US20070124934A1 - Water Block And Manufacturing Method Thereof - Google Patents
Water Block And Manufacturing Method Thereof Download PDFInfo
- Publication number
- US20070124934A1 US20070124934A1 US11/549,673 US54967306A US2007124934A1 US 20070124934 A1 US20070124934 A1 US 20070124934A1 US 54967306 A US54967306 A US 54967306A US 2007124934 A1 US2007124934 A1 US 2007124934A1
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- United States
- Prior art keywords
- casing
- water block
- heat
- water
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 72
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 25
- 238000005245 sintering Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 8
- 238000007493 shaping process Methods 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- 239000002826 coolant Substances 0.000 abstract description 32
- 230000000694 effects Effects 0.000 description 19
- 238000001816 cooling Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Definitions
- the present invention relates to a water-cooling heat dissipating structure and its manufacturing method, and more particularly to a water block applicable for electronic components and its manufacturing method.
- any electric appliance may cause overheats inevitably due to the issue of efficiency or friction.
- products produced by manufacturers of the present technological industry such as integrated circuits and personal electronic products tend to be developed with a high precision. Besides the minimization of volume, these products (particularly computers) also produce increasingly more heat. Since the operation performance of these products is enhanced continuously, the overall heat quantity produced by computes is also increased accordingly, and the main heat source no longer limits to CPU only, but high-speed devices including chip modules, graphic processing units, dynamic random access memories and hard disks also produce a considerable amount of heat.
- a fan is a simple, easy and popular heat dissipating device which can produce a fast flow of air around a heat generating component by vanes, and quickly carry away the heat produced by heat generating components to achieve the heat dissipation effect, but the heat dissipating effect may not be able to satisfy the efficiency required for the heat conduction due to an insufficient heat dissipating area, and thus the actual heat dissipating efficiency is below the expected efficiency.
- a plurality of heat sink structures may be attached onto heat generating components, such arrangement can increase the heat dissipating area and improve the thermal conducting efficiency.
- a fan can be used for blowing and carrying away the heat source compulsorily, but the airflow volume of the fan is very limited, and the heat dissipating effect still cannot be improved effectively.
- prior arts try to improve the airflow volume by connecting a plurality of fans in series, but such arrangement is limited by the available space and it is very difficult to implement.
- an increase of the rotary speed of a motor for improving the airflow volume gives rise to a higher level of difficulty for manufacturing the motor, and the increase of the rotary speed of a motor has an upper limit, and even causes noises, vibrations and heat easily. All of the aforementioned factors make it difficult to achieve the required heat dissipating effect.
- a prior art discloses a water-cooling heat dissipating device that adopts a water block attached onto a heat generating component such as a CPU or a disk drive and uses a motor to pump a coolant from a water tank into a water block.
- the coolant flows from the water block to a heat dissipating module, and then returns to the water tank after the coolant is cooled, so that the circulation of coolant can assist the heat dissipation and lower the temperature of the heat generating components to maintain a normal operation of the system.
- the water block body 101 has a plurality of heat sinks 102 attached onto an internal side of the water block body 191 to form a plurality of unidirectional channels 103 , and the plurality of heat sinks 102 can increase the heat dissipating area.
- a heat exchange is performed between the coolant and the heat sinks 102 to improve the heat dissipating effect.
- the heat sinks 102 can increase the heat dissipating area, and the plurality of channels 103 formed in the heat sinks 102 can direct the flow of the coolant in the water block, such that the contact surface area of the coolant and the plurality of heat sinks 102 can be increased greatly to perform the heat exchange.
- the space available in the unidirectional channels 103 is not close enough, and thus the coolant will pass through the unidirectional channels 103 too quickly, and its staying time cannot be improved.
- the coolant cannot achieve the effect of absorbing enough heat of the heat source which is absorbed by the heat sinks 102 , nor enhancing the heat dissipating effect.
- Such prior arts definitely require further improvements.
- the present invention is to provide a water block having porous microchannels and its manufacturing method, and a thermal conducting powder is sintered to form a porous microchannel structure that can produce a turbulent flow effect on a coolant and greatly improve the staying time of coolant at the water block. Meanwhile, the contact surface area formed by the porous microchannel structure produces a heat exchange effect, such that the coolant can greatly absorb the heat of a heat source conducted from a heat generating component, so as to effectively enhance the heat dissipating effect.
- FIG. 1 is an exploded view of a water block of a prior art
- FIG. 2 is a perspective view of a water block of the present invention
- FIG. 3 is an exploded view of a water block of the present invention
- FIG. 4 is a schematic view of manufacturing a porous microchannel structure in accordance with the present invention.
- FIG. 5 is a schematic view of shaping a porous microchannel structure in accordance with the present invention.
- FIG. 6 is a schematic view of a porous microchannel structure in accordance with the present invention.
- FIG. 7 is a schematic view of operating a porous microchannel structure in accordance with the present invention.
- FIG. 8 is a flow chart of a manufacturing method in accordance with the present invention.
- FIG. 9 is a schematic view of a porous microchannel structure in accordance with another preferred embodiment of the present invention.
- FIG. 10 is a schematic view of a granular structure in accordance with a preferred embodiment of the present invention.
- FIG. 11 is a schematic view of parallel heat sink structures in accordance with the present invention.
- FIG. 12 is a schematic view of parallel heat sink granular structures in accordance with the present invention.
- FIG. 13 is a schematic view of a heat column in accordance with the present invention.
- FIG. 14 is a schematic view of a granular structure of a heat column in accordance with the present invention.
- FIG. 15 is a schematic view of a porous microchannel structure in accordance with another preferred embodiment of the present invention.
- FIG. 16 is a schematic view of a granular structure in accordance with a further preferred embodiment of the present invention.
- a water block body 1 of the invention comprises a first casing 11 and a second casing 12 engaged with each other to form a hollow sealed box body, and the shape of the water block body 1 can be varied appropriately according to different requirements.
- the first casing 11 and the second casing 12 of this embodiment are cuboids (but not limited to such arrangement) made of a metal material or a ceramic material.
- the first casing 11 and the second casing 12 are coupled by soldering, riveting or binding.
- the first casing 11 has a water inlet pipe 111 and a water outlet pipe 112 extended outward (or upward) from both left and right ends of the first casing 11 respectively and provided for the coolant to enter and exit the water block body 1 .
- the second casing 12 has a contact surface 121 at the bottom of the second casing 12 for contacting a heat source (not shown in the figure).
- the second casing 12 of the water block body 1 further comprises a microchannel structure 122 disposed on an internal side of the second casing 12 , and the microchannel structure 122 is made by sintering a thermal conducting powder 2 , such that the porous structures with fine particles form a plurality of substantial microchannels, and the thermal conducting powder 2 is made of a metal material (such as copper) or a ceramic material.
- a power 2 is added (or not added) with a binder (such as stearic acid or wax) and shaped into a circular shape, a square shape, or an irregular shape by a shaping machine, and then the shaped powder 2 is put into a tooling 3 having the same shape of a shaping mold, and the tooling 3 is put at a predetermined position of an internal side of the second casing 12 as shown in FIG. 5 , and then the binder in the tooling 3 is removed, and the powders 2 are bound with each other to form a porous structure and attached on the surfaces of panels of the second casing 12 .
- a binder such as stearic acid or wax
- the powders 2 form the foregoing microchannel structure 122 as shown in FIG. 6 .
- the first casing 11 and the second casing 12 are coupled by soldering, riveting or binding to accomplish the water block body 1 .
- the method comprises the steps of: pressing and shaping a thermal conducting powder 2 (Step S 1 ), putting a tooling 3 at a predetermined position of a second casing 12 and then putting the whole pressed and shaped powder 2 into the tooling 3 (Step S 2 ), and gaps are formed naturally between fine particles, and the powders 2 are combined by sintering to form a microchannel structure 122 (Step S 3 ), and then coupling the first casing 11 and the second casing 12 by soldering, riveting or binding, and finally completing the procedure of manufacturing the water block body 1 (Step S 4 ).
- the water block body 1 is attached onto a heat generating component 4 (which is a CPU or any other heat generating chip), and the contact surface 121 absorbs the heat of a heat source on the heat generating component 4 , and conducts the heat of the heat source to the microchannel structure 122 at the internal side of the water block body 1 , such that after the coolant is directed from the water inlet pipe 111 to the water block body 1 (wherein an arrowhead in FIG. 7 indicates the direction of a water flow), the turbulent flow effect of the microchannel structure 122 greatly extends the staying time of the coolant at the water block body.
- the thermal conducting materials of the coolant and the microchannel structure 122 perform a heat exchange to absorb enough heat and then discharge the heat from the water outlet pipe 112 , so as to achieve the required heat dissipating effect.
- the first casing 11 and second casing 12 are perpendicular to a plurality of heat sinks (or fins) 113 , 123 on the panel, and the heat sinks 113 , 123 form a plurality of intervals which are arranged alternately, and the intervals are interconnected with each other to form circuitous unidirectional channels.
- the microchannel structure 122 made of a thermal conducting powder 2 is put into the intervals, wherein the microchannel structure 122 can be made of square particles of different sizes as shown in FIG.
- the contact surface 121 of the water block body 1 absorbs the heat of a heat source and conducts the heat to the heat sink 113 , 123 and dissipates the heat to the microchannel structure 122 made of the powder 2 .
- the turbulent flow effect of the microchannel structure 122 performs a heat exchange with the plurality of heat sinks 113 , 123 and the microchannel structure 122 , such that the coolant can carry away the heat of the heat source and flow out from the water outlet pipe 112 , so as to achieve the required heat dissipating effect.
- the microchannel structure 122 is a structure in the shape of a long strip, and the microchannel structure 122 can be a circular granular structure made of powders 2 of different sizes as shown in FIG. 12 .
- one or more heat columns 5 are installed at a predetermined position of the microchannel structure 122 of the second casing 12 and erected from a panel on an internal side of the second casing 12 as shown in FIG. 13 (which illustrates an embodiment having one heat column 5 ), and the microchannel structures 122 formed by sintering the thermal conducting powder 2 are set around the heat column 5 , wherein the microchannel structure 122 can be a granular structure made by sintering powders 2 of different sizes as shown in FIG. 14 .
- the first casing 11 has a third pipe 114 aligned precisely with the contact surface 121
- the microchannel structure 122 installed in the water block body 1 has a hollow opening aligned precisely with the position of a third pipe 114 , such that after the coolant is directed from the third pipe 114 , the coolant flows directly through the contact surface 121 attached with the heat generating component 4 and has a direct heat exchange effect with the contact surface 121 , and then the heat is discharged from the water outlet pipe 112 of the porous microchannel structure 121 , and thus the number of pipes is not limited.
- the microchannel structure 122 could be made of circular granular powders of different sizes as shown in FIG. 16 .
Abstract
In a water block and its manufacturing method, a porous microchannel structure adopts a first casing and a second casing to form a water block. Water inlet and outlet pipes are extended from both ends of the first casing respectively. The second casing has a porous microchannel structure made by sintering a heat conducting powder and formed on an internal side of the second casing. The second casing has a contact surface on its external side for absorbing and conducting a heat source to the porous microchannel structure, such that a coolant can flow from the water inlet pipe into the water block. The porous microchannel structure produces turbulent flows to the coolant, so as to extend the staying time of the coolant in the water block, and allow the coolant to fully exchange heat with the porous microchannel structure and flow out from the water outlet pipe.
Description
- 1. Field of the Invention
- The present invention relates to a water-cooling heat dissipating structure and its manufacturing method, and more particularly to a water block applicable for electronic components and its manufacturing method.
- 2. Description of Prior Art
- The operation of any electric appliance may cause overheats inevitably due to the issue of efficiency or friction. Particularly, products produced by manufacturers of the present technological industry such as integrated circuits and personal electronic products tend to be developed with a high precision. Besides the minimization of volume, these products (particularly computers) also produce increasingly more heat. Since the operation performance of these products is enhanced continuously, the overall heat quantity produced by computes is also increased accordingly, and the main heat source no longer limits to CPU only, but high-speed devices including chip modules, graphic processing units, dynamic random access memories and hard disks also produce a considerable amount of heat. To maintain the normal operation of a computer within a permitted operating temperature range, we rely on additional heat dissipating devices to prevent overheats and adverse effects on computer components.
- A fan is a simple, easy and popular heat dissipating device which can produce a fast flow of air around a heat generating component by vanes, and quickly carry away the heat produced by heat generating components to achieve the heat dissipation effect, but the heat dissipating effect may not be able to satisfy the efficiency required for the heat conduction due to an insufficient heat dissipating area, and thus the actual heat dissipating efficiency is below the expected efficiency. Although a plurality of heat sink structures may be attached onto heat generating components, such arrangement can increase the heat dissipating area and improve the thermal conducting efficiency. Further, a fan can be used for blowing and carrying away the heat source compulsorily, but the airflow volume of the fan is very limited, and the heat dissipating effect still cannot be improved effectively. Thus, prior arts try to improve the airflow volume by connecting a plurality of fans in series, but such arrangement is limited by the available space and it is very difficult to implement. Furthermore, an increase of the rotary speed of a motor for improving the airflow volume gives rise to a higher level of difficulty for manufacturing the motor, and the increase of the rotary speed of a motor has an upper limit, and even causes noises, vibrations and heat easily. All of the aforementioned factors make it difficult to achieve the required heat dissipating effect.
- In view of the description above, there are limitations on the breakthrough of the improvement of fan performance, heat dissipating effect, and temperature drop. To meet the heat dissipating requirements for electronic components operated at a high speed, it is necessary to find other feasible solutions. A prior art discloses a water-cooling heat dissipating device that adopts a water block attached onto a heat generating component such as a CPU or a disk drive and uses a motor to pump a coolant from a water tank into a water block. After the heat produced by heat generating components is absorbed by the water block and the coolant has a heat exchange with the water block, the coolant flows from the water block to a heat dissipating module, and then returns to the water tank after the coolant is cooled, so that the circulation of coolant can assist the heat dissipation and lower the temperature of the heat generating components to maintain a normal operation of the system.
- Although the heat exchange between the water block and the coolant is conducted by letting the coolant flow through the water block and the heat source, a heat dissipating effect that is better than the airflow heat dissipation can be achieved. However, the heat absorbing surfaces of the foregoing water block is concentrated at the same spot, and thus only a portion of the coolant entering into the water block can have a heat exchange at the heat absorbing surface, and the staying time of the coolant in the water block is too short. As a result, the coolant will flow out from another pipe before the coolant absorbs enough heat from the heat source, and the effect of the water-cooling heat dissipation will become very limited. Another prior art discloses a water-cooling heat dissipating structure as shown in
FIG. 1 , and thewater block body 101 has a plurality ofheat sinks 102 attached onto an internal side of the water block body 191 to form a plurality ofunidirectional channels 103, and the plurality ofheat sinks 102 can increase the heat dissipating area. After the coolant is directed into thewater block body 101 and passed through the plurality ofunidirectional channels 103, a heat exchange is performed between the coolant and theheat sinks 102 to improve the heat dissipating effect. - In the foregoing heat dissipating structure, the
heat sinks 102 can increase the heat dissipating area, and the plurality ofchannels 103 formed in theheat sinks 102 can direct the flow of the coolant in the water block, such that the contact surface area of the coolant and the plurality ofheat sinks 102 can be increased greatly to perform the heat exchange. However, the space available in theunidirectional channels 103 is not close enough, and thus the coolant will pass through theunidirectional channels 103 too quickly, and its staying time cannot be improved. As a result, the coolant cannot achieve the effect of absorbing enough heat of the heat source which is absorbed by theheat sinks 102, nor enhancing the heat dissipating effect. Such prior arts definitely require further improvements. - In view of the foregoing shortcomings of the prior art, the inventor of the present invention based on years of experience in the related industry to conduct experiments and modifications, and finally designed a water block and its manufacturing method in accordance with the present invention.
- Therefore, the present invention is to provide a water block having porous microchannels and its manufacturing method, and a thermal conducting powder is sintered to form a porous microchannel structure that can produce a turbulent flow effect on a coolant and greatly improve the staying time of coolant at the water block. Meanwhile, the contact surface area formed by the porous microchannel structure produces a heat exchange effect, such that the coolant can greatly absorb the heat of a heat source conducted from a heat generating component, so as to effectively enhance the heat dissipating effect.
- The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself however may be best understood by reference to the following detailed description of the invention, which describes certain exemplary embodiments of the invention, taken in conjunction with the accompanying drawings in which:
-
FIG. 1 is an exploded view of a water block of a prior art; -
FIG. 2 is a perspective view of a water block of the present invention; -
FIG. 3 is an exploded view of a water block of the present invention; -
FIG. 4 is a schematic view of manufacturing a porous microchannel structure in accordance with the present invention; -
FIG. 5 is a schematic view of shaping a porous microchannel structure in accordance with the present invention; -
FIG. 6 is a schematic view of a porous microchannel structure in accordance with the present invention; -
FIG. 7 is a schematic view of operating a porous microchannel structure in accordance with the present invention; -
FIG. 8 is a flow chart of a manufacturing method in accordance with the present invention; -
FIG. 9 is a schematic view of a porous microchannel structure in accordance with another preferred embodiment of the present invention; -
FIG. 10 is a schematic view of a granular structure in accordance with a preferred embodiment of the present invention; -
FIG. 11 is a schematic view of parallel heat sink structures in accordance with the present invention; -
FIG. 12 is a schematic view of parallel heat sink granular structures in accordance with the present invention; -
FIG. 13 is a schematic view of a heat column in accordance with the present invention; -
FIG. 14 is a schematic view of a granular structure of a heat column in accordance with the present invention; -
FIG. 15 is a schematic view of a porous microchannel structure in accordance with another preferred embodiment of the present invention; and -
FIG. 16 is a schematic view of a granular structure in accordance with a further preferred embodiment of the present invention. - The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings. However, the drawings are provided for reference and illustration only and are not intended for limiting the scope of the invention.
- Referring to
FIG. 2 , awater block body 1 of the invention comprises afirst casing 11 and asecond casing 12 engaged with each other to form a hollow sealed box body, and the shape of thewater block body 1 can be varied appropriately according to different requirements. Thefirst casing 11 and thesecond casing 12 of this embodiment are cuboids (but not limited to such arrangement) made of a metal material or a ceramic material. Thefirst casing 11 and thesecond casing 12 are coupled by soldering, riveting or binding. In addition, thefirst casing 11 has awater inlet pipe 111 and awater outlet pipe 112 extended outward (or upward) from both left and right ends of thefirst casing 11 respectively and provided for the coolant to enter and exit thewater block body 1. Thesecond casing 12 has acontact surface 121 at the bottom of thesecond casing 12 for contacting a heat source (not shown in the figure). - Referring to
FIG. 3 for an exploded view of the present invention, thesecond casing 12 of thewater block body 1 further comprises amicrochannel structure 122 disposed on an internal side of thesecond casing 12, and themicrochannel structure 122 is made by sintering a thermal conductingpowder 2, such that the porous structures with fine particles form a plurality of substantial microchannels, and the thermal conductingpowder 2 is made of a metal material (such as copper) or a ceramic material. - Referring to
FIG. 4 for a method of manufacturing thewater block body 1 in accordance with the present invention, apower 2 is added (or not added) with a binder (such as stearic acid or wax) and shaped into a circular shape, a square shape, or an irregular shape by a shaping machine, and then theshaped powder 2 is put into atooling 3 having the same shape of a shaping mold, and thetooling 3 is put at a predetermined position of an internal side of thesecond casing 12 as shown inFIG. 5 , and then the binder in thetooling 3 is removed, and thepowders 2 are bound with each other to form a porous structure and attached on the surfaces of panels of thesecond casing 12. After thetooling 3 is removed, thepowders 2 form theforegoing microchannel structure 122 as shown inFIG. 6 . Referring toFIG. 7 , thefirst casing 11 and thesecond casing 12 are coupled by soldering, riveting or binding to accomplish thewater block body 1. - Referring to
FIG. 8 for a flow chart of a method of manufacturing thewater block body 1 in accordance with the present invention, the method comprises the steps of: pressing and shaping a thermal conducting powder 2 (Step S1), putting atooling 3 at a predetermined position of asecond casing 12 and then putting the whole pressed and shapedpowder 2 into the tooling 3 (Step S2), and gaps are formed naturally between fine particles, and thepowders 2 are combined by sintering to form a microchannel structure 122 (Step S3), and then coupling thefirst casing 11 and thesecond casing 12 by soldering, riveting or binding, and finally completing the procedure of manufacturing the water block body 1 (Step S4). - Referring to
FIG. 7 , thewater block body 1 is attached onto a heat generating component 4 (which is a CPU or any other heat generating chip), and thecontact surface 121 absorbs the heat of a heat source on theheat generating component 4, and conducts the heat of the heat source to themicrochannel structure 122 at the internal side of thewater block body 1, such that after the coolant is directed from thewater inlet pipe 111 to the water block body 1 (wherein an arrowhead inFIG. 7 indicates the direction of a water flow), the turbulent flow effect of themicrochannel structure 122 greatly extends the staying time of the coolant at the water block body. As a result, the thermal conducting materials of the coolant and themicrochannel structure 122 perform a heat exchange to absorb enough heat and then discharge the heat from thewater outlet pipe 112, so as to achieve the required heat dissipating effect. - Referring to
FIG. 9 for another preferred embodiment of the present invention, thefirst casing 11 andsecond casing 12 are perpendicular to a plurality of heat sinks (or fins) 113, 123 on the panel, and theheat sinks microchannel structure 122 made of a thermal conductingpowder 2 is put into the intervals, wherein themicrochannel structure 122 can be made of square particles of different sizes as shown inFIG. 10 , such that when thecontact surface 121 of thewater block body 1 is attached onto theheat generating component 4, thecontact surface 121 absorbs the heat of a heat source and conducts the heat to theheat sink microchannel structure 122 made of thepowder 2. After the coolant is directed from thewater inlet pipe 111 to the circuitous unidirectional channels, the turbulent flow effect of themicrochannel structure 122 performs a heat exchange with the plurality ofheat sinks microchannel structure 122, such that the coolant can carry away the heat of the heat source and flow out from thewater outlet pipe 112, so as to achieve the required heat dissipating effect. Referring toFIG. 11 , only a plurality ofheat sinks 123 are set perpendicularly to a panel of thesecond casing 12 and form a plurality of parallel channels, and then themicrochannel structure 122 made by sintering thepowder 2 is put into the channels. Themicrochannel structure 122 is a structure in the shape of a long strip, and themicrochannel structure 122 can be a circular granular structure made ofpowders 2 of different sizes as shown inFIG. 12 . - Further, one or
more heat columns 5 are installed at a predetermined position of themicrochannel structure 122 of thesecond casing 12 and erected from a panel on an internal side of thesecond casing 12 as shown inFIG. 13 (which illustrates an embodiment having one heat column 5), and themicrochannel structures 122 formed by sintering the thermal conductingpowder 2 are set around theheat column 5, wherein themicrochannel structure 122 can be a granular structure made by sinteringpowders 2 of different sizes as shown inFIG. 14 . - Referring to
FIG. 15 for a further preferred embodiment of the present invention, thefirst casing 11 has athird pipe 114 aligned precisely with thecontact surface 121, while themicrochannel structure 122 installed in thewater block body 1 has a hollow opening aligned precisely with the position of athird pipe 114, such that after the coolant is directed from thethird pipe 114, the coolant flows directly through thecontact surface 121 attached with theheat generating component 4 and has a direct heat exchange effect with thecontact surface 121, and then the heat is discharged from thewater outlet pipe 112 of theporous microchannel structure 121, and thus the number of pipes is not limited. In addition, themicrochannel structure 122 could be made of circular granular powders of different sizes as shown inFIG. 16 . - The present invention is illustrated with reference to the preferred embodiment and not intended to limit the patent scope of the present invention. Various substitutions and modifications have suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
Claims (16)
1. A water block, comprising:
a water block body, being a hollow box, and having at least one water inlet pipe and at least one water outlet pipe; and
at least one microchannel structure, being a porous structure formed by a powder and disposed in the water block body.
2. The water block of claim 1 , wherein the water block body has a contact surface at a bottom surface of the water block body.
3. The water block of claim 1 , wherein the water block body is made of a metal material or a ceramic material.
4. The water block of claim 1 , wherein the water block body comprises a first casing and a second casing engaged with each other.
5. The water block of claim 4 , wherein the second casing further includes a plurality of heat sinks.
6. The water block of claim 5 , wherein the heat sinks are parallel to each other.
7. The water block of claim 4 , wherein the second casing further includes at least one heat column.
8. The water block of claim 4 , wherein the first casing and the second casing have a plurality of heat sinks.
9. The water block of claim 8 , wherein the heat sinks of the first casing and the second casing are arranged alternately.
10. A method of manufacturing a water block, comprising the steps of:
preparing a first casing and a second casing;
pressing and shaping a powder;
putting a tooling at a predetermined position of a second casing;
putting the powder in the tooling;
sintering the powder into a porous microchannel structure; and
coupling the first casing and the second casing to form a water block body.
11. The method of claim 10 , further comprising a step of adding a binder on the powder.
12. The method of claim 11 , wherein the binder is one selected from stearic acid and wax.
13. The method of claim 10 , wherein a shaping machine is used for pressing and shaping the powder.
14. The method of claim 10 , wherein the powder is pressed and shaped in a shape selected from the collection of a circular shape, a square shape, and an irregular shape.
15. The method of claim 10 , wherein the powder is pressed and shaped in a particle in a shape selected from the collection of a circular shape, a square shape, and an irregular shape.
16. The method of claim 10 , wherein the first casing and the second casing are coupled by soldering, riveting, or binding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/971,878 US20080105413A1 (en) | 2006-10-16 | 2008-01-09 | Manufacturing Method of Water Block |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094142444A TW200724010A (en) | 2005-12-02 | 2005-12-02 | Water-cooling head and the manufacturing method |
TW0941424444 | 2005-12-02 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/971,878 Continuation-In-Part US20080105413A1 (en) | 2006-10-16 | 2008-01-09 | Manufacturing Method of Water Block |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070124934A1 true US20070124934A1 (en) | 2007-06-07 |
Family
ID=38117274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/549,673 Abandoned US20070124934A1 (en) | 2005-12-02 | 2006-10-16 | Water Block And Manufacturing Method Thereof |
Country Status (2)
Country | Link |
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US (1) | US20070124934A1 (en) |
TW (1) | TW200724010A (en) |
Cited By (10)
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WO2016150303A1 (en) * | 2015-03-23 | 2016-09-29 | 邱于正 | Porous heat exchanger |
WO2016207712A1 (en) * | 2015-06-26 | 2016-12-29 | Reisser Heinz-Gustav A | Liquid-cooled heat sink |
CN108539320A (en) * | 2018-03-22 | 2018-09-14 | 北京北交新能科技有限公司 | Flexible-packed battery module microchannel water cooling heat exchanger |
US20190162483A1 (en) * | 2017-11-29 | 2019-05-30 | Honda Motor Co., Ltd. | Cooling apparatus |
US20200149829A1 (en) * | 2017-08-02 | 2020-05-14 | Mitsubishi Materials Corporation | Heatsink |
WO2020200721A1 (en) * | 2019-04-04 | 2020-10-08 | Siemens Aktiengesellschaft | Device for dissipating heat from electrical and/or electronic components |
US11306980B2 (en) * | 2020-09-08 | 2022-04-19 | Inventec (Pudong) Technology Corporation | Heat sink and thermal dissipation system |
EP4053895A1 (en) * | 2021-03-03 | 2022-09-07 | Ovh | Water block assembly having an insulating housing |
US11465194B2 (en) * | 2020-09-29 | 2022-10-11 | Ping-Tsang Shih | Combinational heatsink tube for intercooler |
US11644254B2 (en) | 2018-09-04 | 2023-05-09 | Ovh | Thermal transfer device having a fluid conduit |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107995837A (en) * | 2017-12-28 | 2018-05-04 | 深圳红河马智能数字动力技术有限公司 | Air-cooled, water cooling two uses radiator |
CN112203476B (en) * | 2020-10-12 | 2022-11-15 | 上海海事大学 | Porous medium liquid film small channel cooling device |
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US5123982A (en) * | 1990-06-29 | 1992-06-23 | The United States Of American As Represented By The United States Department Of Energy | Process of making cryogenically cooled high thermal performance crystal optics |
US5239200A (en) * | 1991-08-21 | 1993-08-24 | International Business Machines Corporation | Apparatus for cooling integrated circuit chips |
US20050067155A1 (en) * | 2003-09-02 | 2005-03-31 | Thayer John Gilbert | Heat pipe evaporator with porous valve |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016150303A1 (en) * | 2015-03-23 | 2016-09-29 | 邱于正 | Porous heat exchanger |
WO2016207712A1 (en) * | 2015-06-26 | 2016-12-29 | Reisser Heinz-Gustav A | Liquid-cooled heat sink |
US20200149829A1 (en) * | 2017-08-02 | 2020-05-14 | Mitsubishi Materials Corporation | Heatsink |
US20190162483A1 (en) * | 2017-11-29 | 2019-05-30 | Honda Motor Co., Ltd. | Cooling apparatus |
CN108539320A (en) * | 2018-03-22 | 2018-09-14 | 北京北交新能科技有限公司 | Flexible-packed battery module microchannel water cooling heat exchanger |
US11644254B2 (en) | 2018-09-04 | 2023-05-09 | Ovh | Thermal transfer device having a fluid conduit |
WO2020200721A1 (en) * | 2019-04-04 | 2020-10-08 | Siemens Aktiengesellschaft | Device for dissipating heat from electrical and/or electronic components |
US11306980B2 (en) * | 2020-09-08 | 2022-04-19 | Inventec (Pudong) Technology Corporation | Heat sink and thermal dissipation system |
US11465194B2 (en) * | 2020-09-29 | 2022-10-11 | Ping-Tsang Shih | Combinational heatsink tube for intercooler |
EP4053895A1 (en) * | 2021-03-03 | 2022-09-07 | Ovh | Water block assembly having an insulating housing |
Also Published As
Publication number | Publication date |
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TW200724010A (en) | 2007-06-16 |
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Legal Events
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AS | Assignment |
Owner name: COOLER MASTER CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:PENG, YU-HUANG;REEL/FRAME:018392/0170 Effective date: 20060728 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |