CN104576573A - Micro-channel heat exchanger for drop-shaped pin fins - Google Patents
Micro-channel heat exchanger for drop-shaped pin fins Download PDFInfo
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- CN104576573A CN104576573A CN201410802220.6A CN201410802220A CN104576573A CN 104576573 A CN104576573 A CN 104576573A CN 201410802220 A CN201410802220 A CN 201410802220A CN 104576573 A CN104576573 A CN 104576573A
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Abstract
The invention discloses a micro-channel heat exchanger for drop-shaped pin fins. A cooling working medium inlet of a channel is connected with the inlet end of the channel; the outlet end of the channel is connected with a cooling working medium outlet; a cooling silicon substrate channel is formed between the inlet end and the outlet end of the channel; the drop-shaped pin fins are placed inside the cooling silicon substrate channel; a glass cover plate is adhered to the top end of the structure for heat insulation. The cooling silicon substrate channel is etched into a micro channel for the drop-shaped pin fins. According to the micro-channel heat exchanger, without adding an additional drive or control device, the aim of enhancing heat exchange can be achieved by increasing a heat exchange area through the simple drop-shaped pin fin structure and enhancing the mixing of cold fluid and hot fluid.
Description
Technical field
The present invention is used for high integration, High power microelectronic components and parts field of radiating, rational water-drop-shaped flow-disturbing unit is added in micro-channel heat exchanger passage, this heat exchanger is compared with smooth channel heat exchanger, nusselt number Nu and heat exchange property improve, and this is for integrated level is high, the large microelectronic component efficiently radiates heat of thermal power provides possibility.
Background technology
Along with microelectromechanical systems (MEMS) develop rapidly and microelectronic component is little towards volume, lightweight, integrated level is high direction develop rapidly, its heat dissipation problem directly concerns the reliability and stability of system, need effectively the high heat flux heat produced in their runnings to be taken away, and system operation reliability and stability can be ensured, applying traditional cooling technology can not practical requirement.Microchannel has large face body ratio, the features such as large heat exchange coefficient, thus the micro-channel heat sink for dispelling the heat effectively can take away the high heat flux heat produced in microelectronic component and microelectromechanical systems operation, and micro-channel heat sink has been proved to be heat transfer property the best and one of type of cooling of most application potential.Although Thermal Performance of Micro Channels has the advantages such as high heat exchange coefficient, but still present level integrated electronic component and microelectromechanical systems radiating requirements can not be met, need badly and microchannel enhanced heat exchange is furtherd investigate.Although done large quantity research to microchannel enhanced heat exchange both at home and abroad, the micro-channel heat sink about adding water-drop-shaped flow-disturbing unit in channel interior has been had still to appear in the newspapers.
Summary of the invention
The present invention is based on many conventional parallel microchannels heat exchangers, water-drop-shaped flow-disturbing unit is added, to improve the heat exchange amount of heat exchanger to solve the high heat flux heat spreader problem of microelectronic component and microelectromechanical systems (MEMS) at each single channel.The present invention adds water-drop-shaped flow-disturbing unit in the smooth microchannel of routine, the contact area of fluid and solid and heat exchange area are increased, and this structure makes working medium create eddy current in flow process in the channel, and cold fluid and hot fluid mixing strengthens, thus heat exchange amount increases, and namely reaches the object of enhanced heat exchange.
Water-drop-shaped flow-disturbing unit of the present invention micro-channel heat exchanger slightly makes improvements on the basis of conventional microscale channel, and primary structure is as follows:
This heat exchanger is made up of seven parts, is passage cooling working medium entrance 1 respectively, cooling working medium outlet 2, glass cover-plate 3, channel entrance end 4, channel outlet 5, cools silica-based passage 6, water-drop-shaped flow-disturbing unit 7.
Passage cooling working medium entrance 1 is connected with channel entrance end 4, and channel outlet 5 and cooling working medium export 2 and be connected; It is the silica-based passage 6 of cooling between channel entrance end 4, channel outlet 5; Water-drop-shaped flow-disturbing unit 7 is placed in the silica-based passage 6 of cooling; Glass cover-plate 3 is bonded in the top of this structure and plays heat insulating function.
Described cooling silicon substrate microchannel 6 utilizes lithography technique, processes the micro-channel of water-drop-shaped flow-disturbing unit 7.
During work, the cooling working medium of temperature lower (about 20 DEG C) is by passage cooling working medium entrance 1 admission passage entrance point 4, flow to the silica-based passage 6 of the water-drop-shaped flow-disturbing single cooling of unit respectively, owing to there is water-drop-shaped flow-disturbing unit 7 in single passage, compare with conventional micro-channel heat exchanger, this heat exchanger heat exchange area increases, and working medium creates eddy current in runner, cold fluid and hot fluid mixing strengthens, and heat transfer effect strengthens.Higher temperature (with channel size, thermal power densities etc. about) working medium arrive cooling working medium eventually through channel outlet 5 and export 2, and then outflow system, namely the high heat flux heat that electronic devices and components and microelectromechanical systems produce is taken away by the fluid flowed in water-drop-shaped flow-disturbing unit microchannel, reaches the object of cooling.The present invention adds rational water-drop-shaped flow-disturbing meta structure in the channel, this heat exchanger is compared with smooth channel heat exchanger, nusselt number Nu and heat exchange property significantly promote, and this provides possibility for high, the large microelectronic component of thermal power of integrated level and microelectromechanical systems efficiently radiates heat.
The present invention can on the basis not increasing extra driving or control device, and utilize simple water-drop-shaped flow-disturbing meta structure to increase heat exchange area, cold fluid and hot fluid mixing strengthens with the object reaching enhanced heat exchange.
Accompanying drawing explanation
Fig. 1 is water-drop-shaped flow-disturbing of the present invention unit micro-channel heat exchanger design three-dimensional overall profile schematic diagram.
Fig. 2 is the single passage vertical view of water-drop-shaped flow-disturbing of the present invention unit's micro-channel heat exchanger.
Fig. 3 is water-drop-shaped flow-disturbing of the present invention unit's micro-channel heat exchanger single passage water-drop-shaped flow-disturbing unit partial enlarged drawing.
In figure: 1, passage cooling working medium entrance; 2, cooling working medium outlet; 3, glass cover-plate; 4, channel entrance end; 5, channel outlet; 6, silica-based passage is cooled; 7, water-drop-shaped flow-disturbing unit.
Embodiment
Below in conjunction with Structure Figure, invention water-drop-shaped flow-disturbing unit's micro-channel heat exchanger course of work and effect are further elaborated and are verified.
Fig. 1 is water-drop-shaped flow-disturbing unit micro-channel heat exchanger three-dimensional overall profile schematic diagram.This water-drop-shaped flow-disturbing unit micro-channel heat exchanger mainly comprises passage cooling working medium entrance 1, cooling working medium outlet 2, glass cover-plate 3, channel entrance end 4, channel outlet 5, cools silica-based passage 6, water-drop-shaped flow-disturbing unit 7 is formed.In order to verify this invention comparatively regular channels have better heat transfer effect, table 1 lists the parameter that thermal resistance R, nusselt number Nu, heat exchange coefficient h etc. under the given reynolds number Re condition of this heat exchanger characterize heat transfer effect, and and conventional smooth passage contrast.As seen from table, this invention significantly improves the heat exchange property of heat exchanger.
Table 1 water-drop-shaped flow-disturbing unit micro-channel heat exchanger heat exchange property contrasts situation with regular channels
Claims (3)
1. a water-drop-shaped flow-disturbing unit micro-channel heat exchanger, it is characterized in that: this heat exchanger is made up of seven parts, be passage cooling working medium entrance (1) respectively, cooling working medium outlet (2), glass cover-plate (3), channel entrance end (4), channel outlet (5), cool silica-based passage (6), water-drop-shaped flow-disturbing unit (7);
Passage cooling working medium entrance (1) is connected with channel entrance end (4), and channel outlet (5) exports (2) and is connected with cooling working medium; It is the silica-based passage of cooling (6) between channel entrance end (4), channel outlet (5); Water-drop-shaped flow-disturbing unit (7) is placed in the silica-based passage of cooling (6); Glass cover-plate (3) is bonded in the top of this structure.
2. a kind of water-drop-shaped flow-disturbing unit according to claim 1 micro-channel heat exchanger, is characterized in that: described cooling silicon substrate microchannel (6) utilizes lithography technique, processes the micro-channel of water-drop-shaped flow-disturbing unit (7).
3. a kind of water-drop-shaped flow-disturbing unit according to claim 1 micro-channel heat exchanger, it is characterized in that: during work, the lower cooling working medium of temperature is by passage cooling working medium entrance (1) admission passage entrance point (4), flow to the water-drop-shaped flow-disturbing unit's silica-based passage of single cooling (6) respectively, owing to there is water-drop-shaped flow-disturbing unit (7) in single passage, compare with conventional micro-channel heat exchanger, this heat exchanger heat exchange area increases, working medium creates eddy current in runner, cold fluid and hot fluid mixing strengthens, and heat transfer effect strengthens;
The working medium of higher temperature arrives cooling working medium outlet (2) eventually through channel outlet (5), and then outflow system, namely the high heat flux heat that electronic devices and components and microelectromechanical systems produce is taken away by the fluid flowed in water-drop-shaped flow-disturbing unit microchannel, reaches the object of cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410802220.6A CN104576573A (en) | 2014-12-21 | 2014-12-21 | Micro-channel heat exchanger for drop-shaped pin fins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410802220.6A CN104576573A (en) | 2014-12-21 | 2014-12-21 | Micro-channel heat exchanger for drop-shaped pin fins |
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| Publication Number | Publication Date |
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| CN104576573A true CN104576573A (en) | 2015-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410802220.6A Pending CN104576573A (en) | 2014-12-21 | 2014-12-21 | Micro-channel heat exchanger for drop-shaped pin fins |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105305226A (en) * | 2015-12-06 | 2016-02-03 | 北京工业大学 | Microchannel heatsink having backwater layer provided with staggered inclined cylindrical flow-disturbing ridges |
| CN108225079A (en) * | 2017-12-26 | 2018-06-29 | 华北电力大学 | A kind of non-homogeneous wetability silicon substrate microchannel phase-change heat-exchanger of top unicom |
| CN109346444A (en) * | 2018-08-29 | 2019-02-15 | 杭州电子科技大学 | A kind of micro- radiator of the trapezoidal ridge rib array of band |
| CN111933595A (en) * | 2020-07-16 | 2020-11-13 | 杰群电子科技（东莞）有限公司 | Semiconductor packaging structure and manufacturing method thereof |
| CN112151478A (en) * | 2020-08-31 | 2020-12-29 | 中国石油大学(华东) | Micro-channel radiator and preparation method and application thereof |
| CN115014107A (en) * | 2022-05-26 | 2022-09-06 | 西安交通大学 | Double-effect enhanced heat exchange micro-channel heat sink with wing-shaped flow dividing ribs |
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| US20040188064A1 (en) * | 2002-11-01 | 2004-09-30 | Cooligy Inc. | Channeled flat plate fin heat exchange system, device and method |
| CN201383909Y (en) * | 2009-03-03 | 2010-01-13 | 北京奇宏科技研发中心有限公司 | Micro-channel cold plate device for liquid cooling radiator |
| CN201894034U (en) * | 2010-11-12 | 2011-07-06 | 奇鋐科技股份有限公司 | Improved runner structure of water-cooling device |
| CN103594430A (en) * | 2013-10-25 | 2014-02-19 | 上海交通大学 | Micro-channel radiator for dissipating heat of power electronic device |
| CN203633055U (en) * | 2014-01-02 | 2014-06-04 | 中国长江三峡集团公司 | Heat sink heat radiation device with novel heat exchange structure and self-adaptive characteristic |
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2014
- 2014-12-21 CN CN201410802220.6A patent/CN104576573A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040188064A1 (en) * | 2002-11-01 | 2004-09-30 | Cooligy Inc. | Channeled flat plate fin heat exchange system, device and method |
| CN201383909Y (en) * | 2009-03-03 | 2010-01-13 | 北京奇宏科技研发中心有限公司 | Micro-channel cold plate device for liquid cooling radiator |
| CN201894034U (en) * | 2010-11-12 | 2011-07-06 | 奇鋐科技股份有限公司 | Improved runner structure of water-cooling device |
| CN103594430A (en) * | 2013-10-25 | 2014-02-19 | 上海交通大学 | Micro-channel radiator for dissipating heat of power electronic device |
| CN203633055U (en) * | 2014-01-02 | 2014-06-04 | 中国长江三峡集团公司 | Heat sink heat radiation device with novel heat exchange structure and self-adaptive characteristic |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105305226A (en) * | 2015-12-06 | 2016-02-03 | 北京工业大学 | Microchannel heatsink having backwater layer provided with staggered inclined cylindrical flow-disturbing ridges |
| CN108225079A (en) * | 2017-12-26 | 2018-06-29 | 华北电力大学 | A kind of non-homogeneous wetability silicon substrate microchannel phase-change heat-exchanger of top unicom |
| CN109346444A (en) * | 2018-08-29 | 2019-02-15 | 杭州电子科技大学 | A kind of micro- radiator of the trapezoidal ridge rib array of band |
| CN111933595A (en) * | 2020-07-16 | 2020-11-13 | 杰群电子科技（东莞）有限公司 | Semiconductor packaging structure and manufacturing method thereof |
| CN112151478A (en) * | 2020-08-31 | 2020-12-29 | 中国石油大学(华东) | Micro-channel radiator and preparation method and application thereof |
| CN112151478B (en) * | 2020-08-31 | 2022-11-11 | 中国石油大学(华东) | Micro-channel radiator and preparation method and application thereof |
| CN115014107A (en) * | 2022-05-26 | 2022-09-06 | 西安交通大学 | Double-effect enhanced heat exchange micro-channel heat sink with wing-shaped flow dividing ribs |
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Application publication date: 20150429 |