CN104979307A - Device for enabling micro-channel coolers to cool multi-chip system - Google Patents
Device for enabling micro-channel coolers to cool multi-chip system Download PDFInfo
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- CN104979307A CN104979307A CN201510409552.2A CN201510409552A CN104979307A CN 104979307 A CN104979307 A CN 104979307A CN 201510409552 A CN201510409552 A CN 201510409552A CN 104979307 A CN104979307 A CN 104979307A
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Abstract
The invention discloses a device for enabling micro-channel coolers to cool a multi-chip system, which belongs to the technical field of microelectronic cooling, and sequentially comprises a packaging sheet (1) and a substrate (2) packaged together, wherein the packaging sheet (1) is provided with grooves (3) into which the coolers are placed and fluid inlets (4) and fluid outlets (5) connected with channels; and a flow dividing channel groove (6) and a flow combining channel groove (7) are processed on the front surface of the substrate (2), and a total fluid inlet (8) and a total fluid outlet (9) connected with an external pipeline are processed on the back surface. Multiple micro-channel coolers are integrated for cooling the multiple chips.
Description
Technical field
The invention belongs to microelectronics technology, relate to a kind of device cooling multichip system.
Background technology
Developing rapidly of the technology such as very lagre scale integrated circuit (VLSIC) of unifying along with micro-electro-mechanical systems, the future development that electronic equipment is less towards volume, integrated level is higher, with better function, reaction is sensitiveer.The density of heat flow rate of electronic chip sharply increases, and heat load strengthens day by day, if these heats can not be taken away rapidly, electronic device will due to high temperature cisco unity malfunction, even burn.Oneself warp of traditional heat-dissipating mode can not meet the cooling requirements of high load capacity electronic device.For this reason, the radiator structure needing some novel or material solve the heat dissipation problem in the electronic equipment of high heat flux.
The micro-cooler of actively setting about both at home and abroad at present studying and having applied comprises: micro-heat exchanger, micro-refrigerator, micro-channel heat sink, the equal backing of micro heat pipe and integrated micro-cooler etc.Wherein micro-channel heat sink is because of its processing and fabricating Technical comparing maturation, obtains the concern that people are more, and has been proved to be one of potential radiating mode of most.Micro-channel heat sink has that structure is simple, volume is little, radiating efficiency advantages of higher.
Under the application background of MEMS (micro electro mechanical system), heat dissipation element (chip) is not individualism, but exists with the form of multi-chip integrated system.At present, the research for micro-system mainly concentrates on micro-radiator aspect of one single chip, and less for the Research of Integrated System of multiple chip.When there being multiple chip to exist, being the heat radiation ensureing that integrated chip system can be good, the microchannel heat sink system with excellent heat dispersion performance being carried out integrated, multi-chip is dispelled the heat simultaneously.
Summary of the invention
The object of the present invention is to provide a kind of microchannel heat sink to cool the device of multichip system, when there being multiple chip to exist, can microchannel heat sink system effectively, equably dispel the heat, and the uniformity of being distributed by its fluid determined.This device provides a kind of runner layout type of optimum, and make the flow-rate ratio of the radiator corresponding to each chip of direction of flow comparatively even, the operation for chip provides reliable temperature environment.
The present invention devises the device of a kind of microchannel heat sink cooling multichip system, as shown in Figure 1.In order to the structure of definitely illustrative system, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6 sets forth front view, vertical view, A-A profile, B-B profile, the C-C profile of system.
The present invention adopts following technical scheme:
The present invention devises the device of a kind of microchannel heat sink cooling multichip system, it is characterized in that: comprise case chip (1) and substrate (2), the front of case chip (1) has the multiple grooves (3) putting into radiator, the bottom of each groove (3) has fluid intake (4) and fluid issuing (5); Fluid intake (4) and fluid issuing (5) are all through holes, and fluid intake (4) and fluid issuing (5) lead directly to another side and the back side of case chip (1) respectively; The front of substrate (2) is processed with split channel groove (6) and confluence passage groove (7); Split channel groove (6) is made up of a total split channel and multiple split channel branches of being connected with total split channel; Confluence passage groove (7) is made up of a total confluence passage and multiple confluence passage branches of being connected with total confluence passage equally; Substrate (2) another side and the back side have fluid main entrance (8) and fluid general export (9), fluid main entrance (8) is connected with total split channel, and fluid general export (9) is connected with total confluence passage.
The back side of case chip (1) and the vis-a-vis of substrate (2), each fluid intake (4) is connected with a split channel branches end of split channel groove (6) respectively, and each fluid issuing (5) is connected with the confluence passage branches end of confluence passage groove (7) respectively; Case chip (1) and substrate (2) are welded together to form complete system, form closed fluid flow circuit system with the microchannel heat sink be embedded in groove (3).
Split channel groove (6) and the middle channel cross-sectional shape of confluence passage groove (7) are rectangle.
Fluid flows through route: fluid enters split channel groove (6) from the fluid main entrance (8) substrate (2), and shunt in split channel groove (6), the radiator in groove (3) is entered respectively by the fluid intake (4) on case chip (1), flowed into the confluence passage groove (7) on substrate (2) after fluid flows through radiator by the fluid issuing (5) on case chip (1), finally flow out from the fluid general export (9) substrate (2).
The device of a kind of microchannel heat sink cooling multichip system of the present invention's design, meeting under the good condition of each chip cooling effect, also need to make the radiating effect of each chip suitable, the Temperature Distribution of chip is similar, if the Temperature Distribution difference of each chip is comparatively large, then can affect the normal work of chip.Therefore, the assignment of traffic situation that fluid flows to each radiator affects the radiating effect of chip, and assignment of traffic is more even, and radiating effect is better.
In the device of designed system of the present invention, split channel groove (6) is composited by the split channel branch of H type structure and total split channel of T-type structure, namely
type, after fluid enters split channel groove (6) from main entrance (8), first T-shaped passage is flow through, and flow to the identical branch road in two, T-shaped left and right, two fluids flows through the branch of H type passage respectively again afterwards, not only but also divide equally separately and flow to two branch roads, fluid, successively through twice shunting, shunts two branch roads that all flow direction structures are identical and symmetrical at every turn.
The size dimension of the groove (3) on case chip (1) is determined according to the size of microchannel heat sink, microchannel heat sink can according to situation optimal design such as the size of actual chips and heating powers, and overall geometry size can require to determine according to chip size.
Fluid working substance can select air, water, cold-producing medium etc. respectively; The material of system and device can select copper, aluminium alloy etc.
The present invention has following advantages and effect:
1, under multiple chip (thermal source) existent condition, multiple microchannel heat sink is carried out integrated, can dispel the heat to multi-chip simultaneously;
2, fluid flows to the assignment of traffic of each radiator relatively evenly, and radiating effect is suitable, and the Temperature Distribution of chip is similar.
Accompanying drawing explanation
Fig. 1: the schematic diagram of the device of the microchannel heat sink cooling multichip system of the embodiment of the present invention 1;
In figure: 1, case chip, 2, substrate, 3, groove, 4, fluid intake, 5, fluid issuing, 6, split channel groove, 7, confluence passage groove, 8, fluid main entrance, 9, fluid general export.
The structural representation of the device of the microchannel heat sink cooling multichip system of Fig. 2-6 embodiment of the present invention 1;
Fig. 2: the front view of the embodiment of the present invention 1 device;
The vertical view of Fig. 3: Fig. 2 device;
The A-A profile of Fig. 4: Fig. 2 device;
The B-B profile of Fig. 5: Fig. 2 device;
The C-C profile of Fig. 6: Fig. 2 device.
Specific implementation method
Below in conjunction with the application of device in heat dissipation of electronic chip of accompanying drawing and microchannel heat sink cooling multichip system, the invention will be further described: but the present invention is not limited to following examples.
Along with the develop rapidly of information technology and electronic technology, the power of electronic chip sharply increases, and effective heat radiation becomes the vital problem of chip development.
Comprise case chip 1 and substrate 2, the front of case chip 1 has the multiple grooves 3 putting into radiator, the bottom of each groove 3 has fluid intake 4 and fluid issuing 5; Fluid intake 4 and fluid issuing 5 are all through holes, and fluid intake 4 and fluid issuing 5 lead directly to another side and the back side of case chip 1 respectively; The front of substrate 2 is processed with split channel groove 6 and confluence passage groove 7; Split channel groove 6 is made up of a total split channel and multiple split channel branches of being connected with total split channel; Confluence passage groove 7 is made up of a total confluence passage and multiple confluence passage branches of being connected with total confluence passage equally; Substrate 2 another side and the back side have fluid main entrance 8 and fluid general export 9, and fluid main entrance 8 is connected with total split channel, and fluid general export 9 is connected with total confluence passage.
The back side of case chip 1 and the vis-a-vis of substrate 2, each fluid intake 4 is connected with a split channel branches end of split channel groove 6 respectively, and each fluid issuing 5 is connected with the confluence passage branches end of confluence passage groove 7 respectively; Case chip 1 and substrate 2 are welded together to form complete system, form closed fluid flow circuit system with the microchannel heat sink be embedded in groove 3.
Embodiment 1
Under multiple chip existent condition, design the device of a kind of microchannel heat sink cooling multichip system.Case chip 1 and substrate 2 are linked together by welding procedure by this device, and concrete structure is shown in Fig. 1-6.Device material adopts aluminium alloy, and working medium is deionized water, and radiator is triangle depression microchannel heat sink.Because the cost of high-power chip is very expensive, film thermal source in the present embodiment, is adopted to replace chip to carry out performance test.Film thermal source adopts platinum heating film, and through optimal design, platinum heating film can heat production uniformly, and its input voltage is determined according to the quantity of heat production of chip.Platinum heating film forms the even snakelike film of thick 100 nanometers at the radiator back side by coating technique, be then embedded into by radiator in the groove 3 on case chip 1.
Split channel groove 6 is made up of the split channel branch of H type structure and total split channel of T-type structure, after fluid enters split channel groove 6 from main entrance 8, first T-shaped passage is flow through, flow to the branch road that two, left and right is identical, two fluids flows through H type passage respectively again afterwards, divides equally separately again and flows to two branch roads.Fluid, successively through twice shunting, shunts two branch roads that all flow direction structures are identical and symmetrical at every turn.Finally, the flow of four branch roads is relatively even.
Deionized water enters split channel groove 6 from the fluid main entrance 8 substrate 2, and shunt in channel slot 6, the radiator in groove 3 is entered respectively by the fluid intake 4 on case chip 1, flowed into the confluence passage groove 7 on substrate 2 after deionized water flows through radiator by the fluid issuing 5 on case chip 1, finally flow out from the fluid general export 9 substrate 2.Deionized water is divided into four branch roads uniformly in channel slot 6, flow to each radiator, heat is absorbed from radiator bottom surface, heating film is dispelled the heat, because de-ionized water flow rate distribution ratio is more even, so the radiating effect of each heating film is suitable, thus the uniformity of electronic device temperature can be ensured, extend the life-span of electronic device.
Claims (4)
1. the device of a microchannel heat sink cooling multichip system, it is characterized in that: comprise case chip (1) and substrate (2), the front of case chip (1) has the multiple grooves (3) putting into radiator, the bottom of each groove (3) has fluid intake (4) and fluid issuing (5); Fluid intake (4) and fluid issuing (5) are all through holes, and fluid intake (4) and fluid issuing (5) lead directly to another side and the back side of case chip (1) respectively; The front of substrate (2) is processed with split channel groove (6) and confluence passage groove (7); Split channel groove (6) is made up of a total split channel and multiple split channel branches of being connected with total split channel; Confluence passage groove (7) is made up of a total confluence passage and multiple confluence passage branches of being connected with total confluence passage equally; Substrate (2) another side and the back side have fluid main entrance (8) and fluid general export (9), fluid main entrance (8) is connected with total split channel, and fluid general export (9) is connected with total confluence passage; The back side of case chip (1) and the vis-a-vis of substrate (2), each fluid intake (4) is connected with a split channel branches end of split channel groove (6) respectively, and each fluid issuing (5) is connected with the confluence passage branches end of confluence passage groove (7) respectively; Case chip (1) and substrate (2) are welded together to form complete system, form closed fluid flow circuit system with the microchannel heat sink be embedded in groove (3).
2. according to the device of a kind of microchannel heat sink cooling multichip system of claim 1, it is characterized in that: split channel groove (6) and the middle channel cross-sectional shape of confluence passage groove (7) are rectangle.
3. according to the device of a kind of microchannel heat sink cooling multichip system of claim 1, it is characterized in that: fluid flows through route and is: fluid enters split channel groove (6) from the fluid main entrance (8) substrate (2), and shunt in split channel groove (6), the radiator in groove (3) is entered respectively by the fluid intake (4) on case chip (1), flowed into the confluence passage groove (7) on substrate (2) by the fluid issuing (5) on case chip (1) after fluid flows through radiator, finally flow out from the fluid general export (9) substrate (2).
4., according to the device of a kind of microchannel heat sink cooling multichip system of claim 1, its feature exists
after, first flow through T-shaped passage, and flow to the identical branch road in two, T-shaped left and right, two fluids flows through the branch of H type passage respectively again afterwards, not only but also divide equally separately and flow to two branch roads, fluid, successively through twice shunting, shunts two branch roads that all flow direction structures are identical and symmetrical at every turn.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105540529A (en) * | 2015-12-04 | 2016-05-04 | 南通富士通微电子股份有限公司 | Adaptive temperature control chip microsystem |
| CN108666283A (en) * | 2018-05-03 | 2018-10-16 | 中国电子科技集团公司第二十九研究所 | A kind of microchannel heat sink structure and preparation method thereof |
| CN110137146A (en) * | 2019-04-30 | 2019-08-16 | 东南大学 | A kind of fractal runner liquid cooling apparatus |
| CN110711546A (en) * | 2019-11-15 | 2020-01-21 | 南通好唯智能制造科技有限公司 | Flow dividing system for microchannel reactor, flow divider and manufacturing method of flow divider |
| CN111542203A (en) * | 2020-04-29 | 2020-08-14 | 南京工业大学 | T-shaped pipeline chip radiator based on impingement cooling and complete device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151319A (en) * | 2012-10-14 | 2013-06-12 | 中国计量学院 | Fractal fin radiator |
| CN203242614U (en) * | 2013-05-15 | 2013-10-16 | 中国电子科技集团公司第三十八研究所 | Microfluidic-channel heat dissipation device used for an electronic component and electronic device |
| CN103824826A (en) * | 2014-02-21 | 2014-05-28 | 电子科技大学 | Micro-channel type cooling method |
| CN104201158A (en) * | 2014-08-28 | 2014-12-10 | 中国电子科技集团公司第二十九研究所 | Integrated cooling device of silicon-based micro-channel radiator |
| CN205081111U (en) * | 2015-07-13 | 2016-03-09 | 北京工业大学 | Many chip systems of microchannel radiator cooling device |
-
2015
- 2015-07-13 CN CN201510409552.2A patent/CN104979307B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151319A (en) * | 2012-10-14 | 2013-06-12 | 中国计量学院 | Fractal fin radiator |
| CN203242614U (en) * | 2013-05-15 | 2013-10-16 | 中国电子科技集团公司第三十八研究所 | Microfluidic-channel heat dissipation device used for an electronic component and electronic device |
| CN103824826A (en) * | 2014-02-21 | 2014-05-28 | 电子科技大学 | Micro-channel type cooling method |
| CN104201158A (en) * | 2014-08-28 | 2014-12-10 | 中国电子科技集团公司第二十九研究所 | Integrated cooling device of silicon-based micro-channel radiator |
| CN205081111U (en) * | 2015-07-13 | 2016-03-09 | 北京工业大学 | Many chip systems of microchannel radiator cooling device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105540529A (en) * | 2015-12-04 | 2016-05-04 | 南通富士通微电子股份有限公司 | Adaptive temperature control chip microsystem |
| CN105540529B (en) * | 2015-12-04 | 2017-11-10 | 通富微电子股份有限公司 | Adaptive Temperature Controlling Chip micro-system |
| CN108666283A (en) * | 2018-05-03 | 2018-10-16 | 中国电子科技集团公司第二十九研究所 | A kind of microchannel heat sink structure and preparation method thereof |
| CN110137146A (en) * | 2019-04-30 | 2019-08-16 | 东南大学 | A kind of fractal runner liquid cooling apparatus |
| CN110711546A (en) * | 2019-11-15 | 2020-01-21 | 南通好唯智能制造科技有限公司 | Flow dividing system for microchannel reactor, flow divider and manufacturing method of flow divider |
| CN111542203A (en) * | 2020-04-29 | 2020-08-14 | 南京工业大学 | T-shaped pipeline chip radiator based on impingement cooling and complete device |
| CN111542203B (en) * | 2020-04-29 | 2023-02-03 | 南京工业大学 | T-shaped pipeline chip radiator based on impingement cooling and complete device |
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