CN1980560A - Water-cooling type radiating structure and mfg. method - Google Patents
Water-cooling type radiating structure and mfg. method Download PDFInfo
- Publication number
- CN1980560A CN1980560A CNA2005101242653A CN200510124265A CN1980560A CN 1980560 A CN1980560 A CN 1980560A CN A2005101242653 A CNA2005101242653 A CN A2005101242653A CN 200510124265 A CN200510124265 A CN 200510124265A CN 1980560 A CN1980560 A CN 1980560A
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- Prior art keywords
- water
- lid
- cooled
- cooled head
- fin
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- 238000000034 method Methods 0.000 title claims description 7
- 238000001816 cooling Methods 0.000 title abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 32
- 230000001788 irregular Effects 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 4
- 239000012809 cooling fluid Substances 0.000 abstract description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 238000002360 preparation method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 8
- 238000001149 thermolysis Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000008676 import Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 239000002250 absorbent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011469 building brick Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000002269 spontaneous effect Effects 0.000 description 2
- 241000883990 Flabellum Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of water cooling head and its preparation method, is to form a water cooling head by one No. cover body and one No. 2 cover body, among which the two ends of the No. 1 cover body extends to one inlet branch and one outflow tube, in the inside of the No. 2 cover body, there are fixedly designed multiple thermal conductive particles being piled in an irregular way that forms a subminiature flow channel structure, whereas there is one contact surface at the outside of the No. 2 cover body, which absorbd the heat resource through the said contact surface and conducts the heat resource to the multiple heat conductive particles, and makes the cooling fluid flow into the said water cooling head through the inlet branch, the said subminiature flow channel structure works to disturb the cooling fluid, then causes the time when the cooling fluid stays in the water cooling head extend, which is allowed the cooling fluid to exchnage with the heat conductive particles sufficiently, and then flow out from the outflow tube.
Description
Technical field
The present invention relates to a kind of water-cooled radiating structure and preparation method thereof, particularly a kind of water-cooled head that is applicable to electronic building brick and preparation method thereof.
Background technology
The running of any electric equipment, all generations of the heat that can be difficult to avoid too much because of efficient or friction problem, production development in science and technology industry now tends to accurate more especially, as integrated circuit, the personal electric product, except the volume miniaturization, the generation of its heat also gets over increase, especially in computer, because the continuous lifting of its operation efficiency, make the whole caloric value of computer also with increase, and the main heating source of computer no longer is confined to CPU, and other is such as chip module, Graphics Processing Unit, therefore the contour quick-mounting of Dram and hard disk is put and is also produced appreciable heat simultaneously, for making the computer can normal operation in the operating temperature range of allowing, then must be by means of extra heat abstractor, to lower the harmful effect of heat for the computer module running.
And fan is a kind of easy and heat abstractor of being widely used most, rotating the air make arround the heat generating component by flabellum produces fast and flows, with effect heat that heat generating component produced rapidly by band from, to reach its thermolysis, yet its radiating effect but is not enough to satisfy its heat conduction efficiency because of area of dissipation, make its heat dissipation drop occur compared to expection, though utilize a plurality of heat radiating fin structures to be attached at heat generating component afterwards, increase its area of dissipation by this, quicken its heat conduction efficiency, see through again fan blow with thermal source force band from, but because of the throughput of its fan still belongs to limited, its radiating effect still can't effectively be improved, therefore, the radiator fan of the many groups of prior art utilization series connection, attempt increasing the throughput of its fan, but be difficult to carry out because of the restriction that is subject to the space, strengthen its throughput and increase motor rotary speed, then can improve the motor manufacture difficulty, and the increase of motor rotary speed also has the upper limit, even be easy to generate a large amount of noises, vibrations and heat, the limit that causes it to be difficult to carry out.
As previously mentioned, the lifting of the usefulness of fan own has its restriction that is difficult to break through, make its radiating effect be difficult to promote, cooling extent still belongs to limited, but for solving the radiating requirements under the electronic building brick computing high speed, the solution that certainly will will seek other, therefore prior art discloses a kind of water-cooled power converter, be to utilize a water-cooled head to be adsorbed on the heat generating component, as CPU or disc driver, be cooling fluid extract out to be imported in its water-cooled head from water tank by a motor, described cooling fluid and water-cooled head from the adsorbed heat of heat generating component via heat exchange action after, its cooling fluid flows out to a radiating module by the water-cooled head again, via sending water tank again back to after the cooling, liquid circulation is helped heat radiation by this, reduces its heat generating component temperature, and its unit is operated smoothly.
Though produce heat exchange through coolant flow and thermal source by the water-cooled head, can reach the effect that is better than utilizing the air-flow heat radiation, but in above-mentioned water-cooling head structure, the heat-absorbent surface of its water-cooled head only concentrates on same place, after causing cooling fluid to import the water-cooled head, the cooling fluid of its inflow only some and heat-absorbent surface produces heat exchange action, and it is too short that cooling fluid rests on time of water-cooled head, cause cooling fluid not absorb enough thermals source as yet, promptly derive by another pipeline, make the thermolysis of water-cooled function limited, therefore, prior art discloses a kind of water-cooled radiating structure in addition, as shown in Figure 1, described water-cooled 101 inboard set firmly a plurality of fin 102, form a plurality of unidirectional runners, make cooling fluid import described water-cooled 101 after, increase its area of dissipation by a plurality of fin, when seeing through cooling fluid, make cooling fluid and fin generation heat exchange, to improve its thermolysis by described a plurality of unidirectional runner.
In above-mentioned radiator structure, though it utilizes fin that area of dissipation is increased, the formed a plurality of runners of its fin, bootable cooling fluid is in the flow direction of water-cooled head, its cooling fluid and a plurality of fin contact area are significantly increased and produce heat exchange, yet the space of its unidirectional runner is still fine and closely woven inadequately, cause cooling fluid fast by described unidirectional runner, its residence time still can't significantly promote, make cooling fluid absorb enough thermals source and effectively to promote its thermolysis, desirable part is to the greatest extent still arranged not from fin.
Summary of the invention
Purpose of the present invention, be to provide a kind of water-cooled head and preparation method thereof, by the micro flow channel of heat conduction particle with irregular storehouse formation, cooling fluid is produced the flow-disturbing effect, significantly promote the residence time of cooling fluid at the water-cooled head, see through simultaneously with the formed contact area of heat conduction particle and produce heat exchange action, make cooling fluid significantly absorb the thermal source that the spontaneous heating assembly sees through conduction, effectively promote its thermolysis.
To achieve these goals, the invention provides a kind of water-cooled head, it is characterized in that, comprising:
One water-cooled head is to be a hollow box, has at least one inlet channel and at least one outlet conduit;
A plurality of heat conduction particles are to be located at water-cooled head inside, and form a plurality of little shape runners with irregular stack arrangement.
A described water-cooled bottom surface has the contact-making surface of an attaching pyrotoxin.
Described water-cooled head is formed with one first lid and one second lid.
Described second lid further has a plurality of fin.
Described fin is to be arranged in parallel.
Described second lid further has at least one heating column.
Described first lid and second lid all have a plurality of fin.
The fin of described first lid and second lid is to be staggered.
The invention provides a kind of manufacture method of water-cooled head, it is characterized in that, step is as follows:
A. place the predeterminated position of a tool in one second lid;
B. a plurality of heat conduction particles are inserted described tool;
C. via sintering, make the described heat conduction particle combination that waits, form a plurality of little shape runners;
One first lid and described second lid that d. will have at least one pipeline link mutually.
Described first and second lid is to link with welding, riveted joint or bonding mode.
The advantage that the present invention has: significantly promote the residence time of cooling fluid at the water-cooled head, see through simultaneously with the formed contact area of heat conduction particle and produce heat exchange action, make cooling fluid significantly absorb the thermal source that the spontaneous heating assembly sees through conduction, effectively promote its thermolysis.
Description of drawings
Fig. 1 is the three-dimensional exploded view of existing water-cooled head;
Fig. 2 is water-cooled of the present invention second a lid vertical view;
Fig. 3 is a three-dimensional exploded view of the present invention;
Fig. 4 is that micro flow channel structure of the present invention is made schematic diagram;
Fig. 5 is a micro flow channel structure formation schematic diagram of the present invention;
Fig. 6 is a micro flow channel structural representation of the present invention;
Fig. 7 is a micro flow channel structure operation schematic diagram of the present invention;
Fig. 8 is a manufacture method flow chart of the present invention;
Fig. 9 is another embodiment schematic diagram of micro flow channel structure of the present invention;
Figure 10 is a parallel fin structural representation of the present invention;
Figure 11 is a heating column structural representation of the present invention;
Figure 12 is the another embodiment schematic diagram of micro flow channel structure of the present invention.
Description of reference numerals: 101 water-cooled heads; 102 fin; 1 water-cooled head; 11 first lids; 111 inlet channels; 112 outlet conduits; 113 fin; 114 the 3rd pipelines; 12 second lids; 121 contact-making surfaces; 122 micro flow channel structures; 123 fin; 2 heat conduction particles; 3 tools; 4 heat generating components; 5 heating columns.
Embodiment
See also Fig. 2, can find out, water-cooled of the present invention 1 is formed the airtight box body of a hollow by one first lid 11 and one second lid 12 of correspondence, the body of its water-cooled 1 can be done moderate change according to different needs, first lid 11 of present embodiment and second lid 12 are rectangular body (but being not limited to rectangular body), be made by materials such as metal or potteries, its first lid 11 and second lid 12 are to utilize welding, modes such as riveted joint or bonding link, in addition, the left side of described first lid 11, right both ends of the surface outwards (also can make progress) are extended an inlet channel 111 and an outlet conduit 112, provide cooling fluid to pass in and out the pipeline of described water-cooled 1, being provided with a contact-making surface 121 in the bottom surface of second lid 12 in addition, is in order to contact heating source (figure slightly).
See also Fig. 3, it is to be three-dimensional exploded view of the present invention, second lid, 12 inboards more are provided with a micro flow channel structure 122, described micro flow channel structure 122 is to be piled up with irregular mode by several heat conduction particles 2 to form, make the gap that produces between particle and particle short and form small runner, and its heat conduction particle 2 be by circle not of uniform size, square or other irregularly shaped etc. constituted, in addition, its a plurality of heat conduction particles 3 are made by Heat Conduction Materials such as metal or potteries.
Please consult Fig. 4 earlier, the manufacture method of described water-cooled 1 is as follows, be that a tool 3 is positioned on the predeterminated position of second lid, 12 inboards, will make a plurality of heat conduction particles 2 of shaping afterwards and pour in the tool 3, pile up up to filling up tool 3 fully with irregular mode; The continuous Fig. 5 that sees also, after described heat conduction particle 2 such as grade fills up tool 3 fully, utilize the high temperature sintering mode a plurality of heat conduction particles 2 in the tool 3 can be combined closely each other, and be fixedly arranged on the plate face of second lid 12, after taking out tool 3, its a plurality of heat conduction particles 2 just can form aforesaid micro flow channel structure 122, as shown in Figure 6; The continuous Fig. 7 that sees also, last, first lid 11 and second lid 12 are connected in modes such as welding, riveted joint or bondings promptly finish this water-cooled 1 again.
See also Fig. 8, manufacture method with described water-cooled 1 represents as follows with flow chart again, at first tool 3 is positioned over the predeterminated position (S1) of second lid 12, afterwards heat conduction particle 2 is poured in the tool 3, pile up till filling up tool 3 (S2) with irregular mode, produce the gap between its each heat conduction particle 2, via high temperature sintering, heat conduction particle is combined closely each other, form micro flow channel structure 122 (S3), again first lid 11 and second lid 12 are connected shaping in modes such as welding, riveted joint or bondings, finish water-cooled 1 (S4) at last.
Please consult Fig. 7 again, therefore, when water-cooled 1 is attached on the heat generating component 4, promptly by the thermal source on the contact-making surface 121 absorption heat generating components 4, and its thermal source is conducted to a plurality of heat conduction particles 2 of water-cooled 1 inboard, cooling fluid is after inlet channel 111 imports to water-cooled 1, flow-disturbing effect by micro flow channel structure 122, impel cooling fluid significantly to prolong in the residence time of water-cooled 1, make cooling fluid and a plurality of heat conduction particle 2 produce heat exchange, absorb enough heats again by after outlet conduit 112 derivation, just finish its thermolysis.
See also Fig. 9, be to be another embodiment of the present invention, first lid 11 and second lid 12 all are provided with a plurality of fin (fin) 113 perpendicular to the plate face, 123, the described fin 113 that waits, the 123rd, form a plurality of intervals to be staggered, described uniformly-spaced being interconnected becomes circuitous unidirectional runner, after this, insert a plurality of heat conduction particles 2 in uniformly-spaced and constitute micro flow channel structures 122 described, therefore the contact-making surface 121 when water-cooled 1 is attached at heat generating component 4, thermal source is absorbed and conduct to fin 113 via contact-making surface 121,123, dissipate to again on a plurality of heat conduction particles 2, and cooling fluid is after inlet channel 111 imports its unidirectional circuitous runner, flow-disturbing effect by micro flow channel structure 122, simultaneously with a plurality of fin 113,123 and a plurality of heat conduction particle 2 produce heat exchanges, the cooling fluid band is flowed out, to reach thermolysis from thermal source and from outlet conduit 112; In addition, as shown in figure 10, also can only be provided with a plurality of fin 123 and vertically stand on second lid, the 12 plate faces, form a plurality of runners, in runner, insert a plurality of heat conduction particle 2 formed micro flow channel structures 122 again with parallel arrangement mode.
In addition, also can be on the position of second lid, 12 default micro flow channel structures 122, be provided with one or more in advance and stand on the heating column 5 of second lid, 12 interior plate faces, (originally be illustrated as one) as shown in figure 11, around heating column 5, be provided with a plurality of heat conduction particle 2 formed miniature channel architectures 122 again.
See also Figure 12, be to be further embodiment of this invention, on first lid 11, offer the 3rd pipeline 114 that is right against contact-making surface 121, simultaneously the miniature radiator structure 122 in being located at water-cooled 1 is right against on its 3rd pipeline 114 positions, offer a hole, make cooling fluid after the 3rd pipeline 114 imports, can directly flow through the contact-making surface 121 that attaches heat generating component 4, behind described contact-making surface 121 generation direct heat exchange interactions, derive from outlet conduit 112 via micro flow channel structure 121 again, so the pipeline number does not limit.
Above-described execution mode is to be preferable embodiment, when not limiting the scope of the present invention with this, if the equivalence of doing according to the present patent application claim and description changes or modification, all should belong to patent covering scope of the present invention.
Claims (10)
1. a water-cooled head is characterized in that, comprising:
One water-cooled head is to be a hollow box, has at least one inlet channel and at least one outlet conduit; A plurality of heat conduction particles are to be located at water-cooled head inside, and form a plurality of little shape runners with irregular stack arrangement.
2. water-cooled head as claimed in claim 1 is characterized in that: a described water-cooled bottom surface has the contact-making surface of an attaching pyrotoxin.
3. water-cooled head as claimed in claim 1 is characterized in that: described water-cooled head is formed with one first lid and one second lid.
4. water-cooled head as claimed in claim 3 is characterized in that: described second lid further has a plurality of fin.
5. water-cooled head as claimed in claim 4 is characterized in that: described fin is to be arranged in parallel.
6. water-cooled head as claimed in claim 3 is characterized in that: described second lid further has at least one heating column.
7. water-cooled head as claimed in claim 3 is characterized in that: described first lid and second lid all have a plurality of fin.
8. water-cooled head as claimed in claim 7 is characterized in that: the fin of described first lid and second lid is to be staggered.
9. the manufacture method of a water-cooled head is characterized in that, step is as follows:
A. place the predeterminated position of a tool in one second lid;
B. a plurality of heat conduction particles are inserted described tool;
C. via sintering, make the described heat conduction particle combination that waits, form a plurality of little shape runners;
One first lid and described second lid that d. will have at least one pipeline link mutually.
10. the manufacture method of water-cooled head as claimed in claim 9 is characterized in that: described first and second lid is to link with welding, riveted joint or bonding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005101242653A CN1980560A (en) | 2005-11-29 | 2005-11-29 | Water-cooling type radiating structure and mfg. method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005101242653A CN1980560A (en) | 2005-11-29 | 2005-11-29 | Water-cooling type radiating structure and mfg. method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1980560A true CN1980560A (en) | 2007-06-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005101242653A Pending CN1980560A (en) | 2005-11-29 | 2005-11-29 | Water-cooling type radiating structure and mfg. method |
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| Country | Link |
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| CN (1) | CN1980560A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163757A (en) * | 2010-02-23 | 2011-08-24 | 通用汽车环球科技运作有限责任公司 | Combination of heat pipe and louvered fins for air-cooling of li-ion battery cell and pack |
| CN102469748A (en) * | 2010-11-12 | 2012-05-23 | 奇鋐科技股份有限公司 | Improved runner structure of water cooling device |
| US8785024B2 (en) | 2010-02-23 | 2014-07-22 | GM Global Technology Operations LLC | Combination of heat pipe and louvered fins for air-cooling of Li-Ion battery cell and pack |
| CN107509366A (en) * | 2017-08-30 | 2017-12-22 | 中国电子科技集团公司第二十九研究所 | A kind of conformal heat exchanger based on porous flat pipe |
| CN108302970A (en) * | 2017-01-13 | 2018-07-20 | 双鸿科技股份有限公司 | Water-cooling head |
| CN108401400A (en) * | 2018-03-19 | 2018-08-14 | 奇鋐科技股份有限公司 | Water cooling module |
| CN109060495A (en) * | 2018-09-11 | 2018-12-21 | 四川省机械研究设计院 | The device of adjustable thermal resistance |
-
2005
- 2005-11-29 CN CNA2005101242653A patent/CN1980560A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163757A (en) * | 2010-02-23 | 2011-08-24 | 通用汽车环球科技运作有限责任公司 | Combination of heat pipe and louvered fins for air-cooling of li-ion battery cell and pack |
| US8785024B2 (en) | 2010-02-23 | 2014-07-22 | GM Global Technology Operations LLC | Combination of heat pipe and louvered fins for air-cooling of Li-Ion battery cell and pack |
| CN102469748A (en) * | 2010-11-12 | 2012-05-23 | 奇鋐科技股份有限公司 | Improved runner structure of water cooling device |
| CN108302970A (en) * | 2017-01-13 | 2018-07-20 | 双鸿科技股份有限公司 | Water-cooling head |
| CN107509366A (en) * | 2017-08-30 | 2017-12-22 | 中国电子科技集团公司第二十九研究所 | A kind of conformal heat exchanger based on porous flat pipe |
| CN108401400A (en) * | 2018-03-19 | 2018-08-14 | 奇鋐科技股份有限公司 | Water cooling module |
| CN108401400B (en) * | 2018-03-19 | 2020-10-13 | 奇鋐科技股份有限公司 | Water-cooling module |
| CN109060495A (en) * | 2018-09-11 | 2018-12-21 | 四川省机械研究设计院 | The device of adjustable thermal resistance |
| CN109060495B (en) * | 2018-09-11 | 2024-03-15 | 四川省机械研究设计院(集团)有限公司 | Device capable of adjusting thermal resistance |
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