CN201188738Y - Composite heat exchange device - Google Patents
Composite heat exchange device Download PDFInfo
- Publication number
- CN201188738Y CN201188738Y CNU2008201069004U CN200820106900U CN201188738Y CN 201188738 Y CN201188738 Y CN 201188738Y CN U2008201069004 U CNU2008201069004 U CN U2008201069004U CN 200820106900 U CN200820106900 U CN 200820106900U CN 201188738 Y CN201188738 Y CN 201188738Y
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting plate
- radiating block
- exchange device
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title 1
- 150000001875 compounds Chemical class 0.000 claims abstract description 11
- 238000001816 cooling Methods 0.000 claims abstract description 11
- 239000000110 cooling liquid Substances 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 239000012809 cooling fluid Substances 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract 5
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a compound heat exchange device, including the heat-conducting plate, install radiating block, heat absorption end and the heat pipe that radiating block and heat-conducting plate are connected respectively to the radiating end on the heat-conducting plate, its characterized in that: the heat conducting plate is provided with a boss with the surface contacting with the plurality of heating sources and a hole for placing and fixing the radiating block; the heat dissipation block comprises a water cooling system formed by a heat conductor and a sealing cover which is sealed with the heat conductor to form a closed container, and the heat conductor used for being connected with at least one heat conduction pipe; the heat conductor is provided with a cooling liquid inlet and a cooling liquid outlet which are used for placing the groove-shaped structure and the containing groove of the heat conducting pipe and connecting the containing groove of the sealing cover, and the inside of the containing groove is provided with a lug boss used for forcing water flow to be guided; the bottom surfaces of the heat conductor and the heat dissipation block are simultaneously contacted with different heating sources. The utility model discloses area occupied is little, noiselessness, heat-conduction efficiency is high.
Description
Technical field
The utility model relates to a kind of heat abstractor, especially a kind of compound heat-exchange device of video card.
Background technology
Computer plays an increasingly important role in the middle of daily life, and as the part of computer hardware component, video card plays a part very important, and the quality of video card directly influences the performance of computer.As a kind of high-end electronic product, it can produce a large amount of sensible heats in running, and these heat accumulation can have influence on the stability of video card operation on video card, be necessary they are conducted.What the heat abstractor on the video card in the past adopted is that air-cooled fin or fan dispels the heat, and these heat radiation heat conduction efficiency are low, noise is big, area occupied is big, can not adapt to the operation demand of video card of new generation.
The utility model content
At the deficiencies in the prior art, the utility model provides that a kind of area occupied is little, noiselessness, compound heat-exchange device that heat conduction efficiency is high.
For achieving the above object, the technical solution adopted in the utility model is: a kind of compound heat-exchange device, comprise heat-conducting plate, be installed on the heat pipe that radiating block, heat absorbing end and radiating end on the heat-conducting plate is connected radiating block and heat-conducting plate respectively, it is characterized in that: described heat-conducting plate is provided with at least one boss, and this boss surface contacts at least one pyrotoxin, and this heat-conducting plate is provided with at least one in order to place radiating block and fixing with it hole; Described radiating block comprise a water-cooling structure with one in order to be connected the heat carrier of a heat pipe at least.
The lower surface of described heat carrier and radiating block contacts the pyrotoxin of difference simultaneously.
Described water-cooling structure constitutes by heat carrier with seal cover that its sealing forms closed container.
Described heat carrier is provided with at least one in order to place groove shape structure and at least one storage tank of heat pipe.
One side of described seal cover is provided with at least one cooling fluid inlet and at least one cooling liquid outlet, on the communication seals lid storage tank.
Be provided with at least one in the described seal cover storage tank in order to force the projection of current deflecting.
The beneficial effects of the utility model are: owing to adopted heat-conducting plate to be provided with the boss that the surface contacts a plurality of pyrotoxins, and in order to place other heat carriers and fixing with it hole; What engage with heat-conducting plate forms the water-cooling system that the seal cover of closed container constitutes by heat carrier with its sealing, its heat pipe is provided with in order to place heat conduction tube seat shape structure and storage tank and to be connected the inner cooling fluid that is provided with in order to the seal cover storage tank of the projection of forcing current deflecting and enters the mouth and cooling liquid outlet, make heat-exchange device described in the utility model when video card is worked, can contact the heat radiation of abundant pyrotoxin and and form local with difference, improved heat conduction efficiency, alleviate the infringement of video card greatly, prolonged the life-span of video card.
Description of drawings
The utility model is described in further detail below in conjunction with accompanying drawing:
Fig. 1 is the utility model structural representation;
Fig. 2 is the structural representation a of the utility model heat-conducting plate;
Fig. 3 is the structural representation b of the utility model heat-conducting plate
Fig. 4 is the structural representation a of the heat-conducting plate of the utility model radiating block;
Fig. 5 is the structural representation b of the heat-conducting plate of the utility model radiating block;
Fig. 6 is the structural representation a of the seal cover of the utility model radiating block;
Fig. 7 is the structural representation b of the seal cover of the utility model radiating block;
Fig. 8 is the utility model user mode structural representation;
The brief description of the utility model embodiment element numbers:
1, heat-conducting plate 13, radiating fin
2, radiating block 21, water-cooling structure
3, heat pipe 22, heat carrier
4, integrated circuit board 23, seal cover
11 boss 35 31, heat pipe
12, hole 32, heat pipe
221, groove shape structure 311, radiating end
222, storage tank 312, heat absorbing end
231, cooling fluid inlet 2331, projection
232, cooling liquid outlet 41, pyrotoxin
233, seal cover storage tank 10 42, pyrotoxin
Embodiment
Referring to Fig. 1-6, the utility model embodiment comprises heat-conducting plate 1, be installed on the heat pipe 3 that radiating block 2, heat absorbing end 312 and radiating end 311 on the heat-conducting plate 1 is connected radiating block 2 and heat-conducting plate 1 respectively.Heat-conducting plate 1 is provided with boss 11, and the surface of this boss 1 contacts a pyrotoxin 42, also be provided with one in order to place radiating block 2 and fixing with it hole 12, described radiating block 2 comprises a water-cooling structure 21 and a heat carrier 22 in order to be connected a heat pipe 31, described heat carrier 22 is provided with one in order to place the groove shape structure 221 and a storage tank 222 of heat pipe 31, and described water-cooling structure 21 is made of the seal cover 23 that heat carrier 2 and its sealing form closed container.One side of described seal cover 23 is provided with 232 outlets of cooling fluid inlet 231 and one cooling fluid, and on the communication seals lid storage tank 233, described seal cover storage tank 233 is provided with one in order to force the projection 2331 of current deflecting.
When integrated circuit board 4 is in running order, the pyrotoxin 41 of integrated circuit board 4 and pyrotoxin 42 produce a large amount of sensible heats, pyrotoxin 41 and pyrotoxin 42 are by contacting boss 11 and heat carrier 12, heat is passed to radiating block 2 on heat-conducting plate 1 and the heat-conducting plate 1 respectively, and dispel the heat by the radiating fin 13 of heat-conducting plate 1 and the heat pipe 31 that is connected with radiating block 2 and heat pipe 32 and water-cooling structure 21.Heat pipe 31 passes to part energy by radiating end 311 one side of integrated circuit board 4, and the part of the heat that radiating block 2 absorbs is by being positioned at the water-cooling structure 21 that heat carrier 22 and seal cover 23 form, cooling fluid enters seal cover storage tank 233 from cooling fluid inlet 231, and owing in order to the existence of the projection 2331 of forcing current deflecting cooling fluid is flowed out to leave with the heat that radiating block 2 is absorbed from cooling liquid outlet 232, thereby reach purpose of design.
The above, it only is a kind of preferred embodiment of the utility model, be not that technical scope of the present utility model is imposed any restrictions, every foundation technical spirit of the present utility model all still belongs in the scope of the utility model technology any trickle modification, equivalent variations and modification that top embodiment did.
Claims (6)
1, a kind of compound heat-exchange device, comprise heat-conducting plate, be installed on the heat pipe that radiating block, heat absorbing end and radiating end on the heat-conducting plate is connected radiating block and heat-conducting plate respectively, it is characterized in that: described heat-conducting plate is provided with at least one boss, and this boss surface contacts at least one pyrotoxin, and this heat-conducting plate is provided with at least one in order to place radiating block and fixing with it hole; Described radiating block comprise a water-cooling structure with one in order to be connected the heat carrier of a heat pipe at least.
2, compound heat-exchange device according to claim 1 is characterized in that: the lower surface of described heat carrier and radiating block contacts the pyrotoxin of difference simultaneously.
3, compound heat-exchange device according to claim 1 is characterized in that: described water-cooling structure constitutes by heat carrier with seal cover that its sealing forms closed container.
4, compound heat-exchange device according to claim 3 is characterized in that: described heat carrier is provided with at least one in order to place groove shape structure and at least one storage tank of heat pipe.
5, compound heat-exchange device according to claim 3 is characterized in that: a side of described seal cover is provided with at least one cooling fluid inlet and at least one cooling liquid outlet, on the communication seals lid storage tank.
6, compound heat-exchange device according to claim 5 is characterized in that: be provided with at least one in order to force the projection of current deflecting in the described seal cover storage tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201069004U CN201188738Y (en) | 2008-03-20 | 2008-03-20 | Composite heat exchange device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201069004U CN201188738Y (en) | 2008-03-20 | 2008-03-20 | Composite heat exchange device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201188738Y true CN201188738Y (en) | 2009-01-28 |
Family
ID=40311759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201069004U Expired - Fee Related CN201188738Y (en) | 2008-03-20 | 2008-03-20 | Composite heat exchange device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201188738Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101860177A (en) * | 2010-04-16 | 2010-10-13 | 常州佳讯光电产业发展有限公司 | Novel inverter |
| CN102799240A (en) * | 2012-08-27 | 2012-11-28 | 无锡市福曼科技有限公司 | Conversion connector of water-cooling device of display card |
| CN104201158A (en) * | 2014-08-28 | 2014-12-10 | 中国电子科技集团公司第二十九研究所 | Integrated cooling device of silicon-based micro-channel radiator |
| CN113720626A (en) * | 2021-08-31 | 2021-11-30 | 英业达科技有限公司 | Test card body and display adapter for test |
-
2008
- 2008-03-20 CN CNU2008201069004U patent/CN201188738Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101860177A (en) * | 2010-04-16 | 2010-10-13 | 常州佳讯光电产业发展有限公司 | Novel inverter |
| CN102799240A (en) * | 2012-08-27 | 2012-11-28 | 无锡市福曼科技有限公司 | Conversion connector of water-cooling device of display card |
| CN104201158A (en) * | 2014-08-28 | 2014-12-10 | 中国电子科技集团公司第二十九研究所 | Integrated cooling device of silicon-based micro-channel radiator |
| CN113720626A (en) * | 2021-08-31 | 2021-11-30 | 英业达科技有限公司 | Test card body and display adapter for test |
| CN113720626B (en) * | 2021-08-31 | 2024-05-17 | 英业达科技有限公司 | Test card body and display adapter for test |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090128 |