CN112151478A - Micro-channel radiator and preparation method and application thereof - Google Patents
Micro-channel radiator and preparation method and application thereof Download PDFInfo
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- CN112151478A CN112151478A CN202010894841.7A CN202010894841A CN112151478A CN 112151478 A CN112151478 A CN 112151478A CN 202010894841 A CN202010894841 A CN 202010894841A CN 112151478 A CN112151478 A CN 112151478A
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- 238000002360 preparation method Methods 0.000 title description 5
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 18
- 239000000956 alloy Substances 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- 239000002826 coolant Substances 0.000 claims description 40
- 239000012530 fluid Substances 0.000 claims description 20
- 238000005530 etching Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 238000003754 machining Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000012549 training Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 22
- 230000003446 memory effect Effects 0.000 description 14
- 230000000694 effects Effects 0.000 description 11
- 238000012546 transfer Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- 238000005086 pumping Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The disclosure relates to the field of electronic device heat dissipation, and particularly provides a micro-channel heat sink and application thereof. The micro-channel radiator comprises a substrate, wherein a plurality of fins are distributed on the substrate in parallel, a micro-channel is formed between two adjacent fins, and a plurality of pin fin structures are arranged in the micro-channel; the fin is made of a two-way memory alloy material, grooves are formed in the fin under the heating condition, each pin fin structure corresponds to one groove, and any two adjacent grooves are staggered. The micro-channel radiator solves the problems that in the prior art, the micro-channel radiator is low in heat dissipation efficiency, and the balance relation between the effective heat exchange area and the thermal resistance pressure drop is poor.
Description
Technical Field
The disclosure relates to the field of electronic device heat dissipation, and particularly provides a micro-channel heat sink and a preparation method and application thereof.
Background
The statements herein merely provide background information related to the present disclosure and may not necessarily constitute prior art.
With the development of scientific technology, the development of electronic devices tends to be miniaturized and speeded up, and chips have become the most important component of various electronic devices. As devices or systems become smaller and smaller, the heat flux inside the system continues to increase, and therefore thermal management is critical to ensure the performance and reliability of high power chips and micro-cooling systems, and an effective cooling method for micro-devices is also needed. The micro-channel radiator is one of the advanced technologies for solving the problem of heat dissipation of the ultrahigh heat flux electronic equipment.
The prior art provides a symmetrical micro-channel radiator with a corrugated structure, and when a coolant flows through a micro-channel, a vortex is formed in the channel, so that a better heat exchange effect is achieved. Compared with a rectangular micro-channel radiator, when the total thermal resistance is equal to 0.446K/W, the pumping power is reduced by 18.99%, but the symmetrical micro-channel radiator with the corrugated structure has relatively stable fluid in the center of the channel and poor cold flow and heat flow heat exchange effects.
The micro-needle fin flow channel has the characteristics of high packaging density, small thermal resistance, uniform temperature distribution and the like, and is also widely researched. In the prior art, the heat exchange effect of pin fin type models (square, rectangular, triangular and circular) with different shapes is deduced through theory based on the analytic solution of basic fins. The results show that cylindrical pin fins have the longest optimal height and the smallest effective heat transfer area, but the thermal resistance is also the greatest, and dense pin fins can cause excessive pressure drop in the flow channel. The inventor finds that the relationship between the effective heat exchange area and the thermal resistance pressure drop in the micro-channel radiator is a main problem of the structural design of the current micro-channel radiator, the current micro-channel radiator cannot well solve the problem, and the current micro-channel radiator generally has the problem of poor heat dissipation.
Disclosure of Invention
The micro-channel radiator is used for solving the problems that the micro-channel radiator in the prior art is low in heat dissipation efficiency and poor in balance relation between effective heat exchange area and thermal resistance pressure drop.
In one or some embodiments of the present disclosure, a micro channel heat sink is provided, which includes a substrate, on which a plurality of fins are distributed in parallel, a micro channel is formed between two adjacent fins, and a plurality of pin fin structures are arranged in the micro channel; each pin fin structure corresponds to one groove, and any two adjacent grooves are staggered.
In one or more embodiments of the present disclosure, a method for manufacturing the micro flow channel heat sink is provided, in which a rib and a pin fin structure are formed on a substrate by etching or fine machining, and a groove is formed by physically excavating or precisely etching the rib.
In one or some embodiments of the present disclosure, another method for preparing a micro flow channel heat sink is provided, in which the fins are separately manufactured, and after training of shape memory, the fins are compounded on the substrate; the pin fin structure is formed by etching or finish machining.
In one or more embodiments of the present disclosure, there is provided an application of the micro flow channel heat sink or the product manufactured by the method for manufacturing the micro flow channel heat sink in heat dissipation of a micro flow channel, wherein a coolant is introduced into the micro flow channel, and the coolant forms a vortex when passing through the pin fin and the groove in the micro flow channel, and the vortex is a spiral vortex.
In one or more embodiments of the present disclosure, there is provided an application of the above another micro channel radiator or a product prepared by the method for preparing another micro channel radiator in micro channel heat dissipation, when the temperature of the micro channel radiator rises, the fins are heated to deform, cavities are generated on the fins, a coolant is introduced into the micro channel, and when the cold flow and the hot flow in the micro channel are sufficiently mixed for heat exchange, the fins recover to the original shape along with the reduction of the temperature.
In one or more embodiments of the present disclosure, there is provided an application of the above all micro flow channel heat sinks or the products prepared by the above all micro flow channel heat sinks preparation method in an electronic component heat sink.
One or more of the above technical solutions have the following advantages or beneficial effects:
1) the present disclosure provides an interlaced micro-channel heat sink with a reflux cavity and pin fin structure according to the deficiencies of the prior art, which combines the advantages of the corrugated structure and the pin fin structure, so that while a large heat exchange area is obtained, the coolant in the channel flows through the cavity and the vortex generated by the pin fin to fully mix the cold flow and the hot flow (the coolant can take away more heat), and the thermal resistance and the pressure drop are correspondingly reduced. And the micro-channel radiator fin made of the shape memory alloy with the two-way memory effect is provided, the micro-channel structure of the radiator at different temperatures can be changed by using the shape memory effect of the shape memory alloy, and further, better heat dissipation and energy saving effects are achieved.
2) Since the fluid in the micro flow channel usually performs typical laminar flow movement, and one of the key points of heat dissipation is that the fluid is fully mixed, the laminar flow fluid is poorly mixed, and the backflow cavity-pin fin structure described in the present disclosure can realize formation of multiple helical eddy currents, which is also the key point of the high heat dissipation efficiency of the micro flow channel heat sink described in the present disclosure.
3) The backflow cavity grooves in the backflow cavity-pin fin structure are arranged in a staggered mode, spiral eddy currents are formed in the backflow cavity, the spiral eddy currents are formed on two sides of the pin fin structure, the number of the eddy currents is increased, and heat exchange efficiency is improved.
4) In the other micro-channel radiator disclosed by the invention, the shape memory alloy with the two-way memory effect is added into the staggered corrugated-pin fin structure, so that the micro-channel structure of the radiator is changed by using the memory effect of the shape memory alloy, the pressure drop and the pumping power are reduced, and the good heat dissipation and energy saving effects are achieved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the disclosure and, together with the description, serve to explain the disclosure and not to limit the disclosure.
FIG. 1 is a flow chart of coolant flowing through pin fins and a reflow chamber structure in an example.
FIG. 2 is a schematic diagram of the model at a lower temperature in the example.
FIG. 3 is a schematic diagram of the model at a higher temperature in the example.
FIG. 4 is a schematic perspective view of the micro flow channel heat sink with a higher temperature according to the embodiment.
FIG. 5 is a top view of the micro flow channel heat sink structure at a higher temperature in the embodiment.
FIG. 6 is a schematic cross-sectional view of the micro flow channel heat sink substrate taken along the direction AA1 in FIG. 2 in the case of higher temperature in the example.
FIG. 7 is a cross section of the micro flow channel heat sink substrate taken along the direction BB1 in FIG. 2 when the temperature is higher in the example.
FIG. 8 is a top view of a micro flow channel heat sink in accordance with an embodiment.
FIG. 9 is a schematic view of an exemplary embodiment of a shuttle pin fin.
Fig. 10 is a schematic diagram of an embodiment, wherein the three partial diagrams at the top of the diagram are a base plus straight fins structure, a corrugated structure only including the staggered structure, a structure without pin fins, a pin fin structure only including the pin fins, and a partial diagram without the fins structure.
Wherein, 1, a cover plate; 2. a substrate; 3. a coolant inlet; 4. a coolant outlet; 5. a pin fin structure; 6. a reflux cavity; 7. a micro flow channel; 8. ribs; 9. a coolant flow line; 10. vortex.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
The explanation of the two-way memory alloy in the present disclosure is: shape Memory Alloy (SMA) is a material having a shape memory effect (shape memory effect), which is a phenomenon that after deformation is performed within a certain limit under a certain condition, a proper external condition is applied to the material, the deformation of the material disappears, and the shape is restored to the shape before the deformation. Some alloys recover their high temperature phase shape when heated and low temperature phase shape when cooled, called two-way memory effect, and alloys with two-way memory effect are called two-way memory alloys.
The micro-channel radiator aims at the problem that the balance relation between the effective heat exchange area and the thermal resistance pressure drop is poor in the micro-channel radiator in the prior art. The present disclosure provides a micro flow channel heat sink having a staggered corrugated-pin fin structure, which optimizes a heat dissipation structure to a certain extent, and reduces a pressure drop while obtaining a large heat dissipation area. In the other micro-channel radiator disclosed by the invention, the shape memory alloy with the two-way memory effect is added into the staggered corrugated-pin fin structure, so that the structure changes the micro-channel structure of the radiator by using the memory effect of the shape memory alloy, thereby achieving good heat dissipation and energy saving effects.
In one or some embodiments of the present disclosure, a micro channel heat sink is provided, which includes a substrate 1, a plurality of fins 8 distributed on the substrate 1 in parallel, a micro channel 7 formed between two adjacent fins 8, a plurality of pin fin structures 5 in the micro channel 7; each pin fin structure 5 corresponds to one groove, and any two adjacent grooves are staggered.
The base 2 can be etched or finished to form a rib 8 and a pin fin structure 5, the rib 8 is provided with a groove to form a backflow cavity 6, and the pin fins 5 are uniformly distributed in the center of the flow channel 7.
As shown in fig. 10, the conventional microchannel heat sink is a structure of a base and straight fins, and the structure has a small pressure drop and low pumping power, but due to a small heat exchange area, the heat exchange between cold fluid and hot fluid is poor, and the heat dissipation effect is poor. And only contain the ripple structure of alternating expression, the structure that does not contain the pin fin has improved heat transfer area, and cold fluid and hot-fluid heat transfer effect is better, and the radiating effect is good, but still has the great shortcoming of pressure drop. The heat exchanger only comprises the pin fin structure and does not comprise fins has strong heat conductivity, poor heat exchange effect of cold fluid and hot fluid and good heat dissipation effect due to the pin fin structure, but has large pressure drop and high pumping power due to the dense pin fin structure.
The radiator structure formed by combining the pin fins and the fins with the backflow cavities increases the heat dissipation area and enhances the heat convection of cold flow and hot flow. The combined structure of the pin fins and the reflux cavity enables the radiator to overcome the defect of stable flow in the center of the flow channel and overcome the defect of overhigh pressure drop in the flow channel caused by compact pin fins. The shape memory alloy with the two-way memory effect is used for forming the micro-channel structure of the radiator, the structure has small pressure drop at lower temperature, and the purpose of energy conservation can be effectively achieved.
The present disclosure also contemplates that the grooves are axisymmetrically distributed on the fins 8 with the pin fin structure as a point of symmetry. When the fluid in the return cavity is tested when the coolant flows through the pin fin structure 5, it is found that although spiral vortex can be formed in the symmetrically distributed grooves, the two sides of the pin fin structure are basically laminar flow, and the heat exchange efficiency is not high.
The base 1 is also provided with a coolant inlet 3 and a coolant outlet 4, and the coolant inlet 3 and the coolant outlet 4 are respectively distributed on two sides of the end part of the fin 8. In accordance with the flow of fluid in the microchannel 7. The two ends of the substrate 2 are respectively provided with a coolant inlet 3 and a coolant outlet 4, fluid media enter the micro-channel 7 through the coolant inlet 3 on the substrate, and when working media flow in the micro-channel 7, the working media generate vortex through the disturbance of the pin fin structure 5 and the backflow cavity 6, so that heat exchange of heat flow and cold flow is more sufficient, and the existence of the pin fin structure 5 and the backflow cavity 6 also increases the heat exchange area. Specifically, the coolant can select deionized water, forms the vortex when the coolant passes through pin fin structure 5 and backward flow chamber 6 in microchannel 7, can see from fig. 1, the vortex is the spiral, for the radiating typical vortex type of microchannel, has broken the structure of microchannel laminar flow, and can see from the enlarger of fig. 1, forms a vortex in every recess, and every pin fin structure both sides form a vortex at least, and heliciform vortex quantity increases, has improved disturbance heat transfer ability greatly for cold flow and heat flow can carry out abundant heat transfer, and second backward flow chamber 6 has also increased heat transfer area with pin fin structure 5, improves heat transfer efficiency.
The present disclosure combines the reflow chamber 6 and the pin fin structure 5, a large heat exchange area can be obtained, and at the same time when the coolant flows through the reflow chamber 6 and the pin fin structure 5, as shown in fig. 1, the fluid near the inner wall of the return cavity 6 and the outer wall of the pin fin structure 5 is subjected to the resistance of the inner wall of the cavity and the outer wall of the pin fin structure 5, so that the flow speed is reduced and more heat is absorbed, while the fluid far away from the inner wall of the return cavity 6 and the outer wall of the pin fin structure 5 has the same speed, because the flow velocity difference can produce the vortex with pin fin structure 5 rear side in backward flow chamber 6 for cold flow (the fluid velocity of flow far away from backward flow intracavity wall and pin fin outer wall is very fast, and along with the lower coolant of temperature constantly gets into from the working medium entry, its temperature also can be lower) and heat flow (the fluid that is close to backward flow intracavity wall and pin fin outer wall is because the velocity of flow is slow absorbed the heat many, its temperature is higher) intensive mixing heat transfer, thereby takes away more heats. On the other hand, the combination of the reflux cavity 6 and the pin fin structure 5 overcomes the defect of large pressure drop when only the pin fin structure is adopted, and also overcomes the problem of large thermal resistance when only the reflux cavity structure is adopted.
The microchannel heat sink also includes a cover plate 1. As shown in fig. 4, the entire heat sink includes two parts, a cover plate 1 and a base 2. The cover plate 1 is located on the whole substrate 2 and sealed with the substrate. The material of the substrate 2 and the pin fin structure 5 is high heat conduction material such as copper, silicon and the like. The pin fin may be a cylinder, a shuttle, a triangular prism, etc. The cover plate 1 may use a material having low thermal conductivity.
The pin fin structure 5 has the same height as the fins, so that heat dissipation can be better realized.
The substrate and pin fin structure 5 are highly heat conductive materials, such as common metal titanium, aluminum alloy, and other materials commonly used in electronic heat dissipation components.
The pin fin structures are uniformly distributed in the micro channels, each micro channel corresponds to one row of pin fin structures, and the structures correspond to the flow guide diagram in the figure 1, so that the maximum turbulent flow can be exerted.
The cross section of the pin fin structure 5 is in a fusiform shape, one end of the fusiform shape is large, the other end of the fusiform shape is small, and the small end of the fusiform shape is located at the front end of the fluid flowing direction. Thereby changing the flow pattern of the coolant in the flow passage. Different pin fin structures can be selected according to different cooling requirements, and when the cooling requirement is large, the size difference of two ends of the shuttle shape is large.
The present disclosure also provides another rib 8, the other rib 8 being made of a two-way memory alloy material, the rib 8 creating a groove under heating.
Specifically, the rib 8 and the pin fin structure 5 are formed on the substrate by etching or finish machining, and the rib 8 is physically excavated or precisely etched to form a groove. The fins 8 of the micro-channel radiator are made of shape memory alloy with a two-way memory effect, the fins 8 are made independently and are not obtained by etching or processing on the substrate 2, the manufactured fins 8 are assembled with the substrate 2 with good heat conductivity, and the specific assembly mode can be selected from welding, clamping groove splicing and the like. The micro-channels are arranged in parallel to form a micro-channel structure. The coolant fluid flows in through the coolant inlet 3 from the lower portion of the substrate, passes through the micro flow channel 7 and finally flows out from the coolant outlet at the lower end of the substrate.
As shown in fig. 2, when the temperature is low, the fins 8 are of a rectangular structure with flat side edges, the cylindrical pin fin structures 5 made of high-thermal-conductivity materials such as copper are arranged in the micro flow channel 7 at intervals, the micro flow channel 7 is formed between the adjacent fins 8, the two sides of the micro flow channel 7 are flat and smooth, the resistance of the coolant flowing through the micro flow channel is small, and the pressure is reduced; when the temperature of the radiator rises, the fins 8 made of shape memory alloy are deformed by heat, and a concavity (return chamber 6) is created on the fins 8. As shown in FIG. 3, when the temperature rises, the disturbance on the coolant passing through the flow channel increases, the cold flow and the hot flow are fully mixed for heat exchange, the purpose of reducing the temperature is achieved, and the fins 8 recover the original flat and smooth shape along with the reduction of the temperature.
The fins of the microchannel heat sink are made of the shape memory alloy with the two-way memory effect by utilizing the shape memory effect of the shape memory alloy, when the temperature is lower, the fins are of a cuboid structure as shown in figure 2, the fins are arranged in the heat sink in parallel, a microchannel 7 is formed between adjacent fins, the two sides of the microchannel 7 are flat and smooth, the resistance of the coolant flowing through is small, and the pressure is reduced; when the temperature of the radiator rises, the fins made of the shape memory alloy are heated to deform, and concave cavities (backflow cavities 6) are formed in the fins as shown in fig. 3, so that the disturbance on the coolant passing through the flow channel is increased, cold flow and heat flow are fully mixed for heat exchange, the purpose of cooling is achieved, and the fins 8 restore the original flat and smooth shape along with the reduction of the temperature.
In one or some embodiments of the present disclosure, another method for preparing a micro flow channel heat sink is provided, in which the fins are separately manufactured, and after training of shape memory, the fins are compounded on the substrate; the pin fin structure is formed by etching or finish machining.
In one or more embodiments of the present disclosure, there is provided an application of the micro flow channel heat sink or the product manufactured by the method for manufacturing the micro flow channel heat sink in heat dissipation of a micro flow channel, wherein a coolant is introduced into the micro flow channel, and the coolant forms a vortex when passing through the pin fin and the groove in the micro flow channel, and the vortex is a spiral vortex.
Each groove is internally provided with a spiral vortex, and two sides of the pin fin structure are provided with a plurality of spiral vortices.
In one or more embodiments of the present disclosure, there is provided an application of the above another micro channel radiator or a product prepared by the method for preparing another micro channel radiator in micro channel heat dissipation, when the temperature of the micro channel radiator rises, the fins are heated to deform, cavities are generated on the fins, a coolant is introduced into the micro channel, and when the cold flow and the hot flow in the micro channel are sufficiently mixed for heat exchange, the fins recover to the original shape along with the reduction of the temperature.
In one or more embodiments of the present disclosure, there is provided an application of the above all micro flow channel heat sinks or the products prepared by the above all micro flow channel heat sinks preparation method in an electronic component heat sink.
The electronic elements comprise any elements needing chip heat exchange, such as a mobile phone, a computer, a calculator, a desk lamp and the like.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (10)
1. A micro-channel radiator is characterized by comprising a substrate, wherein a plurality of fins are distributed on the substrate in parallel, a micro-channel is formed between two adjacent fins, and a plurality of pin fin structures are arranged in the micro-channel; each pin fin structure corresponds to one groove, and any two adjacent grooves are staggered.
2. The micro flow channel heat sink of claim 1 wherein the base further has a coolant inlet and a coolant outlet, the coolant inlet and the coolant outlet being respectively disposed on both sides of the ends of the fins;
or, the micro-channel radiator also comprises a cover plate;
or the pin fin structure and the fins have the same height;
or the substrate and the pin fin structure are made of high heat conduction materials;
or the pin fin structures are uniformly distributed in the micro-channels, and each micro-channel corresponds to one row of pin fin structures.
3. The micro flow channel heat sink of claim 1 wherein the pin fin structure is a shuttle in cross-section with one end being larger and the other end being smaller and the smaller end being located forward in the direction of fluid flow.
4. The micro flow channel heat sink of claim 1 wherein the fins are made of a two-way memory alloy material, the fins creating grooves when heated.
5. The method of manufacturing a micro flow channel heat sink as claimed in any of claims 1 to 3, wherein the ribs and pin fin structures are formed on the substrate by etching or finish machining, and the grooves are formed by physically digging or precision etching the ribs.
6. The method of making the micro flow channel heat sink of claim 4 wherein the fins are fabricated separately and are compounded onto the substrate after shape memory training; the pin fin structure is formed by etching or finish machining.
7. The micro flow channel heat sink of any one of claims 1 to 3 or the product produced by the method of producing a micro flow channel heat sink of claim 5, wherein a coolant is introduced into the micro flow channel, and the coolant forms a vortex when passing through the pin fin and the groove in the micro flow channel, the vortex being a spiral vortex.
8. The use of claim 7, wherein there is one helical vortex in each recess and there are a plurality of helical vortices on either side of the pin fin structure.
9. The micro flow channel heat sink of claim 4 or the micro flow channel heat sink of claim 6, wherein the fins are deformed by heating when the temperature of the micro flow channel heat sink is raised, cavities are formed in the fins, a coolant is introduced into the micro flow channel, and when the cold flow and the hot flow in the micro flow channel are mixed sufficiently for heat exchange, the fins recover to their original shapes as the temperature is lowered.
10. Use of the micro flow channel heat sink of any one of claims 1 to 4 or the product produced by the method of producing a micro flow channel heat sink of claim 5 or 6 in a heat sink for electronic components;
preferably, the electronic component includes a mobile phone, a computer, a calculator and a desk lamp.
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| CN112928083A (en) * | 2021-02-05 | 2021-06-08 | 北京大学 | Heat dissipation device for grid region of power device and manufacturing method |
| CN112992817A (en) * | 2021-02-10 | 2021-06-18 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Micro-channel self-driven internal circulation convection enhanced heat transfer method |
| CN113224018A (en) * | 2021-06-03 | 2021-08-06 | 北京工业大学 | Low-temperature-rise local-encryption type sine corrugated micro-channel radiator |
| CN113437031A (en) * | 2021-06-17 | 2021-09-24 | 西北工业大学 | Embedded micro-channel heat dissipation device based on liquid metal |
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| CN113437031B (en) * | 2021-06-17 | 2024-06-07 | 西北工业大学 | Embedded microchannel heat abstractor based on liquid metal |
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