CN216435886U - Chip microchannel radiator - Google Patents
Chip microchannel radiator Download PDFInfo
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- CN216435886U CN216435886U CN202123280524.5U CN202123280524U CN216435886U CN 216435886 U CN216435886 U CN 216435886U CN 202123280524 U CN202123280524 U CN 202123280524U CN 216435886 U CN216435886 U CN 216435886U
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Abstract
The utility model provides a chip micro-channel radiator, which comprises a radiator body, wherein a chip is arranged on the radiator body, the radiator body comprises an upper substrate, a lower substrate and a plurality of micro-channels between the upper substrate and the lower substrate, each micro-channel is internally provided with a plurality of groups of micro-structures at equal intervals, the micro-structures comprise a turbulent flow structure and a recess structure, the turbulent flow structure is arranged in the middle of the micro-channel, the recess structure comprises two recesses which are respectively arranged on the left side wall and the right side wall of the micro-channel, the recesses are arranged corresponding to the turbulent flow structures, the upper position and the lower position of the recesses are respectively provided with a heat radiation through hole, and the heat radiation through holes are fused on the basis of the micro-channel radiator, so that a heat radiation area is not limited on the surface of the chip contacted with the radiator, and the heat is transmitted to the upper layer, the middle layer and the lower layer of the radiator body through the heat radiation through holes, the utilization efficiency of the cooling liquid is improved.
Description
Technical Field
The utility model belongs to the technical field of the chip heat dissipation, in particular to chip microchannel radiator.
Background
The IC chip develops towards the direction of small size, high power and high integration, and the integration mode is changed from two dimensions to three dimensions, so that the performance and the service life of a semiconductor device are influenced by the problems of overhigh integral temperature, local hot spots and the like of the chip. Two commonly used heat dissipation technologies for power chips are heat dissipation through holes and micro-channel heat sinks. The heat dissipation through hole technology has the characteristic of simple structure, but faces the problem of thermal stress reliability caused by thermal mismatch in the working process, and the heat dissipation efficiency is low. The microchannel radiator has higher heat dissipation efficiency, but the traditional long and straight microchannel heat dissipation process causes uneven temperature, and the heat dissipation capacity of the cooling liquid is not fully utilized.
Document No. CN111029895B discloses a micro-channel heat sink structure, in which a micro flow channel is added on the basis of a long straight micro flow channel, two heat dissipation through holes are provided at the top baffle for passing in and out the cooling liquid, and the micro flow channel disturbs the gentle laminar flow cooling liquid, which improves the utilization efficiency of the cooling liquid to a certain extent, but needs further improvement, so that the utilization efficiency of the cooling liquid is fully exerted.
SUMMERY OF THE UTILITY MODEL
To the problem that exists, the utility model provides a to overcoming the defect among the prior art, provide a chip microchannel radiator.
The technical solution of the utility model is that: the utility model provides a chip microchannel radiator, includes the radiator body, and the chip sets up on the radiator body, the radiator body includes a plurality of microchannel between upper substrate, lower substrate and the upper and lower substrate, every the equidistance is arranged in the microchannel has the multiunit micro-structure, the micro-structure includes vortex structure and cave structure, the vortex structure sets up the middle part of microchannel, the cave structure is including setting up respectively two caves on the wall of the microchannel left and right sides, the cave corresponds the vortex structure sets up, the upper and lower position of cave all is equipped with radiating through-hole.
The utility model discloses a further improvement lies in: the heat dissipation through hole is vertically arranged, one end of the heat dissipation through hole penetrates through the upper substrate to be directly contacted with the chip, and the other end of the heat dissipation through hole is contacted with the lower substrate.
The utility model discloses a further improvement lies in: the heat dissipation through hole comprises a metal core and an insulating layer arranged on the outer side of the metal core, and the heat dissipation through hole is formed together.
The utility model discloses a further improvement lies in: the metal core is made of copper with high heat conductivity, and the insulating layer is silicon dioxide.
The utility model discloses a further improvement lies in: the turbulence structure is a strip-shaped boss structure.
The utility model discloses a further improvement lies in: the chip is fixed on the upper surface of the radiator body through silicone grease.
The utility model discloses a further improvement lies in: one end of each micro-channel is a liquid inlet end, the other end of each micro-channel is a liquid outlet end, and four groups of micro-structures are arranged in each micro-channel.
The utility model has the advantages that: the micro-channel radiator is simple in structure and reasonable in design, and the radiating through holes are fused on the basis of the micro-channel radiator, so that the radiating area is not limited to the surface of the chip in contact with the radiator, heat is transferred to the upper layer, the middle layer and the lower layer of the radiator body through the radiating through holes, and the utilization efficiency of cooling liquid is improved; the micro-structure is arranged in the micro-channel, wherein the turbulent flow structure can break a boundary layer of laminar flow, all cooling liquid can participate in cooling work, the cooling efficiency is improved, the position of the concave structure in the micro-channel corresponds to the turbulent flow structure, the heat radiator has the significance of reducing overlarge energy loss caused by the obstruction of the turbulent flow structure to fluid flow, and the heat radiation performance of the cooling liquid is fully utilized, so that the efficiency of the heat radiator is improved.
Drawings
FIG. 1 is a schematic view of the chip and the heat sink of the present invention
FIG. 2 is a three-dimensional schematic diagram of the internal structure of the present invention
Fig. 3 is a top view of the internal structure of the present invention;
FIG. 4 is a main sectional view of the present invention
Wherein: 1-chip, 2-radiator body, 3-upper substrate, 4-lower substrate, 5-microchannel, 6-turbulent flow structure, 7-recess structure and 8-radiating through hole.
Detailed Description
In order to deepen the understanding of the present invention, the present invention will be described in further detail with reference to the accompanying drawings and embodiments, which are only used for explaining the present invention and are not limited to the protection scope of the present invention.
As shown in the figure, the present embodiment provides a chip microchannel heat sink, which includes a heat sink body 2, wherein a chip 1 is connected to the heat sink body 2 through a heat dissipation silicone grease, and the heat of the chip 1 is conducted to the heat sink body 2 through the silicone grease. The heat sink body 2 comprises an upper substrate 3, a lower substrate 4 and a plurality of rectangular microchannels 5 between the upper substrate and the lower substrate. Considering that the length of the microchannel is longer than the width of the microchannel, the improvement of the heat dissipation performance of a single group of microstructures on the whole microchannel heat sink is limited, so 4 groups of microstructures are arranged in each microchannel at equal intervals, each microstructure comprises a turbulence structure 6 and a recess structure 7, the turbulence structure 6 is cuboid and arranged in the middle of the microchannel 5, and the turbulence structure 6 is arranged to break a laminar boundary layer, so that the cooling efficiency is improved; the sink structure 7 comprises two sinks respectively arranged on the left side wall and the right side wall of the micro-channel 5, the sinks are arranged corresponding to the turbulent flow structures 4, and the sink structure 7 is significant in reducing the excessive energy loss caused by the obstruction of the turbulent flow structures 2 to the fluid flow. The upper and lower positions of the recess are provided with heat dissipation through holes 8, considering that the copper metal core has a large thermal expansion coefficient in the heat dissipation process of the heat sink, and the insulating layer and the silicon substrate limit the thermal expansion of the metal core at a high temperature, thereby generating thermal stress. For this purpose, the heat-dissipating through-silicon-vias are cylindrical, stress concentrations being avoided by the circular outer surface. The heat dissipation through hole 8 is vertically arranged, one end of the heat dissipation through hole penetrates through the upper substrate 3 to be directly contacted with the chip 1, and the other end of the heat dissipation through hole is contacted with the lower substrate 4. The heat dissipation through-hole 8 includes a metal core made of copper having a high thermal conductivity and a silicon dioxide insulating layer disposed outside the metal core.
The chip microchannel radiator that this embodiment provided, it combines microchannel radiator and heat dissipation through-hole technique, the one end of microchannel 5 is the inlet end, and the other end is for going out the liquid end, and the coolant liquid cools off chip 1 in getting into microchannel 5 from the inlet end, and the chip heat is provided with four vortex structures 6 and pocket structure 7 with heat transfer to the coolant liquid through upper substrate 3 in microchannel 5, shunts gentle laminar flow coolant liquid disturbance, destroys the laminar flow of coolant liquid, makes the heat pass through the substrate efficient and transmits for all coolant liquids. Simultaneously at the even heat dissipation through-hole 8 that is provided with in the substrate wall of cave, heat dissipation through-hole 8 passes upper substrate 3 and directly contacts with the chip, transfer the heat from upper substrate 3 to lower substrate 4 along copper metal core, and also transmit the heat to the coolant liquid through heat dissipation through-hole 8's surface in the transfer process, the radiating surface area of radiator has been increased in other words, make the heat dissipation not only confine to the upper surface with the chip contact, make full use of the lower floor coolant liquid of radiator, improve the utilization efficiency of coolant liquid, thereby improve the radiating efficiency.
It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A chip microchannel heat sink, characterized in that: including the radiator body, the chip sets up on the radiator body, the radiator body includes a plurality of microchannel between upper substrate, lower substrate and the upper and lower substrate, every the equidistance is arranged in the microchannel has the multiunit micro-structure, the micro-structure includes vortex structure and pocket structure, the vortex structure sets up the middle part of microchannel, the pocket structure is including setting up respectively two pockets on the wall of microchannel left and right sides, the pocket corresponds the vortex structure sets up, the upper and lower position of pocket all is equipped with heat dissipation through-hole.
2. The chip microchannel heat sink of claim 1, wherein: the heat dissipation through hole is vertically arranged, one end of the heat dissipation through hole penetrates through the upper substrate to be directly contacted with the chip, and the other end of the heat dissipation through hole is contacted with the lower substrate.
3. The chip microchannel heat sink of claim 1, wherein: the heat dissipation through hole comprises a metal core and an insulating layer arranged on the outer side of the metal core, and the heat dissipation through hole is formed together.
4. The chip microchannel heat sink of claim 3, wherein: the metal core is made of copper with high thermal conductivity, and the insulating layer is silicon dioxide.
5. The heat sink of claim 1, wherein: the turbulence structure is a strip-shaped boss structure.
6. The heat sink of claim 1, wherein: the chip is fixed on the upper surface of the radiator body through silicone grease.
7. The heat sink of claim 1, wherein: one end of each micro-channel is a liquid inlet end, the other end of each micro-channel is a liquid outlet end, and four groups of micro-structures are arranged in each micro-channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123280524.5U CN216435886U (en) | 2021-12-24 | 2021-12-24 | Chip microchannel radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123280524.5U CN216435886U (en) | 2021-12-24 | 2021-12-24 | Chip microchannel radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216435886U true CN216435886U (en) | 2022-05-03 |
Family
ID=81318726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123280524.5U Active CN216435886U (en) | 2021-12-24 | 2021-12-24 | Chip microchannel radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216435886U (en) |
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2021
- 2021-12-24 CN CN202123280524.5U patent/CN216435886U/en active Active
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