat dissipation base plate is disposed between the copper-clad ceramic substrate and the housing, and the silicon carbide chip is bonded to a surface of the copper-clad ceramic substrate away from the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321022404.1U CN219873497U (en) | 2023-04-28 | 2023-04-28 | Silicon carbide chip module and heat radiation structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321022404.1U CN219873497U (en) | 2023-04-28 | 2023-04-28 | Silicon carbide chip module and heat radiation structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219873497U true CN219873497U (en) | 2023-10-20 |
Family
ID=88337062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321022404.1U Active CN219873497U (en) | 2023-04-28 | 2023-04-28 | Silicon carbide chip module and heat radiation structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219873497U (en) |
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2023
- 2023-04-28 CN CN202321022404.1U patent/CN219873497U/en active Active
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