CN107591380A - A kind of fluid channel radiator of integrated temperature sensor - Google Patents
A kind of fluid channel radiator of integrated temperature sensor Download PDFInfo
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- CN107591380A CN107591380A CN201710654396.5A CN201710654396A CN107591380A CN 107591380 A CN107591380 A CN 107591380A CN 201710654396 A CN201710654396 A CN 201710654396A CN 107591380 A CN107591380 A CN 107591380A
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- fluid channel
- temperature sensor
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Abstract
The invention belongs to a kind of fluid channel device, and in particular to a kind of fluid channel radiator of integrated temperature sensor.Including fluid channel box body, bonded layer, fluid channel lid, coolant inlet, cooling liquid outlet, fluid channel groove and temperature sensor.The present invention realizes that temperature sensor is integrated inside fluid channel radiator, and integrated temperature sensor location is laid flexibly, realizes the real-time monitoring of multi-point, high spatial resolution, to improve fluid channel radiator reliability, and then optimization design radiator；Compared with external temperature sensor, the temperature that the program obtains is affected by environment small, as a result more can accurately reflect runner internal state, improve fluid channel radiator global reliability.Also separate coolant using bonded layer to contact with the direct of temperature sensor so that temperature sensor will not directly be contacted influence by coolant, and the stability and accuracy for causing temperature sensor reduce, even temperature sensor short-circuit failure.
Description
Technical field
The invention belongs to a kind of fluid channel device, and in particular to a kind of fluid channel radiator of integrated temperature sensor.
Background technology
As microelectric technique is big towards miniaturization, integrated direction development, the integrated level of microelectronic chip and micro-system
It is big to improve.Integrated level improves and characteristic size reduces the heat flow density brought and increased so that the heating problem of microchip becomes to be cured
Hair is serious.Thermic Problem of Failure has been increasingly becoming the bottleneck for restricting microelectric technique development, and heat management problems become particularly to weigh
Will.Compared with the radiating modes such as traditional fan cooling, heat pipe heat radiation, fluid channel radiator shows splendid radiating effect
Can, turn into one of current most potential chip-scale heat dissipation technology.
Therefore grasp fluid channel radiator internal coolant temperature and its distribution to cooling system and micro-channel structure
Further optimization all has very important significance.However, existing fluid channel radiator does not possess to runner internal coolant
The function of monitoring temperature.Existing technology is each external TEMP of liquid inlet and liquid outlet in fluid channel radiator
Device, or some position external temperature sensor of the non-fluid channel radiator in coolant circulation system, to complete pair
The reading of coolant temperature and feedback.This method can only obtain the cooling liquid temperature of fluid channel radiator gateway or other positions
Degree, away from inside fluid channel, temperature value is not accurate enough, can not obtain high-resolution Temperature Distribution in fluid channel.
The content of the invention
In view of the shortcomings of the prior art, to obtain more accurate in fluid channel and there is high-resolution Temperature Distribution,
The invention provides a kind of fluid channel radiator of integrated temperature sensor.
Concrete technical scheme is as follows：
A kind of fluid channel radiator of integrated temperature sensor, including it is fluid channel box body, bonded layer, fluid channel lid, cold
But liquid entrance, cooling liquid outlet, fluid channel groove and temperature sensor.
The fluid channel of sealing is bonded together to form between fluid channel box body and fluid channel lid by bonded layer alignment.Bonded layer every
Open coolant to contact with the direct of temperature sensor so that temperature sensor will not directly be contacted influence by coolant, cause temperature
The stability and accuracy for spending sensor reduce, even temperature sensor short-circuit failure.
Coolant inlet and cooling liquid outlet are arranged at fluid channel box body and/or fluid channel lid；Fluid channel groove is set
In fluid channel box body or fluid channel top surface, its both ends connects with coolant inlet and cooling liquid outlet respectively.
The temperature sensor is integrated in fluid channel lid or fluid channel box surface, and is not in same with fluid channel groove
One fluid channel lid or fluid channel box body；After bonding, a pair of the temperature spot to be measured 1 in temperature sensor and fluid channel radiator
Should, picked out inside fluid channel radiator, and with lead, the data of output temperature sensor collection are passed by lead.
The alignment keys are combined into the position of temperature sensor and the position alignment of temperature spot to be measured in fluid channel radiator
Bonding.
Further, the temperature sensor is at least one.
Further, the material of the fluid channel box body and fluid channel lid is silicon or glass.
Further, the bonding layer material is resin or silica membrane.
Further, the temperature sensor is resistance temperature detector, resonant frequency formula temperature sensor and/or sound
Waves temperature sensor.
Further, the temperature sensor is film temperature sensor.
The present invention compared with the prior art, it is integrated inside fluid channel radiator to realize temperature sensor；Collection
Into temperature sensor size can reach micron order, position is laid flexibly, realizes the real-time prison of multi-point, high spatial resolution
Survey, to improve fluid channel radiator reliability, and then optimization design radiator；Compared with external temperature sensor, the program obtains
The temperature obtained is affected by environment small, as a result more can accurately reflect runner internal state.Precisely be embodied in inside monitoring and
Two aspects of monitoring of multi-point.Also separate coolant using bonded layer to contact with the direct of temperature sensor so that temperature passes
Sensor will not directly be contacted influence by coolant, and the stability and accuracy for causing temperature sensor reduce, and even temperature passes
Sensor short-circuit failure.
In summary, the present invention can with real-time and precise, multi-point, high spatial resolution monitoring fluid channel radiator inside
Temperature, improve fluid channel radiator global reliability.
Brief description of the drawings
Fig. 1 is the schematic cross-section of the fluid channel radiator of the integrated resistor formula film temperature sensor of embodiment；
Fig. 2 is the top view of the fluid channel radiator of the integrated resistor formula film temperature sensor of embodiment；
Fig. 3 is the test data figure that fluid channel radiator is not passed through coolant in embodiment；
Fig. 4 is the test data figure that fluid channel radiator is passed through coolant in embodiment.
Reference：Fluid channel box body -1, bonded layer -2, fluid channel lid -3, coolant inlet -4, cooling liquid outlet -
5th, fluid channel groove -6, resistance-type film temperature sensor -7, film metal pad -8, center tail runner trench -9.
Embodiment
The present invention is described further with reference to the accompanying drawings and examples.
Embodiment
As shown in figure 1, a kind of fluid channel radiator of integrated resistor formula film temperature sensor, includes fluid channel box body
1st, bonded layer 2, fluid channel lid 3, coolant inlet 4, cooling liquid outlet 5, fluid channel groove 6, resistance-type film temperature sensing
Device 7, film metal pad 8.
The entrance 4 and cooling liquid outlet 5 of the coolant are located at the both sides of the edge of fluid channel box body 1；Fluid channel groove 6 is located at
The lower surface of fluid channel box body 1, coolant entrance 4 and cooling liquid outlet 5 between；Resistance-type film temperature sensor 7 is integrated in
The upper surface of fluid channel lid 3；The lower surface of fluid channel box body 1 and the upper surface of fluid channel lid 3 are aligned by bonded layer 2 to be bonded
Form sealing fluid channel；The size of fluid channel lid 3 is slightly larger than fluid channel box body 1, and film metal pad 8 is located at fluid channel lid 3
Outer peripheral areas after being bonded with fluid channel box body 1；The electrode of the film metal pad 8 and resistance-type film temperature sensor 7
It is connected.
Wherein the material of fluid channel box body 1 and fluid channel lid 3 is silicon；The material of bonded layer 2 is viscous for benzocyclobutene (BCB)
Mixture；The metal layer material of resistance-type film temperature sensor is platinum and gold.
Wherein the size of fluid channel box body 1 is 11mm × 10mm, and the size of fluid channel lid 3 is 20mm × 20mm, circular
Coolant water inlet 4 and the radius size of delivery port 5 be 0.5mm, the length and width and depth of fluid channel groove 6 be respectively 5mm,
0.05mm, 0.3mm, the size of resistance-type film temperature sensor is 0.04mm × 0.04mm.
As shown in Fig. 2 nine resistance-type film temperature sensors are centrally located in fluid channel groove 9, enter along coolant
Mouth 4 arrives the direction equidistantly distributed of cooling liquid outlet 5, is designated as S1, S2, S3, S4, S5, S6, S7, S8 and S9 successively.
As shown in figure 3, to application mould at the surface physical centre of the fluid channel box body 1 of the present embodiment fluid channel radiator
Plan thermal source (5x5mm film platinum layer), power 1.5W, when not being passed through coolant (deionized water), center fluid channel groove
Interior profiling temperatures are as shown in the figure.
As shown in figure 4, when the power added to simulation thermal source is 1.5W, it is 4ml/ to be passed through coolant (deionized water) flow velocity
During min, the profiling temperatures in center fluid channel groove 9 are as shown in the figure.
In summary, it is seen that the present invention can with real-time and precise, multi-point, high spatial resolution monitoring fluid channel radiator
Internal temperature, improves fluid channel radiator global reliability.
Claims (5)
1. a kind of fluid channel radiator of integrated temperature sensor, including fluid channel box body, bonded layer, fluid channel lid, cooling
Liquid entrance, cooling liquid outlet, fluid channel groove and temperature sensor, it is characterised in that：
The fluid channel of sealing is bonded together to form between fluid channel box body and fluid channel lid by bonded layer alignment；Bonded layer separates cold
But liquid contacts with the direct of temperature sensor；
Coolant inlet and cooling liquid outlet are arranged at fluid channel box body and/or fluid channel lid；Fluid channel groove is arranged at micro-
Runner box body or fluid channel top surface, its both ends connect with coolant inlet and cooling liquid outlet respectively；
The temperature sensor is integrated in fluid channel lid or fluid channel box surface, and is not in same micro- with fluid channel groove
Runner lid or fluid channel box body；After bonding, temperature sensor corresponds with the temperature spot to be measured in fluid channel radiator, position
Picked out inside fluid channel radiator, and with lead, the data of temperature sensor measurement are transmitted out by lead；
The alignment keys are combined into the position of temperature sensor and are bonded with the position alignment of temperature spot to be measured in fluid channel groove.
2. the fluid channel radiator of integrated temperature sensor as claimed in claim 1, it is characterised in that：The temperature sensor is extremely
It is few one.
3. the fluid channel radiator of integrated temperature sensor as claimed in claim 1, it is characterised in that：The fluid channel box body and
The material of fluid channel lid is silicon or glass.
4. the fluid channel radiator of integrated temperature sensor as claimed in claim 1, it is characterised in that：It is described bonding layer material be
Resin or silica membrane.
5. the fluid channel radiator of integrated temperature sensor as claimed in claim 1, it is characterised in that：The temperature sensor is
Resistance temperature detector, resonant frequency formula temperature sensor and/or sound wave type temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710654396.5A CN107591380B (en) | 2017-08-03 | 2017-08-03 | A kind of fluid channel radiator of integrated temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710654396.5A CN107591380B (en) | 2017-08-03 | 2017-08-03 | A kind of fluid channel radiator of integrated temperature sensor |
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| Publication Number | Publication Date |
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| CN107591380A true CN107591380A (en) | 2018-01-16 |
| CN107591380B CN107591380B (en) | 2019-08-13 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108630644A (en) * | 2018-08-09 | 2018-10-09 | 苏州加拉泰克动力有限公司 | Radiator |
| CN108666283A (en) * | 2018-05-03 | 2018-10-16 | 中国电子科技集团公司第二十九研究所 | A kind of microchannel heat sink structure and preparation method thereof |
| CN109411427A (en) * | 2018-09-06 | 2019-03-01 | 中国电子科技集团公司第二十九研究所 | A kind of fluid channel Radiator and its preparation method |
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| US20040089442A1 (en) * | 2001-09-28 | 2004-05-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
| CN101086009A (en) * | 2006-06-06 | 2007-12-12 | 北京大学 | Temperature-control matrix biochip and its processing method |
| CN202099269U (en) * | 2011-05-23 | 2012-01-04 | 北京工业大学 | Polymerase chain reactor and real-time micro optics detection device |
| CN104201158A (en) * | 2014-08-28 | 2014-12-10 | 中国电子科技集团公司第二十九研究所 | Integrated cooling device of silicon-based micro-channel radiator |
| CN104848722A (en) * | 2015-05-14 | 2015-08-19 | 李渊 | Energy accumulator, electric heating energy storage heater and terminal of energy storage air conditioner |
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2017
- 2017-08-03 CN CN201710654396.5A patent/CN107591380B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040089442A1 (en) * | 2001-09-28 | 2004-05-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
| CN1636124A (en) * | 2001-09-28 | 2005-07-06 | 莱兰德斯坦福初级大学理事会 | Electroosmotic microchannel cooling system |
| CN101086009A (en) * | 2006-06-06 | 2007-12-12 | 北京大学 | Temperature-control matrix biochip and its processing method |
| CN202099269U (en) * | 2011-05-23 | 2012-01-04 | 北京工业大学 | Polymerase chain reactor and real-time micro optics detection device |
| CN104201158A (en) * | 2014-08-28 | 2014-12-10 | 中国电子科技集团公司第二十九研究所 | Integrated cooling device of silicon-based micro-channel radiator |
| CN104848722A (en) * | 2015-05-14 | 2015-08-19 | 李渊 | Energy accumulator, electric heating energy storage heater and terminal of energy storage air conditioner |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108666283A (en) * | 2018-05-03 | 2018-10-16 | 中国电子科技集团公司第二十九研究所 | A kind of microchannel heat sink structure and preparation method thereof |
| CN108630644A (en) * | 2018-08-09 | 2018-10-09 | 苏州加拉泰克动力有限公司 | Radiator |
| CN109411427A (en) * | 2018-09-06 | 2019-03-01 | 中国电子科技集团公司第二十九研究所 | A kind of fluid channel Radiator and its preparation method |
| CN109411427B (en) * | 2018-09-06 | 2020-06-09 | 中国电子科技集团公司第二十九研究所 | Micro-channel radiator and manufacturing method thereof |
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| Publication number | Publication date |
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| CN107591380B (en) | 2019-08-13 |
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