CN108302970A - Water-cooling head - Google Patents
Water-cooling head Download PDFInfo
- Publication number
- CN108302970A CN108302970A CN201711297737.4A CN201711297737A CN108302970A CN 108302970 A CN108302970 A CN 108302970A CN 201711297737 A CN201711297737 A CN 201711297737A CN 108302970 A CN108302970 A CN 108302970A
- Authority
- CN
- China
- Prior art keywords
- pedestal
- water
- structure part
- stereochemical structure
- cooling head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
Abstract
The present invention provides a kind of water-cooling head.Water-cooling head includes lid, pedestal and stereochemical structure part.A chamber is collectively formed with lid in pedestal, and stereochemical structure part is set in chamber, and the side of stereochemical structure part is plane, which is bonded pedestal, and the other side of stereochemical structure part is fin.The present invention can take into account the thermal conductivity of pedestal and the thermal diffusivity of fin as a result, and also more elastic on processing procedure.
Description
Technical field
The present invention is about a kind of water-cooling head, especially with regard to a kind of pedestal and the non-integral molding water-cooling head of fin.
Background technology
Figure 1A is the stereoscopic schematic diagram of existing water cooling component.Water cooling component 1 ' by water-cooling head 2 ' (Cold plate, also known as
Cold plate), water cooling row 3 ' (radiator, also known as heat dissipation row), 4 ' (pump) of pump and pipeline 5 ' collectively constitute a circulating path,
And working fluid (not shown) is filled in circulating path.
When water cooling component 1 ' operates, water-cooling head 2 ' can be with pyrotoxin 6 ' such as chip, memory or light-emitting component
Contact, at this point, the working fluid in water-cooling head 2 ' increases temperature after absorbing thermal energy caused by pyrotoxin 6 ', and by pipeline
5 ', which are transferred to water cooling row 3 ', carries out the exchange of heat and temperature is allowed to be minimized.Finally, the working fluid to have cooled down can be passed back to again
Water-cooling head 2 ', again cycle next time.In addition, water cooling component 1 ' can be provided with pump 4 ' to drive workflow in circulating path
Body makes it in circulating path smooth flow.
In water cooling component 1 ', water-cooling head 2 ' is a very important composition, is by a lid 21 ' and a pedestal
22 ' are formed, and a chamber 23 ' can be collectively formed with pedestal 22 ' in lid 21 ', are allowed working fluid to be able to by and are taken away certainly
The thermal energy that pyrotoxin 6 ' is transmitted to.And if water-cooling head 2 ' design when, can be in the case where not increasing volume, in chamber
The indoor more heat dissipation areas of increase, absorb more thermal energy, and providing for working fluid has the chance of more heat exchanges and carry
Rise the radiating efficiency of water-cooling head 2 '.In order to reach above-mentioned target, existing way is often as shown in Figure 1B selected in water-cooling head
The inside 22A ' of 2 ' pedestal 22 ', that is, figure middle chamber 23 ' bottom, formed fin 22B ' connect with working fluid to increase
Tactile area, and since it is considered that thermal energy can increase by one section of thermal resistance when being transmitted in different interfaces, thus can utilize one at
The mode of type directly forms fin 22B ' on pedestal 22 '.
But, since the function of pedestal 22 ' is and the fin 22B ' by the chamber 23 ' of thermal energy conduction to water-cooling head 2 '
Function is then to increase more heat dissipation areas, to promptly transfer thermal energy on working fluid, therefore existing water-cooling head 2 '
The design that fin 22B ' is directly formed on pedestal 22 ' is difficult to take into account the thermal conductivity of pedestal and the heat dissipation of fin simultaneously,
If if needing to form the more fin 22B ' of density higher, heat dissipation area, as the original material of pedestal 22 '
And limited to.Furthermore if it is complete plane that pedestal 22 ', which is not, but a circle is extended with to lid direction as shown in Figure 1B
If side wall 22C ', it can also increase the degree of difficulty to form fin 22B '.
Invention content
The technical problem to be solved in the present invention is that, for deficiencies of the prior art, providing one kind can be simultaneous
Care for the thermal conductivity of pedestal and the thermal diffusivity of fin and more elastic water-cooling head on processing procedure.
The technical solution adopted by the present invention to solve the technical problems be to provide a kind of water-cooling head, including lid, pedestal with
And stereochemical structure part.A chamber is collectively formed with lid in pedestal.Stereochemical structure part is set in chamber, the side of stereochemical structure part
For plane, which is bonded pedestal, and the other side of stereochemical structure part is fin.
In an embodiment of the present invention, there is pedestal one side wall, the side wall to extend from pedestal toward lid direction.
In an embodiment of the present invention, there is pedestal a recessed portion, stereochemical structure part to be bonded recessed portion.
In an embodiment of the present invention, stereochemical structure part has an at least positioning column, and an at least positioning column is from the plane
Extend outwardly, pedestal has at least a positioning hole, to accommodate an at least positioning column.
In an embodiment of the present invention, pedestal and stereochemical structure part are to be combined together one of in the following manner：It is welding, soft
Weldering, hard solder, crimping, rivet, be threadedly engaged and viscose engagement.
In an embodiment of the present invention, stereochemical structure part is identical or different in following properties as pedestal, which includes：
Material, density, hardness and thermal coefficient.
In an embodiment of the present invention, fin is skiving fin (Skived fin).
The present invention also provides a kind of water-cooling heads, including lid, pedestal and stereochemical structure part.Pedestal is collectively formed with lid
One chamber, stereochemical structure part are set in chamber and are bonded pedestal.Stereochemical structure part identical or phase in following properties with pedestal
Different, which includes material, density, hardness and thermal coefficient.
In an embodiment of the present invention, there is pedestal one side wall, the side wall to extend from pedestal toward lid direction.
In an embodiment of the present invention, there is pedestal a recessed portion, stereochemical structure part to be bonded the recessed portion.
In an embodiment of the present invention, stereochemical structure part has an at least positioning column, and an at least positioning column is from the solid
The side that structural member is bonded with the pedestal extends outwardly, and pedestal has at least a positioning hole, to accommodate an at least positioning column.
In an embodiment of the present invention, pedestal and stereochemical structure part are to be combined together one of in the following manner：It is welding, soft
Weldering, hard solder, crimping, rivet, be threadedly engaged and viscose engagement.
In an embodiment of the present invention, the side of the stereochemical structure part is bonded the pedestal, the other side of the stereochemical structure part
For fin, which is skiving fin (Skived fin).
The present invention also provides a kind of water-cooling heads, including lid, pedestal, the first stereochemical structure part and the second stereochemical structure
Part.A chamber is collectively formed with lid in pedestal.First stereochemical structure part is set in chamber and is bonded pedestal, the first stereochemical structure
Part in face of chamber side in being provided with the first fin.Second stereochemical structure part is set in chamber and is bonded pedestal, and second is three-dimensional
Structural member in face of chamber side in being provided with the second fin.
In an embodiment of the present invention, the first stereochemical structure part and the second stereochemical structure part, it is identical in following properties or
Different, which includes：Material, density, hardness and thermal coefficient.
In an embodiment of the present invention, the first fin and the second fin, identical or different in following properties, the characteristic packet
Include the spacing of shape, arranging density, orientation, height and adjacent fin.
In an embodiment of the present invention, the first stereochemical structure part and the second stereochemical structure part are one of in the following manner patches
Together in pedestal：Welding, soft soldering, hard solder, crimping, rivet, be threadedly engaged and viscose engagement.
In an embodiment of the present invention, the first stereochemical structure part is identical or different in following properties as pedestal, the characteristic
Including：Material, density, hardness and thermal coefficient.
In an embodiment of the present invention, the second stereochemical structure part is identical or different in following properties as pedestal, the characteristic
Including：Material, density, hardness and thermal coefficient.
In an embodiment of the present invention, the first stereochemical structure part is close to a water intake end of water-cooling head, the second stereochemical structure part
Close to a water outlet of water-cooling head.
The present invention proposes that a kind of novel design, escape form the tradition rule of fin in a manner of integrally formed on pedestal
Then, but pedestal is first fabricated separately according to respectively suitable processing procedure with fin, is provided with modular design concept various
Various selection on different fin structures or unlike material.When assembling water-cooling head later, then the characteristic regarding product or visitor
The demand at family selects suitable fin and fits on the inside of pedestal, thus, can not only take into account the heat conduction of pedestal simultaneously
Property and fin thermal diffusivity, while also providing the elasticity on processing procedure, for permanent, the cost of manufacture can be reduced.
Description of the drawings
Figure 1A is the stereoscopic schematic diagram of existing water cooling component.
Figure 1B is the diagrammatic cross-section of the obtained existing water-cooling head internal structure of 1B-1B hatchings along Figure 1A.
Fig. 2A is the stereoscopic schematic diagram for the water cooling component that one embodiment of the invention is provided.
Fig. 2 B are the diagrammatic cross-sections of the obtained water-cooling head internal structure of 2B-2B hatchings along Fig. 2A.
Fig. 3 A are the schematic diagrames for the stereochemical structure part with taper fin that one embodiment of the invention is provided.
Fig. 3 B are the schematic diagrames that one embodiment of the invention provides the stereochemical structure part with column or plate type fins.
Fig. 3 C are the schematic diagrames for the stereochemical structure part with sheet fin that one embodiment of the invention is provided.
Fig. 3 D are the schematic diagrames for the stereochemical structure part with skiving fin that one embodiment of the invention is provided.
Fig. 3 E are the solids with the first stereochemical structure part and the second stereochemical structure part that one embodiment of the invention is provided
The schematic diagram of structural member.
Fig. 4 A are schematic diagram of the water-cooling head that is provided of one embodiment of the invention before assembling, and display pedestal has recessed portion
Design.
Fig. 4 B are the schematic diagrames after water-cooling head assembling shown in Fig. 4 A.
Fig. 5 A are schematic diagram of the water-cooling head that is provided of one embodiment of the invention before assembling, show stereochemical structure part and bottom
The correspondence Position Design of seat.
Fig. 5 B are the schematic diagrames after water-cooling head assembling shown in Fig. 5 A.
Specific implementation mode
The stereoscopic schematic diagram for the water cooling component that Fig. 2A is proposed by one embodiment of the invention, the water cooling that the present embodiment is proposed
Component 1 also collectively constitutes a circulating path by water-cooling head 2, water cooling row 3, pump 4 and pipeline 5, and in the circulation path
Working fluid (not shown) is filled in diameter.For the water cooling component 1 of the present embodiment in running, water-cooling head 2 can be 6 with pyrotoxin
Such as chip, memory or light-emitting component contact, at this point, the working fluid in water-cooling head 2 can absorb caused by pyrotoxin 6
Thermal energy and increase temperature, and by pipeline 5 be transferred to water cooling row 3 carry out heat exchange and allow temperature to be minimized, finally, dropped
The working fluid of temperature can be communicated back to water-cooling head 2 again, again cycle next time.Water cooling component 1 can be arranged in circulating path
There is pump 4 that working fluid is driven to make it in circulating path smooth flow.
One of the design concept that the present embodiment is proposed is by the pedestal of water-cooling head and stereochemical structure part, and respectively selection is suitable
When processing procedure or engineering method produce or manufacture, just fit together both until assembling.Fig. 2 B are please referred to, are along Fig. 2A
The diagrammatic cross-section of the obtained water-cooling head internal structure of 2B-2B hatchings, in the present embodiment, water-cooling head 2 include a lid
21, a pedestal 22 and a stereochemical structure part 24, wherein the pedestal 22 has one side wall 22C, side wall 22C past from pedestal 22
21 direction of lid extends.A chamber 23 can be collectively formed with pedestal 22 in lid 21, allow working fluid to be able to by and take away spontaneous
The thermal energy that heat source 6 is transmitted to, stereochemical structure part 24 are then arranged in chamber 23, and the side of stereochemical structure part 24 is plane 24B,
The inside 22A of pedestal 22 can be fitted in, the other side of stereochemical structure part 24 is then fin 24A.Thus, which pyrotoxin 6 is produced
Raw thermal energy can be completely bonded by 22A on the inside of the plane 24B of stereochemical structure part 24 and pedestal, and be passed up to
Fin 24A, and the characteristic of contact area can be amplified by fin 24A, and quickly working fluid is allowed to take away thermal energy.
In the present embodiment, the pedestal 22 of water-cooling head 2 with stereochemical structure part 24 due to be separate production or manufacture, can
It respectively selects engineering method appropriate to manufacture, such as may be selected with backing-off cutting, casting (casting), forging (forging), extrudes
(extruding), the engineering methods such as rolling (rolling), extrusion (squeezing) and etching.For example, the water of the present embodiment
Cold head 2, pedestal 22 may be selected to be formed by die casting mode, and three-dimensional structural member 24 then selects the mode of backing-off cutting (Skiving) to carry out shape
At the higher radiating fin of density.
In the present embodiment, since the pedestal 22 of water-cooling head 2 and stereochemical structure part 24 are to be fabricated separately, in material
Identical or different material or composition may be selected, such as copper, aluminium, stainless steel or the alloy for including an above-mentioned material may be selected,
Or selected from ceramics and graphite.For example, the pedestal 22 of water-cooling head 2 may be selected to be made by the preferable copper of heat-conducting effect,
And heat dissipation effect then may be selected preferably for solid structural member 24 or the aluminium of lighter in weight is as the consideration in material.In addition, this implementation
The water-cooling head 2 of example is in design, other than it can allow pedestal 22 that can be varied from material with stereochemical structure part 24,
It can be adjusted or select in the density, hardness or thermal coefficient of material, to meet product characteristic best group of arranging in pairs or groups out
It closes.
In addition, the pedestal 22 of water-cooling head 2 and stereochemical structure part 24, optional by welding (welding), soft soldering
(soldering), hard solder (brazing), crimping (pressing), riveting (riveting), be threadedly engaged (screw
Fastening) or viscose engages modes such as (adhesive joining) and fits together, and can also set between the two when necessary
It is equipped with scaling powder or other helps the material layer engaged.
In the present embodiment, the stereochemical structure part 24 in water-cooling head 2, major function are to increase to contact with working fluid
Area, therefore have the stereochemical structure of very multiple types available, for example, may be selected taper, column, plate, sheet, bumps or
The stereochemical structure of other common geometries.For example, stereochemical structure part 24 can be as shown in Figure 3A, is formed with taper
Fin 24A, can be as shown in Figure 3B, is formed with the fin 24B of column or plate, or as shown in Figure 3 C, form the fin of sheet
24C.In addition, stereochemical structure part 24 can be as shown in Figure 3D, skiving fin (Skived fin) 24E is set, between such fin
Gap is minimum, very high density, and when made by cutting processing procedure, does not just have to again by original pedestal in material and structure
The limitation of (such as side wall), therefore it is highly suitable for the invention essence proposed by the invention for being fabricated separately stereochemical structure part with pedestal
God.In addition, the fin of above-mentioned mentioned stereochemical structure part 24, can continuously or discontinuously, can also there is rule in orientation
Then property or the density for irregularly arranging, and arranging, height, the even spacing of adjacent fin also can optionally be given
To adjust or change, the present invention is not limited.
In addition, the pedestal 22 of water-cooling head 2 of the present invention, in addition to the stereochemical structure part for the different size that can arrange in pairs or groups according to demand
Except 24, can also arrange in pairs or groups multiple stereochemical structure parts simultaneously, and between this multiple stereochemical structure part, it can be in material, density, hardness
And it is identical or different on thermal coefficient, it also can be in the spacing isotactic of shape, arranging density, orientation, height and adjacent fin
It is identical or different on lattice.For example, the solid being exactly made of two stereochemical structure parts 241 and 242 shown by Fig. 3 E
Structural member 24, its fin 24F and 24G may be provided in chamber 23 and facing to chamber 23, and the two is in arranging density
And it is different in the spacing of adjacent fin, fin 24F is relatively low compared with the arranging density of fin 24G, the gap between fin
It is wider.It is thereby possible to select arrange for the first stereochemical structure part 241 to be positioned close to the place of 2 water intake end of water-cooling head, reduce into
The resistance of water end (W.E.), and the second stereochemical structure part 242 is then positioned close to the place of 2 water outlet of water-cooling head, or closer to fever
The place in source, allows working fluid that faster thermal energy is taken away.And the first stereoscopic member 241 and the second stereoscopic member 242 and pedestal 22
Between, it equally may be selected identical or different in the characteristics such as material, density, hardness and thermal coefficient.
In addition, water-cooling head provided by the present invention, since pedestal is two independently separated designs with stereochemical structure part, because
This especially suitable for pedestal there is the side wall or pedestal center that extend to lid direction to have recessed portion and can house stereochemical structure
Both pedestal-styles of part, this is because both pedestals have difference of height in the horizontal direction, if existing way is followed to exist
Pedestal center is integrally formed out stereochemical structure, is easy to be interfered by side wall or recessed portion, but provided according to the present embodiment
Design, then can solve the problems, such as such, smoothly fit in stereochemical structure part on the pedestal with side wall, or fit in pedestal
Recessed portion in.For example, if pedestal 22 used by the present embodiment, as shown in Figure 4 A and 4 B shown in FIG., in 22 center of pedestal
If being formed with a recessed portion 22D, since the horizontal surface of pedestal 22 is with the presence of at least two differences of height, just available
Stereochemical structure part 24 is mounted directly on pedestal 22 by the characteristics of pedestal 22 provided by the present invention is fabricated separately with stereochemical structure part 24
Recessed portion 22D, so that it may the combination both smoothly completed will not be influenced by 22 difference of height shape of pedestal.
In addition, the case where being displaced in an assembling process in order to avoid pedestal and stereochemical structure part, the present invention also can be
It is correspondingly formed location structure on pedestal and stereochemical structure part, for example, can be as shown in Fig. 5 A and Fig. 5 B, in stereochemical structure
An at least positioning column 243 is extended outward in the plane of 24 bottom side of part, and is then correspondingly arranged that can to accommodate this fixed on pedestal 22
The location hole 22E of position column 243, and when stereochemical structure part 24 is bonded or fits together as shown in Figure 5 B with pedestal 22, so that it may
It is automatically performed positioning, certainly, also can form positioning column in pedestal 22, and corresponding in stereochemical structure in other embodiment
Location hole is formed on part 24.
The foregoing is merely presently preferred embodiments of the present invention, is not limited to the present invention, therefore all other without departing from this
The lower equivalent change or modification completed of revealed spirit is invented, is intended to be limited solely by the concept of the invention of the present invention.
Claims (20)
1. a kind of water-cooling head, which is characterized in that including：
Lid；
A chamber is collectively formed with the lid in pedestal, the pedestal；And
Stereochemical structure part is set in the chamber, and the side of the stereochemical structure part is plane, which is bonded the pedestal, this is vertical
The other side of body structural member is fin.
2. water-cooling head as described in claim 1, which is characterized in that there is the pedestal one side wall, the side wall to be somebody's turn to do from the pedestal is past
Lid direction extends.
3. water-cooling head as described in claim 1, which is characterized in that the pedestal has a recessed portion, stereochemical structure part fitting
The recessed portion.
4. water-cooling head as described in claim 1, which is characterized in that the stereochemical structure part has an at least positioning column, this is at least
One positioning column extends outwardly from the plane, which has at least a positioning hole, to accommodate an at least positioning column.
5. water-cooling head as described in claim 1, which is characterized in that the pedestal and the stereochemical structure part are one of in the following manner
It is combined together：Welding, soft soldering, hard solder, crimping, rivet, be threadedly engaged and viscose engagement.
6. water-cooling head as described in claim 1, which is characterized in that the stereochemical structure part and the pedestal are identical in following properties
Or it is different, which includes：Material, density, hardness and thermal coefficient.
7. water-cooling head as described in claim 1, which is characterized in that the fin is skiving fin.
8. a kind of water-cooling head, which is characterized in that including：
Lid；
A chamber is collectively formed with the lid in pedestal, the pedestal；And
Stereochemical structure part is set in the chamber and is bonded the pedestal；
Wherein, the stereochemical structure part is identical or different in following properties as the pedestal, which includes：Material, density, hardness
And thermal coefficient.
9. water-cooling head as claimed in claim 8, which is characterized in that there is the pedestal one side wall, the side wall to be somebody's turn to do from the pedestal is past
Lid direction extends.
10. water-cooling head as claimed in claim 8, which is characterized in that the pedestal has a recessed portion, stereochemical structure part fitting
The recessed portion.
11. water-cooling head as claimed in claim 8, which is characterized in that the stereochemical structure part has an at least positioning column, this is at least
One positioning column extends outwardly from the side that the stereochemical structure part is bonded with the pedestal, which has at least a positioning hole, to
Accommodate an at least positioning column.
12. water-cooling head as claimed in claim 8, which is characterized in that the pedestal and the stereochemical structure part be in the following manner it
One is combined together：Welding, soft soldering, hard solder, crimping, rivet, be threadedly engaged and viscose engagement.
13. water-cooling head as claimed in claim 8, which is characterized in that the side of the stereochemical structure part is bonded the pedestal, the solid
The other side of structural member is fin, which is skiving fin.
14. a kind of water-cooling head, which is characterized in that including：
Lid；
A chamber is collectively formed with the lid in pedestal, the pedestal；
First stereochemical structure part is set in the chamber and is bonded the pedestal, and the first stereochemical structure part is in face of the chamber one
Side is provided with the first fin；And
Second stereochemical structure part is set in the chamber and is bonded the pedestal, and the second stereochemical structure part is in face of the chamber one
Side is provided with the second fin.
15. water-cooling head as claimed in claim 14, which is characterized in that the first stereochemical structure part and second stereochemical structure
Part, identical or different in following properties, which includes：Material, density, hardness and thermal coefficient.
16. water-cooling head as claimed in claim 14, which is characterized in that first fin and second fin, in following properties
Upper identical or different, which includes the spacing of shape, arranging density, orientation, height and adjacent fin.
17. water-cooling head as claimed in claim 14, which is characterized in that the first stereochemical structure part and second stereochemical structure
Part is to fit in the pedestal one of in the following manner：Welding soft soldering, hard solder, crimping, is riveted, is threadedly engaged and viscose connects
It closes.
18. water-cooling head as claimed in claim 14, which is characterized in that the first stereochemical structure part is with the pedestal in following properties
Upper identical or different, which includes：Material, density, hardness and thermal coefficient.
19. water-cooling head as claimed in claim 14, which is characterized in that the second stereochemical structure part is with the pedestal in following properties
Upper identical or different, which includes：Material, density, hardness and thermal coefficient.
20. water-cooling head as claimed in claim 14, which is characterized in that the first stereochemical structure part enters close to the one of the water-cooling head
Water end (W.E.), the second stereochemical structure part is close to a water outlet of the water-cooling head.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762445792P | 2017-01-13 | 2017-01-13 | |
| US62/445,792 | 2017-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108302970A true CN108302970A (en) | 2018-07-20 |
Family
ID=62870283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711297737.4A Pending CN108302970A (en) | 2017-01-13 | 2017-12-08 | Water-cooling head |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108302970A (en) |
| TW (1) | TW201826470A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3993587A1 (en) * | 2020-11-02 | 2022-05-04 | Sungrow Power Supply Co., Ltd. | Water-cooler heat dissipation device and electrical device |
| CN114610133A (en) * | 2022-04-02 | 2022-06-10 | 广东德瑞源新材料科技有限公司 | Semi-solid die-casting formed radiator and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI709017B (en) * | 2018-09-18 | 2020-11-01 | 大陸商深圳興奇宏科技有限公司 | Securing structure for water-cooling head |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1980560A (en) * | 2005-11-29 | 2007-06-13 | 讯凯国际股份有限公司 | Water-cooling type radiating structure and mfg. method |
| CN101094580A (en) * | 2006-06-19 | 2007-12-26 | 讯凯国际股份有限公司 | Device of water cooling head, and manufacturing method |
| CN104238698A (en) * | 2014-08-01 | 2014-12-24 | 北京市鑫全盛商贸有限公司 | Water cooling head for water cooling type CPU (central processing unit) heat radiator |
| TWM529202U (en) * | 2016-04-01 | 2016-09-21 | 雙鴻科技股份有限公司 | A heat dissipating device |
-
2017
- 2017-12-08 CN CN201711297737.4A patent/CN108302970A/en active Pending
- 2017-12-08 TW TW106143189A patent/TW201826470A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1980560A (en) * | 2005-11-29 | 2007-06-13 | 讯凯国际股份有限公司 | Water-cooling type radiating structure and mfg. method |
| CN101094580A (en) * | 2006-06-19 | 2007-12-26 | 讯凯国际股份有限公司 | Device of water cooling head, and manufacturing method |
| CN104238698A (en) * | 2014-08-01 | 2014-12-24 | 北京市鑫全盛商贸有限公司 | Water cooling head for water cooling type CPU (central processing unit) heat radiator |
| TWM529202U (en) * | 2016-04-01 | 2016-09-21 | 雙鴻科技股份有限公司 | A heat dissipating device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3993587A1 (en) * | 2020-11-02 | 2022-05-04 | Sungrow Power Supply Co., Ltd. | Water-cooler heat dissipation device and electrical device |
| CN114610133A (en) * | 2022-04-02 | 2022-06-10 | 广东德瑞源新材料科技有限公司 | Semi-solid die-casting formed radiator and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201826470A (en) | 2018-07-16 |
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