CN104201158A - Integrated cooling device of silicon-based micro-channel radiator - Google Patents
Integrated cooling device of silicon-based micro-channel radiator Download PDFInfo
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- CN104201158A CN104201158A CN201410429131.1A CN201410429131A CN104201158A CN 104201158 A CN104201158 A CN 104201158A CN 201410429131 A CN201410429131 A CN 201410429131A CN 104201158 A CN104201158 A CN 104201158A
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Abstract
The invention provides an integrated cooling device of a silicon-based micro-channel radiator, which is composed of a box body, a silicon-based micro-channel radiator and a cover plate. The box body is a cavity with an opening at the upper end; a flow channel is arranged inside the bottom plate of the box body; a unit cooling liquid inlet and outlet, and an externally connected opening of an internal electronic chip are arrange on the outer side face of the box body; multiple small grooves are formed in the bottom plate of the box body; the silicon-based micro-channel radiator is arranged in the small grooves; two openings are formed in the bottom of each small groove to realize communication between the cooling liquid inlet and outlet of the silicon-based micro-channel radiator and the flow channel at the bottom of the box body; the silicon-based micro-channel radiator is composed of a silicon bottom plate and a silicon cover plate; radiating fins are formed on the silicon bottom plate; both the thickness of the fins and the distance among the fins are less than 0.1 mm. Through such the integration way, the radiator can be arranged and expanded based on the number and positions of high heating flux density chips, the disadvantage that the silicon-based radiator cannot be enlarged is overcome, and strong universality is achieved.
Description
Technical field
The invention belongs to electronic equipment dissipating heat technical field, be specially a kind of silicon substrate microchannel radiator integrated cooling device.
Background technology
For the power electronic system of high heat flux, often adopt the mode of liquid cooling to dispel the heat, as Liquid cooling chasis, liquid cooled module etc.These traditional liquid-cooling heat radiation modes, typically use the materials such as copper, aluminium and make flow channel for liquids, and then sealing welding forms radiator, and runner yardstick is conventionally more than 1mm.Between radiator and chip, conventionally exist radiator material and the unmatched problem of chip material thermal coefficient of expansion, conventional method is to alleviate thermal expansion stress by transition slide glasses such as welding molybdenum copper sheets, and this has increased chip undoubtedly to the thermal resistance between heat sink.
Silicon substrate be in existing electronic material with the immediate a kind of material of coefficient of thermal expansion of third generation semiconductor chip and power chip.Adopt silicon substrate microchannel cooling system, chip can be directly welded in to spreader surface, both alleviated the destruction of thermal expansion stress in hot operation, also greatly reduce chip to the thermal resistance between heat sink.Meanwhile, because the micro fabrication of silicon material is ripe, can process yardstick and reach the microchannel runner below 0.1mm, greatly increase the radiating efficiency of this type of radiator.At present a lot of about the patent of microchannel heat dissipation technology, also very extensive about the patent of micro fabrication on silicon substrate, but the two combination--the patent of silicon substrate microchannel heat dissipation technology is very micro-, only has CN1558448A, CN103839905A etc.And about the patent of silicon substrate microchannel radiator integrated cooling device, be blank.
Summary of the invention
The technical problem solving
The object of the invention is to solve a heat radiation difficult problem for high heat flux power electronic chip.A kind of silicon substrate microchannel radiator integrated cooling device has been proposed for this reason.
Technical scheme
Described a kind of silicon substrate microchannel radiator integrated cooling device, is characterized in that: by box body, and silicon substrate microchannel radiator, cover plate three parts form; Described box body is the cavity of upper end open, and box plate inside is provided with runner, the external opening of the import and export of box body lateral surface setting unit cooling fluid and internal electron chip, and box body outside is also provided with mounting ear; Box plate arranges some little grooves, and silicon substrate microchannel radiator is arranged in little groove, and little bottom portion of groove is provided with two openings, and the cooling fluid import and export that realize silicon substrate microchannel radiator are communicated with box body bottom flow passage; Box body bottom flow passage is all assigned to cooling fluid the entrance of each silicon substrate microchannel radiator; Box body and cover plate for sealing are connected to one, and form closed cavity; Described silicon substrate microchannel radiator is comprised of silicon base plate and silicon cover plate, the connection of silicon base plate and silicon cover plate adopts Si-Si bonding process to realize, on silicon base plate, adopt etching technics to be made into radiating fin, fin thickness and spacing of fin are all less than 0.1mm, and silicon cover plate adopts etching technics to process cooling fluid and imports and exports.
Beneficial effect
The present invention has the following advantages:
1, the coefficient of expansion matching of radiator material and chip is good, without transition support plate, can be directly by chips welding on radiator, reduced the thermal resistance of chip to radiator.
2, microchannel yardstick can reach below 0.1mm, and radiating efficiency increases greatly.
3, this integration mode can, according to the quantity of high heat flux chip and position flexible arrangement and expansion radiator, overcome silica-based radiator and cannot do large shortcoming, highly versatile.
4, radiator material density is low compared with traditional metal radiator.
Accompanying drawing explanation
Fig. 1 silicon substrate microchannel radiator integrated cooling device composition diagram;
1-box body; 2-cover plate; 3-silicon substrate microchannel radiator;
Fig. 2: box body structure schematic diagram (dotted line is inner flow passage signal);
1a-unit cooling liquid outlet; 1b-unit cooling liquid inlet; 1c-microchannel heat sink cooling liquid inlet; 1d-microchannel heat sink cooling liquid outlet; 1e-groove; 1f-mounting ear;
Fig. 3 silicon substrate microchannel radiator schematic diagram;
3a-silicon base plate; 3b-silicon cover plate; 3c-cooling liquid inlet; 3d-cooling liquid outlet; 3e-radiating fin;
Fig. 4: embodiment 1 schematic diagram;
Fig. 5: embodiment 2 schematic diagrames;
Embodiment
Based on the present invention, realized the silicon substrate microchannel radiator integrated cooling device of various structures form, reached good radiating effect.Concrete embodiment is as follows:
Embodiment 1:
As shown in Figure 1, the Outside Dimensions of the silicon substrate microchannel radiator integrated cooling device in the present embodiment is 50mm (length) * 50mm (wide) * 20mm (height), by box body, and silicon substrate microchannel radiator, cover plate three parts form.Described box body is the cavity of upper end open, and box plate inside is provided with runner, the external opening of the import and export of box body lateral surface setting unit cooling fluid and internal electron chip, and box body outside is also provided with mounting ear, for the external connection of integrated cooling device.
Box plate arranges four little grooves, and silicon substrate microchannel radiator is arranged in little groove, and little bottom portion of groove is provided with two openings, and the cooling fluid import and export that realize silicon substrate microchannel radiator are communicated with box body bottom flow passage.Box body bottom flow passage is all assigned to cooling fluid the entrance of each silicon substrate microchannel radiator, and by each silicon substrate microchannel radiator outlet, cooling fluid is led to cooling liquid outlet place, unit.
Cover plate is slab construction, coincide with the upper shed size of box body, after silicon substrate microchannel radiator and internal electron chip are installed, by laser welding technology, cover plate and box body is connected as one.
Silicon substrate microchannel radiator is to be comprised of silicon base plate and silicon cover plate, and the closed cell that externally only has two cooling fluids to import and export.The connection of silicon base plate and silicon cover plate adopts Si-Si bonding process to realize, and adopts etching technics to be made into radiating fin on silicon base plate, and fin thickness and spacing of fin are all less than 0.1mm, and silicon cover plate adopts etching technics to process cooling fluid and imports and exports.
In the present embodiment, silicon substrate microchannel radiator is of a size of 8mm * 8mm * 1mm, and runner is zigzag, and fin thickness is 0.05mm, and spacing of fin is 0.05mm, the circular hole that to import and export as diameter be 1mm.This silicon substrate microchannel radiator integrated cooling device has been installed four silicon substrate microchannel radiators, and the cooling fluid of system is imported and exported interface and is of a size of M2.5 * 0.25mm, and the diameter of inner flow passage is 2mm.
Embodiment 1 is carried out to simulation comparison, emulation boundary condition with unidimensional traditional aluminium alloy heat radiator:
Chip size: 5mm * 5mm * 1mm
Chip power-consumption: 75W
Number of chips: 4
Ambient temperature: 25 ℃
Feed liquor temperature: 25 ℃
Cooling fluid inlet flow rate: 600ml/min
Relevant parameter and result contrast are as follows:
As can be seen here, silicon substrate microchannel radiator integrated cooling device has huge advantage for the heat dissipation of electronic chip that solves high heat flux.
Embodiment 2:
As shown in Figure 2, the Outside Dimensions φ 80mm * 20mm of silicon substrate microchannel radiator integrated cooling device, silicon substrate microchannel radiator is of a size of 10mm * 10mm * 1.3mm, runner is linear pattern, fin thickness is 0.08mm, and spacing of fin is 0.06mm, the circular hole that to import and export as diameter be 1.2mm.This cooling system has been installed 4 silicon substrate microchannel radiators, and the cooling fluid of system is imported and exported interface and is of a size of M3 * 0.35mm, is positioned at the bottom of device, and the diameter of inner flow passage is 3mm.
Claims (1)
1. a silicon substrate microchannel radiator integrated cooling device, is characterized in that: by box body, and silicon substrate microchannel radiator, cover plate three parts form; Described box body is the cavity of upper end open, and box plate inside is provided with runner, the external opening of the import and export of box body lateral surface setting unit cooling fluid and internal electron chip, and box body outside is also provided with mounting ear; Box plate arranges some little grooves, and silicon substrate microchannel radiator is arranged in little groove, and little bottom portion of groove is provided with two openings, and the cooling fluid import and export that realize silicon substrate microchannel radiator are communicated with box body bottom flow passage; Box body bottom flow passage is all assigned to cooling fluid the entrance of each silicon substrate microchannel radiator; Box body and cover plate for sealing are connected to one, and form closed cavity; Described silicon substrate microchannel radiator is comprised of silicon base plate and silicon cover plate, the connection of silicon base plate and silicon cover plate adopts Si-Si bonding process to realize, on silicon base plate, adopt etching technics to be made into radiating fin, fin thickness and spacing of fin are all less than 0.1mm, and silicon cover plate adopts etching technics to process cooling fluid and imports and exports.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410429131.1A CN104201158A (en) | 2014-08-28 | 2014-08-28 | Integrated cooling device of silicon-based micro-channel radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410429131.1A CN104201158A (en) | 2014-08-28 | 2014-08-28 | Integrated cooling device of silicon-based micro-channel radiator |
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| CN104201158A true CN104201158A (en) | 2014-12-10 |
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| CN201410429131.1A Pending CN104201158A (en) | 2014-08-28 | 2014-08-28 | Integrated cooling device of silicon-based micro-channel radiator |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979307A (en) * | 2015-07-13 | 2015-10-14 | 北京工业大学 | Device for enabling micro-channel coolers to cool multi-chip system |
| CN106252309A (en) * | 2016-09-26 | 2016-12-21 | 北京无线电测量研究所 | A kind of microchannel liquid cooling heat radiator for high heat flux chip and conduction cooling plug-in unit |
| CN106298686A (en) * | 2016-09-25 | 2017-01-04 | 东莞市联洲知识产权运营管理有限公司 | A kind of cooling integrated type enclosure |
| CN106328610A (en) * | 2016-09-25 | 2017-01-11 | 东莞市联洲知识产权运营管理有限公司 | Multi-mode integrated circuit package apparatus |
| CN107591380A (en) * | 2017-08-03 | 2018-01-16 | 电子科技大学 | A kind of fluid channel radiator of integrated temperature sensor |
| CN108150275A (en) * | 2017-12-30 | 2018-06-12 | 苏州春兴精工股份有限公司 | A kind of cooling heat transferring container |
| CN108682660A (en) * | 2018-05-18 | 2018-10-19 | 中国电子科技集团公司第二十九研究所 | A kind of miniature cooling unit and its integrated approach and device |
| CN109346446A (en) * | 2018-09-14 | 2019-02-15 | 大连理工大学 | It is a kind of suitable for large scale, the bonding and encapsulating method of highly dense structural metal microchannel heat sink |
| CN110255490A (en) * | 2019-06-26 | 2019-09-20 | 中国电子科技集团公司第三十八研究所 | Integrated fluid channel radiator structure, preparation method and wafer level packaging structure |
| CN114280443A (en) * | 2021-11-03 | 2022-04-05 | 浙江大学杭州国际科创中心 | Power chip manifold type micro-channel heat exchanger testing device |
| CN114664769A (en) * | 2022-03-13 | 2022-06-24 | 南昌大学 | Silicon-based microchannel radiator |
| WO2024001194A1 (en) * | 2022-06-27 | 2024-01-04 | 中兴通讯股份有限公司 | Chip liquid-cooling heat dissipation structure and fabrication method therefor, and electronic device |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979307A (en) * | 2015-07-13 | 2015-10-14 | 北京工业大学 | Device for enabling micro-channel coolers to cool multi-chip system |
| CN106298686A (en) * | 2016-09-25 | 2017-01-04 | 东莞市联洲知识产权运营管理有限公司 | A kind of cooling integrated type enclosure |
| CN106328610A (en) * | 2016-09-25 | 2017-01-11 | 东莞市联洲知识产权运营管理有限公司 | Multi-mode integrated circuit package apparatus |
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| CN106298686B (en) * | 2016-09-25 | 2019-03-22 | 郑青松 | A kind of cooling integrated type packaging cartridge |
| CN106252309A (en) * | 2016-09-26 | 2016-12-21 | 北京无线电测量研究所 | A kind of microchannel liquid cooling heat radiator for high heat flux chip and conduction cooling plug-in unit |
| CN106252309B (en) * | 2016-09-26 | 2020-06-26 | 北京无线电测量研究所 | Micro-channel liquid cooling radiator and cold conducting plug-in unit for high heat flux chip |
| CN107591380B (en) * | 2017-08-03 | 2019-08-13 | 电子科技大学 | A kind of fluid channel radiator of integrated temperature sensor |
| CN107591380A (en) * | 2017-08-03 | 2018-01-16 | 电子科技大学 | A kind of fluid channel radiator of integrated temperature sensor |
| CN108150275A (en) * | 2017-12-30 | 2018-06-12 | 苏州春兴精工股份有限公司 | A kind of cooling heat transferring container |
| CN108682660B (en) * | 2018-05-18 | 2020-03-27 | 中国电子科技集团公司第二十九研究所 | Miniature cooling unit and integration method and device thereof |
| CN108682660A (en) * | 2018-05-18 | 2018-10-19 | 中国电子科技集团公司第二十九研究所 | A kind of miniature cooling unit and its integrated approach and device |
| CN109346446A (en) * | 2018-09-14 | 2019-02-15 | 大连理工大学 | It is a kind of suitable for large scale, the bonding and encapsulating method of highly dense structural metal microchannel heat sink |
| CN109346446B (en) * | 2018-09-14 | 2020-04-24 | 大连理工大学 | Bonding packaging method suitable for large-size and high-density structure metal microchannel radiator |
| CN110255490A (en) * | 2019-06-26 | 2019-09-20 | 中国电子科技集团公司第三十八研究所 | Integrated fluid channel radiator structure, preparation method and wafer level packaging structure |
| CN114280443A (en) * | 2021-11-03 | 2022-04-05 | 浙江大学杭州国际科创中心 | Power chip manifold type micro-channel heat exchanger testing device |
| CN114664769A (en) * | 2022-03-13 | 2022-06-24 | 南昌大学 | Silicon-based microchannel radiator |
| CN114664769B (en) * | 2022-03-13 | 2024-04-19 | 南昌大学 | Silicon-based micro-channel radiator |
| WO2024001194A1 (en) * | 2022-06-27 | 2024-01-04 | 中兴通讯股份有限公司 | Chip liquid-cooling heat dissipation structure and fabrication method therefor, and electronic device |
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Application publication date: 20141210 |